JP3744731B2 - Wiring board manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a wiring board on which electronic components such as a semiconductor element, a capacitor element, and a resistor are mounted.
[0002]
[Prior art]
Conventionally, wiring boards on which electronic components such as semiconductor elements, capacitive elements, resistors and the like are mounted are wiring conductors made of a refractory metal material such as tungsten or molybdenum inside and on the surface of an insulating base made of an aluminum oxide sintered body. It has a structure in which layers are formed so that electronic parts such as semiconductor elements, capacitive elements and resistors are mounted on the surface of the insulating base, and the electrodes of each electronic part are electrically connected to the wiring conductor layer. It has become.
[0003]
Such a wiring board is generally manufactured by adopting a ceramic layering technique and a thick film forming technique such as screen printing. Specifically, the wiring board is manufactured by the following method.
[0004]
(1) First, aluminum oxide (Al ₂ O _Three ), Silicon oxide (SiO ₂ ), Magnesium oxide (MgO), calcium oxide (CaO), etc., an organic solvent and solvent are added to and mixed with ceramic raw material powder to form a slurry, which is then treated by a conventionally known doctor blade method, calendar roll method or the like. A plurality of ceramic green sheets (green ceramic sheets) are obtained by forming into a sheet.
[0005]
(2) Next, a conductive paste obtained by adding and mixing an organic solvent and a solvent to tungsten or molybdenum powder is printed and applied in a predetermined pattern on at least one surface of the ceramic green sheet by a screen printing method.
[0006]
(3) Finally, the ceramic green sheets printed and coated with the conductive paste are stacked one above the other and baked in a reducing atmosphere at a temperature of about 1600 ° C. to vaporize and remove the organic solvent and the solvent. By integrating the conductive paste with the sintered body, a wiring substrate having a wiring conductor layer of a predetermined pattern on the inside and surface of the insulating base is completed.
[0007]
In this conventional wiring board, the wiring conductor layer is formed by printing and applying a conductive paste to a ceramic green sheet in a predetermined pattern by a screen printing method, and the printing of the conductive paste by the screen printing method is related to the screen mesh. Thus, the line width and the adjacent interval cannot be reduced to 70 μm or less. As a result, the formed wiring conductor layer has a large line width and a wide adjacent interval, so that the wiring conductor layer can be formed at a high density. It had the disadvantage that it was not possible.
[0008]
The present invention has been devised in view of the above-described drawbacks, and an object thereof is to provide a method of manufacturing a wiring board capable of forming a wiring conductor layer at a high density.
[0009]
[Means for Solving the Problems]
The method for producing a wiring board of the present invention includes (1) a step of producing a plurality of ceramic green sheets in which ceramic powder is dispersed in an organic resin composition, and a photosensitive conductive paste in which metal powder is added to the photosensitive resin composition. And (2) forming a groove corresponding to a conductor layer for wiring formed on the surface of another ceramic green sheet on the surface of the ceramic green sheet, and covering the surface of the ceramic green sheet with a photosensitive conductive paste. A step of irradiating a predetermined position of the photosensitive conductive paste with light, photocuring the photosensitive resin composition in a predetermined region, and developing to form a wiring conductor layer on the surface of the ceramic green sheet; 3) The plurality of ceramic green sheets on which the wiring conductor layers are formed are divided into the wiring conductor layers and the grooves corresponding to the wiring conductor layers. It laminated to match so, by firing, comprising a step of forming a wiring conductor layer on the inside and the surface of the insulating base made of ceramic.
[0010]
The method for producing a wiring board of the present invention includes (1) a step of producing a plurality of ceramic green sheets in which ceramic powder is dispersed in an organic resin composition, and a conductive paste in which metal powder is added to an organic solvent, and (2) Forming a groove corresponding to a conductor layer for wiring formed on the surface of another ceramic green sheet on the surface of the ceramic green sheet; and (3) placing a photosensitive resist film on the surface of the ceramic green sheet. And a step of irradiating light at a predetermined position to photocure the predetermined region and removing the non-cured region by development to form a resist film having a through hole of a predetermined pattern; and (4) in the through hole of the resist film Filling a conductive paste into the substrate, and then removing the resist film to form a wiring conductor layer on the surface of the ceramic green sheet; ) A plurality of ceramic green sheets on which the wiring conductor layer is formed are laminated so that the wiring conductor layer and the groove corresponding to the wiring conductor layer coincide with each other, and are fired. And forming a wiring conductor layer inside and on the surface of the insulating substrate.
[0011]
According to the method for manufacturing a wiring board of the present invention, the conductive paste for forming the wiring conductor layer is made photosensitive by dispersing and mixing the metal powder in the photosensitive resin composition. A conductive layer for wiring is formed by applying a paste, and then irradiating light at a predetermined position to photocur the photosensitive resin composition in a predetermined region and developing and removing the photosensitive resin composition in an uncured region. Since the so-called photolithography technology can be formed, the wiring conductor layer has a narrow line width and adjacent spacing of 60 μm or less, and thus the wiring conductor layer can be formed into a narrow line. Since the width is narrow and the interval between adjacent lines is narrow, the wiring conductor layer can be formed with high density.
[0012]
Further, according to the method for manufacturing a wiring board of the present invention, a resist film in which through holes having fine predetermined patterns are formed on the surface of the ceramic green sheet by a photolithography technique, and a conductive paste is placed in the through holes. Since the conductor layer for wiring is formed by filling, the line width of the conductor layer for wiring and the adjacent space can be made narrow and narrow as 60 μm or less. As a result, the wiring conductor layer can be formed with high density.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, a method for manufacturing a wiring board according to the present invention will be described based on the embodiment shown in FIGS.
1A to 1E are cross-sectional views for each process for explaining a method of manufacturing a wiring board according to the present invention. First, as shown in FIG. 1A, a ceramic green sheet 1 is formed. A photosensitive conductive paste is prepared.
[0014]
The ceramic green sheet 1 is prepared by adding and mixing ceramic powder in an organic resin composition mainly composed of a polymer binder such as an acrylic resin such as polyacrylic acid ester or polyvinyl butyral, and an organic solvent such as acetone or toluene. The slurry is then formed, and then the slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like.
[0015]
As the ceramic powder used when forming the ceramic green sheet 1, glass ceramic powder, aluminum oxide powder, aluminum nitride powder, crystallized glass powder or the like is used. For example, when glass ceramic powder is used. , Magnesium oxide (MgO) 10.8 wt%, aluminum oxide (Al ₂ O _Three ) 28.0 wt%, silicon oxide (SiO2) ₂ ) 43.8 wt%, zinc oxide (ZnO) 7.1 wt%, the balance being boron (B ₂ O _Three ) To 80% by weight of a glass component comprising silicon oxide (SiO 2) ₂ ) A powder containing 20% by weight is preferably used.
[0016]
The photosensitive conductive paste is, for example, gold, silver, platinum, palladium, copper, nickel, molybdenum, tungsten, or an alloy thereof, or a metal powder made of an alloy containing these as a main component, a photoreactive compound, It is formed by mixing a photosensitive resin composition comprising a photopolymerization initiator and a photopolymerization accelerator, an organic binder, and, if necessary, an ultraviolet absorber, a thermal polymerization inhibitor and an inorganic additive.
[0017]
Next, as shown in FIG. 1B, a photosensitive conductive paste 2 is applied to the upper surface of the ceramic green sheet 1 to a predetermined thickness by a screen printing method, a spin coating method, or the like.
[0018]
Then, as shown in FIG. 1C, a photomask pattern 3 is deposited on the photosensitive conductive paste 2 in a predetermined pattern.
[0019]
For example, the photomask pattern 3 is formed by depositing a photosensitive photoresist on the photosensitive conductive paste 2 and irradiating light through a metal mask of a predetermined pattern to photocure a predetermined area and develop an uncured area. It is formed by adopting a so-called photolithography technique which is removed by the above.
[0020]
Next, for example, about 50 to 3000 mJ / cm from the photomask pattern 3 side with respect to the photosensitive conductive paste 2 having the photomask pattern 3 deposited on the upper surface. ² The photomask pattern 3 is irradiated with UV light, irradiated with UV light to a portion where the photomask pattern 3 does not exist, photopolymerized in the photosensitive resin composition in the region irradiated with UV light, and photocured. By removing the covered non-irradiated region, that is, the uncured region by development, a wiring conductor layer 4 having a predetermined pattern was deposited at a predetermined position as shown in FIG. A ceramic green sheet 1 is obtained.
[0021]
When the conductive conductive layer 4 having a predetermined pattern is formed by irradiating the photosensitive conductive paste 2 with light such as ultraviolet rays, the photomask pattern 3 is formed by employing a photolithography technique capable of fine processing. Therefore, the wiring conductor layer 4 can be made narrow and narrow with a line width and an adjacent interval of 60 μm or less, and at the same time, the formation of the wiring conductor layer 4 is irradiated with light such as ultraviolet rays through the photomask pattern 3. The uncured region can be removed by a very simple operation of developing.
[0022]
As the developer for removing the uncured photosensitive resin composition in the photosensitive conductive paste 2, for example, an organic alkali solution such as triethanolamine is used, and the organic alkaline solution such as triethanolamine is used. The solution is made water-soluble by depriving hydrogen ions from the carboxyl groups of the organic binder in the uncured photosensitive conductive paste and ionizing the carboxyl groups, and dissolved in a developer or washing water.
[0023]
Further, the metal powder contained in the photosensitive conductive paste 2 is likely to be scattered in light such as ultraviolet rays irradiated for photocuring when the particle size is less than 0.5 μm, and formed when the particle size exceeds 10 μm. There is a tendency that the surface of the wiring conductor layer 4 to be formed becomes rough and it is difficult to accurately form a fine wiring conductor layer 4 having a line width of 100 μm or less. Therefore, the metal powder in the photosensitive conductive paste 2 preferably has a particle size in the range of 0.5 μm to 10 μm.
[0024]
The photoreactive compound contained in the photosensitive conductive paste 2 is an organic compound having a photoreactive carbon-carbon double bond, and the conductive paste is insoluble in the developer by photocuring by a polymerization reaction. For example, diethylene glycol, monoethylene glycol, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 2- (2-ethoxyethoxy) ethyl acrylate, caprolactone acrylate, tridecyl acrylate, isooctyl acrylate, stearyl An acrylate, a lauryl acrylate, etc. are mentioned, These 1 type (s) or 2 or more types can be used.
[0025]
When the addition amount of the photoreactive compound is 0.1 parts by weight or less with respect to 100 parts by weight of the metal powder, it tends to be difficult to form a good wiring conductor layer 4 because the curing is weak. If it exceeds 10 parts by weight, the surface of the conductive paste may become sticky and workability may be reduced. Therefore, the amount of the photoreactive compound added is preferably in the range of 0.1 to 0 parts by weight with respect to 100 parts by weight of the metal powder.
[0026]
Further, the photopolymerization initiator contained in the photosensitive conductive paste 2 has a function of generating a radical by light energy and causing a photoreactive compound to undergo a polymerization reaction. For example, 1-hydroxy-cyclohexyl-phenylketone 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, 2, 4-diethylthioxanthone etc. are mentioned, These 1 type (s) or 2 or more types can be used.
[0027]
When the addition amount of the photopolymerization initiator is less than 0.1 parts by weight with respect to 100 parts by weight of the metal powder, the polymerization reaction for photocuring tends to be difficult to start. However, it becomes difficult to form the wiring conductor layer 4 having a predetermined pattern. Therefore, the amount of the photopolymerization initiator added is preferably in the range of 0.1 to 5 parts by weight with respect to 100 parts by weight of the metal powder.
[0028]
The photopolymerization accelerator contained in the photosensitive conductive paste 2 has an action of promoting the polymerization reaction of the photoreactive compound, and for example, 4-dimethylaminobenzoic acid isoamyl ester or the like can be used.
[0029]
If the addition amount of the photopolymerization accelerator is less than 0.1 parts by weight with respect to 100 parts by weight of the metal powder, the effect of promoting photocuring cannot be obtained, and if it exceeds 10 parts by weight, polymerization is unnecessary. Proceeding excessively, it becomes difficult to form the wiring conductor layer 4 having a predetermined pattern. Therefore, it is preferable to add the photopolymerization accelerator in an amount of 0.1 to 10 parts by weight with respect to 100 parts by weight of the metal powder.
[0030]
The organic binder contained in the photosensitive conductive paste 2 has a function of uniformly dispersing the metal powder. For example, a copolymer of methacrylic acid ester and acrylic acid ester can be used.
[0031]
When the addition amount of the organic binder is less than 1% by weight with respect to 100 parts by weight of the metal powder, the fluidity of the photosensitive conductive paste 2 becomes too high and is deposited on the surface of the ceramic green sheet 1 with a uniform thickness. In addition, if it exceeds 15% by weight, the electrical resistance of the wiring conductor formed using the photosensitive conductive paste 2 becomes high. Therefore, the organic binder is preferably added in an amount of 1 to 15 parts by weight with respect to 100 parts by weight of the metal powder.
[0032]
Further, the ultraviolet absorber contained in the photosensitive conductive paste 2 has an action of preventing the irradiated ultraviolet rays from being photocured to an unnecessary portion by being scattered by the metal powder inside the photosensitive conductive paste. For example, 2- (2′-hydroxy-5′methyl-phenyl) -benzotriazole or the like can be used.
[0033]
Further, the ultraviolet absorber has an insufficient effect of preventing the scattering of ultraviolet rays when the addition amount is less than 0.1 parts by weight with respect to 100 parts by weight of the metal powder, and when it exceeds 10 parts by weight, the absorption amount of ultraviolet rays is large. Therefore, the photocuring is difficult to proceed, and the exposure efficiency is lowered and the productivity tends to be lowered. Therefore, it is preferable that the ultraviolet absorber is added in an amount of 0.1 to 10 parts by weight with respect to 100 parts by weight of the metal powder.
[0034]
In addition, the thermal polymerization inhibitor contained in the photosensitive conductive paste 2 decomposes a part of the photosensitive resin composition by the thermal energy applied to the photosensitive conductive paste to generate free radicals, and the free radicals cause photoreaction. Has a function of preventing the problem that the photosensitive compound paste is partially polymerized to increase the viscosity of the photosensitive conductive paste, making it difficult to print and apply to the surface of the ceramic green sheet 1, for example, methoquinone, hydroquinone , Methyl hydroquinone and the like can be used.
[0035]
The thermal polymerization inhibitor has a weak effect of absorbing free radicals when the addition amount is less than 0.1 parts by weight with respect to 100 parts by weight of the metal powder, and when it exceeds 5 parts by weight, the surface of the photosensitive conductive paste becomes sticky. Workability may be reduced. Therefore, the amount of the thermal polymerization inhibitor added is preferably in the range of 0.1 to 5 parts by weight with respect to 100 parts by weight of the metal powder.
[0036]
The inorganic additive contained in the photosensitive conductive paste 2 is made of metal oxide or glass such as aluminum oxide, silicon dioxide, magnesium oxide, zinc oxide, boron oxide, etc., and this photosensitive conductive paste 2 is used. The wiring conductor formed is firmly bonded to the insulating substrate.
[0037]
If the inorganic additive is less than 0.1 part by weight with respect to 100 parts by weight of the metal powder, the effect of increasing the bonding strength between the wiring conductor and the insulating substrate is insufficient, and if it exceeds 10 parts by weight, the wiring conductor is formed. There is a risk that the electrical resistance of the will increase. Therefore, the inorganic additive is preferably added in an amount of 0.1 to 10 parts by weight with respect to 100 parts by weight of the metal powder.
[0038]
Finally, a plurality of ceramic green sheets 1 having a predetermined pattern of wiring conductor layer 4 deposited and filled on the surface are laminated and fired at a temperature of about 1000 ° C. By integrating the sheet 1 and the wiring conductor layer 4 by sintering, a wiring board as a product in which the wiring conductor layer 4a is formed inside and on the surface of the insulating base 1a is completed as shown in FIG.
[0039]
In this case, the line width and the adjacent interval of the wiring conductor layer 4 can be formed as narrow and narrow as 60 μm or less, so the wiring conductor layer 4a is also as narrow and narrow as the line width and adjacent interval of 60 μm or less. As a result, the wiring conductor layer 4a can be formed with high density.
[0040]
When the ceramic green sheets 1 are laminated, grooves having the same pattern and thickness as the wiring conductor layer 4 formed on the upper surface of the ceramic green sheet 1 positioned on the lower surface of the ceramic green sheet 1 positioned on the upper side. If the wiring conductor layer 4 is fitted in the groove portion, the upper and lower ceramic green sheets 1 can be more securely adhered to each other, and there is a risk that problems such as adhesion failure occur on the insulating substrate 1a. Can be very low. Accordingly, when the ceramic green sheet 1 is laminated, a groove portion having the same pattern and thickness as the wiring conductor layer 4 formed on the upper surface of the ceramic green sheet 1 located on the lower surface of the ceramic green sheet 1 located on the upper portion. Is preferably formed.
[0041]
The groove portion is formed by, for example, pressing the metal mask used when forming the photomask pattern 3 against the lower surface of the ceramic green sheet located at the upper portion and pressing it to the same depth as the thickness of the wiring conductor layer. It can be formed easily.
[0042]
Next, another embodiment of the present invention will be described with reference to FIGS.
In the figure, the same parts as those in FIG.
First, as shown in FIG. 2A, a plurality of ceramic green sheets 1 are formed.
The photosensitive ceramic green sheet 1 is formed by using the material and method used for the ceramic green sheet 1 shown in FIG.
[0043]
Next, as shown in FIG. 2B, a photosensitive resist film 7 is adhered to the upper surface of the ceramic green sheet 1.
[0044]
The photosensitive resist film 7 is mainly composed of a photopolymerization reaction of an acrylic ester-based photosensitive monomer and a photopolymerization initiator such as benzophenone with an acrylic or styrene radical polymerizable monomer as a binder. Depending on the case, it is formed by adding a dye, a thermal polymerization inhibitor, an adhesion aid or the like.
[0045]
Next, in a predetermined region of the photosensitive resist film 7, for example, about 30 to 150 mj / cm through a metal mask having a predetermined pattern. ² The predetermined area irradiated with light is photocured and the non-cured area is removed by development to form through holes 7b having a predetermined pattern on the ceramic green sheet 1 as shown in FIG. A resist film 7a is formed.
[0046]
The through-hole 7b of the resist film 7a is formed by applying a so-called photolithography technique in which a predetermined position of the photosensitive resist film 7 is irradiated with light so that the predetermined region is photocured and the non-cured region is removed by development. Therefore, the through-hole 7c can have a very fine width and interval of 60 μm or less.
[0047]
As the developer for removing the non-cured photosensitive resist film 7 for forming the through hole 7b, for example, an inorganic alkali developer or an organic amine developer is preferably used.
[0048]
Further, when the thickness of the photosensitive resist film 7 exceeds 50 μm, it is difficult for light irradiated for photocuring to reach the lower surface side of the photosensitive resist film 7 and the resolution of forming the through hole 7b is lowered. There is a fear. Therefore, it is preferable that the photosensitive resist film 7 has a thickness of 50 μm or less.
[0049]
Next, as shown in FIG. 2D, a conductive paste 8 is filled into the through hole 7b of the resist film 7a.
[0050]
The conductive paste 8 forms a wiring conductor layer of a wiring board, for example, a metal powder made of gold, silver, platinum, palladium, copper, nickel, molybdenum, tungsten, or an alloy thereof, or an alloy containing these as a main component. , An organic binder, a solvent, a dispersant and the like are added and mixed.
[0051]
In the conductive paste 8 composed of the metal powder, the organic binder, the solvent, the dispersant, etc., when the amount of the organic binder is less than 1 part by weight with respect to 100 parts by weight of the metal powder, the fluidity of the conductive paste 8 is deteriorated. It becomes difficult to fill the entire area in the through-hole 7b of the film 7a with a uniform thickness, and when it exceeds 15 parts by weight, the electric resistance value of the wiring conductor layer formed by using the conductive paste becomes high. End up. Therefore, in the conductive paste 8 made of the metal powder, organic binder, solvent, dispersant, etc., the amount of the organic binder is preferably in the range of 1 to 15 parts by weight with respect to 100 parts by weight of the metal powder.
[0052]
Next, the resist film 7a is filled with the conductive paste 8 in the through hole 7b, and then peeled off from the ceramic green sheet 1, whereby a predetermined pattern is formed on the upper surface of the ceramic green sheet 1 as shown in FIG. The wiring conductor layer 4 is formed.
[0053]
The wiring conductor layer 4 can be formed so that the through-holes 7b of the resist film 7a have a width of 60 μm or less and an adjacent interval of 60 μm or less, so that the width and the adjacent interval on the upper surface of the ceramic green sheet 1 are set to 60 μm or less. Can be formed into a pattern.
[0054]
Finally, a plurality of ceramic green sheets 1 having a predetermined pattern of wiring conductor layer 4 deposited on the surface are laminated and fired at a temperature of about 1000 ° C. As shown in FIG. 2 (f), a wiring board as a product in which the wiring conductor layer 4a is formed on the inside and the surface of the insulating base 1a is completed by baking and integrating 1 and the wiring conductor layer 4.
[0055]
In this case, the wiring conductor layer 4 can be formed in a narrow and narrow line width and adjacent spacing of 60 μm or less, so the wiring conductor layer 4a also has a narrow and narrow line width and adjacent spacing of 60 μm or less. As a result, the wiring conductor layer 4a can be formed with high density.
[0056]
When the ceramic green sheets 1 are laminated, grooves having the same pattern and thickness as the wiring conductor layer 4 formed on the upper surface of the ceramic green sheet 1 positioned on the lower surface of the ceramic green sheet 1 positioned on the upper side. If the wiring conductor layer 4 is fitted in the groove portion, the upper and lower ceramic green sheets 1 can be more securely adhered to each other, and there is a risk that problems such as adhesion failure occur on the insulating substrate 1a. Can be very low. Accordingly, when the ceramic green sheet 1 is laminated, a groove portion having the same pattern and thickness as the wiring conductor layer 4 formed on the upper surface of the ceramic green sheet 1 located on the lower surface of the ceramic green sheet 1 located on the upper portion. Is preferably formed.
[0057]
The groove is formed by, for example, pressing the metal mask used when forming the resist film 7a against the lower surface of the ceramic green sheet located at the upper portion and pressing it to the same depth as the thickness of the wiring conductor layer 4. It can be formed easily.
[0058]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, the upper surface of the ceramic green sheet 1 in each of the above-described embodiments. If a metal punching pin is pressed from the side to the bottom side to form a through hole penetrating in a thickness direction at a predetermined position of the ceramic green sheet 1, and a through hole conductor is filled in the through hole The wiring conductor layers 4a positioned above and below can be electrically connected through the through-hole conductors.
[0059]
【The invention's effect】
According to the method for manufacturing a wiring board of the present invention, the conductive paste for forming the wiring conductor layer is made photosensitive by dispersing and mixing the metal powder in the photosensitive resin composition. A conductive layer for wiring is formed by applying a paste, and then irradiating light at a predetermined position to photocur the photosensitive resin composition in a predetermined region and developing and removing the photosensitive resin composition in an uncured region. Since the so-called photolithography technology can be formed, the wiring conductor layer has a narrow line width and adjacent spacing of 60 μm or less, and thus the wiring conductor layer can be formed into a narrow line. Since the width is narrow and the interval between adjacent lines is narrow, the wiring conductor layer can be formed with high density.
[0060]
Further, according to the method for manufacturing a wiring board of the present invention, a resist film in which through holes having fine predetermined patterns are formed on the surface of the ceramic green sheet by a photolithography technique, and a conductive paste is placed in the through holes. Since the conductor layer for wiring is formed by filling, the line width of the conductor layer for wiring and the adjacent space can be made narrow and narrow as 60 μm or less. As a result, the wiring conductor layer can be formed with high density.
[Brief description of the drawings]
FIGS. 1A to 1E are cross-sectional views for each step for explaining a method of manufacturing a wiring board according to the present invention.
FIGS. 2A to 2F are cross-sectional views for each step for explaining another embodiment of the manufacturing method of the present invention. FIGS.
[Explanation of symbols]
1 ... Ceramic green sheet
1a ... Insulating substrate
2 ... photosensitive conductive paste
3 ... Photomask pattern
4 ... Conductor layer for wiring
5 ... Wiring conductor layer
5a ・ ・ Wiring conductor layer
7 ... Photosensitive resist film
7a: Resist film
7b ... through hole

Claims (3)

(1) a step of producing a plurality of ceramic green sheets in which ceramic powder is dispersed in an organic resin composition, and a photosensitive conductive paste in which metal powder is added to the photosensitive resin composition;
(2) forming a groove corresponding to a conductor layer for wiring formed on the surface of the other ceramic green sheet on the surface of the ceramic green sheet;
The photosensitive green paste is applied to the surface of the ceramic green sheet, and light is applied to a predetermined position of the photosensitive conductive paste, the photosensitive resin composition in a predetermined area is photocured and developed, and then the ceramic green sheet is developed. Forming a wiring conductor layer on the surface of
(3) said plurality of ceramic green sheets for wiring conductor layers are formed, are laminated such that said groove corresponding to the conductor layer for the wiring conductor layer and the wiring are identical, by firing, ceramic And a step of forming a wiring conductor layer on and inside the insulating substrate. (1) A step of producing a plurality of ceramic green sheets in which ceramic powder is dispersed in an organic resin composition, and a conductive paste in which metal powder is added to an organic solvent,
(2) forming a groove corresponding to a conductor layer for wiring formed on the surface of another ceramic green sheet on the surface of the ceramic green sheet;
(3) the the front surface of the ceramic green sheet is placed a photosensitive resist film, and the through-holes of a predetermined pattern by removing the non-cured areas by development with photocuring a predetermined area is irradiated with light in a predetermined position Forming a resist film having,
( 4 ) filling a conductive paste into the through hole of the resist film, and then removing the resist film to form a wiring conductor layer on the surface of the ceramic green sheet;
(5) a plurality of ceramic green sheets in which the wiring conductor layer is formed, stacked so said groove corresponding to the conductor layer for the wiring conductor layer and the wiring are identical, by firing, ceramic And a step of forming a wiring conductor layer on and inside the insulating substrate. 3. The groove is formed by pressing a metal mask for forming the wiring conductor layer on the other ceramic green sheet against the surface of the ceramic green sheet. Wiring board manufacturing method.

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