JPS63292661A - Method of packaging electronic circuit - Google Patents

Method of packaging electronic circuit

Info

Publication number
JPS63292661A
JPS63292661A JP12693487A JP12693487A JPS63292661A JP S63292661 A JPS63292661 A JP S63292661A JP 12693487 A JP12693487 A JP 12693487A JP 12693487 A JP12693487 A JP 12693487A JP S63292661 A JPS63292661 A JP S63292661A
Authority
JP
Japan
Prior art keywords
board
sub
frame
water
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12693487A
Other versions
JPH0644598B2 (en
Inventor
Yoshimitsu Sakakawa
Original Assignee
Nippon Telegr & Teleph Corp <Ntt>
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegr & Teleph Corp <Ntt> filed Critical Nippon Telegr & Teleph Corp <Ntt>
Priority to JP12693487A priority Critical patent/JPH0644598B2/en
Publication of JPS63292661A publication Critical patent/JPS63292661A/en
Publication of JPH0644598B2 publication Critical patent/JPH0644598B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Abstract

PURPOSE: To package an electronic circuit, wherein LSIs characterized by large amounts of heating and wirings are provided at a high packaging density, and to facilitate maintenance, by fixing the heat conducting plate of a sub-board to the frame of a mother board, and electrically connecting the sub-board and the mother board with connectors.
CONSTITUTION: In a sub-board 3, the wiring of an LSI 8 is connected to a large wiring substrate 1, which is connected with a heat conducting plate 7 and a water cooled frame 2 from a small wiring substrate 6 through a connector 4. Meanwhile, heat, which is yielded in the LSI 8, is conducted to cooling water in a cooling water pipe 5, which is connected to the water cooling pipe 2 through a heat conductor 9, a heat conducting plate 7 and the water cooling frame 2. The sub-board 3 and a mother board, wherein the water cooling frame 2 and the large wiring substrate 1 form a unitary body, can be readily attached and removed by using screwes and the like. Therefore, a plurality of the boards can be used in the laminated mode by making the size of the sub-board 3 to agree with the size of the space between the water cooling space. Thus, a high heat yielding density can be realized.
COPYRIGHT: (C)1988,JPO&Japio
JP12693487A 1987-05-26 1987-05-26 Electronic circuit implementation method Expired - Lifetime JPH0644598B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12693487A JPH0644598B2 (en) 1987-05-26 1987-05-26 Electronic circuit implementation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12693487A JPH0644598B2 (en) 1987-05-26 1987-05-26 Electronic circuit implementation method

Publications (2)

Publication Number Publication Date
JPS63292661A true JPS63292661A (en) 1988-11-29
JPH0644598B2 JPH0644598B2 (en) 1994-06-08

Family

ID=14947516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12693487A Expired - Lifetime JPH0644598B2 (en) 1987-05-26 1987-05-26 Electronic circuit implementation method

Country Status (1)

Country Link
JP (1) JPH0644598B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device
US7345883B2 (en) 1992-05-20 2008-03-18 Seiko Epson Corporation Processing device

Also Published As

Publication number Publication date
JPH0644598B2 (en) 1994-06-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term