JP3778162B2 - Electronic component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component such as a flip chip on a substrate.
[0002]
[Prior art]
In an electronic component mounting apparatus, an electronic component in a component supply unit is picked up by a mounting head, conveyed to a mounting position on a substrate, and mounted. Electronic components such as flip chips are often supplied in a state where they are stored in a tray or the like in a component supply unit. When an electronic component in such a supply form is picked up by a suction nozzle of a mounting head, it is held by the suction nozzle. In general, the electronic component in the above state is displaced from the normal position of the suction nozzle.
[0003]
And if the electronic component is mounted on the board in such a misalignment state, the mounting position will be misaligned. Therefore, an electronic component mounting apparatus provided with a positioning portion in the vicinity of the substrate holding table for correcting this misalignment in advance is used. As such a positioning part, one having an alignment surface for alignment is known (for example, see Patent Document 1).
[0004]
The positioning unit using the alignment surface lowers the mounting head holding the electronic component on the suction holding surface on the lower surface with respect to the positioning unit, and causes the mounting head to perform a predetermined alignment operation so that the electronic component is made to be the alignment surface. Thus, the electronic component is aligned with the normal position of the mounting head.
[0005]
[Patent Document 1]
JP-A 64-82700 (FIG. 3)
[0006]
[Problems to be solved by the invention]
However, in the electronic component mounting apparatus described in Patent Document 1, if any abnormality occurs, such as an erroneous attachment of the suction tool due to human error or an incorrect setting of the operation parameter, the electronic head is not the electronic component in the alignment operation. The tool itself interferes with the alignment surface of the positioning part. The conventional electronic component mounting apparatus does not have a function to cope with the above-described interference during the alignment operation, and if the alignment operation is continued as it is, a device such as a suction tool may be damaged.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that can prevent equipment damage in an alignment operation for positioning an electronic component held by a mounting head.
[0008]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that mounts an electronic component on a substrate by a mounting head, and holds the substrate by component holding means for holding the electronic component on a lower surface of the mounting head. Board holding means, and positioning means for positioning an electronic component provided adjacent to the board holding means and held by the mounting head in a horizontal direction with respect to the mounting head. An alignment tool that is provided with an alignment surface corresponding to the outer shape planar shape and is held via a horizontal support shaft, alignment position holding means that holds the alignment tool in a normal position, and the alignment tool with respect to the mounting head Moving means for relatively moving in the horizontal and vertical directions, and controlling the moving means to align the alignment tool. And an alignment operation control means for causing the tool to perform a predetermined alignment operation. If interference occurs between the mounting head and the alignment tool in the alignment operation, the alignment tool releases the interference by rotation around the support shaft. Move in the direction.
[0009]
The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein when the interference between the mounting head and the alignment tool is released, the alignment tool is automatically returned to the normal position. A position returning means is provided.
[0010]
According to the present invention, the positioning means for positioning the electronic component held by the mounting head in the horizontal direction, the alignment tool held via the horizontal support shaft is held in the normal position, and the alignment tool is mounted. By performing a predetermined alignment operation by moving the head relative to the head in the horizontal and vertical directions, if there is interference between the mounting head and the alignment tool during the alignment operation, the alignment tool supports it. By rotating around the shaft, it can be moved in the direction of canceling the interference, and damage to the device can be reliably prevented.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a component positioning unit of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4, FIG. 5 and FIG. 6 are operation explanatory views of the component positioning operation in the electronic component mounting apparatus according to the embodiment of the present invention, FIG. 7 and FIG. These are the block diagrams of the component positioning unit of the electronic component mounting apparatus of one embodiment of this invention.
[0012]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, the electronic component mounting apparatus has a configuration in which a mounting head 10 is disposed above a moving table 1. A suction tool 10 a that holds electronic components by vacuum suction is mounted on the lower surface of the mounting head 10. The suction tool 10a and the suction means (not shown) for vacuum suction from the suction tool 10a are component holding means for holding electronic components. The mounting head 10 is raised and lowered by the head moving mechanism 3, and the head moving mechanism 3 is controlled by the control unit 2.
[0013]
The moving table 1 has a structure in which a moving plate 4 is mounted on an orthogonal table in which an X-axis table 1X and a Y-axis table 1Y are stacked. Arranged on the upper surface of the moving plate 4 are a component tray 5 for supplying electronic components 6 in a predetermined arrangement, and a substrate holder 7 (substrate holding means) for holding a substrate 8 on which the electronic components 6 are mounted. A component positioning unit 9 is disposed adjacent to the holding unit 7.
[0014]
The X-axis table 1X and the Y-axis table 1Y are controlled by the control unit 2, and by driving the X-axis table 1X and the Y-axis table 1Y, the moving plate 4 is moved horizontally relative to the mounting head 10, and the parts The tray 5, the substrate 8, and the component positioning unit 9 can be positioned directly below the mounting head 10.
[0015]
In the electronic component mounting operation, the electronic component 6 is first picked up from the component tray 5 by the suction tool 10a mounted on the lower surface of the mounting head 10 with the component tray 5 positioned immediately below the mounting head 10. Next, after moving the component positioning unit 9 directly below the mounting head 10, the mounting head 10 is lowered with respect to the component positioning unit 9.
[0016]
Then, the moving plate 4 is moved to move the mounting head 10 horizontally relative to the component positioning unit 9 to perform an alignment operation for determining the horizontal position of the electronic component 6. Thereby, the horizontal positioning of the electronic component 6 in the state hold | maintained at the adsorption | suction tool 10a is performed. The board positioning unit 9 serves as a positioning means for positioning the electronic component 6 held by the mounting head 10 with respect to the mounting head 10 in the horizontal direction.
[0017]
Thereafter, the substrate 8 is moved below the mounting head 10 and the component mounting operation by the mounting head 10 is performed. Prior to this mounting, the image pickup unit 11 is advanced between the board 8 and the mounting head 10 to perform board recognition and component recognition. In the component mounting operation by the mounting head 10, the electronic component 6 is aligned with the substrate 8 based on the position recognition result of the substrate 8 and the electronic component 6.
[0018]
Next, the structure of the component positioning unit 9 will be described with reference to FIGS. In FIG. 2, a substantially box-shaped collection box 14 is disposed at the center of the base member 12 with the opening facing upward. The collection box 14 accommodates and collects the electronic component 6 that has dropped from the suction tool 10a during the alignment operation. At both diagonal positions of the collection box 14, an L-shaped alignment tool 13 is arranged with the L-shaped inner surface abutting against the outer surface 14 a of the collection box 14.
[0019]
As shown in FIG. 3, the L-shaped inner surface of the alignment tool 13 is alignment surfaces 13 </ b> X and 13 </ b> Y provided for positioning the horizontal position of the electronic component 6, and corresponds to the outer shape planar shape of the electronic component 6. And a right-angled corner. As will be described later, the electronic component 6 is positioned in the horizontal direction by performing an alignment operation in which the end surface of the electronic component 6 is pressed along the alignment surfaces 13X and 13Y.
[0020]
The alignment tool 13 is fastened to the upper surface of the holding member 13a, and a hinge portion 13b is provided on the lower surface of the holding member 13a. The hinge portion 13b is sandwiched between two bearing portions 12a provided on the upper surface of the base member 12, and is pin-coupled by a support shaft 17 in the horizontal direction. Accordingly, the two alignment tools 13 are held via the support shaft 17 and are allowed to rotate around the support shaft 17. In this rotation, the position of the rotation in the inner direction is regulated by the alignment tool 13 coming into contact with the outer surface 14a of the collection box 14, and only the rotation displacement in the outer direction is allowed.
[0021]
On the side end surfaces of the two holding members 13 a, spring pins 15 are provided so as to extend in opposite directions, and a tension spring 16 is stretched between the two spring pins 15. Therefore, the alignment tool 13 is pulled inwardly via the spring pin 15 and the holding member 13a, whereby the inner surface of the alignment tool 13 is always held in contact with the outer surface 14a of the collection box 14.
[0022]
Here, the outer surface shape of the collection box 14 is shaped and arranged so that the alignment surfaces 13X and 13Y are held at the normal positions in a state where the alignment tool 13 is in contact. Therefore, the tension spring 16 and the outer surface 14a of the collection box 14 serve as alignment position holding means for holding the alignment tool 13 in the normal position.
[0023]
A plate dog 18 made of a thin plate member is extended and provided on the side surface of the holding member 13 a opposite to the spring mounting side, and the tip of the plate dog 18 is held by the sensor bracket 20 on the base member 12. It is located within 19 light shielding detection ranges. When the alignment tool 13 is rotationally displaced outwardly against the urging force of the tension spring 16, the tip of the plate dog 18 is displaced vertically within the light shielding detection range, and the light shielding state is changed by this displacement. The optical sensor 19 detects the rotation of the alignment tool 13.
[0024]
Next, an alignment operation for positioning the electronic component 6 in the horizontal direction will be described with reference to FIGS. The relative position of the electronic component 6 with respect to the suction tool 10a when picked up from the component tray 5 by the suction tool 10a of the mounting head 10 is not necessarily the correct position due to factors such as misalignment in the component tray 5. Of course, as shown in FIG. If position recognition is performed while leaving this misalignment state, a recognition error often occurs. Even when a recognition error does not occur, recognition accuracy often deteriorates.
[0025]
For this reason, prior to position recognition by the imaging unit 11, an alignment operation for adjusting the relative position of the electronic component 6 with respect to the suction tool 10a is performed. In the electronic component mounting apparatus shown in the present embodiment, this alignment is performed by controlling the head moving mechanism 3, the X-axis table 1 </ b> X, and the Y-axis table 1 </ b> Y by the control unit 2 to hold the alignment tool 13 with the electronic component 6. The alignment tool 13 is moved in the horizontal direction and the vertical direction relative to the mounting head 10 to cause the alignment tool 13 to perform a predetermined alignment operation.
[0026]
Therefore, the head moving mechanism 3, the X-axis table 1X, and the Y-axis table 1Y serve as moving means for moving the alignment tool 13 in the horizontal and vertical directions relative to the mounting head 10 holding the electronic component 6. The control unit 2 is an alignment operation control unit that controls the moving unit to cause the alignment tool 13 to perform a predetermined alignment operation.
[0027]
The alignment operation will be described. First, as shown in FIG. 4B, the suction tool 10 a holding the electronic component 6 is lowered to the middle between the two alignment tools 13. In this state, the position of the electronic component 6 relative to the suction tool 10a is in a misaligned state as it is at the time of pickup. At this time, as shown in FIG. 4 (c), the lowering stop position of the suction tool 10a is set so that only the electronic component 6 has a height (alignment height) in contact with the alignment surfaces 13X and 13Y of the alignment tool 13. Is done.
[0028]
Next, an operation for pressing the electronic component 6 against the alignment surfaces 13X and 13Y is performed. That is, as shown in FIG. 5A, the suction tool 10a is moved in the directions of arrows x and y so that the end surface of the electronic component 6 is pressed against the alignment surfaces 13X and 13Y of the alignment tool 13 on one side. Thereby, the electronic component 6 is pressed against the corner portion of the alignment surfaces 13X and 13Y of the alignment tool 13, and the relative position with respect to the suction tool 10a is positioned at the normal position. The reference of the normal position is the outer surface 14a of the collection box 14, and the component positioning unit 9 is arranged on the moving plate 4 with reference to the outer surface 14a.
[0029]
This tracing operation is performed in the same manner for the alignment tool 13 on the other side located at the opposite position as shown in FIG. By performing the following operation on the two alignment tools 13 arranged opposite to each other, even if the electronic component 6 is displaced in any direction with respect to the suction tool 10a, FIG. As shown, the electronic component 6 is correctly positioned with respect to the suction tool 10a.
[0030]
Next, interference between the mounting head 10 and the alignment tool 13 in the alignment operation will be described with reference to FIG. In the alignment operation, only the electronic component 6 is brought into contact with the alignment tool 13 by stopping the suction tool 10a at a preset alignment height as described above. However, due to erroneous attachment of the suction tool 10a or human error when setting the alignment height, as shown in FIG. 6A, the suction tool 10a itself may come into contact with the alignment tool 13 in the alignment operation. .
[0031]
FIG. 6B shows a state in which the suction tool 10a is further moved in the direction of pressing against the alignment tool 13 when the alignment height is erroneously set in this way. When the suction tool 10a moves in the direction of the arrow, interference with the alignment tool 13 occurs.
[0032]
Even in such a case, the alignment tool 13 is held so as to be allowed to rotate around the support shaft 17 via the holding member 13a. It rotates about the support shaft 17 against the urging force 16 (see FIGS. 1 and 2). That is, if interference between the suction tool 10 a of the mounting head 10 and the alignment tool 13 occurs in the alignment operation, the alignment tool 13 moves in a direction to cancel the interference due to the rotational displacement around the support shaft 17.
[0033]
Due to the rotation of the alignment tool 13 due to this interference, the plate dogs 18 attached to the holding member 13 a are both rotationally displaced around the support shaft 17. Then, when the optical sensor 19 detects this displacement, it is possible to automatically detect the abnormal rotation of the alignment tool 13, that is, the occurrence of abnormality in which the alignment tool 13 that should be originally in the fixed position is displaced. When this detection result is received, the operation of the mounting head 10 is stopped and a notification means such as a monitor screen or an indicator lamp provided in the electronic component mounting apparatus is notified.
[0034]
Upon receiving this notification, when the mounting head 10 is moved away from the component positioning unit 9, the alignment tool 13 is again pressed against the outer surface of the collection box 14 by the urging force of the tension spring 16, and is brought into the normal position. Return. Accordingly, the tension spring 16 serves as a position returning means for automatically returning the alignment tool 13 to the normal position when the interference between the mounting head 10 and the alignment tool 13 is released.
[0035]
In the above embodiment, an example in which the alignment tool 13 is automatically returned to the normal position is shown. However, a configuration in which the component pressing load during the alignment operation is held only by the weight of the alignment tool 13 may be used. In this case, when the interference with the mounting head 10 occurs, the alignment tool 13 falls around the support shaft 17, thereby releasing the interference with the mounting head 10.
[0036]
As described above, in the electronic component mounting apparatus shown in the present embodiment, by adopting the above-described configuration for the component positioning unit 9, it is generated in the positioning unit having the same function provided in the conventional electronic component mounting apparatus. If there is any abnormality, such as incorrect attachment of the suction tool due to human error or incorrect setting of the alignment height, the mounting head interferes with the fixed alignment tool. As a result, there is no possibility of equipment damage or machine troubles due to continued operation.
[0037]
FIGS. 7 and 8 show examples of component positioning units 9A and 9B having a configuration different from that of the component positioning unit 9 and having the same component positioning function. The component positioning units 9A and 9B shown in FIGS. 7 and 8 are examples using alignment tools 13A and 13B in which the two alignment tools 13 shown in FIGS. 1 and 2 are integrated in a frame shape. The alignment tools 13A and 13B are each provided with a rectangular opening in plan view, and the inner surface of the opening is an alignment surface having the same function as the alignment surfaces 13X and 13Y.
[0038]
In the example shown in FIG. 7, the alignment tool 13 </ b> A is held by an integral substantially U-shaped holding member 21, and the bottom of the holding member 21 is pivotally supported on the base member 12 </ b> A by a horizontal support shaft 22. A recovery box 14 similar to that shown in FIG. 1 is disposed below the alignment tool 13A. When interference similar to that described above occurs in the above configuration, the alignment tool 13A is integrally rotated around the support shaft 22 as shown in FIG. Breakage can be prevented.
[0039]
In the example shown in FIG. 8, the lower part of the alignment tool 13B is hinged to the plurality of link members 23 by the support shaft 24, and the lower end of the link member 23 is similarly linked to the base member 12B. Therefore, the alignment tool 13B is held by the base member 12B via the horizontal support shaft 24. In this configuration, when the same interference as described above occurs, the alignment tool 13B maintains the horizontal posture by rotating each link member 23 around the support shaft 24 as shown in FIG. 8B. Move horizontally. This can similarly prevent the suction tool 10a from being damaged.
[0040]
【The invention's effect】
According to the present invention, the positioning means for positioning the electronic component held by the mounting head in the horizontal direction, the alignment tool held via the horizontal support shaft is held in the normal position, and the alignment tool is mounted. Since the predetermined alignment operation is performed by moving the head relative to the head in the horizontal direction and the vertical direction, if interference occurs between the mounting head and the alignment tool during the alignment operation, the alignment tool is supported by the support shaft. By rotating around, it can be moved in the direction to cancel the interference, and it is possible to reliably prevent damage to the equipment and machine trouble.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a component positioning unit of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a plan view of a component positioning unit of the electronic component mounting apparatus according to the embodiment. FIG. 4 is an operation explanatory diagram of the component positioning operation in the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6 is an operation explanatory diagram of component positioning operation in the electronic component mounting apparatus of FIG. 6. FIG. 6 is an operation explanatory diagram of component positioning operation in the electronic component mounting apparatus of one embodiment of the present invention. Configuration diagram of component positioning unit of component mounting apparatus [FIG. 8] Configuration diagram of component positioning unit of electronic component mounting apparatus according to an embodiment of the present invention
DESCRIPTION OF SYMBOLS 1 Moving table 2 Control part 3 Head moving mechanism 6 Electronic component 7 Board | substrate holding | maintenance part 8 Board | substrate 9 Component positioning unit 10 Mounting head 10a Adsorption tool 13,13A, 13B Alignment tool 13X, 13Y Alignment surface 16 Tension spring 17 Support shaft 17

Claims (2)

An electronic component mounting apparatus for mounting an electronic component on a substrate by a mounting head, the component holding means for holding the electronic component on the lower surface of the mounting head, the substrate holding means for holding the substrate, and adjacent to the substrate holding means And positioning means for positioning the electronic component held by the mounting head in a horizontal direction with respect to the mounting head,
The positioning means includes an alignment tool that is provided with an alignment surface corresponding to the outer shape planar shape of the electronic component and is held via a horizontal support shaft, and an alignment position holding means that holds the alignment tool at a normal position. A moving means for moving the alignment tool in a horizontal direction and a vertical direction relative to the mounting head; and an alignment operation control means for controlling the moving means to cause the alignment tool to perform a predetermined alignment operation. ,
The electronic component mounting apparatus according to claim 1, wherein when the interference between the mounting head and the alignment tool occurs in the alignment operation, the alignment tool moves in a direction to cancel the interference by rotation around the support shaft. 2. The electronic component mounting apparatus according to claim 1, further comprising position returning means for automatically returning the alignment tool to a normal position when interference between the mounting head and the alignment tool is released.

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