JP3755161B2 - Conductive resin composition and method for producing the same - Google Patents
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Description
【０００１】
【産業上の利用分野】
本発明は、導電性、帯電防止性樹脂成形物を製造するのに適した加工性、導電性が改善された導電性樹脂組成物およびその製造方法に関する。
【０００２】
【従来の技術】
熱可塑性樹脂にカーボンブラック、炭素繊維、金属繊維、金属、金属酸化物および黒鉛等を配合し、導電性あるいは帯電防止性の成形物を製造することが知られている。その中でもカーボンブラックは安価で加工しやすいことからポリプロピレン樹脂等に配合され広範囲の成形分野で使用されている。
【０００３】
しかしながら、ポリプロピレン樹脂にカーボンブラックを高濃度に配合した導電性樹脂組成物は、成形加工の際、粘度上昇をきたし、混練性や成形加工品の外観が悪くなるという欠陥があった。このような欠陥を改善する方法として密度０.945ｇ／cm3 以上のポリエチレン重合体を配合する方法が提案されている。（特開昭５５−１５２７３６号公報）
【０００４】
この提案方法によると、マスターバッチのように、さらにカーボンブラックを高濃度に配合した場合、稀釈ポリプロピレン樹脂との相溶性が悪く、成形物の外観不良、機械的強度低下、導電性のバラツキ等の問題が生じ、コンパウンドとして使用するのが現状であった。
【０００５】
【発明が解決しようとする課題】
したがって、本発明の目的は一般のポリプロピレン樹脂との加工性が良好であり、成形物を成形する際に、本発明の導電性樹脂組成物１00重量部に対し、稀釈ポリプロピレン樹脂６０〜２00重量部の割合で配合することができ成形物の外観、機械的強度、導電性にバラツキの生じない導電性樹脂組成物およびその製造方法を提供することにある。
【０００６】
【問題点を解決するための手段】
上述の目的を達成するため、本発明の導電性樹脂組成物によれば、ポリプロピレン樹脂と、ポリエチレン樹脂と、カーボンブラック（Ｃ）とを配合し、前記ポリプロピレン樹脂のメルトフローレートが１０ｇ〜５０ｇ／１０分であり、前記ポリエチレン樹脂の密度が０．９１０／ｃｍ ３ 以下であり、かつ前記カーボンブラックのＤＢＰ吸油量が６０〜２００ｍｌ／１００ｇ、比表面積が３０〜２００ｍ ２ ／ｇであり、さらに、ポリプロピレン樹脂５０〜９０重量部に対してポリエチレン樹脂１０〜５０重量部、ポリプロピレン樹脂とポリエチレン樹脂の合計重量１００重量部に対してカーボンブラック６０〜１５０重量部の配合比率とし、ポリプロピレン樹脂で稀釈しながら、成形可能な導電性または帯電防止性成形物を得ることを特徴とする。
【０００７】
さらに、上述の目的を達成するため、本発明の製造方法によれば、メルトフローレートが１０ｇ〜５０ｇ／１０分のポリプロピレン樹脂、密度が０．９１０／ｃｍ ３ 以下のポリエチレン樹脂およびＤＢＰ吸油量が６０〜２００ｍｌ／１００ｇ、比表面積が３０〜２００ｍ ２ ／ｇのカーボンブラックを、ポリプロピレン樹脂５０〜９０重量部に対してポリエチレン樹脂１０〜５０重量部、ポリプロピレン樹脂とポリエチレン樹脂の合計重量１００重量部に対してカーボンブラック６０〜１５０重量部の配合比率となるように配合してなる導電性樹脂組成物を混練し、次いでこの混練物を押出成形機により押出してペレット化し、上述の導電性樹脂組成物を得ることを特徴とする。
【０００８】
【好ましい実施態様】
本発明で使用されるポリプロピレン樹脂（Ａ）はメルトフローレートが１０〜５０ｇ／１０min.のもので、例えば、商品名：出光ポリプロ３050 Ｈ（メルトフローレート３５g ／１０min.) 等のものが使用される。
【０００９】
メルトフローレートが１０ｇ／１０分未満では、カーボンブラックを高濃度に添加したマスターバッチとしての流動性が悪くなり、ポリプロピレン樹脂で稀釈しながら成形する際に稀釈樹脂との相溶性が悪くなり、成形物の導電性が低下し、成形物の外観がよくなく、さらに成形物の機械的強度が低下するので好ましくない。また、メルトフローレートが５０ｇ／１０分を越えると、カーボンブラックを樹脂中に均一に分散させることが難しく、ポリプロピレン樹脂で稀釈しながら成形する際に、やはり導電性が低下し、成形物の外観がよくなく、さらに成形物の機械的強度が低下するので好ましくない。
【００１０】
次に本発明で使用されるポリエチレン樹脂（Ｂ）は密度が０.910ｇ／cm3 以下の超低密度ポリエチレンである。密度が０.910ｇ／cm 3 を越えると、ポリプロピレン樹脂で稀釈しながら成形すると稀釈樹脂との相溶性がよくなく、成形物の衝撃強度が低下するので好ましくない。
【００１１】
上記のポリプロピレン樹脂（Ａ）に対するポリエチレン樹脂（Ｂ）の配合量はポリプロピレン樹脂５０〜９０重量部に対して１０〜５０重量部である。ポリエチレン樹脂が１０重量部未満では、目的とする改善効果が得られず、希釈成形した成形物の衝撃強度が充分でない。また、５０重量部を越えると、希釈成形した成形物の剛性が低くなり、ポリプロピレン樹脂本来の特性が損なわれた成形物となるので好ましくない。
【００１２】
本発明において使用されるカーボンブラック（Ｃ）は、ＤＢＰ吸油量が６０〜２00ml／１00ｇ、比表面積が３０〜２00m2／ｇである。カーボンブラックのＤＢＰ吸油量が６０ml／１00ｇ未満、比表面積３０m2／ｇ未満では、ポリプロピレン樹脂で稀釈成形した成形物の導電性が低下するので好ましくない。
【００１３】
また、カーボンブラックのＤＢＰ吸油量が２00ml／１00ｇを越え、比表面積が２00m2／ｇを越える場合は、流動性の悪い導電性樹脂組成物となるためポリプロピレン樹脂で稀釈成形したときに、稀釈樹脂との相溶性が良くなく、導電性、外観、機械的強度に劣る成形物となるので好ましくない。
【００１４】
上記のカーボンブラック（Ｃ）の配合量は、ポリプロピレン樹脂（Ａ）とポリエチレン樹脂（Ｂ）の合計量１00重量部に対してカーボンブラック６０〜１50重量部である。カーボンブラックが６０重量部未満では、ポリプロピレン樹脂で稀釈成形した際に導電性が著しく低下するので好ましくない。そして１50重量部を越える場合は稀釈用ポリプロピレン樹脂と混合し、成形した際に外観不良が生じ、機械的強度が低下するので好ましくない。
【００１５】
本発明の導電性樹脂組成物は、必要に応じてその他の添加剤、例えば、可塑剤、光安定剤、帯電防止剤、劣化防止剤および充填剤等を配合することができる。
【００１６】
本発明の導電性樹脂組成物を製造する場合、配合物をバンバリーミキサー、ミキシングロール等に供して混練するバッチ式で行うほか、１軸押出機、２軸押出機等の連続式の押出機により押出して行うことができる。
【００１７】
配合順序は特に限定されるものではなく、配合物を一度に混合して混練するほかに、初め超低密度ポリエチレンとカーボンブラックを上記の混練機で混練しておき、その混練物とポリプロピレン樹脂とを混練することもできる。
【００１８】
〔実施例〕
以下、実施例により本発明を具体的に説明する。
【００１９】
実施例１
ポリプロピレン樹脂（商品名：出光ポリプロＪ３050 Ｈ、メルトフロレート３５ｇ／１０min.、出光石油化学社製品）８０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）２０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）１30重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００２０】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）１00重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００２１】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００２２】
実施例２
ポリプロピレン樹脂（商品名：出光ポリプロＪ３050 Ｈ、メルトフロレート３５ｇ／１０min.、出光石油化学社製品）８０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）２０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）８０重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００２３】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）６０重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００２４】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００２５】
実施例３
ポリプロピレン樹脂（商品名：出光ポリプロＪ３050 Ｈ、メルトフロレート３５ｇ／１０min.、出光石油化学社製品）６０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）４０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）１30重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００２６】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）６０重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００２７】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００２８】
実施例４
ポリプロピレン樹脂（商品名：出光ポリプロＪ３050 Ｈ、メルトフロレート３５ｇ／１０min.、出光石油化学社製品）６０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）４０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）８０重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００２９】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）６０重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００３０】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００３１】
比較例１
ポリプロピレン樹脂（商品名：出光ポリプロＪ６50Ｈ、メルトフロレート６ｇ／１０min.、出光石油化学社製品）８０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）２０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）１30重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００３２】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）１00重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００３３】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００３４】
比較例２
ポリプロピレン樹脂（商品名：出光ポリプロＪ６50Ｈ、メルトフロレート３５ｇ／１０min.、出光石油化学社製品）１00重量部カーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）１30重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００３５】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）１00重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００３６】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００３７】
比較例３
ポリプロピレン樹脂（商品名：出光ポリプロＪ３050 Ｈ、メルトフロレート３５ｇ／１０min.、出光石油化学社製品）８０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ２522 、密度０.920ｇ／cm3 、宇部興産社製品）２０重量部にカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）１30重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００３８】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）１00重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００３９】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００４０】
比較例４
ポリプロピレン樹脂（商品名：出光ポリプロＪ６50Ｈ、メルトフロレート６ｇ／１０min.、出光石油化学社製品）８０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）２０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）５０重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００４１】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）６０重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００４２】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００４３】
比較例５
ポリプロピレン樹脂（商品名：出光ポリプロＪ６50Ｈ、メルトフロレート６ｇ／１０min.、出光石油化学社製品）８０重量部、ポリエチレン樹脂（商品名：宇部超低密度ポリエチレンＺ５21、密度０.905ｇ／cm3 、宇部興産社製品）２０重量部およびカーボンブラック（商品名：東海カーボンシーストＳＯ、ＤＢＰ吸油量 １15ml／１00ｇ、比表面積 ４２m2／ｇ）１60重量部をバンバリーミキサーで混練し、次いでこの混練物を押出成形機により２20℃で押出してペレット化し、導電性樹脂組成物を得た。
【００４４】
次いで、上記の導電性樹脂組成物１00重量部にポリプロピレン樹脂（商品名：日石ポリプロＪ６30Ｇ、メルトフロレート ４ｇ／１０min.）100 重量部を配合してタンブラーで混合し、射出成形機（金型設定温度２５℃）により板状成形板とアイゾット衝撃試験用テストピースを得た。
【００４５】
得られた板状成形板、アイゾット衝撃試験用テストピースについて成形物外観の目視観察、アイゾット衝撃試験（ＡＳＴＭ Ｄ２57）、表面抵抗値測定（三菱油化社製、表面抵抗計ロレスターＣＰ使用）を行った結果を表１に示す。
【００４６】
【表１】
【発明の効果】
本発明の導電性樹脂組成物およびその製造方法は、ポリプロピレン樹脂に密度が０.910ｇ／cm3 以下のポリエチレン樹脂と特定のＤＢＰ吸油量、比表面積を有するカーボンブラックを所定量配合しているため、成形加工時に外観不良、例えば、フローマーク等が生じることなく、アイゾット衝撃強度、表面抵抗の良好な成形物を得ることができる。[0001]
[Industrial application fields]
The present invention relates to a conductive resin composition having improved processability and conductivity suitable for producing a conductive and antistatic resin molded product, and a method for producing the same .
[0002]
[Prior art]
It is known to blend a thermoplastic resin with carbon black, carbon fiber, metal fiber, metal, metal oxide, graphite and the like to produce a conductive or antistatic molded product. Among them, carbon black is inexpensive and easy to process, so it is blended with polypropylene resin and used in a wide range of molding fields.
[0003]
However, the conductive resin composition in which carbon black is blended with polypropylene resin at a high concentration has a defect that the viscosity is increased during molding and the kneadability and appearance of the molded product are deteriorated. As a method for improving such defects, a method of blending a polyethylene polymer having a density of 0.945 g / cm 3 or more has been proposed. (Japanese Unexamined Patent Publication No. 55-152736)
[0004]
According to this proposed method, when the carbon black is further blended at a high concentration as in the master batch, the compatibility with the diluted polypropylene resin is poor, the appearance of the molded product is poor, the mechanical strength is reduced, the electrical conductivity is varied, etc. There was a problem and it was currently used as a compound.
[0005]
[Problems to be solved by the invention]
Therefore, the object of the present invention is good workability with general polypropylene resins, and when molding a molded product, 60 to 200 parts by weight of diluted polypropylene resin is used with respect to 100 parts by weight of the conductive resin composition of the present invention. It is an object of the present invention to provide a conductive resin composition that can be blended in a proportion of the above-mentioned ratio, and in which the appearance, mechanical strength, and conductivity of the molded product do not vary, and a method for producing the same.
[0006]
[Means for solving problems]
In order to achieve the above object, according to the conductive resin composition of the present invention, a polypropylene resin, a polyethylene resin, and carbon black (C) are blended, and the melt flow rate of the polypropylene resin is 10 g to 50 g / 10 minutes, the density of the polyethylene resin is 0.910 / cm 3 or less, the DBP oil absorption of the carbon black is 60 to 200 ml / 100 g, the specific surface area is 30 to 200 m 2 / g, The blending ratio of carbon black 60 to 150 parts by weight with respect to 50 to 90 parts by weight of polypropylene resin and 60 to 150 parts by weight of carbon black with respect to 100 parts by weight of the total weight of polypropylene resin and polyethylene resin, while diluting with polypropylene resin Characterized by obtaining moldable conductive or antistatic moldings That.
[0007]
Furthermore, in order to achieve the above-mentioned object, according to the production method of the present invention, a polypropylene resin having a melt flow rate of 10 g to 50 g / 10 min, a polyethylene resin having a density of 0.910 / cm 3 or less, and a DBP oil absorption amount. Carbon black of 60 to 200 ml / 100 g and specific surface area of 30 to 200 m 2 / g is added to 10 to 50 parts by weight of polyethylene resin with respect to 50 to 90 parts by weight of polypropylene resin, and 100 parts by weight of the total weight of polypropylene resin and polyethylene resin. In contrast, the conductive resin composition blended so as to have a blending ratio of 60 to 150 parts by weight of carbon black is kneaded, and then the kneaded product is extruded and pelletized by an extrusion molding machine. It is characterized by obtaining.
[0008]
[Preferred embodiment]
The polypropylene resin (A) used in the present invention has a melt flow rate of 10 to 50 g / 10 min., For example, a product name: Idemitsu Polypro 3050 H (melt flow rate 35 g / 10 min.) Is used. The
[0009]
When the melt flow rate is less than 10 g / 10 min , the flowability as a master batch in which carbon black is added at a high concentration is deteriorated, and when being diluted with polypropylene resin, the compatibility with the diluted resin is deteriorated. This is not preferable because the electrical conductivity of the product is lowered, the appearance of the molded product is not good, and the mechanical strength of the molded product is further reduced. In addition, when the melt flow rate exceeds 50 g / 10 min, it is difficult to uniformly disperse carbon black in the resin, and when the molding is performed while diluting with polypropylene resin, the conductivity is lowered, and the appearance of the molded product is also reduced. Is not good, and further, the mechanical strength of the molded product is lowered, which is not preferable.
[0010]
Next, the polyethylene resin (B) used in the present invention is an ultra-low density polyethylene having a density of 0.910 g / cm 3 or less. If the density exceeds 0.910 g / cm 3 , molding while diluting with a polypropylene resin is not preferable because the compatibility with the diluted resin is not good and the impact strength of the molded product is reduced.
[0011]
The compounding quantity of the polyethylene resin (B) with respect to said polypropylene resin (A) is 10-50 weight part with respect to 50-90 weight part of polypropylene resin. If the polyethylene resin is less than 10 parts by weight, the intended improvement effect cannot be obtained, and the impact strength of the molded product obtained by dilution molding is not sufficient. On the other hand, if the amount exceeds 50 parts by weight, the rigidity of the molded product obtained by dilution molding is lowered, and the original property of the polypropylene resin is impaired.
[0012]
Carbon black (C) used in the present invention has a DBP oil absorption of 60 to 200 ml / 100 g and a specific surface area of 30 to 200 m 2 / g. If the DBP oil absorption of carbon black is less than 60 ml / 100 g and the specific surface area is less than 30 m 2 / g, the conductivity of the molded product diluted with polypropylene resin is not preferable.
[0013]
In addition, when the DBP oil absorption of carbon black exceeds 200 ml / 100 g and the specific surface area exceeds 200 m 2 / g , it becomes a conductive resin composition having poor fluidity. This is not preferable because it is incompatible with the resin and becomes a molded product having poor conductivity, appearance, and mechanical strength.
[0014]
The blending amount of the carbon black (C) is 60 to 150 parts by weight of carbon black with respect to 100 parts by weight of the total amount of the polypropylene resin (A) and the polyethylene resin (B). If the carbon black is less than 60 parts by weight, the conductivity is remarkably lowered when diluted with polypropylene resin, which is not preferable. When the amount exceeds 150 parts by weight , it is not preferable because it is mixed with a diluting polypropylene resin and molded, resulting in poor appearance and reduced mechanical strength.
[0015]
The conductive resin composition of the present invention can be blended with other additives such as a plasticizer, a light stabilizer, an antistatic agent, a deterioration preventing agent, and a filler as necessary.
[0016]
When the conductive resin composition of the present invention is produced, it is performed by a batch method in which the blend is kneaded by being supplied to a Banbury mixer, a mixing roll, or the like, by a continuous extruder such as a single screw extruder or a twin screw extruder. It can be carried out by extrusion.
[0017]
Blending order is not particularly limited, in addition to kneading a mixture of the formulation at a time, the first ultra low density polyethylene and carbon black in advance by kneading with the above kneader, and the kneaded product and the polypropylene resin Can also be kneaded.
[0018]
〔Example〕
Hereinafter, the present invention will be described specifically by way of examples .
[0019]
Example 1
Polypropylene resin (trade name: Idemitsu Polypro J3050 H, melt flow rate 35 g / 10 min., Product of Idemitsu Petrochemical Co., Ltd.) 80 parts by weight, polyethylene resin (trade name: Ube ultra-low density polyethylene Z521, density 0.905 g / cm 3 , Ube Industries product) 20 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) were kneaded with a Banbury mixer, and then this kneaded product was extruded. A conductive resin composition was obtained by extruding and pelletizing at 220 ° C. with a molding machine.
[0020]
Next, 100 parts by weight of the above-mentioned conductive resin composition was mixed with 100 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0021]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) is performed on the obtained plate-shaped plate and test piece for Izod impact test. The results are shown in Table 1.
[0022]
Example 2
Polypropylene resin (trade name: Idemitsu Polypro J3050 H, melt flow rate 35 g / 10 min., Product of Idemitsu Petrochemical Co., Ltd.) 80 parts by weight, polyethylene resin (trade name: Ube ultra-low density polyethylene Z521, density 0.905 g / cm 3 , Ube Industries product) 20 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) were kneaded with a Banbury mixer, and then this kneaded product was extruded. A conductive resin composition was obtained by extruding and pelletizing at 220 ° C. with a molding machine.
[0023]
Next, 100 parts by weight of the above conductive resin composition was mixed with 60 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0024]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) is performed on the obtained plate-shaped plate and test piece for Izod impact test. The results are shown in Table 1.
[0025]
Example 3
Polypropylene resin (trade name: Idemitsu Polypro J3050 H, melt flow rate 35 g / 10 min., Idemitsu Petrochemical Co., Ltd.) 60 parts by weight, polyethylene resin (trade name: Ube ultra-low density polyethylene Z521, density 0.905 g / cm 3 , Ube Industries, Ltd.) 40 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) were kneaded with a Banbury mixer, and then this kneaded product was extruded. A conductive resin composition was obtained by extruding and pelletizing at 220 ° C. with a molding machine.
[0026]
Next, 100 parts by weight of the above conductive resin composition was mixed with 60 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0027]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) was performed on the obtained plate-shaped molded plate and test piece for Izod impact test. The results are shown in Table 1.
[0028]
Example 4
Polypropylene resin (trade name: Idemitsu Polypro J3050 H, melt flow rate 35 g / 10 min., Idemitsu Petrochemical Co., Ltd.) 60 parts by weight, polyethylene resin (trade name: Ube ultra-low density polyethylene Z521, density 0.905 g / cm 3 , Ube Industries product) 40 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) were kneaded with a Banbury mixer, and then this kneaded product was extruded. A conductive resin composition was obtained by extruding and pelletizing at 220 ° C. with a molding machine.
[0029]
Next, 100 parts by weight of the above conductive resin composition was mixed with 60 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0030]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) was performed on the obtained plate-shaped molded plate and test piece for Izod impact test. The results are shown in Table 1.
[0031]
Comparative Example 1
Polypropylene resin (trade name: Idemitsu Polypro J650H, melt flow rate 6 g / 10 min., Idemitsu Petrochemical Co., Ltd.) 80 parts by weight, polyethylene resin (trade name: Ube ultra low density polyethylene Z521, density 0.905 g / cm 3 , Ube Kosan Co., Ltd. product) 20 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) are kneaded with a Banbury mixer, and then this kneaded product is extruded. A conductive resin composition was obtained by extruding into pellets at 220 ° C. using a machine.
[0032]
Next, 100 parts by weight of the above-mentioned conductive resin composition was mixed with 100 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0033]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) was performed on the obtained plate-shaped molded plate and test piece for Izod impact test. The results are shown in Table 1.
[0034]
Comparative Example 2
Polypropylene resin (trade name: Idemitsu Polypro J650H, melt flow rate 35 g / 10 min., Product of Idemitsu Petrochemical Co., Ltd.) 100 parts by weight carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) 130 parts by weight was kneaded with a Banbury mixer, and the kneaded product was extruded and pelletized at 220 ° C. with an extruder to obtain a conductive resin composition.
[0035]
Next, 100 parts by weight of the above-mentioned conductive resin composition was mixed with 100 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0036]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) is performed on the obtained plate-shaped plate and test piece for Izod impact test. The results are shown in Table 1.
[0037]
Comparative Example 3
Polypropylene resin (trade name: Idemitsu Polypro J3050 H, melt flow rate 35 g / 10 min., Product of Idemitsu Petrochemical Co., Ltd.) 80 parts by weight, polyethylene resin (trade name: Ube ultra-low density polyethylene Z2522, density 0.920 g / cm 3 , Ube Industries product) 20 parts by weight of carbon black (trade name: Tokai carbon seast SO, DBP oil absorption: 115 ml / 100 g, specific surface area: 42 m 2 / g) was kneaded with a Banbury mixer, and this kneaded product was extruded. A conductive resin composition was obtained by extruding and pelletizing at 220 ° C. with a molding machine.
[0038]
Next, 100 parts by weight of the above-mentioned conductive resin composition was mixed with 100 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0039]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Yuka Co., Ltd., using a surface resistance meter Lorester CP) was performed on the obtained plate-shaped molded plate and test piece for Izod impact test. The results are shown in Table 1.
[0040]
Comparative Example 4
Polypropylene resin (trade name: Idemitsu Polypro J650H, melt flow rate 6 g / 10 min., Idemitsu Petrochemical Co., Ltd.) 80 parts by weight, polyethylene resin (trade name: Ube ultra-low density polyethylene Z522, density 0.905 g / cm 3 , Ube Kosan Co., Ltd. product) 20 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) were kneaded with a Banbury mixer, and then this kneaded product was extruded. A conductive resin composition was obtained by extruding into pellets at 220 ° C. using a machine.
[0041]
Next, 100 parts by weight of the above conductive resin composition was mixed with 60 parts by weight of a polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) And mixed with a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0042]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Oil Chemical Co., Ltd., surface resistance meter Lorester CP) was performed on the obtained plate-shaped molded plate and test piece for Izod impact test. The results are shown in Table 1.
[0043]
Comparative Example 5
Polypropylene resin (trade name: Idemitsu Polypro J650H, melt flow rate 6 g / 10 min., Idemitsu Petrochemical Co., Ltd.) 80 parts by weight, polyethylene resin (trade name: Ube ultra low density polyethylene Z521, density 0.905 g / cm 3 , Ube Kosan Co., Ltd. product) 20 parts by weight and carbon black (trade name: Tokai carbon seast SO, DBP oil absorption 115 ml / 100 g, specific surface area 42 m 2 / g) were kneaded with a Banbury mixer, and then this kneaded product was extruded. A conductive resin composition was obtained by extruding into pellets at 220 ° C. using a machine.
[0044]
Next, 100 parts by weight of polypropylene resin (trade name: Nisseki Polypro J630G, melt flow rate 4 g / 10 min.) Is blended with 100 parts by weight of the above conductive resin composition, and mixed by a tumbler. A plate-shaped molded plate and an Izod impact test test piece were obtained at a set temperature of 25 ° C.
[0045]
Visual observation of the appearance of the molded product, Izod impact test (ASTM D257), surface resistance measurement (manufactured by Mitsubishi Oil Chemical Co., Ltd., surface resistance meter Lorester CP) was performed on the obtained plate-shaped molded plate and test piece for Izod impact test. The results are shown in Table 1.
[0046]
[Table 1]
【The invention's effect】
The conductive resin composition and the method for producing the same of the present invention are blended with polypropylene resin in a predetermined amount of a polyethylene resin having a density of 0.910 g / cm 3 or less and carbon black having a specific DBP oil absorption and specific surface area. , poor appearance during molding, for example, without flow marks or the like is generated, it is possible to obtain Izod impact strength, a good molded product of the surface resistance.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10322195A JP3755161B2 (en) | 1995-04-05 | 1995-04-05 | Conductive resin composition and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10322195A JP3755161B2 (en) | 1995-04-05 | 1995-04-05 | Conductive resin composition and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08279310A JPH08279310A (en) | 1996-10-22 |
| JP3755161B2 true JP3755161B2 (en) | 2006-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10322195A Expired - Lifetime JP3755161B2 (en) | 1995-04-05 | 1995-04-05 | Conductive resin composition and method for producing the same |
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| Country | Link |
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| JP (1) | JP3755161B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7166677B2 (en) | 2004-03-19 | 2007-01-23 | Mitsui Chemicals, Inc. | Polypropylene resin compositions |
| JP2006052276A (en) * | 2004-08-10 | 2006-02-23 | Toyo Ink Mfg Co Ltd | Method for producing conductive resin composition, conductive resin composition and molded article |
| JP6311572B2 (en) | 2013-10-30 | 2018-04-18 | 日本ポリエチレン株式会社 | Conductive polyethylene resin composition, molded article using the same, and laminate |
| CN115403861B (en) * | 2022-09-21 | 2023-07-14 | 武汉金发科技有限公司 | Isotropic electromagnetic shielding polypropylene composite material and preparation and application thereof |
-
1995
- 1995-04-05 JP JP10322195A patent/JP3755161B2/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| JPH08279310A (en) | 1996-10-22 |
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