JP3782912B2 - Cooling device and cooling method for processor and companion voltage regulator - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to cooling of electronic components, and more particularly, to a cooling device and a cooling method for a processor and a companion voltage regulator having a cooling plate arranged to simultaneously cool the processor and its companion voltage regulator.
[0002]
[Prior art]
High speed electronic components generate undesirable heat. For example, high speed computer processors such as microprocessors, graphics processors, etc. generate unwanted heat that must be removed for efficient operation. Removing heat provides a lower operating temperature, faster operating speed and higher computing power. Still other advantages, there is a high reliability.
[0003]
In order to meet the growing demand for computer power, processor design methods continue to evolve and become more complex. The more complex the design, the greater the number of transistors that are integrated, causing each such transistor to generate more heat during operation. As each transistor operates at a higher speed, more heat is generated.
[0004]
[Problems to be solved by the invention]
Various cooling methods are known in the prior art. In general, the higher the efficiency with which heat is removed, the larger the mechanism that implements the cooling scheme, the heavier, the bulkier, and the more difficult it will be to place in a computer system.
[0005]
High-speed computer systems are endowed with overwhelming computing power, but have two problems. The first problem is the rigorous cooling requirements required by high speed processors, and the second problem is the more stringent requirements of one or more dedicated companion voltage regulators and high speed memory carefully placed near the high speed processor. It is a condition.
[0006]
In some prior art processor cooling schemes, there is a bulky mechanism to implement the scheme, which hinders advantageous configurations and arrangements to maximize the operating speed of the companion voltage regulator and memory. For example, such a bulky mechanism has prevented designers from adopting a substantially coplanar arrangement of the processor and voltage regulator that extends across the entire surface of the motherboard. This problem is exacerbated by the introduction of additional bulky mechanisms to cool the voltage regulator.
[0007]
The present invention has been made in view of such a situation, so as to absorb heat from both the processor and the voltage regulator at the same time while providing an advantageous arrangement of the voltage regulator and the memory near the processor for high-speed operation. It is an object of the present invention to provide a cooling device and a cooling method for an efficient and small-sized processor and a companion voltage regulator, which are arranged in the above.
[0008]
[Means for Solving the Problems]
The present invention provides an efficient and compact arrangement arranged to absorb heat from both the processor and the voltage regulator simultaneously, while advantageously placing the voltage regulator and memory close to the processor for high speed operation. A cooling method and a cooling device are provided.
[0009]
In the past, due to the bulky cooling mechanism, it has not been possible to achieve a substantially coplanar arrangement of the processor and voltage regulator that extends over the entire surface of the motherboard. In contrast, the present invention provides a compact stacked arrangement of voltage regulators, cold plates and processors, each placed close to each other for high speed operation. Further, the arrangement close thereto is advantageous in reducing electrical noise (and relaxing the conditions of the components used for decoupling the corresponding components such as capacitors).
[0010]
Briefly and schematically, the present invention includes a processor that requires at least one bias voltage, and further includes a companion voltage regulator for supplying the bias voltage. Electrical coupling between the voltage regulator and the processor leads to the bias voltage. The voltage regulator is placed close enough to the processor to suppress this electrical coupling inductance.
[0011]
At least one cold plate is sandwiched between the processor and the voltage regulator in a heat transfer state and is configured to simultaneously absorb heat from the processor and the voltage regulator.
[0012]
The present invention further provides an electrical coupling that carries signals between the memory and the processor. The memory is placed close enough to the processor to reduce signal propagation delay through this electrical coupling and achieve high speed operation.
[0013]
Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an isometric view of a preferred embodiment of a cooling device 100 according to the present invention. As shown, the present invention includes a processor 101 that requires at least one bias voltage and a companion voltage regulator 103 that further supplies the bias voltage. An electrical coupling 105 between the voltage regulator 103 and the processor 101 introduces a bias voltage. The electrical coupling 105 preferably includes a flexible strip of printed circuit material using a single layer or multiple layers of polyimide (or polyester). There are several tradeoffs, and by way of example, multilayer strips can provide the desired low inductance, but are generally more expensive than single layer strips.
[0015]
The power supply voltage is supplied to the voltage regulator 103 from the support printed wiring board 107 via another electrical coupling 109 preferably made of flexible printed circuit material. The square bracket 110 of the printed wiring board is soldered to the voltage regulator 103 and the electrical couplings 105 and 109 made of flexible printed circuit material, respectively, for reliable electrical connection. Alternatively, a so-called “flying lead” can be used to connect the other electrical coupling 109.
[0016]
In addition, additional alternative structures can be used to achieve beneficial results. For example, the present invention can be implemented using a so-called “power pod” that implements an integral structure of voltage regulator and electrical coupling with the necessary fixtures.
[0017]
In the preferred embodiment, the power supply voltage is 48 VDC and is provided by the voltage regulator 103 to provide a selected bias voltage generally less than 2 volts. Although a 2 volt bias voltage is preferred in some designs, it should be understood that the principles of the invention are not limited to a particular bias voltage (or a particular power supply voltage).
[0018]
The cooling plate 111 is sandwiched between the processor 101 and the voltage regulator 103 in a heat transfer state, and is arranged so as to absorb heat from the processor 101 and the voltage regulator 103 simultaneously. In a preferred embodiment, the cold plate 111 absorbs 130 watts (130 W) of heat from the processor 101 and 50 watts (50 W) of heat from the voltage regulator 103 simultaneously, and is typically 35 degrees Celsius (35 ° C.). Assuming a high ambient temperature, the operating temperature of the cooling plate 111 is maintained in the range of about 60 degrees Celsius (60 ° C.) to about 70 degrees Celsius (70 ° C.). A total of about 180 watts (180 W) of heat is absorbed from the processor 101 and the voltage regulator 103, but the cooling plate 111 is thought to be able to handle more heat due to factors such as the rate of increase in fluid flow. Preferred flow rates are from about 378.5 milliliters (about 1/10 gallon) to about 757 milliliters (about 2/10 gallons) per minute for each processor 101 to be cooled, although the present invention is not limited to this preferred flow rate Please understand that.
[0019]
The heat exchanger 113 is thermally coupled with fluid in communication with the cooling plate 111 to absorb heat. The design of the heat exchanger 113 may be a finned tube, a plate heat sink, or any other suitable design. The heat exchanger 113 can preferably be made from copper, or aluminum, stainless steel, or a composite material. Cold plate 111 and heat exchanger 113 each include a respective flow path for circulating, for example, water, water-blended ethylene glycol, fluorinert, or other suitable fluid known to those skilled in the art.
[0020]
As shown in FIG. 1, the present invention includes a pair of fluid conduits 115, 117 coupled to the flow path of the cold plate 111 and the heat exchanger 113 for circulating fluid between them. In a preferred embodiment, the fluid conduits 115, 117 are comprised of a hollow copper tube of diameter 6.35 millimeters (1/4 inch) (or 12.7 millimeters (1/2 inch)), or another suitable material.
[0021]
In a preferred embodiment, an electric pump 119 is lined with one of the fluid conduits 115, 117 to facilitate fluid circulation. A variety of different electric pumps can provide desirable results. In order to completely seal the circulating fluid, it is preferable to use a magnetically coupled pump. Such pumps are generally available from manufacturers such as Iwaki Welchem and Gorman Rupp.
[0022]
In a preferred embodiment, the memory module 121 and the processor 101 are each soldered or electrically coupled to a conductor trace on the printed wiring board 107 so that the memory module 121 and the processor 101 are electrically connected. Couplings are provided, and electrical signals can be transmitted between them.
[0023]
As shown in FIG. 1, the memory module 121 is placed close enough to the processor 101 to suppress delay in signal propagation through electrical coupling. In a preferred embodiment, each of the conductor traces that provide electrical coupling between the processor controller and each memory controller of each memory module 121 is substantially to achieve a memory access frequency as high as about 125 megahertz (125 Mhz). Less than about 40 centimeters (40 cm). In order to achieve a sufficient timing margin for such a high memory access frequency, the conductor traces that provide electrical coupling between the processor controller and each memory controller of each memory module 121 must be within about 38 centimeters each. Preferably there is.
[0024]
FIG. 2 is a detailed view of the sandwich structure of the voltage regulator 103, the cooling plate 111, and the processor 101 shown in FIG. The cooling plate 111 has a first main surface and a second main surface opposite to the first main surface. Voltage regulator 103 has a main surface that transfers heat to the first main surface of cooling plate 111. The processor 101 has a second opposing main surface of the cooling plate 111 and a main surface that conducts heat. In a preferred embodiment, a thin layer of thermal grease (not shown) is applied to the contact portion between the first major surface of the cold plate 111 and the major surface of the voltage regulator 103 to facilitate heat flow. ) Is sandwiched. For the same reason, another thin layer (not shown) of thermal grease is sandwiched between the opposite second side of the cold plate 111 and the processor 101. In an alternative embodiment, using thin thermal pads instead of thermal grease can provide beneficial results.
[0025]
The voltage regulator 103 is placed close enough to the processor 101 to limit the inductance of the electrical coupling with the processor 101. The electrical coupling 105 may be engaged with the processor 101 as shown, or connected to the printed wiring board 107 immediately adjacent to the processor 101 and made relatively short for the printed wiring board 107. It may be coupled to the processor 101 by conductor traces.
[0026]
The length dimension L of the electrical coupling 105 extending from the processor 101 to where the printed wiring board square fixture 110 is soldered to the voltage regulator 103 is approximately 240 megahertz to about 1 gigahertz (or more). ) In the range of about 2 millimeters to about 25 millimeters so as to limit the inductance of the electrical coupling 105 and provide an appropriate step load current response. In a preferred embodiment, the length dimension L of the electrical coupling 105 between the voltage regulator 103 and the processor 101 is suitable for a step load that is appropriate when the processor 101 is operating at a clock frequency on the order of about 500 megahertz. It is about 4 millimeters so that a current response is provided.
[0027]
Thus, the close placement of the processor 101 and the voltage regulator 103 ranges from about 2 millimeters to about 25 millimeters. In the preferred embodiment, the adjacent placement of the processor 101 and the voltage regulator 103 is about 4 millimeters.
[0028]
For the same reason as described above, the inductance of the electrical coupling 105 between the voltage regulator 103 and the processor 101 is about 0.15 nanohenry (at a clock frequency of 1 GHz) to about 0.6 nanohenry (at a clock frequency of 240 megahertz). ). In a preferred embodiment, the inductance of the electrical coupling 105 between the voltage regulator 103 and the processor 101 is about 0.3 nanohenry (corresponding to a clock frequency of 500 megahertz).
[0029]
The overall thickness dimension T of the cooling plate 111 sandwiched between the voltage regulator 103 and the processor 101 is sufficiently thin so that the processor 101 can be placed near the voltage regulator 103. The overall thickness dimension T of the cooling plate 111 is in the range of about 2 millimeters to about 7 millimeters.
[0030]
The reason why the overall thickness dimension T must be greater than the first limit of about 2 millimeters is related to the constraints in manufacturing the cold plate 111. In a preferred embodiment, the cooling plate 111 is made of a two-lamellar clam-shell arrangement with meandering channels or cavities in which it circulates and circulates cooling fluid for heat transfer. In order to efficiently transfer heat to the fluid, the serpentine channel must have a preferred diameter in the range of about 4.06 millimeters (about 0.16 inches) to about 5.08 millimeters (about 0.2 inches). It is theoretically known by the inventor that this must be done. Smaller channel diameters can achieve some beneficial results, but such preferred channel diameters maintain the structural integrity of the component plate and efficient heat transfer from the component plate. In addition, the overall thickness dimension T of the two plates should be substantially greater than about 2 millimeters.
[0031]
The reason why the overall thickness dimension T must be smaller than the second limit of about 7 millimeters is the actual limitation of the entire space available for the signed switch structure of the processor 101, the cold plate 111 and the voltage regulator 103. is connected with. In order to achieve an advantageous balance between the available space and the thermal efficiency and structural integrity of the component plates, the preferred overall thickness dimension T of the cooling plate 111 is about 4 millimeters.
[0032]
The cold plate 111 must be large enough for thermal coupling with the processor 101 and the voltage regulator 103 and large enough for coupling with the fluid conduits 115, 117. For example, if the major surface of processor 101 has dimensions of about 127 millimeters (about 5 inches) by about 76.2 millimeters (about 3 inches), the opposite major surfaces of cold plate 111 are each about 95 Preferably, it has a width and depth dimension of .25 millimeters (about 3.75 inches) by about 146.05 millimeters (about 5.75 inches). In the foregoing example, it is assumed that the major surface of voltage regulator 103 has a width and depth dimension of about 60.96 millimeters (about 2.4 inches) by about 116.84 millimeters (about 4.6 inches). Of course, it should be understood that according to the principles of the present invention, the size of the cooling plate 111 will change if the size of the processor 101 and the voltage regulator 103 are different.
[0033]
FIG. 3 is an exploded view of the sandwich structure of FIG. 2, showing a printed wiring board square fixture 110, a voltage regulator 103, and a processor 101. With respect to the cold plate 111, two thinner component clamshell structures that are sealed together are shown as disassembled parts to show a serpentine channel therethrough for circulating the cooling fluid. In a preferred embodiment, the serpentine channel is machined to extend into the component plate, which component plate is made from copper, aluminum, stainless steel or a composite material. Preferably, it is copper resistant to corrosion. The preferred length of the channel is about 508 millimeters (about 20 inches). The component plate is brazed to seal the cooling plate 111 to prevent undesirable leakage of fluid.
[0034]
It should be understood that depending on the desired cold plate 111 temperature, alternative channel structures can be utilized to achieve beneficial results. In an alternative embodiment, a folded finestock is used instead of a serpentine channel to achieve fluid circulation. The folded fine stock is brazed between the two component plates of the cold plate 111 to seal the cold plate 111 and prevent unwanted leakage.
[0035]
As discussed above, the present invention absorbs heat from both the processor 101 and the voltage regulator 103 simultaneously while advantageously placing the voltage regulator 103 and the memory module 121 near the processor 101 for high speed operation. An efficient and compact cooling method and cooling apparatus configured as described above are provided. Within the scope of the appended claims, the present invention may be practiced in situations other than those specifically shown and illustrated.
[Brief description of the drawings]
FIG. 1 is a perspective view of a preferred embodiment of the present invention by an isometric method.
FIG. 2 is an enlarged perspective view showing a sandwich structure including a voltage regulator, a cooling plate and a processor shown in FIG. 1;
3 is an exploded perspective view of the sandwich structure shown in FIG. 2. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 100 Cooling device 101 Processor 103 Companion voltage regulator 105, 109 Electrical coupling 107 Printed wiring board 110 Mounting tool 111 Cooling plate 113 Heat exchanger 115, 117 Fluid conduit 119 Electric pump 121 Memory module L Length dimension T Thickness dimension

Claims (10)

A processor requiring at least one bias voltage;
A voltage regulator for supplying the bias voltage,
Electrical coupling between the voltage regulator and the processor to communicate the bias voltage to the processor ;
At least one cold plate sandwiched in a state of transferring heat between the processor and the voltage regulator and configured to simultaneously absorb heat from the processor and the voltage regulator ;
Including a cooling device for a processor and a voltage regulator. The cooling plate has a first main surface and a second main surface opposite to the first main surface,
The voltage regulator has a main surface that conducts heat with the first main surface of the cooling plate,
The processor has a main surface that conducts heat with the second main surface of the cooling plate.
Cooling apparatus for processors and voltage regulator of claim 1. In order to limit the inductance of the electrical coupling, the voltage regulator is arranged sufficiently close to the processor, the cooling device for the processor and voltage regulator of claim 1. Disposed close between the processor and the voltage regulator is in the range of about 2 millimeters to about 25 millimeters, the cooling device for the processor and voltage regulator of claim 3. The length of the electrical coupling between the voltage regulator and the processor in order to limit the inductance of the electrical coupling is in the range from about 2 millimeters to about 25 millimeters processor of claim 1 a cooling device for the voltage regulator. Inductance of electrical coupling between the voltage regulator and the processor is in the range of about 0.15 nH to about 0.6 nH, the cooling device for the processor and voltage regulator of claim 1. A memory module ;
Electrical coupling between the memory module and the processor for transmitting signals between them ;
Further comprising a, in order to suppress the delay of signals passing through the electrical coupling propagation, placing the memory module sufficiently close to the processor, the cooling device for the processor and voltage regulator of claim 1. Providing a voltage regulator, a processor, and an electrical coupling for communicating at least one bias voltage therebetween;
Sandwiching a cooling plate with heat transfer between the processor and the voltage regulator;
Simultaneously absorbing heat from the processor and the voltage regulator using the cold plate ;
Including a method of cooling the processor and voltage regulator. In order to limit the inductance of the electrical coupling, further comprising, a method of cooling the processor and voltage regulator of claim 8 the step of disposing the voltage regulator sufficiently close to the processor. Providing a memory module, the method comprising transmitting a signal therebetween and electrically couple with said memory module and the processor,
Placing the memory module close enough to the processor to suppress propagation delay of signals through the electrical coupling ;
Including a method of cooling the processor and voltage regulator of claim 8.

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