JP3772272B2 - I−vii族半導体単結晶薄膜およびその製造方法 - Google Patents
I−vii族半導体単結晶薄膜およびその製造方法 Download PDFInfo
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- H—ELECTRICITY
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
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- C30B29/10—Inorganic compounds or compositions
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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Description
S.Yano, T.Goto, and T.Itoh, J.Appl.Phys.79 (1996) p.8216 A.Ekimov, Al.L.Efros, and A.A.Onushchenko, Solid State Commun.56 (1985) p.921 T.Itoh, Y.Iwabuchi and M.Kataoka, Phy.Stat.Sol.B145 (1988) p.567 G.R.Olbright and N.Peyghambarian, Solid State Common.58 (1986) p.337 R.S.Williams, D.K.Shuh and Y.Segawa, J.Vac.Sci.Technol.A6 (1988) p.337 A.Kahn, S.Ahsan, W.Chen and M.Damas, Phys.Rev.Lett.68 (1992) p.3200 A.Yanase, Y.Segawa, Surf.Sci.278 (1992) L105 H.Ishihara, T.Amakata, K.Cho, Phys.Rev.B65, 2001, 035305 K.Cho, J.Phys.Soc.Jpn.55, 1986, p.4113
本発明の実施例について、図1〜図5を用いて説明する。
図1は、本実施例にかかるI−VII族半導体単結晶薄膜であるCuCl薄膜1が形成された基板(CaF2(111)基板2上)2の構成を示す断面図である。
この図に示すように、本実施例にかかるCuCl薄膜1は、電子線を照射しながら形成された電子線照射膜1aと、形成中に電子線を照射されていない電子線非照射膜1bとからなる。また、CuCl薄膜1は、CaF2(111)基板2上に形成されたCaF2buffer層(バッファ層)3上に形成されている。なお、CuClおよびCaF2の結晶構造は、それぞれ閃亜鉛型構造、蛍石型構造と異なるが、両者の格子不整合は約1%(CuCl、CaF2の格子定数はそれぞれ0.5406nm、0,5463nm)と非常に小さい。このため、CuCl薄膜はCaF2基板上にエピタキシャル成長可能である。
まず、CaF2(111)基板2を、650℃で1時間サーマルクリーニング(熱的洗浄)し、表面に付着している自然酸化膜などの不純物を除去した。
図2は、CuCl薄膜1の、原子間力顕微鏡(AFM)像である。また、図3は、電子線照射を行わない以外は、CuCl薄膜1と同様の条件で形成したCuCl薄膜の、AFM像である。すなわち、図3は、CaF2(111)基板2上に形成されたCaF2バッファ層3上に、電子線を照射せずに基板温度180℃、成長速度0.065nm/sでMBE法によって形成された膜厚65nmのCuCl膜のAFM像である。
本発明の他の実施例について、図6〜図8を用いて説明する。
本実施例に係るCuCl薄膜(以下に示す6つの試料)は、実施例1のCuCl薄膜1と同様、CaF2(111)基板2上に形成された膜厚約50nmのCaF2buffer層(CaF2バッファ層)3上に形成されている。ただし、本実施例に係るCuCl薄膜の膜厚は、内部電場の共鳴増大が最も顕著に起こるとされている膜厚約30nmとした。なお、製造方法については、CuCl薄膜の膜厚が異なる他は、実施例1と同様の方法で形成した。
すなわち、電子線を照射せずに膜厚約30nmのCuClを形成したCuCl薄膜10、電子線照射膜厚約6nmのCuCl薄膜11、電子線照射膜厚約12nmのCuCl薄膜12、電子線照射膜厚約15nmのCuCl薄膜13、電子線照射膜厚約18nmのCuCl薄膜14、膜厚約30nmすべてについて電子線を照射しながら形成したCuCl薄膜15を作成した。
1a 電子線照射膜
1b 電子線非照射膜
2 CaF2(111)基板(基板)
3 CaF2buffer層(バッファ層)
Claims (7)
- CaF 2 (111)基板上に形成されたI−VII族半導体単結晶薄膜であって、
CuCl薄膜が、上記CaF 2 (111)基板上に形成された、上記CaF 2 (111)基板と上記CuCl薄膜との格子定数の相違による歪みを緩和するためのバッファ層上に、電子線を照射しながら形成されてなるものであり、
上記CuCl薄膜は、
電子線を照射しながら形成された層と、電子線を照射せずに形成された層とからなることを特徴とするI−VII族半導体単結晶薄膜。 - 上記CuCl薄膜は、
内部電場が共鳴的に増大する膜厚であることを特徴とする請求項1に記載のI−VII族半導体単結晶薄膜。 - 上記CuCl薄膜は、
上記基板面に垂直な方向から見て、電子線を照射しながら形成された領域と、電子線を照射されずに形成された領域とを含むことを特徴とする請求項1または2に記載のI−VII族半導体単結晶薄膜。 - CaF 2 (111)基板上に形成されるI−VII族半導体単結晶薄膜の製造方法であって、
上記CaF 2 (111)基板上に、上記CaF 2 (111)基板とCuCl薄膜との格子定数の相違による歪みを緩和するためのバッファ層を形成する工程と、
上記バッファ層上に、上記CuCl薄膜を、分子線エピキタシー法を用いて電子線を照射しながら形成する工程とを含み、
上記CuCl薄膜の一部の層は、電子線を照射しながら形成し、
上記CuCl薄膜の残りの層は、電子線を照射せずに形成することを特徴とするI−VII族半導体単結晶薄膜の製造方法。 - 形成するCuCl薄膜の膜厚に応じて、電子線を照射しながら形成する部分の膜厚と、電子線を照射せずに形成する部分の膜厚とを決定することを特徴とする請求項48に記載のI−VII族半導体単結晶薄膜の製造方法。
- 上記CuCl薄膜の膜厚を、
内部電場が共鳴的に増大する膜厚とすることを特徴とする請求項4または5に記載のI−VII族半導体単結晶薄膜の製造方法。 - 上記バッファ層を、分子線エピキタシー法を用いて形成することを特徴とする請求項4から6の何れか1項に記載のI−VII族半導体単結晶薄膜の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2004037441A JP3772272B2 (ja) | 2004-02-13 | 2004-02-13 | I−vii族半導体単結晶薄膜およびその製造方法 |
CA2555582A CA2555582C (en) | 2004-02-13 | 2004-11-30 | Group i-vii semiconductor single crystal thin film and process for producing same |
PCT/JP2004/017777 WO2005078788A1 (ja) | 2004-02-13 | 2004-11-30 | I-vii族半導体単結晶薄膜およびその製造方法 |
US10/589,003 US7683457B2 (en) | 2004-02-13 | 2004-11-30 | Group I-VII semiconductor single crystal thin film and process for producing same |
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JP2004037441A JP3772272B2 (ja) | 2004-02-13 | 2004-02-13 | I−vii族半導体単結晶薄膜およびその製造方法 |
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JP2005228995A JP2005228995A (ja) | 2005-08-25 |
JP3772272B2 true JP3772272B2 (ja) | 2006-05-10 |
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JP (1) | JP3772272B2 (ja) |
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KR101258232B1 (ko) | 2012-12-24 | 2013-04-25 | 서울반도체 주식회사 | 복수개의 파장변환 물질층들을 갖는 발광 소자 |
KR101883176B1 (ko) * | 2017-08-29 | 2018-08-24 | 주식회사 페타룩스 | 할로겐화구리 컬러 광센서 구조 및 제조방법 |
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JPS55901B2 (ja) | 1974-06-07 | 1980-01-10 | ||
JPS63232311A (ja) | 1987-02-20 | 1988-09-28 | Tokyo Inst Of Technol | 半導体薄膜の製造方法 |
JP3109109B2 (ja) * | 1990-07-12 | 2000-11-13 | ソニー株式会社 | 周期ドメイン反転構造を有する光デバイス装置の製造方法 |
JPH05194085A (ja) | 1992-01-24 | 1993-08-03 | Fujitsu Ltd | 高温超伝導薄膜の形成方法 |
JPH05330822A (ja) | 1992-05-26 | 1993-12-14 | Fujitsu Ltd | 酸化物超伝導体膜の製造装置及び酸化物超伝導体膜の製造方法 |
FR2808531B1 (fr) * | 2000-05-05 | 2004-09-17 | Rhodia Chimie Sa | Complexe silicone/adhesif dont l'interface possede une force de decollement modulable par irradiation par faisceau d'electrons |
TW200419279A (en) * | 2003-03-28 | 2004-10-01 | Adv Lcd Tech Dev Ct Co Ltd | Method and apparatus for forming crystalline portions of semiconductor film |
US20050150758A1 (en) * | 2004-01-09 | 2005-07-14 | Yakshin Andrey E. | Processes and device for the deposition of films on substrates |
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- 2004-02-13 JP JP2004037441A patent/JP3772272B2/ja not_active Expired - Fee Related
- 2004-11-30 CA CA2555582A patent/CA2555582C/en not_active Expired - Fee Related
- 2004-11-30 WO PCT/JP2004/017777 patent/WO2005078788A1/ja active Application Filing
- 2004-11-30 US US10/589,003 patent/US7683457B2/en not_active Expired - Fee Related
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US7683457B2 (en) | 2010-03-23 |
WO2005078788A1 (ja) | 2005-08-25 |
CA2555582C (en) | 2010-06-01 |
US20070090341A1 (en) | 2007-04-26 |
JP2005228995A (ja) | 2005-08-25 |
CA2555582A1 (en) | 2005-08-25 |
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