JP3768075B2 - High frequency integrated circuit device and high frequency circuit using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a high-frequency integrated circuit device in which high-frequency elements are integrated and a high-frequency circuit using the same, and more particularly to a configuration of a transmission amplifier module and its peripheral circuits mounted in a wireless system such as mobile communication.
[0002]
[Prior art]
  In recent years, mobile communication devices typified by mobile phones have been rapidly increasing in performance and miniaturization, and at the same time, the penetration rate has been increasing at an explosive rate. In particular, the digitization of communication data has dramatically increased the number of call channels and has created a system that can easily transmit and receive text information and image information. However, diversification of these communication services brings about complexity of the system itself, so that integration of devices is essential as in the computer industry.
[0003]
  High-frequency devices used in the radio section of communication systems have also been integrated and miniaturized. In particular, power amplifier devices that are key devices include various types such as HIC (hybrid IC) modules and MMICs (microwave monolithic ICs). It has been put to practical use in the form of. Hereinafter, the configuration of a conventional transmission amplifier module having an HIC structure will be described with reference to the drawings.
[0004]
  5 and 6 show a transmission amplifier module, which is a conventional high-frequency integrated circuit device, and a high-frequency circuit using the same. In FIG. 5, 51 is a metal cap, 52 is a heat sink, 53 is a printed circuit board, and is fixed to the heat sink 52. An electric lead 54 is attached to the back side of the printed circuit board 53 and extends to the outside of the heat sink 52. In the printed circuit board 53, 55 is a wiring region, 56 is an active element such as a high-frequency field effect transistor, and 57 is a passive element such as a chip capacitor. Reference numeral 51 a denotes a pressing portion at the center of the metal cap 51, and is in contact with the side surface of the heat sink 52. A screw hole 52 a penetrates the heat sink 52.
[0005]
  In FIG. 6, 61 is the conventional transmission amplifier module shown in FIG. 5, and 60 is a part of the housing. Here, the housing 60 refers to a metal case that holds the role of a heat sink and the entire high-frequency circuit. In practice, however, a metal cover (cover) is provided to prevent high-frequency leakage. Reference numeral 63 denotes another printed circuit board on which a high frequency circuit including a power supply circuit such as a high frequency input region 65a, power supply regions 65b and 65c to which a DC bias is applied, and a high frequency output region 65d is formed.
[0006]
  As shown in FIG. 6, the transmission amplifier module 61 is fixed to the housing 60 by screws using the through holes 52a at both ends. The four electrical leads 54 are fixed by soldering to corresponding regions 65a to 65d on the printed circuit board 63 (for example, “N. Nakamura et al.,“ A high power and low distortion amplifier module for large cell base station in digital ”). cordless system "IEICE Trans. Electron., vol. E81-C, no. 6, pp. 886-891, June 1998.).
[0007]
[Problems to be solved by the invention]
  However, in the configuration of the conventional high frequency circuit, abnormal oscillation may occur. Then, when this cause was examined, it turned out that it is because the earthing | grounding of the metal cap 51 is inadequate. That is, the grounding of the metal cap 51 is preferably good in the vicinity of the high-frequency regions 65a and 65d of the printed board 63, but in the conventional example of FIG. 5, the metal cap 51 is connected to the heat sink 12 via set screws at both ends. Therefore, the grounding of the central part of the metal cap 51 is not so strong. Moreover, since the grounding reaches the grounding surface on the back surface of the printed circuit board 63 via the set screw, the heat sink 12 and the housing 60, there is a physically large distance until grounding. As a result, abnormal oscillation is likely to occur, which is a practical problem.
[0008]
  Therefore, for example, there is a method of soldering the lower periphery of the metal cap to a heat sink as an improvement method, but a long physical distance to the ground cannot be eliminated, and abnormal oscillation also occurs. Moreover, the soldering process is complicated and the productivity is poor.
[0009]
  Furthermore, due to insufficient grounding of the metal cap 51 and insufficient electrical separation between the high-frequency input region 65a and the high-frequency output region 65d in the printed circuit board 63, oscillation tends to occur, high-frequency characteristics greatly vary, or A situation different from the result of single item evaluation occurred, and a stable high-frequency circuit could not be formed.
[0010]
  SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a high-frequency integrated circuit device having an HIC structure configured to allow sufficient grounding of a metal cap, and a high-frequency circuit configured to sufficiently isolate high-frequency input / output. There is to do.
[0011]
[Means for Solving the Problems]
  In order to solve the above problems, in the present invention, a grounding part is newly formed in a metal cap in a high-frequency integrated circuit device, and the high-frequency circuit having this high-frequency integrated circuit device is connected to the grounding part of the metal cap. A connection region is formed, and the high frequency input region and the high frequency output region are electrically separated by the connection region.
[0012]
  That is, the high-frequency integrated circuit device according to claim 1 includes a metal plate, a printed circuit board mounted on the upper surface of the metal plate, and mounted with an electrical lead extending outward from the metal plate, and the printed circuit board. A metal cap mounted on the metal plate so as to cover the printed circuit board, and the printed circuit board has a ground area electrically connected to a ground surface provided on the back surface on the metal plate side and patterned on the surface. The electrical lead is connected to an active element of a high-frequency field effect transistor or a high-frequency bipolar transistor placed on the surface of the printed circuit board through a wiring region patterned on the surface of the printed circuit board. An electrical lead for input and an electrical lead for high-frequency output, and a contact connected to the ground area on the surface of the printed circuit board and extending outward from the metal plate And a use electrical lead, the metal capOne side surface is cut out leaving a central portion, and this central portion serves as a portion that retains the shape of the metal cap, and the metal cap is formed by bending a part of the lower side of the central portion outward. A first grounding portion extending outward from the board, and a second grounding portion that is bent inwardly at the lower portion of the central portion and contacts the grounding region of the printed circuit board surface.The grounding portion of the metal cap and the electrical lead for grounding are between the electrical lead for high frequency input and the electrical lead for high frequency output when the printed circuit board is covered with the metal cap. Feature to be locatedAnd
[0013]
  Claim 2The invention according to claim 1 is the high frequency integrated circuit device according to claim 1, wherein the metal cap isFirst ground contact areaThe electrical leads mounted on the printed circuit board extend outward in parallel at the same height position.
[0014]
  Claim 3The high-frequency integrated circuit device according to the invention is mounted on a metal plate having a recess and the recess of the metal plate, and in this mounted state, the surface height matches the surface height of the metal plate, and the metal plate A printed circuit board on which electrical leads extending outward are mounted, and a metal cap mounted on the metal plate so as to cover the printed circuit board, and the printed circuit board is provided on the back surface on the metal plate side A ground region electrically connected to the ground plane and patterned on the surface, wherein the electrical lead is an active element of a high-frequency field-effect transistor or a high-frequency bipolar transistor placed on the printed circuit board surface; A high-frequency input electrical lead and a high-frequency output electrical lead connected via a wiring region patterned on the surface of the printed circuit board, and the printed circuit board surface Than of being connected to a ground region and the metal plate and a ground electrical leads extending outwardly, said metal capOne side is cut away leaving the central part, and this central part becomes a part that retains the shape of the metal cap, and the metal cap is bent outward at the lower side of the central part.The metal plate has a grounding portion that contacts the surface of the metal plate and extends outward from the metal plate, and the grounding portion of the metal cap and the electrical lead for grounding are in a state where the printed board is covered with the metal cap, It is located between the high frequency input electrical lead and the high frequency output electrical lead.
[0015]
  Claim 4The invention described isClaim 3In the high-frequency integrated circuit device described above, the grounding portion of the metal cap and the electrical lead mounted on the printed board extend outward in parallel at the same height position.
[0016]
  Claim 5The high-frequency circuit of the described invention isClaim 1A high-frequency integrated circuit device and the metal capFirst ground contact areaAnd the grounding electrical lead of the printed circuit boardSoldered and fixedThe printed circuit board includes another printed circuit board on which a ground region is formed, and the other printed circuit board has a high frequency input region and a high frequency output region sandwiching the ground region.
[0017]
  According to a sixth aspect of the present invention, there is provided a high frequency circuit comprising: the high frequency integrated circuit device according to the third aspect; and a grounding region fixed by soldering to a grounding portion of the metal cap and the grounding electrical lead of the printed circuit board. The other printed circuit board is formed, and a high frequency input region and a high frequency output region are formed on the other printed circuit board with the grounding region interposed therebetween.
[0018]
  With the above,Claims 1 and 2In the high frequency integrated circuit device of the invention described, the metal capFirst ground contact areaBy connecting to an external grounding area to ensure good grounding of the metal capFirst ground contact areaCan be obtained directly at. Moreover,Second contact areaIs also connected to the ground region of the internal printed circuit board, so that the grounding of the printed circuit board is ensured. In addition, the metal capFirst and second ground contact partsCan be formed by a simple process, and thus is more productive than soldering a metal cap to a heat sink. In addition, secondarily,A central portion having the first and second grounding portions in the metal capThere is a metal cap against the internal printed circuit board or metal plateShapeSince the metal is physically held, deformation such as dents in the metal cap is prevented.
[0019]
  Also,Claims 3 and 4Similarly, in the high-frequency integrated circuit device of the described invention, a good grounding of the metal cap can be obtained directly at the grounding part by connecting the grounding part of the metal cap to an external grounding region. Further, since the grounding portion is connected to the surface of the metal plate, the grounding of the metal plate is also ensured. Moreover, when the printed circuit board is mounted in the recess of the metal plate, the surface height of the printed circuit board and the surface height of the metal plate are the same height, and the height of the grounding part of the metal cap and the electrical lead of the printed circuit board Can be connected to a ground area or a wiring area formed on the surface of an external printed circuit board without performing lead forming. Further, as described above, it is excellent in productivity and can effectively prevent deformation such as dents in the metal cap.
[0020]
  Furthermore,Claims 1-4In the described invention, in particular, since the grounding portion of the metal cap is located between the high frequency input electrical lead and the high frequency output electrical lead of the printed circuit board, the ground region of the high frequency circuit to be connected to these, the high frequency input region The positional relationship of the high-frequency output region is a relationship that sandwiches the grounding region. Therefore, the high frequency input region and the high frequency output region are electrically and effectively separated from each other by the ground region, so that the high frequency input / output separation characteristics are improved, the oscillation is difficult, and the electrical characteristics are stabilized. .
[0021]
  In particular,Claims 2 and 4In the described invention, since the height of the grounding portion of the metal cap and the electrical lead of the printed circuit board extend in parallel at the same height position, it is formed on the surface of the external printed circuit board without performing lead forming. It can be connected to a ground area or a wiring area.
[0022]
  in addition,Claims 1 and 3In the described invention, the grounding lead connected to the grounding region on the surface of the printed circuit board is connected to the external grounding region, whereby the grounding of the printed circuit board using the grounding portion of the metal cap is strengthened, and the printed circuit board The grounding becomes more reliable. Further, since the grounding electrical lead has the same height position as the grounding portion of the metal cap, in other words, other electrical leads, there is no need to perform lead forming.
[0023]
  Also,Claims 5 and 6In the described invention, in the high-frequency circuit, a good grounding of the metal cap can be obtained directly at the grounding part by connecting the grounding part of the metal cap of the high-frequency integrated circuit device to the grounding region of another printed circuit board. .
[0024]
  In particular, theseClaims 5 and 6In the described invention, the grounding region is located between the high-frequency input region and the high-frequency output region, and the two high-frequency regions are electrically separated by the grounding region, so that the high-frequency input / output separation characteristics are improved. It is hard to oscillate and has stable electrical characteristics.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, a high-frequency integrated circuit device and a high-frequency circuit according to embodiments of the present invention will be described with reference to the drawings.
[0026]
  (First embodiment)
  FIG. 1 shows a configuration of a transmission amplifier module which is a high-frequency integrated circuit device according to a first embodiment of the present invention.
[0027]
  In the figure, 11 is a metal cap, 12 is a heat sink (metal plate), 13 is a printed circuit board, and is mounted on the upper surface of the heat sink 12. The metal cap 12 is attached to the heat sink 12 so as to cover the printed board 13.
[0028]
  In the printed circuit board 13, 15 is a wiring region, and a pattern is formed on the surface of the printed circuit board 13 using a copper film or the like. Reference numeral 15a denotes a ground region patterned on the front surface side, and is electrically connected to a ground surface 15b formed on the entire back surface of the printed circuit board 13 through a through hole (not shown). Reference numeral 16 denotes an active element such as a high-frequency field effect transistor or a high-frequency bipolar transistor, and reference numeral 17 denotes a passive element such as a chip capacitor or a chip resistor. Further, 14a is an electric lead for high frequency input, 14b and 14c are electric leads for power supply, 14d is an electric lead for high frequency output, and these electric leads 14a to 14d are mounted on the surface side of the printed circuit board 13, and the wiring The active element 16 and the passive element 17 are connected via the region 15. 14e is an electrical lead for grounding, and is connected to the grounding region 15a on the surface side. The grounding electrical lead 14e is located between the two power supply electrical leads 14b and 14c. The electrical leads 14 a to 14 e are arranged in parallel to each other and extend to the outside of the heat sink 12.
[0029]
  In the metal cap 11, reference numeral 11 a denotes a first grounding portion, which is bent outward from the center of the metal cap 11 and extended to the outside of the heat sink 12. Reference numeral 11b denotes a second grounding portion bent inward and connected to the grounding region 15a on the surface side of the printed circuit board 13. These grounding parts 11a and 11b are located at the surface position of the printed circuit board 13 with the metal cap 11 mounted on the heat sink 12. Therefore, the grounding parts 11a and 11b and the electrical leads 14a to 14e are identical to each other. It extends outward and inward at a height position. In addition, the grounding portions 11a and 11b are located between the pair of high frequency electrical leads 14a and 14d and the pair of power supply electrical leads 14b and 14c in a state where the metal cap 11 is mounted on the heat sink 12. In FIG. 1, reference numerals 11 c and 12 a denote through holes for screwing provided in the metal cap 11 and the heat sink 12, respectively.
[0030]
  Therefore, in the present embodiment, the grounding of the metal cap 11 can be obtained directly at the first grounding part 11a. Further, since the second grounding portion 11b is connected to the grounding region 15a on the surface of the internal printed circuit board 13, the grounding with the printed circuit board 13 is ensured. In the present embodiment, the second grounding portion 11b is bent inward. Conversely, if the printed circuit board 13 is formed so as to project the grounding region 15a outward and come into contact with the first grounding portion 11a, the second grounding portion 11b is bent. The ground contact portion 11b can be omitted.
[0031]
  The grounding portions 11a and 11b provided on the metal cap 11 can be formed by a simple process. Therefore, productivity is excellent compared with the case where a metal cap is soldered to a heat sink. Moreover, since the grounding part 11a physically holds the metal cap 11, deformation such as dents in the metal cap 11 can be effectively prevented.
[0032]
  Further, since the first grounding portion 11a of the metal cap 11 and the electrical leads 14a to 14e of the printed circuit board 13 are unified at the height position of the surface of the printed circuit board 13, even if lead forming is not particularly performed, It is possible to make good contact with the surface of the external printed circuit board.
[0033]
  Further, since the grounding electrical lead 14e in contact with the grounding area 15a on the surface side is extended to the outside of the heat sink 12, the grounding of the printed circuit board 13 is further strengthened.
[0034]
  (Second Embodiment)
  FIG. 2 shows a configuration of a transmission amplifier module which is a high-frequency integrated circuit device according to the second embodiment of the present invention.
[0035]
  In the figure, 21 is a metal cap, 22 is a heat sink, and 23 is a printed circuit board. In the printed circuit board 23, 25 is a wiring region, 25a is a grounding region on the front surface side, 25b is a grounding surface on the back surface, 26 is an active device, 27 is a passive device, 24a is an electrical lead for high frequency input, and 24b and 24c are electrical power for power supply. A lead, 24d is an electrical lead for high-frequency output, and 24e is a grounding electrical lead in contact with the ground region 25a on the surface side. The overall configuration of the printed circuit board 23 including the ground region 25a and the electrical leads 24a to 24e is the same as that in the first embodiment. Hereinafter, a configuration different from that of the first embodiment will be described.
[0036]
  The heat sink 22 is formed with a recess 22b. The printed circuit board 23 is fitted and fixed in a recess 22 b formed in the heat sink 22. The concave portion 22b is set to an appropriate depth so that the surface height of the printed circuit board 23 and the surface height of the heat sink 22 are the same height in this fitted state.
[0037]
  On the other hand, in the metal cap 21, a grounding portion 21 a that is bent outward from the central portion extends to the outside of the heat sink 22. A part of the bottom surface of the ground contact portion 21a is in contact with the convex portion (surface portion other than the concave portion 22b) 22c of the heat sink 22. The metal cap 21 is not provided with a grounding portion that bends inward as in the first embodiment.
[0038]
  In the present embodiment, as in the first embodiment, the electrical leads 24a to 24e of the printed circuit board 23 are extended to the outside of the heat sink 22, and the arrangement order thereof is in order from the left in FIG. The high-frequency input electrical lead 24a, the power supply electrical lead 24b, the grounding electrical lead 24c, the power supply electrical lead 24d, and the high-frequency output electrical lead 24d are arranged in this order, and a metal is provided between the two high-frequency electrical leads 24a and 24d. The ground contact portion 21a of the cap 21 is located. In addition, all the electrical leads 24a to 24e including the grounding electrical lead 24c are outside the heat sink 22 at the height position of the grounding portion 21a of the metal cap 21, that is, the surface of the printed board 23 (the surface of the heat sink 22). Stretched in parallel. In FIG. 2, 21 b and 22 a are through holes for screwing provided in the metal cap 21 and the heat sink 22, respectively.
[0039]
  Therefore, in the present embodiment, the grounding of the metal cap 21 can be obtained directly at the grounding part 21a that bends outward. In addition, since the bottom surface of the grounding portion 21a is in contact with the convex portion 22c of the heat sink 22, the grounding with the heat sink 22 is ensured. Here, since the grounding part 21a provided in the metal cap 21 can be formed by a simple process, the productivity is superior to the case where the metal cap is soldered to the heat sink, and the grounding part 21a physically attaches the metal cap 21 to the heat sink. It can hold | maintain and can prevent deformation | transformation of the dent etc. of the metal cap 21. FIG.
[0040]
  Further, the printed circuit board 23 is fitted into the recess 22b of the heat sink 22 so that the surface height of the printed circuit board 23 is the same as the surface height of the heat sink 22, and each of the grounding portion 21a of the metal cap 21 and each of the printed circuit board 23 is set. The height positions of the electrical leads 24 a to 24 e are unified with the surface height position of the heat sink 22. For this reason, even if it does not give lead forming especially, these grounding parts and an electrical lead can be reliably touched to the surface of an external printed circuit board.
[0041]
  The grounding electrical lead 24a in contact with the grounding area 25a of the printed circuit board 23 further enhances the grounding of the printed circuit board 23.
[0042]
  (Third embodiment)
  FIG. 3 shows the configuration of the high-frequency circuit according to the third embodiment of the present invention. In the same figure, 31 is the whole transmission amplifier module shown in FIG. 1, and 30 is a part of the housing. Reference numeral 33 denotes another printed circuit board on which a high-frequency circuit including a power supply circuit is formed. That is, in the printed circuit board 33, 35a is a high frequency input region, 35b and 35c are power regions, and a DC bias is applied. 35d is a high-frequency output region, and 35e is a grounding region formed on the surface of the printed circuit board 33. The grounding region is located between the two high-frequency regions 35a and 35d, and is grounded on the back surface through a plurality of through holes 35f. 36 and the housing 30 are electrically connected.
[0043]
  The transmission amplifier module 31 is fixed to the housing 30 with screws using the through holes 12a at both ends of the metal cap 11. In this state, the electrical leads 14a to 14d for high-frequency input, two power supplies, and high-frequency output of the transmission amplifier module 31 are for high-frequency input on the printed circuit board 33, for two power supplies, and for high-frequency output, respectively. These regions 35a to 35d are fixed by soldering. At this time, the first grounding portion 11a of the metal cap 11 of the transmission amplifier module 31 and the grounding electrical lead 14e of the internal printed circuit board 13 are directly soldered to the grounding area 35e of the printed circuit board 33. Therefore, the metal cap 11 and the internal printed circuit board 13 can be firmly grounded.
[0044]
  Here, the ground region 35e of the printed circuit board 33 is located between the high frequency input region 35a and the high frequency output region 35d formed on the printed circuit board 33, and is a position for electrically separating the high frequency regions 35a and 35d. Therefore, the input / output separation characteristics of the entire high-frequency circuit are improved, the oscillation resistance is improved, and the variation in electrical characteristics is effectively reduced.
[0045]
  Next, FIG. 4 shows an experimental result that the high-frequency circuit of this embodiment is effective in improving the oscillation resistance. As a result of this experiment, an impedance variable device is connected to the outside of the high frequency output region 35d of FIG. 3 of the present embodiment and the outside of the conventional high frequency output region 65d of FIG. 6, and predetermined regions 35a to 35c are respectively predetermined. When the DC bias and the high frequency input power are added, and the load impedance of the transmission amplifier module is changed using the impedance variable device, the impedance at which the transmission module oscillates is examined, and this is shown on the Smith chart. It is a plot. In the present embodiment, it can be seen that the oscillation region is drastically reduced as compared with the conventional example of FIG.
[0046]
  In the present embodiment, the configuration shown in FIG. 1 is adopted as the high frequency integrated circuit device. However, when the high frequency integrated circuit device shown in FIG. 2 is adopted, the electrical leads 14a to 14e shown in FIG. However, the only difference is that the electrical leads 24a to 24e in FIG.
[0047]
  Moreover, although the case where both ends of the metal caps 11 and 21 were screwed was illustrated in the above description, this invention is not limited to this. That is, there is an insufficient grounding portion for each of various metal caps, and the positions of the grounding portions 11a and 11b may be specified so as to improve the grounding of this portion.
[0048]
【The invention's effect】
  As explained above,Claims 1 and 2According to the high frequency integrated circuit device of the described invention, the external to the metal capgroundShould connect to the regionFirst ground contact areaNewly formed, the metal cap has good groundingFirst ground contact areaCan be obtained directly at. Moreover, this metal capFirst and second ground contact partsCan be formed by a simple process, so that the productivity is higher than when the metal cap is soldered to the heat sink,First and secondGrounding partMetal cap center withBy metal capShapeCan be physically held, and deformation of the metal cap can be prevented.
[0049]
  Also,Claims 3 and 4According to the high frequency integrated circuit device of the described invention, similarly, by connecting the grounding part of the metal cap to the external grounding region, it is possible to obtain a good grounding of the metal cap directly at the newly provided grounding part. In addition, since the printed board is mounted in the concave portion of the metal plate and the height of the grounding portion of the metal cap and the electric lead of the printed board is unified at the surface position of the metal plate, it is not necessary to perform lead forming. Moreover, it is excellent in productivity and can effectively prevent deformation such as dents in the metal cap.
[0050]
  Furthermore,Claims 1-4According to the described invention, in the high frequency circuit, the ground region connected to the grounding portion of the metal cap is located between the high frequency input region and the high frequency output region, and these two high frequency regions are electrically connected by the ground region. Therefore, it is possible to improve the high-frequency input / output separation characteristics, hardly oscillate, and to stabilize the electrical characteristics.
[0051]
  In particular,Claims 2 and 4According to the described invention, since the height of the grounding portion of the metal cap and the electrical lead of the printed circuit board are set at the same height position, the grounding portion and the electrical lead are connected to the external printed circuit board without performing lead forming. It can be easily connected to the grounding area and wiring area on the surface.
[0052]
  in addition,Claims 1 and 3According to the described invention, the grounding of the printed circuit board can be strengthened by using the grounding electrical lead, and the height position of the grounding electrical lead is unified with that of the other electrical leads, so there is no need to perform lead forming.
[0053]
  Also,Claims 5 and 6According to the described invention, in the high-frequency circuit, a good grounding of the metal cap can be obtained directly by simply connecting the grounding part newly provided on the metal cap of the high-frequency integrated circuit device to the grounding region of another printed circuit board. Can do.
[0054]
  In particular, theseClaims 5 and 6According to the described invention, since the grounding region is located between the high frequency input region and the high frequency output region and the two high frequency regions are electrically separated by the grounding region, the high frequency input / output separation characteristics can be improved. In addition, there is an effect that it is difficult to oscillate and the electrical characteristics can be stabilized.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a high-frequency integrated circuit device according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a high-frequency integrated circuit device according to a second embodiment of the present invention.
FIG. 3 is a diagram illustrating a configuration of a high-frequency circuit according to a third embodiment of the present invention.
FIG. 4 is a diagram comparing oscillation regions of the transmission module of the present invention and a conventional transmission module.
FIG. 5 is a diagram showing a configuration of a conventional high-frequency integrated circuit device.
FIG. 6 is a diagram showing a configuration of a conventional high-frequency circuit.
[Explanation of symbols]
  11, 21 Metal cap
  11a First ground contact part
  11b Second grounding part
  12, 22 Heat sink (metal plate)
  13, 23 Printed circuit board
  14a, 24a High frequency input electrical lead
  14b, 24b Electrical lead for power supply
  14c, 24c Electrical lead for power supply
  14d, 24d High frequency output electrical leads
  14e, 24e Electrical lead for grounding
  15, 25 Wiring area
  15a Grounding area of printed circuit board surface
  21a Grounding part
  22b recess
  22c Convex
  30 housing
  31 Transmission amplifier module (high frequency integrated circuit device)
  33 Other printed circuit boards
  35a High frequency input area
  35b, 35c Power supply area
  35d high frequency output region
  35e Grounding area

Claims (6)

A metal plate,
A printed circuit board mounted on the upper surface of the metal plate, and mounted with electrical leads extending outward from the metal plate;
A metal cap mounted on the metal plate so as to cover the printed circuit board;
The printed circuit board has a ground region electrically connected to a ground surface provided on the back surface on the metal plate side and patterned on the surface;
The electrical lead is
An active element of a high-frequency field effect transistor or a high-frequency bipolar transistor placed on the surface of the printed circuit board, a high-frequency input electrical lead and a high-frequency output connected via a wiring region patterned on the surface of the printed circuit board Electrical leads for,
A grounding electrical lead connected to the grounding area of the printed circuit board surface and extending outward from the metal plate;
One side of the metal cap is cut out leaving a central portion, and the central portion serves as a portion for retaining the shape of the metal cap, and the metal cap has a part below the central portion on the outside. A first grounding portion that is bent and extends outward from the metal plate; and a second grounding portion that is bent inwardly at the lower portion of the central portion and is in contact with the grounding region of the printed circuit board surface. ,
The grounding portion of the metal cap and the electrical lead for grounding are located between the electrical lead for high frequency input and the electrical lead for high frequency output in a state where the printed circuit board is covered with the metal cap. High frequency integrated circuit device. 2. The high-frequency integrated circuit device according to claim 1, wherein the first grounding portion of the metal cap and the electrical lead attached to the printed circuit board extend outward in parallel at the same height position. A metal plate with a recess,
A printed circuit board that is mounted in the recess of the metal plate, and in which the electrical leads are mounted in such a mounted state that the surface height matches the surface height of the metal plate and extends outward from the metal plate;
A metal cap mounted on the metal plate so as to cover the printed circuit board;
The printed circuit board has a ground region electrically connected to a ground surface provided on the back surface on the metal plate side and patterned on the surface;
The electrical lead is
An active element of a high-frequency field effect transistor or a high-frequency bipolar transistor placed on the surface of the printed circuit board, a high-frequency input electrical lead and a high-frequency output connected via a wiring region patterned on the surface of the printed circuit board Electrical leads for,
A grounding electrical lead connected to the grounding area of the printed circuit board surface and extending outward from the metal plate;
One side of the metal cap is cut out leaving a central portion, and the central portion serves as a portion that retains the shape of the metal cap, and the metal cap is bent at the lower side of the central portion to the outside. It has a ground contact portion that is in contact with the surface of the metal plate and extends outward from the metal plate,
The grounding portion of the metal cap and the electrical lead for grounding are located between the electrical lead for high frequency input and the electrical lead for high frequency output in a state where the printed circuit board is covered with the metal cap. High frequency integrated circuit device. 4. The high-frequency integrated circuit device according to claim 3 , wherein the grounding portion of the metal cap and the electrical lead attached to the printed board extend outward in parallel at the same height position. The high-frequency integrated circuit device according to claim 1 ,
A first grounding portion of the metal cap and another printed circuit board on which a grounding region fixed by soldering to the grounding electrical lead of the printed circuit board is formed;
A high-frequency circuit, wherein a high-frequency input region and a high-frequency output region are formed on the other printed circuit board with the grounding region interposed therebetween. The high-frequency integrated circuit device according to claim 3,
And having a grounding region of the metal cap and another printed circuit board on which a grounding region fixed by soldering to the grounding electrical lead of the printed circuit board is formed,
On the other printed circuit board, a high frequency input region and a high frequency output region are formed with the grounding region interposed therebetween.
A high-frequency circuit characterized by that.

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