JP3748459B2 - Cutting equipment - Google Patents

Cutting equipment Download PDF

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Publication number
JP3748459B2
JP3748459B2 JP18768895A JP18768895A JP3748459B2 JP 3748459 B2 JP3748459 B2 JP 3748459B2 JP 18768895 A JP18768895 A JP 18768895A JP 18768895 A JP18768895 A JP 18768895A JP 3748459 B2 JP3748459 B2 JP 3748459B2
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Japan
Prior art keywords
cutting
chuck table
workpiece
waste
hole
Prior art date
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Expired - Lifetime
Application number
JP18768895A
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Japanese (ja)
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JPH0919846A (en
Inventor
享 上倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
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Filing date
Publication date
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Priority to JP18768895A priority Critical patent/JP3748459B2/en
Publication of JPH0919846A publication Critical patent/JPH0919846A/en
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Publication of JP3748459B2 publication Critical patent/JP3748459B2/en
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、セラミックス等の被加工物を切削する切削装置に関する。
【0002】
【従来の技術】
セラミックス等の被加工物を切削する切削装置は、従来例えば図4に示すようにカセット載置領域Aに載置されたカセットC内から搬出入手段Bによってセラミックス等の被加工物Pを待機領域Dに搬出し、旋回アームを有する搬送手段Eによって被加工物PをチャックテーブルTに搬送して保持させ、このチャックテーブルTを移動してアライメント手段Fにより位置決めした後、回転ブレードを備えた切削手段Gによって切削する。
【0003】
前記チャックテーブルTは、図5に示すように装置本体1内に設けられた移動手段2によりテーブルガイド3に沿って移動する移動テーブル4の上に回転可能に取り付けられ、蛇腹ガイド兼廃液トレイ5の開口部5aから上方に突出しており、且つ周囲にはウォータカバー6が取り付けられ、このウォータカバー6は開口部5aの縁片に沿って移動可能に形成されている。
前記蛇腹ガイド兼廃液トレイ5の端部には排水孔5bが設けられ、この排水孔5bには排水管7が接続され、チャックテーブルT上で前記切削手段Gにより切削された切削屑が切削液と共に排水孔5bに流れ込み、排水管7によって装置本体1外に排出される。
尚、ウォータカバー6の両側には防水用の蛇腹カバー8(図4)が取り付けられ、前記開口部5a等を覆うことで装置本体1内部への切削液等の浸入を防止している。
【0004】
【発明が解決しようとする課題】
比重の大きいセラミックス等の被加工物を切削液を供給しながら切削すると、比重の大きい切削屑が排水孔5bや排水管7に詰まって排水不良となり、又廃液が漏れ出て装置本体1内部や周囲を汚染する問題があった。
本発明は、このような従来の問題を解決するためになされ、セラミックス等の被加工物から出る比重の大きい切削屑により排水孔5bや排水管7が詰まらないようにした切削装置を提供することを課題とする。
【0005】
【課題を解決するための手段】
前記課題を技術的に解決するための手段として、本発明は、セラミックス等の被加工物を保持するチャックテーブルと、切削液を供給しながら被加工物を切削する切削手段と、を少なくとも含む切削装置において、
前記チャックテーブルの外周には廃液を一時的に溜め比重の大きい切削屑を沈澱させる沈澱槽が配設されていて、
前記沈澱槽は、底部の外周の立上片に水抜き孔が間隔をあけて形成されている切削装置であって、
前記沈澱槽は、底部の中央に前記チャックテーブルを嵌め込む係合孔が設けられると共に、その周縁部に縁片が上向きに形成され、且つ底部の要所には取付孔が設けられている切削装置を要旨とするものである。
【0006】
【発明の実施の形態】
以下、本発明の実施の形態を添付図面に基づいて(従来と同一部材は同一符号で)詳説する。
図1において、1は装置本体であり、従来と同様にカセット載置領域AにカセットCが載置され、このカセットC内から搬出入手段Bによってセラミックス等の被加工物(図略)が待機領域Dに搬出されると共に、搬送手段EによってチャックテーブルTに搬送され、チャックテーブルTを移動してアライメント手段Fによりアライメントした後切削手段Gで被加工物を切削する。
【0007】
前記チャックテーブルTは、図2に示すように移動テーブル4の上に回転可能に取り付けられ、この移動テーブル4と共に移動手段2によってテーブルガイド3に沿って移動され、且つ周囲にはウォータカバー6が取り付けられている。
【0008】
9は沈澱槽であり、図3に示すように方形受け皿状に形成され、底部の中央には前記チャックテーブルTを嵌め込む係合孔9aが設けられると共に、その周縁部に縁片9bが上向きに形成され、底部の要所には取付孔9cが設けられ、更に外周の立上片9dには複数個の水抜き孔9eが間隔をあけて形成されている。
【0009】
この沈澱槽9は、前記チャックテーブルTを係合孔9aに嵌合してウォータカバー6の上に載せ、止めねじ10を取付孔9cに差し込んでウォータカバー6に設けられたねじ孔6aに螺着することにより取り付けられる。
【0010】
上記のように構成された本発明に係る切削装置は、チャックテーブルT上に保持されたセラミックス等の被加工物が切削手段Gにより切削液を供給しながら切削されると、その切削屑は切削液と共に沈澱槽9内に一時的に収容され、比重の大きい切削屑は沈澱槽9の底部に沈澱して分離され、廃液は水抜き孔9eから沈澱槽9外に排出される。この排出された廃液は、前記排水孔5bから排水管7内に流入し装置本体1外に排出される。尚、比重の小さい切削屑は廃液に混入して排出されるが、排水孔5b及び排水管7を詰まらせることはない。
【0011】
従って、比重の大きい切削屑は排水孔5b及び排水管7に流れ込むことはなく、従来のように切削屑が詰まって排水不良となったり、或は廃液が漏れ出て装置本体1内部や周囲を汚染するといった不都合を未然に防止することが出来る。沈澱槽9の内部に堆積した切削屑は、適宜取り出して排除することが可能である。
【0012】
尚、沈澱槽はウォータカバーに一体に設ける構成にしても良いが、前記のようにウォータカバーとは別体に形成し止めねじ等で着脱自在に取り付けることにより、沈澱したセラミックス等の切削屑を含む廃液処理を容易に出来るようにすることが好ましい。
【0013】
【発明の効果】
以上説明したように、本発明は、セラミックス等の被加工物を保持するチャックテーブルと、切削液を供給しながら被加工物を切削する切削手段と、を少なくとも含む切削装置において、前記チャックテーブルの外周には廃液を一時的に溜め比重の大きい切削屑を沈澱させる沈澱槽が配設されていて、前記沈澱槽は、底部の外周の立上片に水抜き孔が間隔をあけて形成されている切削装置であって、前記沈澱槽は、底部の中央に前記チャックテーブルを嵌め込む係合孔が設けられると共に、その周縁部に縁片が上向きに形成され、且つ底部の要所には取付孔が設けられているので、この沈澱槽に切削屑が切削液と共に一時的に収容され、比重の大きい切削屑は底部に沈澱し分離され、比重の小さい切削屑を含む廃液は水抜き孔によって適宜排出される。これにより、比重の大きい切削屑は排水孔及び排水管に流れ込むことはなく、比重の小さい切削屑を含む廃液のみが排水孔及び排水管に流れ込むため、排水不良や廃液漏出による装置本体内又は周囲の汚染等を未然に防止することができる。特に沈澱槽は、ウォータカバーに対して止めねじ等で着脱自在に取り付けられるため、沈澱した比重の大きい切削屑を含む残留廃液の処理が容易にできる効果を奏する。
【図面の簡単な説明】
【図1】 本発明の実施例を示す切削装置の概略斜視図である。
【図2】 チャックテーブル近傍の詳細を示す一部破断斜視図である。
【図3】 沈澱槽の取付要領を示す分解斜視図である。
【図4】 従来の切削装置を示す概略斜視図である。
【図5】 同、チャックテーブル近傍の詳細を示す一部破断斜視図である。
【符号の説明】
1…装置本体 2…移動手段 3…テーブルガイド 4…移動テーブル5…蛇腹ガイド兼廃液トレイ 5a…開口部 5b…排水孔 6…ウォータカバー 6a…ねじ孔 7…排水管 8…蛇腹カバー 9…沈澱槽 9a…係合孔 9b…縁片 9c…取付孔 9d…立上片 9e…水抜き孔 10…止めねじ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cutting apparatus for cutting a workpiece such as ceramics.
[0002]
[Prior art]
A cutting apparatus for cutting a workpiece such as ceramics is conventionally provided with a waiting area for a workpiece P such as ceramics by means of loading / unloading means B from inside a cassette C placed in a cassette placement area A as shown in FIG. The workpiece P is carried to the chuck table T by the conveying means E having a swivel arm and held on the chuck table T. After the chuck table T is moved and positioned by the alignment means F, the cutting with the rotating blade is performed. Cutting by means G.
[0003]
As shown in FIG. 5, the chuck table T is rotatably mounted on a moving table 4 that moves along a table guide 3 by a moving means 2 provided in the apparatus main body 1. A water cover 6 is attached to the periphery of the opening 5a, and the water cover 6 is formed to be movable along the edge of the opening 5a.
A drainage hole 5b is provided at an end of the bellows guide / waste liquid tray 5, and a drainage pipe 7 is connected to the drainage hole 5b so that the cutting waste cut by the cutting means G on the chuck table T is a cutting liquid. At the same time, it flows into the drain hole 5 b and is discharged out of the apparatus main body 1 by the drain pipe 7.
A waterproof bellows cover 8 (FIG. 4) is attached to both sides of the water cover 6 to cover the opening 5a and the like to prevent the cutting fluid and the like from entering the apparatus main body 1.
[0004]
[Problems to be solved by the invention]
When a workpiece such as ceramics having a high specific gravity is cut while supplying a cutting fluid, cutting waste having a high specific gravity is clogged in the drain holes 5b and the drain pipe 7, resulting in poor drainage. There was a problem of contaminating the surroundings.
The present invention is made in order to solve such a conventional problem, and provides a cutting device in which the drain hole 5b and the drain pipe 7 are not clogged by cutting waste having a large specific gravity from a workpiece such as ceramics. Is an issue.
[0005]
[Means for Solving the Problems]
As means for technically solving the above-mentioned problem, the present invention provides a cutting table including at least a chuck table for holding a workpiece such as ceramics and a cutting means for cutting the workpiece while supplying a cutting fluid. In the device
The outer periphery of the chuck table is provided with a settling tank for temporarily collecting waste liquid and precipitating cutting waste with a large specific gravity,
The settling tank is a cutting device in which drain holes are formed at intervals in a rising piece on the outer periphery of the bottom,
The sedimentation tank is provided with an engagement hole for fitting the chuck table in the center of the bottom part, an edge piece is formed upward at the peripheral edge part, and a mounting hole is provided at the important part of the bottom part. The gist of the apparatus is as follows.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings (the same members as those in the past are denoted by the same reference numerals).
In FIG. 1, reference numeral 1 denotes an apparatus main body. A cassette C is placed in a cassette placement area A as in the prior art, and a workpiece (not shown) such as ceramics is waiting from inside the cassette C by loading / unloading means B. In addition to being carried out to the region D, it is transported to the chuck table T by the transport means E, moved by the chuck table T and aligned by the alignment means F, and then the workpiece is cut by the cutting means G.
[0007]
The chuck table T is rotatably mounted on the moving table 4 as shown in FIG. 2, and is moved along the table guide 3 by the moving means 2 together with the moving table 4, and a water cover 6 is provided around the chuck table T. It is attached.
[0008]
Reference numeral 9 denotes a settling tank, which is formed in a rectangular tray shape as shown in FIG. 3, and an engagement hole 9a for fitting the chuck table T is provided at the center of the bottom, and an edge piece 9b is directed upward at the peripheral edge thereof. A mounting hole 9c is provided at the bottom portion, and a plurality of drain holes 9e are formed at intervals in the rising piece 9d on the outer periphery.
[0009]
In this settling tank 9, the chuck table T is fitted into the engagement hole 9a and placed on the water cover 6, and the set screw 10 is inserted into the attachment hole 9c and screwed into the screw hole 6a provided in the water cover 6. It is attached by wearing.
[0010]
In the cutting apparatus according to the present invention configured as described above, when a workpiece such as ceramics held on the chuck table T is cut while supplying cutting fluid by the cutting means G, the cutting waste is cut. The cutting waste having a large specific gravity is temporarily stored in the sedimentation tank 9 together with the liquid, and settles and separated at the bottom of the sedimentation tank 9, and the waste liquid is discharged out of the sedimentation tank 9 through the drain hole 9e. The discharged waste liquid flows into the drain pipe 7 through the drain hole 5b and is discharged out of the apparatus main body 1. Although the cutting waste having a small specific gravity is mixed with the waste liquid and discharged, the drain hole 5b and the drain pipe 7 are not clogged.
[0011]
Accordingly, the cutting waste having a large specific gravity does not flow into the drain hole 5b and the drain pipe 7, and the cutting waste becomes clogged as in the conventional case, or the drainage is poor, or the waste liquid leaks out and leaks around the inside of the apparatus main body 1 and the surroundings. It is possible to prevent inconvenience such as contamination. The cutting waste accumulated in the settling tank 9 can be taken out and removed as appropriate.
[0012]
The sedimentation tank may be provided integrally with the water cover. However, as described above, the sedimentation tank is formed separately from the water cover and is detachably attached with a set screw or the like, so that the deposited cutting waste such as ceramics can be removed. It is preferable to facilitate the treatment of the waste liquid containing.
[0013]
【The invention's effect】
As described above, the present invention provides a cutting apparatus including at least a chuck table for holding a workpiece such as ceramics and a cutting means for cutting the workpiece while supplying a cutting fluid. The outer periphery is provided with a settling tank for temporarily collecting waste liquid and precipitating cutting waste with a large specific gravity. The settling tank has drain holes formed at intervals on the rising piece on the outer periphery of the bottom. The settling tank is provided with an engagement hole for fitting the chuck table in the center of the bottom portion, and an edge piece is formed upward at the peripheral portion thereof, and is attached to a key portion of the bottom portion. Since a hole is provided, cutting waste is temporarily stored in the sedimentation tank together with the cutting fluid, cutting waste having a high specific gravity is settled and separated at the bottom, and waste liquid containing cutting waste having a low specific gravity is drained by a drain hole. As appropriate It is. As a result, cutting waste with high specific gravity does not flow into the drain hole and drain pipe, but only waste liquid containing cutting waste with low specific gravity flows into the drain hole and drain pipe. Contamination can be prevented in advance. In particular, since the settling tank is detachably attached to the water cover with a set screw or the like, there is an effect that it is possible to easily treat the remaining waste liquid containing the precipitated cutting waste having a large specific gravity.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a cutting apparatus showing an embodiment of the present invention.
FIG. 2 is a partially broken perspective view showing details in the vicinity of the chuck table.
FIG. 3 is an exploded perspective view showing an installation procedure of a precipitation tank.
FIG. 4 is a schematic perspective view showing a conventional cutting apparatus.
FIG. 5 is a partially broken perspective view showing details of the vicinity of the chuck table.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Apparatus main body 2 ... Moving means 3 ... Table guide 4 ... Moving table 5 ... Bellows guide and waste liquid tray 5a ... Opening part 5b ... Drain hole 6 ... Water cover 6a ... Screw hole 7 ... Drain pipe 8 ... Bellows cover 9 ... Precipitation Tank 9a ... engagement hole 9b ... edge piece 9c ... mounting hole 9d ... rise piece 9e ... drain hole 10 ... set screw

Claims (1)

セラミックス等の被加工物を保持するチャックテーブルと、切削液を供給しながら被加工物を切削する切削手段と、を少なくとも含む切削装置において、
前記チャックテーブルの外周には廃液を一時的に溜め比重の大きい切削屑を沈澱させる沈澱槽が配設されていて、
前記沈澱槽は、底部の外周の立上片に水抜き孔が間隔をあけて形成されている切削装置であって
前記沈澱槽は、底部の中央に前記チャックテーブルを嵌め込む係合孔が設けられると共に、その周縁部に縁片が上向きに形成され、且つ底部の要所には取付孔が設けられている切削装置。
In a cutting apparatus including at least a chuck table for holding a workpiece such as ceramics, and a cutting means for cutting the workpiece while supplying a cutting fluid,
The outer periphery of the chuck table is provided with a settling tank for temporarily collecting waste liquid and precipitating cutting waste with a large specific gravity,
The settling tank is a cutting device in which drain holes are formed at intervals in a rising piece on the outer periphery of the bottom,
The sedimentation tank is provided with an engagement hole for fitting the chuck table in the center of the bottom part, an edge piece is formed upward at the peripheral edge part, and a mounting hole is provided at the important part of the bottom part. apparatus.
JP18768895A 1995-07-03 1995-07-03 Cutting equipment Expired - Lifetime JP3748459B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18768895A JP3748459B2 (en) 1995-07-03 1995-07-03 Cutting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18768895A JP3748459B2 (en) 1995-07-03 1995-07-03 Cutting equipment

Publications (2)

Publication Number Publication Date
JPH0919846A JPH0919846A (en) 1997-01-21
JP3748459B2 true JP3748459B2 (en) 2006-02-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107150252A (en) * 2017-06-26 2017-09-12 深圳市久久犇自动化设备股份有限公司 A kind of metalwork Milling Process system and its chip cleaning device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5988787B2 (en) * 2012-09-07 2016-09-07 株式会社ディスコ Grinding equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107150252A (en) * 2017-06-26 2017-09-12 深圳市久久犇自动化设备股份有限公司 A kind of metalwork Milling Process system and its chip cleaning device
CN107150252B (en) * 2017-06-26 2019-06-07 深圳市久久犇自动化设备股份有限公司 A kind of metalwork Milling Process system and its clast cleaning device

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