JP3773474B2

JP3773474B2 - Method and apparatus for cleaning and drying chip electronic components

Info

Publication number: JP3773474B2
Application number: JP2002248197A
Authority: JP
Inventors: 公信佐藤; 正彦今野; 寿粂; 武吉佐藤; 仁三浦
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 2002-08-28
Filing date: 2002-08-28
Publication date: 2006-05-10
Anticipated expiration: 2022-08-28
Also published as: CN1486796A; CN1240491C; JP2004082018A

Description

【０００１】
【発明の属する技術分野】
本発明は、チップ電子部品の洗浄乾燥方法及び装置に係り、とくに電気メッキ後の積層チップ電子部品等の洗浄、乾燥後の汚れ（シミ）を防止し、省力化を図った洗浄乾燥方法及び装置に関する。
【０００２】
【従来の技術】
従来、電気メッキ後のチップ電子部品の作業フローは、メディア分離後のチップ電子部品の超音波洗浄、水切り、アルコール置換（アルコール液中にチップ電子部品を浸漬する）、液切り、送風乾燥の順に行うようになっていた。
【０００３】
【発明が解決しようとする課題】
上記従来の作業フローは、溶剤置換（アルコール置換）作業工程があるため、作業環境に問題があった。また、アルコール置換を行っても乾燥後のチップ電子部品に汚れ（シミ）が残る場合があった。さらに、リードタイムも長くなる問題があった。
【０００４】
公知技術としては、薬液洗浄と水洗浄の両方を行うものとして特開２００１−２９９０３号公報等がある。
【０００５】
本発明は、上記の点に鑑み、溶剤置換を不要として作業環境を改善し、リードタイムの短縮、省力化を図り、さらに乾燥後のチップ電子部品の汚れ（シミ）低減を図ることが可能な洗浄乾燥方法及び装置を提供することを目的とする。
【０００６】
本発明のその他の目的や新規な特徴は後述の実施の形態において明らかにする。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、本願請求項１の発明に係るチップ電子部品の洗浄乾燥方法は、チップ電子部品を穴あき容器に収容して洗浄する洗浄工程と、該洗浄工程終了後に、前記穴あき容器に収容されたチップ電子部品に対して、空気吸引による脱水除滴を行う脱水除滴工程と、該脱水除滴工程終了後に前記穴あき容器に収容されたチップ電子部品を熱風により乾燥する熱風乾燥工程と、該熱風乾燥工程終了後に前記穴あき容器に収容されたチップ電子部品を送風により乾燥冷却する乾燥冷却工程とを備え、
前記脱水除滴工程では、前記穴あき容器の底面に対応する吸引筒を一体に有する第１の載置板と、上部に開口を持つ第１の筒状カバー本体及び該第１の筒状カバー本体の内側に設けられた第１の邪魔板を有する第１のカバーとを用い、前記第１の載置板上に前記穴あき容器を載置し、前記第１の邪魔板が前記穴あき容器の上面開口の上方位置となるようにし、前記第１の筒状カバー本体の下縁と前記第１の載置板との間を閉じた状態として前記吸引筒より空気吸引し、
前記熱風乾燥工程では、前記第１の載置板と前記第１のカバーとを引き続き用い、前記吸引筒より空気吸引を行うとともに前記第１の筒状カバー本体の開口に熱風を供給し、その後、前記吸引筒よりの空気吸引を停止するとともに前記第１の筒状カバー本体の下縁と前記第１の載置板との間を開いた状態として前記第１の筒状カバー本体の開口に熱風を供給することを特徴としている。
【０００８】
本願請求項２の発明に係るチップ電子部品の洗浄乾燥方法は、請求項１において、前記洗浄工程は、チップ電子部品を穴あき容器に収容して超音波洗浄する超音波洗浄工程であることを特徴としている。
本願請求項３の発明に係るチップ電子部品の洗浄乾燥方法は、請求項２において、前記超音波洗浄工程では洗浄水の電導度が２μＳ／cmを超えないように制御することを特徴としている。
【００１１】
本願請求項４の発明に係るチップ電子部品の洗浄乾燥方法は、請求項１，２又は３において、前記乾燥冷却工程では、前記穴あき容器の底面を支持する第２の載置板と、上部に開口を持つ第２の筒状カバー本体及び該第２の筒状カバー本体の内側に設けられた第２の邪魔板を有する第２のカバーとを用い、前記第２の載置板上に前記穴あき容器を載置し、前記第２の邪魔板が前記穴あき容器の上面開口の上方位置となるようにし、前記第２の筒状カバー本体の下縁と前記第２の載置板間に隙間を設けた状態にて前記第２の筒状カバー本体の開口に空気を供給することを特徴としている。
【００１２】
本願請求項５の発明に係るチップ電子部品の洗浄乾燥装置は、チップ電子部品を穴あき容器に収容して洗浄する洗浄部と、
前記穴あき容器の底面に対応する吸引筒を一体に有する第１の載置板と、上部に開口を持つ第１の筒状カバー本体及び該第１の筒状カバー本体の内側に設けられた第１の邪魔板を有する第１のカバーとを具備していて脱水除滴及び熱風乾燥を行う脱水乾燥部と、
前記穴あき容器に収容されたチップ電子部品を送風により乾燥冷却する乾燥冷却部とを備え、
前記脱水乾燥部では、前記第１の載置板上に前記穴あき容器を載置し、前記第１の邪魔板が前記穴あき容器の上面開口の上方位置となるようにし、前記第１の筒状カバー本体の下縁と前記第１の載置板との間を閉じた状態で前記吸引筒より空気吸引して脱水除滴し、また、前記脱水除滴後に前記吸引筒より空気吸引を行うとともに前記第１の筒状カバー本体の開口に熱風を供給して第１段階の熱風乾燥を行い、その後、前記吸引筒よりの空気吸引を停止するとともに前記第１の筒状カバー本体の下縁と前記第１の載置板との間を開いた状態で前記第１の筒状カバー本体の開口に熱風を供給して第２段階の熱風乾燥を行うことを特徴としている。
【００１３】
本願請求項６の発明に係るチップ電子部品の洗浄乾燥装置は、請求項５において、前記乾燥冷却部は、前記穴あき容器の底面を支持する第２の載置板と、上部に開口を持つ第２の筒状カバー本体及び該第２の筒状カバー本体の内側に設けられた第２の邪魔板を有する第２のカバーとを具備し、
前記第２の筒状カバー本体の開口から空気を供給して乾燥冷却することを特徴としている。
【００１４】
本願請求項７の発明に係るチップ電子部品の洗浄乾燥装置は、請求項５又は６において、前記洗浄部が、前記穴あき容器を浸す超音波洗浄槽を有する超音波洗浄部であり、前記超音波洗浄槽の洗浄水の電導度が一定値を超えないように制御することを特徴としている。
【００１５】
【発明の実施の形態】
以下、本発明に係るチップ電子部品の洗浄乾燥方法及び装置の実施の形態を図面に従って説明する。
【００１６】
図１は本発明に係るチップ電子部品の洗浄乾燥方法及び装置の実施の形態の全体構成を示す正断面図、図２は実施の形態における超音波洗浄部の構成を示す正断面図、図３乃至図５は実施の形態における脱水乾燥部の動作説明図、及び図６は乾燥冷却部の動作説明図である。
【００１７】
図１のように、実施の形態の装置フレーム６内には、チップ電子部品投入部１、超音波洗浄部２、脱水乾燥部３、乾燥冷却部４及び取出部５がライン状に設置され、チップ電子部品を多数収容した穴あき容器１０が搬送手段（フレーム６側に設けたトランスファ機構）よってチップ電子部品投入部１から取出部５に向けて各部間を順次間欠搬送されるようになっている。
【００１８】
前記穴あき容器１０は上面が開口したステンレス製であって、収容するチップ電子部品が外部に脱落しないような小穴が側面及び底面に多数形成されたものである。穴径は収容するチップ電子部品に対応して決められ、例えば穴径０.５mm、１.０mm、１.５mm等に設定する。
【００１９】
チップ電子部品投入部１は水又はお湯を満たした浸漬槽２０を装置フレーム６側に固定した構造を有し、浸漬槽２０にチップ電子部品を多数収容した穴あき容器１０ごと入れてチップ電子部品を浸漬槽２０内の水又はお湯に浸し、汚れの付着した状態でのチップ電子部品の乾燥を防ぐ（シミ発生対策）。
【００２０】
図２のように、超音波洗浄部２は、洗浄水としての温水（純水）が供給される超音波洗浄槽３０と、超音波洗浄槽３０の外側底面に設けられる超音波振動子３１と、超音波洗浄槽３０から溢れた温水を受ける受け槽３３と、超音波洗浄槽３０内の温水の電導度を測定する電導度測定器３８を有している。超音波洗浄槽３０及び受け槽３３は装置フレーム６側に固定されている。また、図１のように装置フレーム６の下部に超音波振動子３１を駆動する超音波発振機３２が設置されている。超音波洗浄槽３０に温水を供給するために、温水タンク（温水器）４５及びその温水タンク４５から温水を汲み上げて超音波洗浄槽３０に供給するポンプ４６が装置フレーム６の下部に設けられている。
【００２１】
また、図１のように濯ぎ用シャワー手段３４が超音波洗浄槽３０の上側を覆う筒状カバー３５の内側に設けられている。カバー３５は昇降スライダ３６に取り付けられ、昇降スライダ３６は昇降手段３７により昇降駆動される。昇降手段３７は、例えば上下のスプロケット４０，４１間にチェーン４２を巻き掛け、上側のスプロケット４０をモーター４３で回転駆動して昇降スライダ３６に一部が固定されたチェーン４２を走行させ、昇降スライダ３６を昇降駆動するものである。なお、濯ぎ用シャワー手段３４はカバー３５と一体的に昇降する。
【００２２】
図３乃至図５のように、脱水乾燥部３は、穴あき容器１０の底面に対応する吸引筒５１を一体に有する載置板５０と、上部に開口６２を持つ筒状カバー本体６１及び該筒状カバー本体６１の内側に設けられた邪魔板（遮蔽板）６３を有するカバー６０とを具備している。
【００２３】
前記載置板５０は穴あき容器１０の底面に対応する開口５２（吸引筒５１の上部開口となる）を有していて、容器１０の底面外縁部を開口５２の周縁部のパッキン（シリコンゴム等）５６で気密に支えるものであり、開口５２に連通するように吸引筒５１が載置板５０に一体化されている。これらの載置板５０及び吸引筒５１は図１の装置フレーム６側に固定であり、吸引筒５１の下端は空気吸引機５５にパイプで連結されている。吸引筒５１はテーパー状に細くなっていて、水滴が溜まりにくい形状である。また、載置板５０の外縁部のカバー本体６１に対面する位置には気密シールのためにシリコンゴム等のパッキン５３が一体化されている。
【００２４】
一方、図１のように、カバー６０（筒状カバー本体６１及び邪魔板６３）は昇降スライダ６６に取り付けられ、昇降スライダ６６は昇降手段６７により昇降駆動される。昇降手段６７は前述した昇降手段３７と同様の機構である。筒状カバー本体６１の上部開口６２には蛇腹パイプ６４等を介して装置フレーム６下部の熱風発生機６５から熱風が供給されるようになっている。
【００２５】
図６のように、乾燥冷却部４は、穴あき容器１０の底面を支持する載置板７０と、上部に開口８２を持つ筒状カバー本体８１及びこの内側に設けられた邪魔板（遮蔽板）８３を有するカバー８０とを具備している。載置板７０は図１の装置フレーム６側に固定である。また、図１のように、カバー８０（筒状カバー本体８１及び邪魔板８３）は昇降スライダ８６に取り付けられ、昇降スライダ８６は昇降手段８７により昇降駆動される。昇降手段８７は前述した昇降手段３７と同様の機構である。筒状カバー本体８１の上部開口８２には蛇腹パイプ８４等を介して装置フレーム６下部の送風機８５から空気（常温）が供給されるようになっている。
【００２６】
図１の取出部５は洗浄及び乾燥処理が終了した穴あき容器１０を一時的に載置して置く位置であり、穴あき容器１０の支持手段９０が設けられている。
【００２７】
次に、この実施の形態の全体的動作説明を行う。
【００２８】
まず、チップ電子部品投入部１にチップ電子部品を多数収容した穴あき容器１０を載置する。つまり、水又はお湯を満たした浸漬槽２０にチップ電子部品を収容した穴あき容器１０ごと入れてチップ電子部品を浸漬槽２０内の水又はお湯に浸し、汚れの付着した状態でのチップ電子部品の乾燥を防いで、シミ発生防止を図る。
【００２９】
次に、トランスファ機構によりチップ電子部品投入部１の穴あき容器１０は超音波洗浄部２に移送される。その際、図１のカバー３５は容器１０の移送の妨げにならないように一旦上昇位置となり、移送後に図示の下降位置となる。この超音波洗浄部２における超音波洗浄工程では、超音波洗浄槽３０内にチップ電子部品を収容した穴あき容器１０ごと入れてチップ電子部品を超音波洗浄槽３０内の温水に浸しかつ超音波を放射することでチップ電子部品を超音波洗浄する。このとき、超音波洗浄槽３０には純水の温水を供給するが、洗浄を継続すると超音波洗浄槽３０内の温水が汚れるため、電導度測定器３８にて超音波洗浄槽３０内の温水の電導度を連続的に測定することで、温水の電導度を管理し、電導度が２μＳ（ジーメンス）/cm近くの値を超えない範囲で新たに純水の温水を超音波洗浄槽３０に毎分１〜２リットル程度供給し、電導度を２μＳ／cm以下に制御する。その温水の供給はオーバーフロー式とし、超音波洗浄槽３０から溢れた温水は受け槽３３で受けて排出する。この超音波洗浄時間は１０分以内の適切な時間に設定する。
【００３０】
ここで、超音波洗浄工程において温水（例えば６５〜８０℃）を使用するのは、チップ電子部品の乾燥前の予熱の目的もあり、水温が低いと短時間には乾燥できず、シミが発生し易くなる。但し、チップ製品の一部には、常温の純水で洗浄するのが好ましいものもあり、このときは常温の純水を用いる。
【００３１】
超音波洗浄終了後、チップ電子部品を収容した穴あき容器１０をトランスファ機構で超音波洗浄槽３０から引き上げた状態とし、かつカバー３５及び濯ぎ用シャワー手段３４の位置もそれに合わせて上昇位置としてから、濯ぎのための純水を濯ぎ用シャワー手段３４から容器１０内のチップ電子部品に数１０秒間かける（流量は毎分１〜２リットル程度）。
【００３２】
超音波洗浄及びその後の濯ぎシャワーが終わったチップ電子部品を収容した穴あき容器１０はトランスファ機構により脱水乾燥部３に移送される。その際、カバー６０は容器１０の移送の妨げにならないように一旦上昇位置となり、移送後に図示の下降位置となる。
【００３３】
脱水乾燥部３では、まず図３の状態において脱水除滴工程を行う。すなわち、チップ電子部品を収容した穴あき容器１０は載置板５０上に載置され、容器１０の底面外縁部が載置板５０に形成した開口５２の周縁部で支えられている（パッキン５６で気密シールされている）。また、載置板５０側のパッキン５３にカバー本体６１の下縁が当接して載置板５０とカバー６０との間を気密に閉じ、隙間が生じないようにする。そして、開口５２に連通する吸引筒５１の下端側をパイプを介して空気吸引機５５で吸引する。このときカバー本体６１の上部開口６２からは常温の空気が取り入れられる。吸引圧力は例えば２ｋｐａで、吸引時間は数１０秒である。穴あき容器１０は上面に開口しているが、邪魔板６３が容器上方に位置することで乱流を発生し、穴あき容器１０の上から下に抜ける空気流とともに穴あき容器１０の側面から底面下方に抜ける空気流を発生させることができ、穴あき容器１０内のチップ電子部品に付着した水滴、水分を空気吸引機５５で効果的に除去できる。水滴が残った状態で乾燥を始めるとシミが発生し易いが、この脱水除滴工程を実行することでシミ発生の防止を図っている。
【００３４】
次に、図４のように、そのままの脱水乾燥部３の位置にて、吸引筒５１の下端側を空気吸引機５５で吸引しながら、カバー本体６１の上部開口６２より熱風を熱風発生器６５から供給して第１段階の熱風乾燥工程を実行する。このとき、図３と同様に載置板５０とカバー６０との間は気密に閉じている。熱風温度は９０±１０℃、風量は数ｍ^３／分程度であり、吸引乾燥時間は数分である。上部開口６２からカバー６０内に入った熱風は、邪魔板６３があるため乱流となり、穴あき容器１０の全面に熱風が当たり、乾燥を促進する。
【００３５】
それから、図５のように、そのままの脱水乾燥部３の位置にて、吸引筒５１からの空気吸引は停止し、載置板５０からカバー６０を浮かせ、載置板５０とカバー本体６１の下縁との間に１０〜２０mmの隙間を設けてから、カバー本体６１の上部開口６２より熱風を熱風発生器６５から供給することで第２段階の熱風乾燥工程を実行する。ここで、カバー６０を載置板５０から浮かせる目的は、カバー６０内の熱風の流れを良くし、穴あき容器１０の穴に表面張力で付着している水滴等を除去しやすくするためである（とくに容器側面に効果がある）。また、吸引を併用すると熱風の通り道が一定してしまい、乾燥しきれない箇所が発生するが、カバー６０を浮かせたことで、吸引時とは熱風の通り方が異なるようになり、穴あき容器１０内のチップ電子部品をまんべんなく乾燥することが可能になる。穴あき容器１０内に収容するチップ電子部品はその大きさにかかわらず容器底面より高さ２０mm位まで乾燥させ得る。なお、熱風温度及び風量は第１段階の熱風乾燥工程と同様である。
【００３６】
上記第２段階の熱風乾燥工程が終わったチップ電子部品を収容した穴あき容器１０は、脱水乾燥部３からトランスファ機構により乾燥冷却部４に移送される。その際、カバー８０は容器１０の移送の妨げにならないように一旦上昇位置となり、移送後に図示の下降位置となる。この乾燥冷却部４では乾燥冷却工程を実行する。すなわち、図６のように、載置板７０上にチップ電子部品を収容した穴あき容器１０が載置され、邪魔板８３が穴あき容器１０の上部開口の上方位置となるようにし、筒状カバー本体８１の下縁と載置板７０間に隙間を設けた状態にて筒状カバー本体８１の上部開口８２に送風機８５から常温空気を供給（送風）する。この場合も、カバー８０内に送り込まれた空気は、邪魔板８３があるため乱流となって穴あき容器１０の上方及び側面に当たり、チップ電子部品を乾燥、冷却する。送風温度は１０〜４０℃であり、送風時間は数１０秒〜数分である。風量は数ｍ^３／分程度である。
【００３７】
乾燥冷却部４における乾燥冷却工程の終了した穴あき容器１０は取出部５にトランスファ機構で移送される。
【００３８】
この実施の形態によれば、次の通りの効果を得ることができる。
【００３９】
(1) 電気メッキ後の積層チップ電子部品等の洗浄、乾燥後の汚れ（シミ）を低減できる。
【００４０】
(2) 従来の洗浄、乾燥方法で行っていた溶剤置換（ソルミックス）作業が不要になり、作業環境を改善できる。
【００４１】
(3) 脱水乾燥部３及び乾燥冷却部４の構成を工夫したことにより、洗浄乾燥工程の省力化を図ることができる。
【００４２】
(4) 脱水乾燥部３の位置でチップ電子部品を収容した穴あき容器１０を移し替えることなく、脱水除滴、熱風乾燥を行うことができる。
【００４３】
(5) チップ電子部品を収容した穴あき容器１０をチップ電子部品投入部１、超音波洗浄部２、脱水乾燥部３、乾燥冷却部４の順にトランスファ機構により移送して行けば良く、工程数も少なくリードタイム短縮を図ることができる。
【００４４】
(6) 超音波洗浄部２では洗浄水の電導度が一定値を超えないように管理することにより、超音波洗浄を常時良好な条件で実行でき、この点でもシミの低減を図り得る。
【００４５】
以上本発明の実施の形態について説明してきたが、本発明はこれに限定されることなく請求項の記載の範囲内において各種の変形、変更が可能なことは当業者には自明であろう。
【００４６】
【発明の効果】
以上説明したように、本発明によれば、電気メッキ後のチップ電子部品の洗浄、乾燥後のシミ低減を図ることができ、さらに、洗浄乾燥作業の省力化、溶剤置換を無くすことによる作業環境改善、リードタイム短縮を図ることが可能である。
【図面の簡単な説明】
【図１】本発明に係るチップ電子部品の洗浄乾燥方法及び装置の実施の形態の全体構成を示す正断面図である。
【図２】実施の形態における超音波洗浄部の構成を示す正断面図である。
【図３】実施の形態において、脱水乾燥部が脱水除滴工程を実行するときの動作説明図である。
【図４】実施の形態において、脱水乾燥部が第１段階の熱風乾燥工程を実行するときの動作説明図である。
【図５】実施の形態において、脱水乾燥部が第２段階の熱風乾燥工程を実行するときの動作説明図である。
【図６】実施の形態における乾燥冷却部の動作説明図である。
【符号の説明】
１チップ電子部品投入部
２超音波洗浄部
３脱水乾燥部
４乾燥冷却部
５取出部
６装置フレーム
１０穴あき容器
２０浸漬槽
３０超音波洗浄槽
３１超音波振動子
３２超音波発振機
３３受け槽
３４濯ぎ用シャワー手段
３５，６０，８０カバー
３６，６６，８６昇降スライダ
３７，６７，８７昇降手段
３８電導度測定器
４０，４１スプロケット
４２チェーン
４３モーター
５０，７０載置板
５１吸引筒
５２，６２，８２開口
５３，５６パッキン
５５空気吸引機
６１，８１カバー本体
６３，８３邪魔板
６５熱風発生器
８５送風機
９０支持手段[0001]
BACKGROUND OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip electronic component cleaning and drying method and apparatus, and more particularly to a cleaning and drying method and apparatus for preventing laundering (staining) after cleaning and drying of laminated chip electronic components and the like after electroplating. About.
[0002]
[Prior art]
Conventionally, the work flow of chip electronic components after electroplating is as follows: ultrasonic cleaning of the chip electronic components after media separation, draining, alcohol replacement (immersing the chip electronic components in alcohol liquid), draining, and blow drying. I was supposed to do it.
[0003]
[Problems to be solved by the invention]
The conventional work flow has a problem in the work environment because of the solvent substitution (alcohol substitution) work process. Further, even after alcohol substitution, dirt (stains) may remain on the chip electronic component after drying. Furthermore, there is a problem that the lead time becomes long.
[0004]
As a known technique, Japanese Patent Application Laid-Open No. 2001-29903 is known as performing both chemical cleaning and water cleaning.
[0005]
In view of the above points, the present invention can improve the working environment by eliminating the need for solvent replacement, reduce the lead time, save labor, and reduce stains on chip electronic components after drying. An object is to provide a cleaning and drying method and apparatus.
[0006]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a method for cleaning and drying a chip electronic component according to the invention of claim 1 includes a cleaning step of cleaning the chip electronic component in a perforated container, and the hole after the cleaning step is completed. A dehydration / droplet process for performing dehydration / droplet removal by air suction on the chip electronic component housed in the perforated container, and the chip electronic component housed in the perforated container after the dewatering / droplet process is dried with hot air A hot air drying step, and a drying cooling step of drying and cooling the chip electronic components accommodated in the perforated container after the hot air drying step by air blowing ,
In the dehydration / droplet removal step, a first mounting plate integrally having a suction cylinder corresponding to the bottom surface of the perforated container, a first cylindrical cover body having an opening in the upper part, and the first cylindrical cover A first cover having a first baffle plate provided inside the main body, and placing the perforated container on the first placement plate, wherein the first baffle plate is perforated So as to be in a position above the upper surface opening of the container, air is sucked from the suction cylinder as a state where the lower edge of the first cylindrical cover body and the first mounting plate are closed,
In the hot air drying step, the first mounting plate and the first cover are continuously used, air is sucked from the suction cylinder, hot air is supplied to the opening of the first cylindrical cover body, and then The air suction from the suction cylinder is stopped and the opening between the lower edge of the first cylindrical cover body and the first placement plate is opened to the opening of the first cylindrical cover body. It is characterized by supplying hot air .
[0008]
The method for cleaning and drying a chip electronic component according to the invention of claim 2 of the present application is the method according to claim 1, wherein the cleaning step is an ultrasonic cleaning step of ultrasonically cleaning the chip electronic component in a perforated container. It is a feature.
According to a third aspect of the present invention, there is provided a method for cleaning and drying a chip electronic component according to the second aspect , wherein in the ultrasonic cleaning step, the electrical conductivity of the cleaning water is controlled so as not to exceed 2 μS / cm.
[0011]
According to a fourth aspect of the present invention, there is provided a method for cleaning and drying a chip electronic component according to the first, second or third aspect , wherein, in the drying and cooling step, a second mounting plate for supporting the bottom surface of the perforated container, And a second cover having a second baffle plate provided on the inner side of the second cylindrical cover main body having an opening in the second cylindrical cover main body, and on the second mounting plate The perforated container is placed so that the second baffle plate is positioned above the top opening of the perforated container, and the lower edge of the second cylindrical cover body and the second placement plate Air is supplied to the opening of the second cylindrical cover main body with a gap provided therebetween.
[0012]
An apparatus for cleaning and drying a chip electronic component according to the invention of claim 5 of the present application includes a cleaning unit that houses and cleans the chip electronic component in a perforated container,
A first mounting plate integrally having a suction cylinder corresponding to the bottom surface of the perforated container; a first cylindrical cover body having an opening in the upper part; and an inner side of the first cylindrical cover body. A dehydrating and drying unit that includes a first cover having a first baffle plate and that performs dehydration and hot air drying ;
A drying cooling unit for drying and cooling the chip electronic component housed in the perforated container by blowing air,
In the dehydrating and drying unit, the perforated container is placed on the first placing plate so that the first baffle plate is positioned above the upper surface opening of the perforated container. With the space between the lower edge of the cylindrical cover main body and the first mounting plate closed, air is sucked from the suction tube for dehydration and dropping, and after the dehydration and dropping, air is sucked from the suction tube. And the hot air is supplied to the opening of the first cylindrical cover body to perform the first stage of hot air drying, and then the air suction from the suction cylinder is stopped and the bottom of the first cylindrical cover body is stopped. Hot air is supplied to the opening of the first cylindrical cover main body in a state where the edge and the first mounting plate are open, and the second stage of hot air drying is performed.
[0013]
According to a sixth aspect of the present invention, there is provided a cleaning / drying apparatus for chip electronic components according to the fifth aspect , wherein the drying / cooling section has a second mounting plate for supporting a bottom surface of the perforated container and an opening at an upper portion thereof. A second cover having a second cylindrical cover main body and a second baffle plate provided inside the second cylindrical cover main body ,
Air is supplied from the opening of the second cylindrical cover body to dry and cool.
[0014]
The cleaning / drying apparatus for chip electronic components according to the invention of claim 7 is the ultrasonic cleaning unit according to claim 5 or 6 , wherein the cleaning unit includes an ultrasonic cleaning tank in which the perforated container is immersed. It is characterized by controlling the electrical conductivity of the cleaning water in the sonic cleaning tank so as not to exceed a certain value.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a chip electronic component cleaning and drying method and apparatus according to the present invention will be described below with reference to the drawings.
[0016]
FIG. 1 is a front sectional view showing the overall configuration of an embodiment of a cleaning and drying method and apparatus for chip electronic components according to the present invention, FIG. 2 is a front sectional view showing the configuration of an ultrasonic cleaning section in the embodiment, and FIG. FIG. 5 to FIG. 5 are operation explanatory views of the dehydrating and drying unit in the embodiment, and FIG. 6 is an operation explanatory view of the drying and cooling unit.
[0017]
As shown in FIG. 1, in the apparatus frame 6 of the embodiment, a chip electronic component input unit 1, an ultrasonic cleaning unit 2, a dehydration drying unit 3, a drying cooling unit 4 and an extraction unit 5 are installed in a line shape. A perforated container 10 containing a large number of chip electronic components is intermittently conveyed between the respective parts sequentially from the chip electronic component loading part 1 to the take-out part 5 by the conveying means (transfer mechanism provided on the frame 6 side). Yes.
[0018]
The perforated container 10 is made of stainless steel with an open top surface, and has a large number of small holes on the side and bottom surfaces that prevent chip electronic components to be accommodated from falling outside. The hole diameter is determined according to the chip electronic component to be accommodated, and is set to, for example, a hole diameter of 0.5 mm, 1.0 mm, 1.5 mm, or the like.
[0019]
The chip electronic component charging unit 1 has a structure in which a dipping tank 20 filled with water or hot water is fixed to the apparatus frame 6 side. The chip electronic component is inserted into the dipping tank 20 together with a perforated container 10 containing a large number of chip electronic components. Is soaked in water or hot water in the dipping tank 20 to prevent the chip electronic component from drying in a state where dirt is attached (smudge generation countermeasure).
[0020]
As shown in FIG. 2, the ultrasonic cleaning unit 2 includes an ultrasonic cleaning tank 30 to which hot water (pure water) as cleaning water is supplied, and an ultrasonic transducer 31 provided on the outer bottom surface of the ultrasonic cleaning tank 30. A receiving tank 33 that receives hot water overflowing from the ultrasonic cleaning tank 30 and an electric conductivity measuring device 38 that measures the electric conductivity of the hot water in the ultrasonic cleaning tank 30 are provided. The ultrasonic cleaning tank 30 and the receiving tank 33 are fixed to the apparatus frame 6 side. As shown in FIG. 1, an ultrasonic oscillator 32 that drives the ultrasonic transducer 31 is installed under the apparatus frame 6. In order to supply hot water to the ultrasonic cleaning tank 30, a hot water tank (heater) 45 and a pump 46 that pumps the hot water from the hot water tank 45 and supplies the hot water to the ultrasonic cleaning tank 30 are provided at the lower part of the apparatus frame 6. Yes.
[0021]
Further, as shown in FIG. 1, a rinsing shower means 34 is provided inside a cylindrical cover 35 that covers the upper side of the ultrasonic cleaning tank 30. The cover 35 is attached to the lift slider 36, and the lift slider 36 is driven up and down by the lift means 37. The elevating means 37, for example, winds a chain 42 between the upper and lower sprockets 40, 41, drives the upper sprocket 40 to rotate by a motor 43, and travels the chain 42 partially fixed to the elevating slider 36. 36 is driven up and down. The rinsing shower means 34 moves up and down integrally with the cover 35.
[0022]
As shown in FIGS. 3 to 5, the dehydrating and drying unit 3 includes a mounting plate 50 integrally having a suction cylinder 51 corresponding to the bottom surface of the perforated container 10, a cylindrical cover body 61 having an opening 62 in the upper portion, and the And a cover 60 having a baffle plate (shielding plate) 63 provided inside the cylindrical cover main body 61.
[0023]
The mounting plate 50 has an opening 52 corresponding to the bottom surface of the perforated container 10 (becomes an upper opening of the suction cylinder 51), and the outer peripheral edge of the bottom surface of the container 10 is a packing (silicon rubber) at the peripheral edge of the opening 52. The suction cylinder 51 is integrated with the mounting plate 50 so as to communicate with the opening 52. The mounting plate 50 and the suction cylinder 51 are fixed to the apparatus frame 6 side of FIG. 1, and the lower end of the suction cylinder 51 is connected to the air suction machine 55 with a pipe. The suction cylinder 51 is tapered and has a shape that prevents water droplets from collecting. A packing 53 such as silicon rubber is integrated at a position facing the cover main body 61 at the outer edge of the mounting plate 50 for airtight sealing.
[0024]
On the other hand, as shown in FIG. 1, the cover 60 (the cylindrical cover main body 61 and the baffle plate 63) is attached to the elevating slider 66, and the elevating slider 66 is driven up and down by the elevating means 67. The lifting / lowering means 67 is the same mechanism as the lifting / lowering means 37 described above. Hot air is supplied to the upper opening 62 of the cylindrical cover main body 61 from a hot air generator 65 below the apparatus frame 6 via a bellows pipe 64 and the like.
[0025]
As shown in FIG. 6, the drying and cooling unit 4 includes a mounting plate 70 that supports the bottom surface of the perforated container 10, a cylindrical cover body 81 having an opening 82 in the upper portion, and a baffle plate (shielding plate) provided on the inside thereof. And a cover 80 having 83. The mounting plate 70 is fixed to the apparatus frame 6 side of FIG. Further, as shown in FIG. 1, the cover 80 (the cylindrical cover body 81 and the baffle plate 83) is attached to the elevating slider 86, and the elevating slider 86 is driven up and down by the elevating means 87. The lifting / lowering means 87 is the same mechanism as the lifting / lowering means 37 described above. Air (normal temperature) is supplied to the upper opening 82 of the cylindrical cover main body 81 from the blower 85 under the apparatus frame 6 via the bellows pipe 84 or the like.
[0026]
The take-out section 5 in FIG. 1 is a position where the perforated container 10 after the cleaning and drying process is temporarily placed and placed, and a support means 90 for the perforated container 10 is provided.
[0027]
Next, the overall operation of this embodiment will be described.
[0028]
First, a perforated container 10 containing a large number of chip electronic components is placed in the chip electronic component loading unit 1. That is, the chip electronic component in a state where the chip electronic component is put in the water or hot water in the immersion bath 20 and the dirt is attached to the perforated container 10 containing the chip electronic component in the immersion bath 20 filled with water or hot water. Prevents dryness and prevents stains.
[0029]
Next, the perforated container 10 of the chip electronic component loading unit 1 is transferred to the ultrasonic cleaning unit 2 by the transfer mechanism. At that time, the cover 35 in FIG. 1 is temporarily raised so as not to hinder the transfer of the container 10, and is moved to the lowered position shown in the figure after the transfer. In the ultrasonic cleaning process in the ultrasonic cleaning unit 2, the perforated container 10 containing the chip electronic components is placed in the ultrasonic cleaning tank 30, the chip electronic components are immersed in warm water in the ultrasonic cleaning tank 30, and the ultrasonic wave is ultrasonicated. The chip electronic component is ultrasonically cleaned by radiating. At this time, hot water of pure water is supplied to the ultrasonic cleaning tank 30, but if the cleaning is continued, the hot water in the ultrasonic cleaning tank 30 is contaminated. The conductivity of hot water is managed by continuously measuring the conductivity of hot water, and hot water of pure water is newly added to the ultrasonic cleaning tank 30 within a range where the conductivity does not exceed 2 μS (Siemens) / cm. Supply about 1 to 2 liters per minute and control the conductivity to 2 μS / cm or less. The supply of the hot water is an overflow type, and the hot water overflowing from the ultrasonic cleaning tank 30 is received by the receiving tank 33 and discharged. The ultrasonic cleaning time is set to an appropriate time within 10 minutes.
[0030]
Here, the use of warm water (for example, 65 to 80 ° C.) in the ultrasonic cleaning process is also for the purpose of preheating the chip electronic component before drying, and if the water temperature is low, it cannot be dried in a short time and stains are generated. It becomes easy to do. However, some chip products are preferably washed with pure water at room temperature. At this time, pure water at room temperature is used.
[0031]
After the ultrasonic cleaning is finished, the perforated container 10 containing the chip electronic components is lifted from the ultrasonic cleaning tank 30 by the transfer mechanism, and the positions of the cover 35 and the rinsing shower means 34 are also raised accordingly. Then, pure water for rinsing is applied to the chip electronic components in the container 10 from the rinsing shower means 34 for several tens of seconds (the flow rate is about 1 to 2 liters per minute).
[0032]
The perforated container 10 containing the chip electronic components after the ultrasonic cleaning and the subsequent rinsing shower is transferred to the dehydrating and drying unit 3 by the transfer mechanism. At that time, the cover 60 is temporarily raised so as not to hinder the transfer of the container 10, and is moved to the lowered position shown in the figure after the transfer.
[0033]
In the dehydrating and drying unit 3, first, a dehydrating and dropping step is performed in the state shown in FIG. That is, the perforated container 10 containing the chip electronic components is placed on the mounting plate 50, and the outer peripheral edge of the bottom surface of the container 10 is supported by the peripheral edge of the opening 52 formed in the mounting plate 50 (packing 56. Is hermetically sealed). Further, the lower edge of the cover body 61 comes into contact with the packing 53 on the mounting plate 50 side so that the space between the mounting plate 50 and the cover 60 is hermetically closed so that no gap is generated. Then, the lower end side of the suction cylinder 51 communicating with the opening 52 is sucked by the air suction machine 55 through the pipe. At this time, normal temperature air is taken in from the upper opening 62 of the cover body 61. The suction pressure is 2 kpa, for example, and the suction time is several tens of seconds. Although the perforated container 10 is open on the upper surface, the turbulent flow is generated by the baffle plate 63 positioned above the container, and from the side surface of the perforated container 10 together with the air flow that flows downward from above the perforated container 10. It is possible to generate an air flow that flows downward from the bottom surface, and water droplets and moisture adhering to the chip electronic components in the perforated container 10 can be effectively removed by the air suction device 55. When drying is started with water droplets remaining, stains are likely to occur. However, this dehydration and removal step is executed to prevent the generation of stains.
[0034]
Next, as shown in FIG. 4, hot air is generated from the upper opening 62 of the cover main body 61 while the lower end side of the suction cylinder 51 is sucked by the air suction device 55 at the position of the dehydrating and drying unit 3 as it is. The first stage hot air drying process is performed. At this time, the space between the mounting plate 50 and the cover 60 is hermetically closed as in FIG. The hot air temperature is 90 ± 10 ° C., the air volume is about several m ³ / min, and the suction drying time is several minutes. The hot air that has entered the cover 60 from the upper opening 62 becomes a turbulent flow because of the baffle plate 63, and the hot air hits the entire surface of the perforated container 10 to promote drying.
[0035]
Then, as shown in FIG. 5, the air suction from the suction cylinder 51 is stopped at the position of the dehydrating and drying unit 3 as it is, the cover 60 is lifted from the placement plate 50, and the bottom of the placement plate 50 and the cover main body 61. After providing a gap of 10 to 20 mm between the edges, the hot air drying process of the second stage is executed by supplying hot air from the hot air generator 65 through the upper opening 62 of the cover body 61. Here, the purpose of floating the cover 60 from the mounting plate 50 is to improve the flow of hot air in the cover 60 and facilitate removal of water droplets or the like adhering to the holes of the perforated container 10 due to surface tension. (Especially effective on the side of the container). Further, when the suction is used in combination, the passage of the hot air is fixed, and a portion that cannot be completely dried is generated. However, by floating the cover 60, the passage of the hot air becomes different from that at the time of suction, and the perforated container It becomes possible to dry the chip electronic components in 10 evenly. The chip electronic component housed in the perforated container 10 can be dried to a height of about 20 mm from the bottom of the container regardless of its size. The hot air temperature and air volume are the same as those in the first stage hot air drying step.
[0036]
The perforated container 10 containing the chip electronic components for which the second stage hot air drying process has been completed is transferred from the dehydration drying unit 3 to the drying cooling unit 4 by the transfer mechanism. At that time, the cover 80 is temporarily raised so as not to hinder the transfer of the container 10, and is moved to the lowered position shown in the figure after the transfer. The drying / cooling unit 4 executes a drying / cooling process. That is, as shown in FIG. 6, the perforated container 10 containing the chip electronic components is placed on the mounting plate 70, and the baffle plate 83 is positioned above the upper opening of the perforated container 10 to form a cylindrical shape. Room temperature air is supplied (blowed) from the blower 85 to the upper opening 82 of the cylindrical cover body 81 with a gap provided between the lower edge of the cover body 81 and the mounting plate 70. Also in this case, the air sent into the cover 80 becomes a turbulent flow due to the baffle plate 83 and hits the upper and side surfaces of the perforated container 10 to dry and cool the chip electronic components. The blowing temperature is 10 to 40 ° C., and the blowing time is several tens of seconds to several minutes. The air volume is about several m ³ / min.
[0037]
The perforated container 10 having been subjected to the drying and cooling process in the drying and cooling unit 4 is transferred to the take-out unit 5 by a transfer mechanism.
[0038]
According to this embodiment, the following effects can be obtained.
[0039]
(1) Dirt (stain) after washing and drying of laminated chip electronic components after electroplating can be reduced.
[0040]
(2) Solvent replacement (sol-mix) work that has been done with conventional cleaning and drying methods is no longer necessary, and the work environment can be improved.
[0041]
(3) By devising the configuration of the dehydrating and drying unit 3 and the drying and cooling unit 4, it is possible to save labor in the washing and drying process.
[0042]
(4) Dehydration and dropping and hot air drying can be performed without transferring the perforated container 10 containing the chip electronic components at the position of the dehydration drying unit 3.
[0043]
(5) The perforated container 10 containing the chip electronic components may be transferred by the transfer mechanism in the order of the chip electronic component loading unit 1, the ultrasonic cleaning unit 2, the dehydration drying unit 3, and the drying cooling unit 4, and the number of steps Less lead time can be achieved.
[0044]
(6) By managing the electrical conductivity of the cleaning water so that it does not exceed a certain value, the ultrasonic cleaning unit 2 can always perform the ultrasonic cleaning under good conditions, and it is possible to reduce the spots in this respect as well.
[0045]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.
[0046]
【The invention's effect】
As described above, according to the present invention, it is possible to clean chip electronic components after electroplating, reduce stains after drying, and further save labor in cleaning and drying work and work environment by eliminating solvent replacement It is possible to improve and shorten the lead time.
[Brief description of the drawings]
FIG. 1 is a front sectional view showing the overall configuration of an embodiment of a cleaning and drying method and apparatus for chip electronic components according to the present invention.
FIG. 2 is a front sectional view showing a configuration of an ultrasonic cleaning section in the embodiment.
FIG. 3 is an operation explanatory diagram when the dehydrating and drying unit executes a dehydrating and dropping step in the embodiment.
FIG. 4 is an operation explanatory diagram when the dehydration drying unit executes the first stage hot air drying process in the embodiment.
FIG. 5 is an operation explanatory diagram when the dehydration drying unit executes the second stage hot air drying process in the embodiment.
FIG. 6 is an operation explanatory diagram of a drying and cooling unit in the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Chip electronic component insertion part 2 Ultrasonic cleaning part 3 Dehydration drying part 4 Drying cooling part 5 Extraction part 6 Apparatus frame 10 Perforated container 20 Immersion tank 30 Ultrasonic cleaning tank 31 Ultrasonic vibrator 32 Ultrasonic oscillator 33 Receiving tank 34 Rinsing shower means 35, 60, 80 Covers 36, 66, 86 Elevating sliders 37, 67, 87 Elevating means 38 Conductivity measuring instrument 40, 41 Sprocket 42 Chain 43 Motor 50, 70 Mounting plate 51 Suction cylinder 52, 62 , 82 Opening 53, 56 Packing 55 Air suction device 61, 81 Cover body 63, 83 Baffle plate 65 Hot air generator 85 Blower 90 Support means

Claims

A cleaning step for storing and cleaning the chip electronic component in the perforated container, and a dehydration / depletion step for performing dehydration / dropping by air suction on the chip electronic component stored in the perforated container after the cleaning step is completed. And a hot-air drying step for drying the chip electronic components housed in the perforated container after the dehydration / dropping step with hot air, and a blower for blowing the chip electronic components housed in the perforated container after the hot-air drying step A drying cooling process for drying and cooling,
In the dehydration / droplet removal step, a first mounting plate integrally having a suction cylinder corresponding to the bottom surface of the perforated container, a first cylindrical cover body having an opening in the upper part, and the first cylindrical cover A first cover having a first baffle plate provided inside the main body, and placing the perforated container on the first placement plate, wherein the first baffle plate is perforated So as to be in a position above the upper surface opening of the container, air is sucked from the suction cylinder as a state where the lower edge of the first cylindrical cover body and the first mounting plate are closed ,
In the hot air drying step, the first mounting plate and the first cover are continuously used, air is sucked from the suction cylinder, hot air is supplied to the opening of the first cylindrical cover body, and then The air suction from the suction cylinder is stopped and the opening between the lower edge of the first cylindrical cover body and the first placement plate is opened to the opening of the first cylindrical cover body. A method for cleaning and drying a chip electronic component, wherein hot air is supplied .

The method for cleaning and drying a chip electronic component according to claim 1, wherein the cleaning step is an ultrasonic cleaning step in which the chip electronic component is accommodated in a perforated container and ultrasonically cleaned.

3. The method for cleaning and drying a chip electronic component according to claim 2, wherein in the ultrasonic cleaning step, the electrical conductivity of the cleaning water is controlled so as not to exceed 2 μS / cm.

In the drying and cooling step, the second mounting plate that supports the bottom surface of the perforated container, the second cylindrical cover main body having an opening in the upper portion, and the second cylindrical cover main body are provided inside. And a second cover having a second baffle plate, the perforated container is placed on the second placement plate, and the second baffle plate is positioned above the upper surface opening of the perforated container. And supplying air to the opening of the second cylindrical cover body in a state where a gap is provided between the lower edge of the second cylindrical cover body and the second mounting plate. 2. A method for cleaning and drying a chip electronic component according to 1, 2 or 3 .

A cleaning section for storing and cleaning the chip electronic components in a perforated container;
A first mounting plate integrally having a suction cylinder corresponding to the bottom surface of the perforated container; a first cylindrical cover body having an opening in the upper part; and an inner side of the first cylindrical cover body. A dehydrating and drying unit that includes a first cover having a first baffle plate and that performs dehydration and hot air drying ;
A drying cooling unit for drying and cooling the chip electronic component housed in the perforated container by blowing air,
In the dehydrating and drying unit, the perforated container is placed on the first placing plate so that the first baffle plate is positioned above the upper surface opening of the perforated container. With the space between the lower edge of the cylindrical cover main body and the first mounting plate closed, air is sucked from the suction tube for dehydration and dropping, and after the dehydration and dropping, air is sucked from the suction tube. And the hot air is supplied to the opening of the first cylindrical cover body to perform the first stage of hot air drying, and then the air suction from the suction cylinder is stopped and the bottom of the first cylindrical cover body is stopped. A second stage of hot air drying is performed by supplying hot air to the opening of the first cylindrical cover main body in a state where an edge and the first mounting plate are open. Washing and drying equipment.

The drying / cooling unit is provided on the inner side of the second mounting plate that supports the bottom surface of the perforated container, the second cylindrical cover main body having an opening in the upper portion, and the second cylindrical cover main body. A second cover having a second baffle plate ,
6. The chip electronic component cleaning and drying apparatus according to claim 5, wherein air is supplied from an opening of the second cylindrical cover body to dry and cool the chip electronic component.

Wherein the cleaning unit is a ultrasonic cleaning unit having an ultrasonic cleaning bath of immersing the perforated container, the or claim 5 conductivity of the washing water ultrasonic cleaning tank is controlled so as not to exceed a certain value 6 A cleaning / drying apparatus for the chip electronic component according to claim.