JP2002026163A - High-frequency integrated circuit device and high- frequency circuit using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency integrated circuit device where the fully grounding of its metallic cap can be made. SOLUTION: On the top surface of a heat sink 12, a printed board 13 is mounted. On the front-surface side of the printed board 13, a grounding region 15a electrically connected with a grounding plane present on its rear surface is formed, and electric leads 14a-14e extended outwardly from the heat sink 12 are mounted. A metal cap 11 is so mounted on the heat sink 12 as to cover the printed board 13. In the metal cap 11, a first grounding portion 11a bent outward from the lower end of a presser portion 11c and a second grounding portion 11b bent inwardly are formed respectively. The second grounding portion 11b is brought into contact with the grounding region 15a present on the front surface of the printed board 13. While the first grounding portion 11a is connected with an external grounding region. Accordingly, the grounding of the metal cap 11 is obtained directly by the first grounding portion 11a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency integrated circuit device in which high-frequency elements are integrated and a high-frequency circuit using the same, and more particularly to a transmission amplifier module and its peripheral circuits mounted in a wireless system such as mobile communication. Regarding the configuration.

[0002]

2. Description of the Related Art In recent years, mobile communication devices typified by portable telephones have been rapidly increasing in performance and miniaturization, and at the same time, the penetration rate has been growing explosively. In particular, digitization of communication data has dramatically increased the number of communication channels, and created a system that can easily transmit and receive character information and image information. However, since the diversification of these communication services leads to the complexity of the system itself,
As in the computer industry, device integration is essential.

[0003] High-frequency devices used in the radio section of a communication system have also been integrated and miniaturized. In particular, in a power amplifier device as a key device, an HIC (hybrid IC) module or an MMIC (microwave monolithic IC) has been developed. Various forms such as the above have been put to practical use. Hereinafter, the configuration of a conventional transmission amplifier module having the HIC structure will be described with reference to the drawings.

FIGS. 5 and 6 show a transmission amplifier module as a conventional high-frequency integrated circuit device and a high-frequency circuit using the same, respectively. In FIG. 5, reference numeral 51 denotes a metal cap, 52 denotes a heat sink, and 53 denotes a printed circuit board, which is fixed to the heat sink 52. Reference numeral 54 denotes an electric lead, which is mounted on the back surface of the printed circuit board 53 and extends to the outside of the heat sink 52. In the printed circuit board 53, 55 is a wiring area, 56
Are active elements such as high-frequency field-effect transistors;
Reference numeral 7 denotes a passive element such as a chip capacitor. Also,
Reference numeral 51 a denotes a pressing portion at the center of the metal cap 51, which is in contact with the side surface of the heat sink 52. 52a is a screw hole passing through the heat sink 52.

In FIG. 6, reference numeral 61 denotes a conventional transmission amplifier module shown in FIG. 5, and reference numeral 60 denotes a part of a housing. Here, the case 60 refers to a metal case holding the role of a heat sink and the entire high-frequency circuit, but is actually covered with a metal cover (lid) to prevent high-frequency leakage. 63
Is another printed circuit board, and a high-frequency input area 65a,
High-frequency circuits including power circuits such as power regions 65b and 65c to which a DC bias is applied and a high-frequency output region 65d are formed.

As shown in FIG. 6, the transmission amplifier module 61 is screwed and fixed to the housing 60 using through holes 52a at both ends. The four electric leads 54 are fixed by soldering to the corresponding regions 65a to 65d on the printed circuit board 63 (for example, "A high power" by N. Nakamura et al.
and low distortion amplifier module for large cell
base station in digital cordless system "IEICE Tr
ans.Electron., vol.E81-C, no.6, pp.886-891, June 1998.
Etc.).

[0007]

However, in the configuration of the conventional high-frequency circuit, abnormal oscillation sometimes occurs. Then, when the cause was examined, it was found that the grounding of the metal cap 51 was insufficient.
That is, it is desirable that the grounding of the metal cap 51 be good in the vicinity of the high-frequency regions 65a and 65d of the printed circuit board 63, but in the conventional example of FIG. 5, the metal cap 51 is connected to the heat sink 12 via set screws at both ends thereof. Therefore, the grounding of the central portion of the metal cap 51 is not so strong. In addition, the ground reaches the ground surface on the back surface of the printed circuit board 63 via the set screw, the heat sink 12, and the housing 60, so that there is a physically large distance before reaching the ground. As a result, abnormal oscillation is likely to occur, which is a serious problem in practical use.

Therefore, for example, as a method of improvement, there is a method of soldering a lower peripheral edge of a metal cap to a heat sink. However, a long physical distance until grounding cannot be eliminated.
Again, abnormal oscillation occurs. In addition, the soldering process becomes complicated, resulting in poor productivity.

Further, due to insufficient grounding of the metal cap 51 and insufficient electrical separation between the high-frequency input area 65a and the high-frequency output area 65d on the printed circuit board 63,
Oscillation was likely to occur, high-frequency characteristics varied greatly, or the results differed from the results of single-unit evaluation, and a stable high-frequency circuit could not be formed.

[0010] The present invention has been made in view of the above problems, and its object is to
It is an object of the present invention to provide a high-frequency integrated circuit device having an HIC structure capable of sufficiently grounding a metal cap and a high-frequency circuit having a structure capable of sufficiently electrically isolating a high-frequency input and output.

[0011]

In order to solve the above-mentioned problems, according to the present invention, a grounding portion is newly formed on a metal cap in a high-frequency integrated circuit device. A connection region connected to a ground portion of the metal cap is formed, and the high-frequency input region and the high-frequency output region are electrically separated by the connection region.

That is, a high-frequency integrated circuit device according to a first aspect of the present invention is a high-frequency integrated circuit device, comprising: a metal board; a printed circuit board mounted on an upper surface of the metal plate; and an electric lead extending outside the metal plate. A metal cap mounted on the metal plate so as to cover the printed circuit board, wherein the printed circuit board has a ground area provided on a front surface side electrically connected to a ground plane provided on a back surface which is the metal plate side. Wherein the metal cap has a grounding portion that is in contact with a grounding region on the surface of the printed circuit board and that extends outside the metal plate.

According to a second aspect of the present invention, in the high frequency integrated circuit device according to the first aspect, the ground portion of the metal cap is formed by bending a first ground portion extending outward from the metal plate and inwardly bent. And a second grounding portion that is in contact with a grounding region on the surface of the printed circuit board.

According to a third aspect of the present invention, in the high frequency integrated circuit device according to the first aspect, the ground portion of the metal cap and the electric lead mounted on the printed circuit board are parallel at the same height. And extending outwardly.

According to a fourth aspect of the present invention, in the high frequency integrated circuit device according to the first or third aspect, the electrical leads mounted on the printed circuit board include an electrical lead for high frequency input and an electrical lead for high frequency output. The ground portion of the metal cap is located between the high-frequency input electric lead and the high-frequency output electric lead when the printed circuit board is covered with the metal cap.

According to a fifth aspect of the present invention, in the high-frequency integrated circuit device according to the first or third aspect, the electric lead mounted on the printed board is located outside a ground area of the surface of the printed board from the metal plate. A grounding electrical lead extending to

According to a sixth aspect of the present invention, there is provided a high-frequency integrated circuit device according to the first aspect of the present invention, wherein a metal plate having a concave portion is mounted in the concave portion of the metal plate. A printed circuit board on which electric leads extending outward from the metal plate are mounted; and a metal cap mounted on the metal plate so as to cover the printed circuit board. And a ground contact portion extending outside the metal plate.

According to a seventh aspect of the present invention, in the high frequency integrated circuit device according to the sixth aspect, the ground portion of the metal cap and the electric lead mounted on the printed circuit board are parallel at the same height. And extending outwardly.

According to an eighth aspect of the present invention, in the high frequency integrated circuit device according to the sixth or seventh aspect, the electrical leads mounted on the printed circuit board include a high frequency input electrical lead and a high frequency output electrical lead. The ground portion of the metal cap is located between the high-frequency input electric lead and the high-frequency output electric lead when the printed circuit board is covered with the metal cap.

According to a ninth aspect of the present invention, in the high frequency integrated circuit device according to the sixth or seventh aspect, the electric lead mounted on the printed board is located outside a ground region of the surface of the printed board from the metal plate. A grounding electrical lead extending to

According to a tenth aspect of the present invention, there is provided a high-frequency circuit comprising a printed circuit board, a metal plate on which the printed circuit board is mounted on an upper surface, and a metal cap formed with a ground portion extending outside the metal plate by bending a part thereof. And a printed circuit board having a ground region electrically connected to a ground portion of the metal cap.

The invention according to claim 11 is the invention according to claim 10.
In the high-frequency circuit according to the above, the other printed circuit board,
A high-frequency input region and a high-frequency output region are formed with the ground region interposed therebetween.

According to a twelfth aspect of the present invention, there is provided the eleventh aspect.
In the high frequency circuit described above, the high frequency integrated circuit device is the high frequency integrated circuit device according to claim 4.

According to a thirteenth aspect of the present invention, there is provided the method according to the eleventh aspect.
In the high frequency circuit described above, the high frequency integrated circuit device is the high frequency integrated circuit device according to claim 8.

As described above, in the high-frequency integrated circuit device according to the first to fifth aspects of the present invention, by connecting the grounding portion of the metal cap to the external grounding region, good grounding of the metal cap is directly performed at the grounding portion. Obtainable. In addition, since the grounding portion is also connected to the ground area of the internal printed circuit board, the grounding of the printed circuit board is also ensured. Further, since the ground portion of the metal cap can be formed by a simple process, the productivity is superior to the case where the metal cap is soldered to a heat sink. In addition, since the grounding portion physically holds the metal cap to the internal printed circuit board or the metal plate, deformation such as dent of the metal cap is prevented.

Also, in the high frequency integrated circuit device according to the present invention, the grounding portion of the metal cap is connected to an external grounding region, so that a good grounding of the metal cap is achieved at the grounding portion. Can be obtained directly. Also, since the grounding portion is connected to the surface of the metal plate,
The grounding of the metal plate is also ensured. In addition, when the printed circuit board is mounted in the concave portion of the metal plate, the surface height of the printed circuit board and the surface height of the metal plate become the same height, and the height of the ground portion of the metal cap and the electric lead of the printed circuit board are increased. Is unified at the surface position of the metal plate, so that it can be connected to a ground region or a wiring region formed on the surface of the external printed circuit board without performing lead forming. Further, as described above, the productivity is excellent, and deformation such as dent of the metal cap can be effectively prevented.

In particular, according to the third and seventh aspects of the present invention, the height of the ground portion of the metal cap and the electrical lead of the printed circuit board extend parallel to the outside at the same height position, so that lead forming is not performed. It can be connected to a ground area or a wiring area formed on the surface of an external printed circuit board.

Furthermore, in the inventions according to the fourth and eighth aspects, the grounding portion of the metal cap is particularly located between the high-frequency input electric lead and the high-frequency output electric lead of the printed circuit board, so that the metal cap is connected thereto. The positional relationship between the ground region, high-frequency input region, and high-frequency output region of the high-frequency circuit to be formed is a relationship sandwiching the ground region. Therefore, the high-frequency input region and the high-frequency output region are electrically and effectively separated by the ground region, so that the high-frequency input / output separation characteristics are improved, oscillation is difficult, and the electric characteristics are stable. .

[0029] In addition, in the invention according to claims 5 and 9,
By connecting the grounding electrical lead connected to the grounding area on the surface of the printed board to an external grounding area, the grounding of the printed board using the grounding portion of the metal cap is strengthened, and the grounding of the printed board is more reliably performed. become. In addition, since the height position of the grounding electrical lead of the metal cap, that is, the height position of the other electrical leads is unified, there is no need to perform lead forming.

In the invention according to claims 10 to 13,
In the high-frequency circuit, by connecting the grounding portion of the metal cap of the high-frequency integrated circuit device to the grounding region of another printed circuit board, good grounding of the metal cap can be directly obtained at the grounding portion.

In particular, in the inventions according to claims 11 to 13,
Since the ground region is located between the high-frequency input region and the high-frequency output region, and the two high-frequency regions are electrically separated by the ground region, high-frequency input / output separation characteristics are improved, and oscillation is difficult. Also, the electrical characteristics are stabilized.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a high-frequency integrated circuit device and a high-frequency circuit according to embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 shows a configuration of a transmission amplifier module which is a high-frequency integrated circuit device according to a first embodiment of the present invention.

In the figure, reference numeral 11 denotes a metal cap;
Denotes a heat sink (metal plate), and 13 denotes a printed circuit board, which is mounted on the upper surface of the heat sink 12. The metal cap 12 is mounted on the heat sink 12 so as to cover the printed circuit board 13.

In the printed board 13, a wiring area 15 is formed on the surface of the printed board 13 by a pattern using a copper film or the like. Reference numeral 15a denotes a ground region formed on the front surface side, and is electrically connected to a ground surface 15b formed on the entire back surface of the printed circuit board 13 through through holes (not shown). Reference numeral 16 denotes an active element such as a high-frequency field-effect transistor or a high-frequency bipolar transistor;
Reference numeral 7 denotes a passive element such as a chip capacitor or a chip resistor. 14a is an electric lead for high frequency input, 1
Reference numerals 4b and 14c denote electric leads for power supply, and 14d denote electric leads for high frequency output.
4 d is mounted on the front side of the printed circuit board 13 and is connected to the active element 16 and the passive element 17 via the wiring area 15. 14e is a grounding electrical lead, which is connected to the grounding area 15a on the front side. This grounding electrical lead 1
4e is located between the two power leads 14b and 14c. The electrical leads 14a-14e are arranged parallel to each other and extend outside the heat sink 12.

In the metal cap 11, reference numeral 11 a denotes a first ground portion, which is bent outward from the center of the metal cap 11 and extended to the outside of the heat sink 12. Reference numeral 11b denotes a second ground portion bent inward, which is connected to a ground region 15a on the front surface side of the printed circuit board 13. These contact parts 1
1a and 11b show that the metal cap 11 is a heat sink 12
The ground portions 11a and 11b and the electrical leads 14a to 14e extend outward and inward at the same height as each other. In addition, the two contact portions 11a, 11
b is located between one set of high-frequency electrical leads 14a, 14d and one set of power supply electrical leads 14b, 14c when the metal cap 11 is mounted on the heat sink 12. In FIG. 1, reference numerals 11c and 12a denote through holes for screws provided in the metal cap 11 and the heat sink 12, respectively.

Therefore, in this embodiment, the grounding of the metal cap 11 can be obtained directly at the first grounding portion 11a. Further, since the second grounding portion 11b is connected to the grounding region 15a on the surface of the printed circuit board 13, the grounding with the printed circuit board 13 is ensured. In the present embodiment, the second grounding portion 11b is bent inward, but the grounding region 15a protrudes outwardly, and the first grounding portion 1b is bent outward.
If the printed circuit board 13 is formed so as to be in contact with 1a, the second ground portion 11b can be omitted.

The grounding portion 1 provided on the metal cap 11
1a and 11b can be formed by simple steps. Therefore, the productivity is superior to the case where the metal cap is soldered to the heat sink. Moreover, since the grounding portion 11a physically holds the metal cap 11, deformation such as dent of the metal cap 11 can be effectively prevented.

The first ground portion 11a of the metal cap 11 and the electrical leads 14a to 14e of the printed circuit board 13
Is uniform at the height position of the surface of the printed circuit board 13, so that it is possible to properly contact the surface of the external printed circuit board without particularly performing lead forming.

Further, since the grounding electrical lead 14a in contact with the grounding area 15a on the front side extends to the outside of the heat sink 12, the grounding of the printed circuit board 13 is further strengthened.

(Second Embodiment) FIG. 2 shows a configuration of a transmission amplifier module which is a high-frequency integrated circuit device according to a second embodiment of the present invention.

In the figure, 21 is a metal cap, 22
Denotes a heat sink and 23 denotes a printed circuit board. In the printed circuit board 23, 25 is a wiring region, 25a is a ground region on the front surface side, 25b is a ground surface on the back surface, 26 is an active element,
7 is a passive element, 24a is a high-frequency input electric lead, 24
Reference numerals b and 24c denote electric leads for power supply, 24d an electric lead for high-frequency output, and 24e an electric lead for ground contacting the ground area 25a on the front side. The overall configuration of the printed circuit board 23 including the ground region 25a and the electric leads 24a to 24e is the same as that of the first embodiment. Hereinafter, a configuration different from that of the first embodiment will be described.

A concave portion 22b is formed in the heat sink 22. The printed circuit board 23 includes the heat sink 2.
2 and is fixedly fitted in the concave portion 22b formed in the same. The recess 22b is set to an appropriate depth such that the surface height of the printed circuit board 23 and the surface height of the heat sink 22 are the same in this fitted state.

On the other hand, in the metal cap 21, a ground portion 21 a bent outward from the central portion extends to the outside of the heat sink 22. This ground part 2
A part of the bottom surface of 1a is
surface portion other than b) 22c. The metal cap 21 is not provided with a ground portion that bends inward as in the first embodiment.

In this embodiment, similarly to the first embodiment, each of the electric leads 24a to 24a
4e is extended to the outside of the heat sink 22, and these are arranged in order from the left side of FIG. 2 in the order of the high-frequency input electric lead 24a, the power supply electric lead 24b, the grounding electric lead 24c, the power supply electric lead 24d, The output electric lead 24d is in the order, and the ground portion 21a of the metal cap 21 is located between the two high-frequency electric leads 24a and 24d. Also, the grounding electrical lead 24c
Are extended parallel to the outside of the heat sink 22 at the height position of the ground portion 21 a of the metal cap 21, that is, at the surface position of the printed circuit board 23 (the surface of the heat sink 22). In FIG. 2, reference numerals 21b and 22a denote through holes for screws provided in the metal cap 21 and the heat sink 22, respectively.

Therefore, in this embodiment, the grounding of the metal cap 21 can be directly obtained at the grounding portion 21a which is bent outward. In addition, since the bottom surface of the ground portion 21a is in contact with the protrusion 22c of the heat sink 22, grounding with the heat sink 22 is also ensured. Here, since the grounding portion 21a provided on the metal cap 21 can be formed by a simple process, the productivity is superior to the case where the metal cap is soldered to the heat sink, and the grounding portion 21a is improved.
a physically holds the metal cap 21 and can prevent deformation such as dent of the metal cap 21.

Further, the printed circuit board 23 is
2, the surface height of the printed circuit board 23 becomes the same as the surface height of the heat sink 22, and the ground portion 21 a of the metal cap 21 and each of the electric leads 24 a to 24 e of the printed circuit board 23 are connected. The height position is unified with the surface height position of the heat sink 22. For this reason, these grounding portions and electric leads can be reliably brought into contact with the surface of the external printed circuit board without particularly performing lead forming.

The grounding electrical lead 24a in contact with the ground area 25a of the printed circuit board 23 further enhances the grounding of the printed circuit board 23.

(Third Embodiment) FIG. 3 shows a configuration of a high-frequency circuit according to a third embodiment of the present invention. In the figure, reference numeral 31 denotes the whole of the transmission amplifier module shown in FIG.
Reference numeral 30 denotes a part of the housing. Reference numeral 33 denotes another printed circuit board on which a high-frequency circuit including a power supply circuit is formed. That is, in the printed circuit board 33, 35a is a high-frequency input area, 35b and 35c are power supply areas, and a DC bias is applied. 35d is a high-frequency output area, 35e is a ground area formed on the surface of the printed circuit board 33, and is located between the two high-frequency areas 35a and 35d, and a ground plane on the back surface through a plurality of through holes 35f. 36 and the housing 30.

The transmission amplifier module 31 is fixed to the housing 30 by screws using through holes 12a at both ends of the metal cap 11. In this state, the electrical leads 14a to 14d for high-frequency input, two power supplies, and high-frequency output of the transmission amplifier module 31 are respectively connected to the printed circuit board 33.
It is fixed by soldering to the upper high-frequency input, two power supply and high-frequency output regions 35a to 35d. At this time,
The first ground portion 11a of the metal cap 11 of the transmission amplifier module 31 and the grounding electrical lead 14e of the internal printed board 13 are connected to the ground area 3 of the printed board 33.
5e is directly soldered. Therefore, the metal cap 11
And strong grounding of the internal printed circuit board 13 is possible.

Here, the ground area 35 of the printed circuit board 33
e is the high frequency input area 3 formed on the printed circuit board 33.
5a and the high-frequency output region 35d, and formed at a position for electrically separating the high-frequency regions 35a and 35d, the input / output separation characteristics of the entire high-frequency circuit are improved, and the oscillation resistance is improved. And the variation in electrical characteristics is effectively reduced.

Next, FIG. 4 shows the results of an experiment in which the high-frequency circuit according to the present embodiment is effective in improving oscillation resistance. This experimental result shows that an impedance variable device is connected to the outside of the high-frequency output region 35d of FIG. 3 of the present embodiment and the outside of the conventional high-frequency output region 65d of FIG.
When a predetermined DC bias and high-frequency input power are applied to 35c, and the load impedance of the transmission amplifier module is changed using the impedance variable device, it is checked at which impedance the transmission module oscillates. This is plotted on a Smith chart. In the present embodiment, the oscillation region is dramatically reduced as compared with the conventional example of FIG. 6, and it can be seen that there is no practical problem at all.

In this embodiment, the high-frequency integrated circuit device shown in FIG. 1 is used. However, when the high-frequency integrated circuit device shown in FIG. 2 is used, the electric lead shown in FIG. 14a to 14e are the electrical leads 24a to 24e of FIG.
The difference is only that it is changed to 24e, and a description thereof will be omitted.

In the above description, the metal cap 1
Although the case where both ends of 1 and 21 are screwed was illustrated, the present invention is not limited to this. That is, an insufficient grounding portion exists for each of the various metal caps, and the positions of the grounding portions 11a and 11b may be specified so as to improve the grounding of this portion.

[0055]

As described above, according to the high frequency integrated circuit device of the present invention, a ground portion to be connected to the external connection region with respect to the metal cap is newly formed. Good grounding of the cap can be obtained directly at the grounding site. Moreover, since the grounding portion of the metal cap can be formed by a simple process, the productivity is superior to the case where the metal cap is soldered to a heat sink, and the metal cap can be physically held by the grounding portion. Deformation such as dents can be prevented.

According to the high frequency integrated circuit device of the present invention, similarly, the grounding portion of the metal cap is connected to the external grounding region, so that a good grounding of the metal cap is newly provided. Since it can be obtained directly at the provided grounding part, the printed circuit board is mounted in the recess of the metal plate, and the height of the grounding part of the metal cap and the electric lead of the printed circuit board are unified at the surface position of the metal plate There is no need to perform lead forming. In addition, the productivity is excellent, and deformation such as dents of the metal cap can be effectively prevented.

In particular, according to the third and seventh aspects of the present invention, the height of the grounding portion of the metal cap and the height of the electrical lead of the printed circuit board are set at the same height position, so that these portions can be formed without performing lead forming. The grounding portion and the electrical lead can be easily connected to the grounding region and the wiring region on the external printed circuit board surface.

According to the fourth and eighth aspects of the present invention, in the high frequency circuit, the ground region connected to the ground portion of the metal cap is located between the high frequency input region and the high frequency output region. Since the two high-frequency regions are electrically separated effectively by the ground region, it is possible to improve the high-frequency input / output separation characteristics, make it difficult to oscillate, and to stabilize the electric characteristics. .

In addition, according to the fifth and ninth aspects of the present invention, the grounding of the printed circuit board can be strengthened by using the grounding electrical lead, and the grounding electrical lead is unified in height with other electrical leads. Therefore, there is no need to perform lead forming.

According to the tenth to thirteenth aspects of the present invention, in a high-frequency circuit, a metal part of a metal cap of a high-frequency integrated circuit device is connected to a ground region of another printed board simply by connecting a metal part. Good grounding of the cap can be obtained directly.

In particular, according to the present invention, the ground region is located between the high-frequency input region and the high-frequency output region, and the two high-frequency regions are electrically separated by the ground region. Therefore, it is possible to improve the high-frequency input / output separation characteristics, hardly oscillate, and stabilize the electric characteristics.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a high-frequency integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a configuration of a high-frequency integrated circuit device according to a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a configuration of a high-frequency circuit according to a third embodiment of the present invention.

FIG. 4 is a diagram comparing oscillation regions of the transmission module of the present invention and a conventional transmission module.

FIG. 5 is a diagram showing a configuration of a conventional high-frequency integrated circuit device.

FIG. 6 is a diagram illustrating a configuration of a conventional high-frequency circuit.

[Explanation of symbols]

11, 21 Metal cap 11a First ground portion 11b Second ground portion 12, 22 Heat sink (metal plate) 13, 23 Printed circuit board 14a, 24a High frequency input electric lead 14b, 24b Power supply electric lead 14c, 24c For power supply Electric leads 14d, 24d High-frequency output electric leads 14e, 24e Grounding electric leads 15, 25 Wiring area 15a Ground area on printed circuit board surface 21a Grounding area 22b Concave section 22c Convex section 30 Housing 31 Transmitting amplifier module (high-frequency integrated circuit device) 33 Other printed circuit board 35a High frequency input area 35b, 35c Power supply area 35d High frequency output area 35e Ground area

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Sadao Nagata 1-1, Komachi, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. F-term (reference) 5E321 AA02 CC22 GG05

Claims (13)

[Claims] A metal plate, a printed circuit board mounted on an upper surface of the metal plate, and an electric lead extending outside the metal plate, and mounted on the metal plate so as to cover the printed circuit board. A metal cap, wherein the printed circuit board has a ground area provided on a front surface side electrically connected to a ground plane provided on a back surface which is the metal plate side; A high-frequency integrated circuit device having a ground portion that is in contact with a ground region on the surface of the substrate and extends outside the metal plate. 2. The grounding portion of the metal cap has a first grounding portion extending outward from the metal plate, and a second grounding portion bent inward and in contact with a grounding region on the surface of the printed circuit board. Claim 1 characterized by the following:
A high-frequency integrated circuit device according to claim 1. 3. The high-frequency integrated circuit device according to claim 1, wherein the ground portion of the metal cap and the electrical lead mounted on the printed circuit board extend parallel and outward at the same height. . 4. An electric lead mounted on the printed circuit board, comprising an electric lead for high-frequency input and an electric lead for high-frequency output, wherein the ground portion of the metal cap covers the printed circuit board with the metal cap. 4. The high-frequency integrated circuit device according to claim 1, wherein the high-frequency integrated circuit device is located between the high-frequency input electric lead and the high-frequency output electric lead. 5. The electric lead according to claim 1, wherein the electric lead mounted on the printed circuit board has a grounding electric lead extending from a ground area on the surface of the printed circuit board to outside of the metal plate. High frequency integrated circuit device. 6. A metal plate having a concave portion formed therein, and mounted in the concave portion of the metal plate. In this mounted state, the surface height matches the surface height of the metal plate and extends outward from the metal plate. A printed circuit board on which an electric lead is mounted, and a metal cap mounted on the metal plate so as to cover the printed circuit board, wherein the metal cap is in contact with the surface of the metal plate and extends outward from the metal plate. A high-frequency integrated circuit device having a ground portion. 7. The high-frequency integrated circuit device according to claim 6, wherein the ground portion of the metal cap and the electric lead mounted on the printed circuit board extend outward in parallel at the same height. . 8. An electric lead mounted on the printed circuit board, comprising an electric lead for high-frequency input and an electric lead for high-frequency output, wherein a ground portion of the metal cap covers the printed circuit board with the metal cap. 8. The high-frequency integrated circuit device according to claim 6, wherein the high-frequency input electric lead is located between the high-frequency input electric lead and the high-frequency output electric lead. 9. The electric lead mounted on the printed circuit board, the electric lead having a ground extending from the ground area on the surface of the printed circuit board to the outside of the metal plate. High frequency integrated circuit device. 10. A high-frequency integrated circuit device comprising: a printed circuit board; a metal plate on which the printed circuit board is mounted on an upper surface; and a metal cap formed with a ground portion extending outside the metal plate by partially bending the metal plate; A high-frequency circuit comprising: a printed circuit board having a ground region electrically connected to a ground portion of the cap. 11. The high-frequency circuit according to claim 10, wherein the other printed circuit board has a high-frequency input area and a high-frequency output area sandwiching the ground area. 12. The high frequency integrated circuit device according to claim 4,
A high-frequency circuit according to claim 11, which is the high-frequency integrated circuit device according to claim 13. 13. The high frequency integrated circuit device according to claim 8,
A high-frequency circuit according to claim 11, which is the high-frequency integrated circuit device according to claim 13.