JP3755705B2 - IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement of an IC socket for detachably holding an IC package.
[0002]
[Prior art]
This type of conventional IC socket holds the IC package in order to perform a performance test such as a burn-in test of the IC package.
[0003]
That is, in this IC socket, the IC package is housed in the socket body, and the holding cover that is rotatably attached to the socket body is rotated downward, so that the IC package can be moved from above by the pressing cover. A large number of terminals provided on the holding and IC package are brought into pressure contact with an electrical conduction member provided on the socket body side with a predetermined pressure.
[0004]
[Problems to be solved by the invention]
However, in such a conventional device, the holding cover performs a rotating operation around the rotating shaft, and unlike the case where the IC package is vertically moved from the upper side to the lower side to hold the IC package. A portion close to the moving shaft first presses the IC package, and then a portion far from the rotating shaft presses the IC package, and simultaneous pressing is difficult. As a result, first, a large pressing force is applied to a portion close to the rotating shaft, and there is a possibility that the terminal of the IC package in this portion is deformed.
[0005]
Therefore, an object of the present invention is to provide an IC socket capable of pressing the IC package in a balanced manner and preventing damage to the terminals.
[0006]
In order to achieve such an object, the invention according to claim 1 is characterized in that a pressing cover is rotatably provided on a socket body into which an IC package is inserted, and the pressing member is locked to the pressing cover. In the IC socket provided so as to be rotatable through a shaft and pressing the IC package with the pressing member by closing the pressing cover, the locking shaft is inserted into the pressing member, An elastic member for generating a pressing force for pressing the IC package is provided between the locking shaft and the pressing cover between the locking shaft and the pressing cover. The IC socket is arranged so that one end portion of the elastic member is brought into contact with the locking shaft, and the pressing force is directly applied to the locking shaft.
[0007]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, the elastic member is a coil spring, and the coil spring has a planar shape on both end surfaces that abut against the pressing cover and the locking shaft. It is formed.
[0008]
According to a third aspect of the present invention, in addition to the configuration of the second aspect, the coil spring is a conical coil spring.
[0009]
According to a fourth aspect of the present invention, in addition to the configuration of the third aspect, the conical coil spring is configured such that an end portion having a large diameter is brought into contact with the pressing cover, and an end portion having a small diameter is contacted with the locking shaft. It contact | abutted to the longitudinal direction center part of this.
[0010]
According to a fifth aspect of the present invention, in addition to the configuration according to any one of the first to fourth aspects, a guide convex portion guided by the guide groove of the socket body is protruded from the pressing member. The guide projection is provided on an extension line that passes through the center of the locking shaft and extends perpendicular to the pressing surface of the pressing member.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0012]
1 to 9 show an embodiment of the present invention.
[0013]
First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket. The IC socket 11 detachably holds an IC package 12 as shown in FIG. The terminal 12b of the IC package 12 is electrically connected to a printed circuit board (not shown) of a measuring instrument (tester).
[0014]
The IC package 12 has a large number of ball-shaped terminals 12b protruding from the peripheral edge of the lower surface of the package body 12a.
[0015]
On the other hand, the IC socket 11 generally includes a socket body 13 into which the IC package 12 is inserted, and a pressing cover 15 is rotatably disposed on the socket body 13 via a rotation shaft 14. By rotating the pressing cover 15 downward, the IC package 12 placed on the socket body 13 is pressed from above by the pressing member 24 attached to the pressing cover 15.
[0016]
Specifically, the socket body 13 is formed with a recess 13a that is inserted and placed in a state where the IC package 12 is positioned, and the terminal 12b array of the IC package 12 is arranged on the bottom surface of the recess 13a. A tab film 16 having an electrode pattern to be joined is disposed, and a substrate 17 is disposed below the tab film 16, and the substrate 17 is disposed below the electrode pattern of the tab film 16. In addition, a resilient member 18 made of silicon is disposed. The printed circuit board is connected via the tab film 16.
[0017]
On the other hand, the holding cover 15 is rotatably attached to the socket body 13 by the rotating shaft 14 on the base end 15 a side, and is urged in the opening direction by a spring 19. Further, a latch 20 is rotatably attached to the front end portion 15b side of the pressing cover 15 by a shaft 21 so that the latch 20 is engaged with and disengaged from a locked portion 13b provided on the socket body 13. It has become. The latch 20 is urged counterclockwise in FIG. 4 by the spring 22, that is, in the locking direction. When the closed state is completed by rotating the pressing cover 15 in the closing direction, the latch 20 is It is locked to the locked portion 13b (see FIG. 2).
[0018]
Further, as shown in FIG. 5 and the like, the pressing member 24 that presses the IC package 12 from above when the pressing cover 15 is closed has a rectangular parallelepiped pressing member main body 24a. While penetrating, both end portions of the locking shaft 25 protrude from both side portions of the main body 24a, and an intermediate portion of the locking shaft 25 is exposed from a recess 24b provided on the upper surface of the pressing member main body 24a. ing.
[0019]
Then, both end portions of the locking shaft 25 protruding from both side surface portions of the pressing member main body 24a are inserted into the long holes 15c formed in the pressing cover 15, so that they can be rotated and the long holes 15c. Can be translated in the longitudinal direction. The longitudinal direction of the long hole 15 c is along the tangential direction of a circle centering on the rotation shaft 14 of the pressing cover 15.
[0020]
The pressing member 24 is provided with a guide protrusion 24c that is guided by a guide groove 13c of the socket body 13 described later in detail. The guide convex portion 24 c is provided on an extension line P that passes through the center of the locking shaft 25 and extends perpendicularly to the pressing surface 24 d of the pressing member 24. Further, the guide convex portion 24c is formed in a tapered shape on the leading side in the fitting direction into the guide groove 13c.
[0021]
A conical coil spring 27 as an “elastic member” is disposed between the locking shaft 25 of the pressing member 24 and the pressing cover 15 and biases the locking shaft 25. As shown in FIG. 7, the conical coil spring 27 has an upper flat surface 27a formed by polishing an upper end surface having a large upper diameter, and a lower flat surface being one end portion by polishing a lower end surface having a small lower diameter. 27b is formed. The upper flat surface 27 a comes into contact with and comes into contact with the pressing cover 15, and the lower flat surface 27 b comes into contact with the central portion in the longitudinal direction of the locking shaft 25.
[0022]
On the other hand, the socket body 13 is formed with an inclined surface 13d on the upper part of the inner wall of the recess 13a as shown in FIG. 2 and the like, and a vertical surface 13e is formed from the lower end of the inclined surface 13d. The guide groove 13c has a guide portion 13g having a side wall 13f formed in a tapered shape (inverted C shape) and a posture correcting portion 13i having a parallel side wall 13h. The guide convex portion 24c The pressing member 24 is set so as to be movable in the vertical direction with respect to the IC package 12 by being inserted into the guiding portion 13g and guided to the posture correcting portion 13i and being inserted into the posture correcting portion 13i. ing. A width H1 of the posture correcting portion 13i is formed substantially the same as a width H2 of the guide convex portion 24c.
[0023]
By the cooperation of the guide convex portion 24c and the guide groove 13c, the pressing member 24 is set to move in the vertical direction with respect to the IC package 12 to press the IC package 12 when the pressing cover 15 is closed.
[0024]
Two sets of the guide convex portion 24 c and the guide groove 13 c are provided symmetrically with respect to the pressing member 24.
[0025]
Next, a method of using the IC socket 11 having such a configuration will be described.
[0026]
First, the IC package 12 is inserted into the recess 13 a of the socket body 13 and placed on the tab film 16, and then the pressing cover 15 is closed against the urging force of the spring 19 around the rotation shaft 14. Rotate in the direction. When rotating from the state shown in FIG. 8A to the state shown in FIG. 8B, the guide convex portion 24 c of the pressing member 24 comes into sliding contact with the side wall 13 f of the guide portion 13 g of the guide groove 13 c of the socket body 13. When the pressing cover 15 is further rotated, the guide convex portion 24c is guided by the guide portion 13g and inserted into the posture correcting portion 13i (see FIG. 8C). Next, as shown in FIG. 9D, when the guide convex portion 24c is completely inserted into the posture correcting portion 13i, the pressing member 24 is corrected to a posture capable of moving in the vertical direction with respect to the IC package 12. The Rukoto.
[0027]
Further, when the pressing cover 15 is rotated, the posture thereof is maintained, that is, the pressing surface 24d of the lower surface of the pressing member 24 is vertically lowered and brought into contact with the upper surface of the IC package 12 while being kept parallel. .
[0028]
Then, by further rotating the pressing cover 15, the latch 20 of the pressing cover 15 is locked to the locked portion 13 b of the socket body 13, and the closing of the pressing cover 15 is completed, and the conical coil spring 27 is attached. Due to the force, the upper surface of the IC package 12 is pressed in a balanced manner over a wide range by the pressing surface 24 d of the pressing member 24.
[0029]
Further, even if the guide convex portion 24c and the guide groove 13c are not cooperated as described above, the elastic force of the conical coil spring 27 is applied to the locking shaft 25 of the pressing member 24 as follows. The IC package 12 can be pressed in equilibrium with the member 24.
[0030]
That is, by causing the elastic force of the conical coil spring 27 to act on the locking shaft 25 of the pressing member 24, the elastic force of the conical coil spring 27 does not work to correct the posture of the pressing member 24 to a certain angle, The pressing member 24 can be freely rotated around the locking shaft 25 until it comes into contact with the IC package 12. Accordingly, in the process of closing the pressing cover 15 and pressing the IC package 12, first, a portion of the pressing member 24 close to the pressing cover rotating shaft 14 comes into contact with the IC package 12, but this is one-sided contact. In this state, the elastic force of the conical coil spring 27 does not act as a force for pressing the IC package 12 and shifts from the state to the surface contact state. Further, by closing the pressing cover 15, the elastic force of the conical coil spring 27 acts on the IC package 12 via the pressing member 24, and the IC package 12 can be pressed in equilibrium. In the case where the upper surface of the pressing member 24 is directly pressed by the coil spring, the force to correct the posture of the pressing member 24 by the coil spring even until the pressing member 24 comes into surface contact with the IC package 12. As a result, a strong pressing force is applied to the IC package 12 at the time of the one-piece contact, and the terminal 12b of the IC package 12 may be damaged.
[0031]
Accordingly, either the elastic force of the conical coil spring 27 acts on the locking shaft 25 of the pressing member 24 in this way, or the guide convex portion 24c and the guide groove 13c cooperate as described above. On the other hand, the effect of pressing the IC package 12 in a balanced manner can be obtained, but a further effect can be obtained by combining both.
[0032]
Further, by using a coil spring such as the conical coil spring 27, the amount of deformation can be increased as compared with a plate spring or a disc spring.
[0033]
Further, by forming the upper flat surface 27a and the lower flat surface 27b with the both end surfaces of the conical coil spring 27 as flat surfaces, a pressing force can be applied uniformly to the pressing cover 15 and the contact surface of the locking shaft 25. Incidentally, on the side of the locking shaft 25, if the end surface side of the conical coil spring 27 is not flat, the position of the end portion of the coil spring 27 that is in contact with the locking shaft 25 is such that the coil spring 27 has the coil central axis. Since the spring constant changes depending on the contact position by changing by turning at an angle at the center, in such a case, there is a problem that the change in the pressing force of the IC package 12 becomes large.
[0034]
Furthermore, since the conical coil spring 27 can take a large amount of displacement and pressing force even when the height is low compared to a normal cylindrical coil spring, the conical coil spring 27 is engaged with the pressing cover 15. By disposing it between the retaining shaft 25, the IC socket 11 can be miniaturized and the amount of displacement of the pressing member 24 can be increased.
[0035]
Further, the conical coil spring 27 makes the upper flat surface 27a on the end portion side with a large diameter abut on the pressing cover 15, and the lower flat surface 27b on the end portion side with a small diameter abuts on the engagement shaft 25 to By concentrating the elastic force near the longitudinal center of the shaft 25, the pressing of the IC package 12 by the pressing member 24 can be balanced. That is, since the conical coil spring 27 and the locking shaft 25 are in contact at two points, if the end of the conical coil spring 27 having the large diameter is brought into contact with the locking shaft 25, the interval between the contact positions increases. Therefore, if the pressing force at each point is different, this influence greatly acts on the pressing member 24. As a result, the pressing force of the IC package 12 varies at each position. This is suppressed by concentrating as described above.
[0036]
In the above embodiment, the conical coil spring 27 is used as the “elastic member”. However, the present invention is not limited to this, and a cylindrical coil spring, a leaf spring, a disc spring, rubber, or the like can also be used.
[0037]
【The invention's effect】
As described above, according to the invention described in each claim, by causing the elastic force of the elastic member to act on the locking shaft of the pressing member, the elastic force of the elastic member makes the posture of the pressing member at a certain angle. The pressing member does not act so as to correct, and can be freely rotated around the locking shaft until it comes into contact with the IC package. Accordingly, in the process of closing the pressing cover and pressing the IC package, first, a portion of the pressing member close to the pressing cover rotating shaft comes into contact with the IC package, but in this state, the elastic member The elastic force does not act as a force for pressing the IC package, but shifts from the state to the surface contact state. Further, by closing the pressing cover, the elastic force of the elastic member acts on the IC package via the pressing member, and the IC package can be pressed in a balanced manner. As a result, damage to the terminals of the IC package can be prevented.
[0038]
According to the second aspect of the present invention, when the elastic member is a coil spring, the amount of deformation can be increased as compared with a plate spring or a disc spring.
[0039]
According to the invention described in claim 3, by forming both end faces of the coil spring into a flat surface, it is possible to uniformly act on the pressing cover and the contact surface of the locking shaft. By the way, on the side of the locking shaft, if the end surface side of the coil spring is not flat, the position of the end of the coil spring that is in contact with the locking shaft is an angular rotation where the coil spring is centered on the coil central axis. As a result, since the spring constant changes depending on the contact position due to the change, in such a case, there is a problem that the change in the pressing force of the IC package becomes large.
[0040]
According to the fourth aspect of the present invention, the conical coil spring can take a large amount of displacement and pressing force even when the height is low, compared with a normal cylindrical coil spring. By disposing the spring between the pressing cover and the locking shaft, the IC socket can be miniaturized and the displacement of the pressing member can be increased.
[0041]
According to the fifth aspect of the present invention, the end of the conical coil spring having the large diameter is brought into contact with the holding cover, the end having the small diameter is brought into contact with the locking shaft, By concentrating the elastic force in the vicinity of the central portion in the longitudinal direction, the IC package by the pressing member can be pressed in a more balanced manner. That is, since the conical coil spring and the locking shaft are in contact at two points, if the end portion having a large diameter of the conical coil spring is brought into contact with the locking shaft, the interval between the contacting positions becomes large. When the pressing force is different, this influence greatly acts on the pressing member, and as a result, the pressing force of the IC package varies at each position. This is suppressed by concentrating as described above.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention.
2 is a cross-sectional view taken along line AA of FIG. 1 according to the same embodiment.
3 is a cross-sectional view taken along line BB of FIG. 1 according to the same embodiment. FIG.
FIG. 4 is a cross-sectional view of the IC socket in a state in which a pressing cover according to the same embodiment is opened.
5A and 5B are diagrams showing a pressing member according to the embodiment, where FIG. 5A is a plan view, FIG. 5B is a front view, FIG. 5C is a bottom view, and FIG. 5D is a CC line of FIG. FIG.
FIG. 6 is a cross-sectional view showing a state where the IC package according to the embodiment is pressed.
FIG. 7 is a front view of the conical coil spring according to the embodiment.
FIGS. 8A and 8B are views showing the operation according to the embodiment, and FIGS. 8A, 8B, and 8C are front views each partially broken showing a state in which the pressing cover is closed. FIGS.
FIGS. 9A and 9B are diagrams showing the operation according to the embodiment, and FIGS. 9D and 9E are front views partially cut away showing a state in which the pressing cover is closed continuously from FIG.
[Explanation of symbols]
11 IC socket
12 IC package
12a IC package body
12b terminal
13 Socket body
13c Guide groove
13g invitation part
13i Posture Correction Department
14 Rotating axis
15 Presser cover
15c long hole
24 Press member
24a Press member body
24b Guide protrusion
25 Locking shaft
27 Conical coil spring (elastic member)

Claims (5)

A presser cover is rotatably provided on the socket body into which the IC package is inserted, and a pressing member is rotatably provided to the presser cover via a locking shaft, and the presser cover is closed. In the IC socket adapted to press the IC package with the pressing member,
The locking shaft is inserted into the pressing member and is provided to be able to rotate and slide in a long hole provided in the pressing cover. Further, the IC is interposed between the locking shaft and the pressing cover. An elastic member for generating a pressing force for pressing the package is arranged , one end of the elastic member is brought into contact with the locking shaft, and the pressing force is directly applied to the locking shaft. IC socket. 2. The IC socket according to claim 1, wherein the elastic member is a coil spring, and the coil spring has both end surfaces abutting against the pressing cover and the locking shaft formed in a planar shape. The IC socket according to claim 2, wherein the coil spring is a conical coil spring. 4. The conical coil spring is configured such that an end portion having a large diameter is brought into contact with the pressing cover, and an end portion having a small diameter is brought into contact with a central portion in a longitudinal direction of the locking shaft. IC socket. The pressing member is provided with a guide convex portion that is guided by the guide groove of the socket body, and the guide convex portion passes through the center of the locking shaft and is perpendicular to the pressing surface of the pressing member. The IC socket according to claim 1, wherein the IC socket is provided on an extended line extending.

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