JP3773517B2 - Plasma display panel - Google Patents

Description

  The present invention relates to a structure for improving the display quality of a gas discharge display device, particularly a panel (plasma display panel) thereof.

  FIG. 5 shows a planar configuration of a general alternating current (AC) plasma display panel (PDP).

  In the PDP constituting the panel portion of the gas discharge display device, the first substrate and the second substrate are sealed at the end portions thereof and sealed with a sealing material made of frit glass or the like, and the gas is sealed in the gap. A discharge space 22 is formed. A plurality of discharge cells are formed in a matrix in the discharge space 22, and the phosphor 34 is caused to emit light by controlling discharge / non-discharge of each discharge cell, thereby performing a desired image display.

  The first substrate has a front glass substrate (hereinafter referred to as FP substrate) 10, and on this FP substrate 10, sustain electrode wiring (hereinafter referred to as X electrode wiring) 12 constituting a pair of display electrode wirings and scanning / maintenance. Electrode wiring (hereinafter referred to as Y electrode wiring) 14 is formed in a stripe shape. The X / Y electrode wirings 12 and 14 are made of a three-layer structure of Cr / Cu / Cr formed by photolithography, Au formed by screen printing (also referred to as thick film printing), or the like. In addition, a dielectric layer 18 is formed on almost the entire surface of the FP substrate 10 so as to cover the X electrode wiring 12 and the Y electrode wiring 14, and is further made of MgO that functions as a cathode during discharge so as to cover the dielectric layer 18. A discharge electrode layer (also referred to as a discharge protective layer, hereinafter referred to as an MgO layer) 20 is formed.

  On the other hand, the second substrate has a rear glass substrate (hereinafter referred to as BP substrate) 30, and address electrode wirings 32 extending in a direction orthogonal to the X / Y electrode wirings 12 and 14 are formed on the BP substrate 30. Has been. In an area corresponding to the display area of the PDP, a phosphor 34 of red (R), green (G), or blue (B) is formed on each address electrode wiring 32 correspondingly, and each address electrode is formed. Barrier portions (hereinafter referred to as ribs) are formed by screen printing in the gaps between the wirings 32 to prevent light crosstalk from occurring between adjacent address electrode wirings 32, that is, between discharge cells.

  The discharge cells are respectively formed at the intersections of the address electrode wiring 32 and the X electrode wiring 12 and the Y electrode wiring 14 orthogonal thereto. Then, by applying an address pulse to the address electrode wiring 32 and simultaneously applying a scanning pulse to the Y electrode wiring 14, a discharge cell at the intersection is selected, and the discharge cell is discharged (address writing discharge) to accumulate wall charges. To do. After that, by applying a sustain pulse alternately to the Y electrode wiring 14 and the X electrode wiring 12, a sustain discharge is generated between the Y electrode wiring 14 and the X electrode wiring 12, and the discharge is maintained. The phosphor 34 formed along the address electrode wiring 32 is excited by ultraviolet rays generated by the discharge in each discharge cell to generate visible light.

Japanese Patent Laid-Open No. 9-222656

  Although it is possible to display images by controlling each discharge cell as described above, it is desired as a display device to display images with higher image quality. In order to perform display with high image quality, it is necessary to prevent reflection of external light, improve the display contrast of each discharge cell of the PDP, and further improve the light emission efficiency in the discharge cell.

  However, manufacturing costs must be reduced while enabling high display quality. In order to reduce the cost, it is advantageous to form each layer using screen printing as compared with a thin film process by photolithography. Therefore, it is desired to obtain a PDP that can be stably formed by screen printing and has high display quality.

  The present invention has been made to solve the above-described problems, and an object thereof is to obtain a plasma display panel having high display quality.

The plasma display panel of the present invention is a panel of a display device for performing a desired display by discharging a gas sealed between a pair of substrates arranged opposite to each other, and arranged on one substrate in a matrix form A pair of display electrode lines for scanning each of the discharge cells thus formed and maintaining the discharge is formed, and the pair of display electrode lines is formed on the transparent electrode formed on the substrate and the transparent electrode. The bus electrode is made of a material containing silver such that at least the side in contact with the transparent electrode is black, and the display electrode wiring is made to flow molten glass over the molten tin. Formed on a non-tin surface of a glass substrate manufactured by a float method, and a dielectric layer for insulating each electrode wiring is provided on the display electrode wiring, and the dielectric Ri substantially equal to or greater than der softening point and the firing temperature of the bus electrode layer, the pair of display electrode lines and between the other adjacent pair of display electrode lines, line-shaped black dielectric layer is formed on top of the black dielectric layers that have a light reflecting material layer is formed.

  In the plasma display panel according to another aspect of the present invention, the display electrode wiring is formed on a film coated on a non-tin surface of a glass substrate manufactured by a float process in which molten glass is poured onto molten tin. Form.

In the plasma display panel according to another aspect of the present invention, the film coated on the non-tin surface of a glass substrate manufactured by a float process in which the molten glass is flowed onto the molten tin is SiO ₂ . .

In the plasma display panel according to another aspect of the present invention, the composition of the dielectric layer for insulating each electrode wiring formed on the display electrode wiring is such that PbO is 60 wt% to 65 wt%, and B ₂ O ₃ is B ₂ O _3. The range is 1 wt% to 5 wt%, SiO ₂ is 25 wt% to 30 wt%, Al ₂ O ₃ is 1 wt% to 5 wt%, and ZnO is 1 wt% to 5 wt%.

  In the plasma display panel according to another aspect of the present invention, a dielectric having a softening point lower than a softening point of the dielectric layer is formed on the dielectric layer for insulating each electrode wiring formed on the display electrode wiring. A body layer is formed.

In the plasma display panel according to another aspect of the present invention, the composition of the dielectric layer formed on the dielectric layer for insulating each electrode wiring formed on the display electrode wiring is such that the PbO is 60 wt. % -65 wt%, B ₂ O ₃ is 10 wt% -15 wt%, SiO ₂ is 10 wt% -15 wt%, Al ₂ O ₃ is 1 wt% -5 wt%, and ZnO is 1 wt% -5 wt%.

  In the plasma display panel according to another aspect of the present invention, a light reflecting layer is formed on the bus electrode.

In the plasma display panel according to another aspect of the present invention, the light reflecting material layer formed on the line-shaped black dielectric layer is formed using a white dielectric material .

As described above, according to the present invention, it is possible to form a low-resistance electrode by using Ag as the material of the bus electrode and using Ag containing a black additive in the black conductive material. In this case, by forming the display electrode wiring on the non-tin surface side of the soda glass substrate, it becomes possible to prevent discoloration of the substrate and the electrode due to diffusion of Ag as the electrode material. Further, a material having a softening point substantially equal to or higher than the firing temperature of the bus electrode is used as the dielectric layer formed on the display electrode wiring. Therefore, when the firing of the dielectric layer in baking the same firing temperature of the bus electrode is also, the dielectric layer is prevented from resulting fusion only be completely softened, and Ag of the bus electrode material dielectric It is possible to prevent diffusion into the body layer and disconnection of the bus electrode. Furthermore, by providing a black dielectric layer between a pair of display electrode wirings and a pair of adjacent display electrode wirings, the display contrast can be further improved. Further, by forming a light reflecting material on the side of the black dielectric layer facing the second substrate, the light use efficiency in the discharge cell is improved, and as a result, the display contrast can be further increased.

  Also, since at least the side of the bus electrode that contacts the transparent electrode is black, light generated in the adjacent discharge cells is difficult to leak, and external light is prevented from being reflected on the surface of the bus electrode on the display surface side of the display. Therefore, the display contrast can be further improved.

In this invention, the diffusion of Ag to the substrate can be more reliably prevented by forming the display electrode wiring on a film that coats the non-tin surface of the glass substrate, for example, a film such as SiO _2. .

  In addition, by forming a dielectric layer having a softening point lower than that of the dielectric layer formed on the display electrode wiring as described above, the upper dielectric layer is sintered. In this case, the upper dielectric layer can be sufficiently melted without softening the lower dielectric layer, and the surface of the upper dielectric layer on the side facing the second substrate can be smoothed. It becomes possible.

  The lower dielectric layer and the upper dielectric layer can have different intended softening points by adjusting the composition ratio of the materials as described above.

  In the present invention, since the light reflection layer is provided on the bus electrode, the upper layer of the bus electrode reflects the light, so that the utilization efficiency of the light emitted from the phosphor can be increased and the display quality can be improved. be able to.

  Further, according to the present invention, the white dielectric material is used as the light reflecting material layer formed on the black dielectric layer between the pair of display electrode wirings, thereby efficiently reflecting the light emitted from the phosphor. Can be made.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG.
A panel (PDP) of a gas discharge display device is formed by sealing a first substrate and a second substrate with a sealing material such as frit glass at the end portions thereof, and enclosing a gas in a gap. Yes.

  FIG. 1 shows a schematic configuration of a display area of the PDP according to the first embodiment.

  In FIG. 1, the first substrate has an FP substrate 10, and a sustain electrode wiring (X electrode wiring) 12 and a scan / sustain electrode wiring (Y electrode wiring) constituting a pair of display electrode wirings on the FP substrate 10. 14 are formed in stripes.

  The X electrode wiring 12 and the Y electrode wiring 14 are composed of transparent electrodes 12b and 14b and bus electrodes (mother electrodes) 12a and 14a. The transparent electrodes 12b and 14b are made of, for example, indium tin oxide ITO, and are formed on the FP substrate 10 side by photolithography, screen printing, or the like. The bus electrodes 12a and 14a are made of a black conductive material, specifically black and a low-resistance metal material (for example, Ag, Au containing black colorant), and a screen is formed on the transparent electrodes 12b and 14b. It is formed by printing. The X electrode wiring 12 and the Y electrode wiring 14 are formed in the same process by, for example, screen printing. The X electrode wiring 12 and the Y electrode wiring 14 correspond to one pair of scanning lines (for example, n, n + 1, n + 2), and between each scanning line (for example, the Y electrode wiring 14 of the n scanning line and A black stripe (BS) 16 constituting a black dielectric layer is formed between the X electrode wiring 12 of the (n + 1) scanning line. The BS 16 is made of a dielectric material, and is provided to prevent crosstalk due to light emission on adjacent scanning lines and improve contrast.

  A dielectric layer 18 is formed on almost the entire surface of the FP substrate 10 so as to cover the X electrode wiring 12, the Y electrode wiring 14 and the BS 16. In addition, a discharge electrode layer 20 (hereinafter referred to as a protective film) made of MgO that functions as a cathode during discharge and also functions as a protective film for the dielectric layer 18 is formed by sputtering or vapor deposition so as to cover the dielectric layer 18. Has been.

  The second substrate includes a BP substrate 30, and address electrode wirings 32 extending in a direction orthogonal to the X / Y electrode wirings 12 and 14 are formed on the BP substrate 30. In order to improve the brightness of the panel, a white glaze layer 42 which is a white dielectric layer is formed on almost the entire surface of the BP substrate 30 so as to cover the address electrode wiring 32. Ribs (barrier portions) 36 are formed in the gap positions of the address electrode lines 32 on the white glaze layer 42 to prevent light crosstalk between adjacent address electrode lines 32, that is, between discharge cells. is doing.

  Phosphors 34 are respectively formed on the wall surfaces of the address electrode wiring 32 and the corresponding rib 36.

  Each discharge cell is formed at each intersection of the address electrode wiring 32 and the X electrode wiring 12 and Y electrode wiring 14 orthogonal thereto, and a plurality of discharge cells are arranged in a matrix in the display area of the PDP. By applying an address pulse to the address electrode wiring 32 and simultaneously applying a scanning pulse to the Y electrode wiring 14 that can be individually driven for each scanning line, a predetermined discharge cell is selected and wall charges are accumulated. After the wall charges are accumulated, a sustain pulse is alternately applied to the X electrode wiring 12 and the Y electrode wiring 14 that are formed as a common electrode in the panel, and the Y electrode wiring 14 and the Y electrode wiring 14 as shown in FIG. A sustain discharge is generated between the X electrode wiring 12 and the discharge is maintained. In the first embodiment, R, G, and B phosphors 34 are arranged in a stripe pattern as shown in FIG. 1, and the RGB phosphors 34 are caused to emit light by controlling the discharge in each discharge cell. And get a color image across the screen.

In the configuration as described above, in the first embodiment, as described above, an Ag material containing a black additive (RuO ₂ or the like) is used as the bus electrodes 12a and 14a. Therefore, the bus electrodes 12a and 14a have a black color tone.

  In the AC type PDP, the FP substrate 10 side is a display surface, and visible light emitted from the phosphor 34 is transmitted through the transparent electrodes 12b and 14b, so that light emission is displayed in each discharge cell. On the other hand, the formation regions of the bus electrodes 12a and 14a are not involved in the light emitting display. The same applies to adjacent scanning lines. If the light leaks between these bus electrodes 12a, 14a and the scanning lines or the external light is reflected, the display contrast is lowered. Therefore, BS16 is provided between the scanning lines to shield the gap and make it black. Furthermore, the bus electrodes 12a and 14a are black, so that external light from the display surface side of the FP substrate 10 can be prevented from being reflected by the surfaces of the bus electrodes 12a and 14a, and the display contrast can be improved. The black bus electrodes 12a and 14a can be formed by screen printing to reduce the manufacturing cost, but may be formed by photolithography. In either case, the bus electrode is formed of a metal material containing a black additive.

  A soda glass substrate is used as the FP substrate 10, and this soda glass substrate is generally formed by a float process in which molten glass is poured onto molten tin for manufacturing. In the glass substrate formed by this float method, a smooth surface close to the polished surface can be obtained on the tin surface (also referred to as the bottom surface) that comes into contact with molten tin. When Ag is formed, Ag easily diffuses into the substrate and turns yellowish brown.

Therefore, in the first embodiment, Ag bus electrodes 12a and 14a are formed on the non-tin surface (also referred to as a top surface) side that does not come into contact with molten tin in order to prevent discoloration that adversely affects quality. In order to more reliably prevent Ag from diffusing into the substrate, a coating film made of SiO ₂ is formed on the entire surface of the FP substrate 10 by sputtering or CVD (not shown).

FIG. 2 shows a more detailed cross-sectional configuration of the first substrate of the first embodiment. As shown in FIG. 2, in the first embodiment, a black Ag material is used for the bus electrodes 12a and 14a, and the dielectric layer 18 formed thereon has a multilayer structure (for example, two layers). Yes. The dielectric layer 18 can be made of lead glass or bismuth glass as a main component, but the lower dielectric layer 18b on the bus electrodes 12a and 14a side is made of a glass material [component component Examples: PbO (60-65 w%), B ₂ O ₃ (1-5 w%), SiO ₂ (25-30 w%), Al ₂ O ₃ (1-5 w%), ZnO (1-5 w%)] Use. The upper dielectric layer 18a is made of a glass material having a low softening point [examples of components: PbO (60 to 65 w%), B ₂ O ₃ (10 to 15 w%), SiO ₂ (10 to 15 w%), Al ₂ O ₃ (1-5 w%), ZnO (1-5 w%)]. The glass component is not limited to the above example, but the softening point of the glass can be lowered by increasing the compounding ratio of the component (for example, B ₂ O ₃ ) having a low oxygen-metal bond strength. -The glass softening point can be increased by increasing the compounding ratio of components having high metal bonding strength.

The softening point of the lower dielectric layer 18b is about + 10 ° C. near the firing temperature of the dielectric layer 18b, specifically, for example, the firing temperature of the Ag bus electrodes 12a and 14a formed by screen printing (usually 550 ° C.). Is set to The firing conditions for the lower dielectric layer 18b are the same as the firing conditions for the Ag bus electrodes 12a and 14a. Thus, by making the firing temperature and softening point of the lower dielectric layer 18b substantially equal, the lower dielectric layer 18b is not completely softened in the firing process of the lower dielectric layer 18b. In other words, it does not melt. When Ag is used as the bus electrodes 12a and 14a, if the dielectric layer is completely melted during firing, Ag diffuses into the dielectric layer 18 and there is a possibility of disconnection of the bus electrode or defective breakdown voltage. For this reason, diffusion of Ag is prevented by increasing the softening point of the lower dielectric layer 18b and preventing the lower dielectric layer 18b from melting completely even if the lower dielectric layer 18b is baked. .

  On the other hand, the softening point of the upper dielectric layer 18a formed by screen printing is set to a temperature sufficiently lower than the firing temperature of the dielectric layer and the softening point of the lower dielectric layer 18b, for example, about 500 ° C. For this reason, it sets so that a glass material may fully melt | dissolve by baking at about 550 degreeC. The upper dielectric layer 18a has a characteristic that the temperature at which the glass starts to flow is equal to or higher than the sealing temperature (about 450 ° C.) at the sealing portion.

  Since the protective film 20 is formed on the upper dielectric layer 18a, the surface is required to be smooth. Therefore, by lowering the softening point of the upper dielectric layer 18a, the upper dielectric layer 18a is sufficiently melted by firing to increase the smoothness of the surface. In addition, a sealing material is disposed on the upper dielectric layer 18a of the panel end portion between the opposing BP substrate 30. In the sealing process using the sealing material, the upper dielectric layer 18a is heated. Exposed to the process. For this reason, when the upper dielectric layer 18a flows during the sealing heat process, there is a tendency that a crack occurs in the protective film 20 in the vicinity of the upper dielectric layer 18a and triggers a discharge failure. Therefore, the upper dielectric layer 18a avoids these problems by selecting a material that does not flow at the sealing temperature.

  It should be noted that the dielectric layer having a multilayer structure in which the softening point of the lower layer is high and the softening point of the upper layer is set low is not limited to the case where Ag is used as the bus electrode. Also when used in the above, there is an effect in forming a stable dielectric layer. That is, after the electrodes are formed, the temperature of the electrodes and dielectric layers rises due to the refining even in the firing step of the dielectric layer 18 and the protective film 20 formed on the electrodes. It must be set to the same level as the temperature. Under such circumstances, it is necessary to maintain the smoothness of the surface of the dielectric layer 18 while preventing the electrode material from diffusing. In the case of a single dielectric layer 18, it is difficult to satisfy such a condition. However, if a dielectric layer 18 having a multilayer structure with different softening points is used, such a condition can be easily satisfied.

  In FIG. 2, the bus electrodes 12a and 14a are formed of a single Ag layer. However, a plurality of black Ag layers (for example, two layers) are formed (see FIG. 3 to be described later). 14a. If the electrode has a plurality of layers, the effect of preventing disconnection of the electrode is improved. In particular, when multi-layered black Ag is formed by screen printing a plurality of times, if the lower Ag layer and the upper Ag layer are printed with a slight shift in the longitudinal direction of the electrode pattern, disconnection is more reliably prevented. be able to.

Embodiment 2. FIG.
FIG. 3 shows the configuration of the first substrate of the second embodiment. In the second embodiment, the bus electrodes 12a and 14a have a multilayer structure, and a black metal material (for example, Ag mixed with a black additive material) is used for the lower bus electrode 13b as in the first embodiment. The upper bus electrode 13a is formed using a light reflecting material. Other configurations and materials are the same as those in the first embodiment.

  As the light reflecting material, a white or metallic luster non-colored metallic material (pure Ag, pure Au, etc.) that does not contain a black additive is applicable. Since the dielectric layer 18 and the MgO layer 20 are transparent, the upper bus electrode 13a substantially faces the phosphor 34 of the second substrate shown in FIG. Therefore, by using a material that reflects the light (visible light) emitted from the phosphor 34 for the upper bus electrode 13a, the light use efficiency can be improved, and as a result, the light emission efficiency can be improved and the contrast can be improved. . Pure Ag, pure Au, and the like that do not contain a coloring material have high visible light reflectivity, and thus can be efficiently reflected without absorbing visible light emitted from the phosphor 34. The lower bus electrode 13b is black as in the first embodiment to improve the display contrast on the display surface side.

  In addition, the bus electrodes 12a and 14a have a two-layer structure of a metal material, so that disconnection and resistance can be reduced. Furthermore, the upper bus electrode 13a and the lower bus electrode 13b can be formed by using the same printing screen, and the bus electrode 12 is printed by printing the electrode with a slight shift in the longitudinal direction of the electrode pattern during printing. , 14 can be more reliably prevented.

  As the metal material of these upper and lower bus electrodes formed by screen printing, for example, a material having a fine average particle size (for example, about φ = 0.5 μm) is used. In particular, by using a fine-grained material for the upper bus electrode 13a, the smoothness of the electrode surface is improved, the disconnection is prevented, and the stability of the upper dielectric layer 18 is improved. By reducing the particle size, the reflectance of visible light is also increased. Therefore, it is possible to further contribute to the improvement of contrast by using a metal material having a fine particle size as the metal material of the upper bus electrode 13a.

Embodiment 3 FIG.
FIG. 4 shows a cross-sectional configuration of the first substrate of the third embodiment. Other configurations are the same as those in the first or second embodiment.

  In the third embodiment, in order to further improve the light utilization efficiency, a white dielectric layer 19a made of a white dielectric material is formed on the upper layer of BS 16, that is, on the surface facing the second substrate, as a material having a high light reflectance. Forming. Similarly, a white dielectric layer 19b is formed on the upper layers of the bus electrodes 12a and 14a. By forming the white dielectric layer 19 on the portion on the opposite surface side of the second substrate, it is possible to reflect visible light from the phosphor 34 and increase the light utilization efficiency. The white dielectric layer 19b can be formed after the bus electrodes 12a and 14a are formed by using the same printing screen as that for the bus electrode, and the white dielectric layer 19a is also formed after the BS 16 is formed. Can be formed. However, you may form using the printing screen for exclusive use for white dielectric material layers.

  The bus electrodes 12a and 14a are configured by forming a single layer or a plurality of layers of a black electrode material (such as Ag mixed with a black additive material) as in the first embodiment. When a light reflecting material is used for the upper layer of the bus electrodes 12a and 14a as in the second embodiment, the white dielectric layer 19b may not be formed on the bus electrodes 12a and 14a. In this case, the white dielectric layer 19a is provided only on the surface of the BS16.

It is a figure which shows schematic structure of the plasma display which concerns on Embodiment 1 of this invention. FIG. 3 is a diagram showing a schematic cross-sectional configuration on the first substrate side of the plasma display of the first embodiment. It is a figure which shows schematic sectional structure by the side of the 1st board | substrate of the plasma display of Embodiment 2. FIG. 6 is a diagram showing a schematic cross-sectional configuration on the first substrate side of the plasma display of the third embodiment. It is a figure for demonstrating the basic composition of an AC type plasma display.

Explanation of symbols

10 FP substrate (glass substrate), 12 X electrode wiring (sustain electrode), 14 Y electrode wiring (scanning sustain electrode), 12a, 14a bus electrode, 12b, 14b transparent electrode, 13a upper bus electrode, 13b lower bus electrode, 16 BS (black dielectric layer), 18 dielectric layer, 18a Upper dielectric layer, 18b Lower dielectric layer, 19 White dielectric layer, 20 MgO layer, 22 Discharge space, 30 BP substrate, 32 Address electrode wiring, 34 Fluorescence Body layer, 36 ribs (barrier part), 42 white glaze layer.

Claims (8)

A panel of a display device for performing a desired display by discharging a gas sealed between a pair of substrates arranged opposite to each other,
On one substrate, a pair of display electrode wirings are formed for scanning each discharge cell arranged in a matrix and maintaining the discharge.
The pair of display electrode lines includes a transparent electrode formed on a substrate and a bus electrode formed on the transparent electrode,
The bus electrode is made of a material containing silver such that at least the side in contact with the transparent electrode is black, and the display electrode wiring is produced by a float method in which molten glass is poured out onto molten tin. It is formed on the non-tin surface of the manufactured glass substrate,
A dielectric layer for insulating each electrode wiring is provided on the display electrode wiring, and the softening point of the dielectric layer is approximately equal to or higher than the firing temperature of the bus electrode,
A line-shaped black dielectric layer is formed between the pair of display electrode lines and another pair of adjacent display electrode lines,
A plasma display panel, wherein a light reflecting material layer is formed on the black dielectric layer. The display electrode wiring according to claim 1, characterized in that formed on coated on the non-tin surface of the glass substrate produced by a float process for producing poured out the molten glass on molten tin film Plasma display panel. 3. The plasma display according to claim ₂ , wherein the film coated on the non-tin surface of a glass substrate manufactured by a float process in which the molten glass is poured out on molten tin is made of SiO _2. panel. The composition of the dielectric layer for insulating each electrode wiring formed on the display electrode wiring is 60 wt% to 65 wt% for PbO, 1 wt% to 5 wt% for B ₂ O ₃ , and 25 wt% to 30 wt% for SiO _2. %, Al ₂ O ₃ is 1 wt% to 5 wt%, the plasma display panel according to any one of claims 1 to 3, ZnO is characterized in that it is in the range of 1 wt% to 5 wt%. The composition of the dielectric layer formed on the dielectric layer for insulating each electrode wiring formed on the display electrode wiring is 60 wt% to 65 wt% for PbO and 10 wt% to B ₂ O _3. 5. The plasma display panel according to claim 4 , wherein 15 wt%, SiO ₂ is 10 wt% to 15 wt%, Al ₂ O ₃ is 1 wt% to 5 wt%, and ZnO is 1 wt% to 5 wt%. The plasma display panel according to any one of claims 1 to 5, characterized in that the light reflecting layer is formed on the bus electrode. A dielectric layer having a softening point lower than a softening point of the dielectric layer is formed on the dielectric layer for insulating each electrode wiring formed on the display electrode wiring. The plasma display panel according to any one of claims 1 to 6 . The light reflecting material layer is formed on the line-shaped black dielectric layer on any one of claims 1 to 7, characterized in that it is formed by using a white dielectric material The plasma display panel described.

Images