JP3744567B2 - Electronic component packing method and packing bag - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for packing electronic parts using a plastic sheet having flexibility and transparency, and in particular, a plurality of electronic parts having the same shape are packed together in a predetermined number to perform boxing operations and the like. The present invention relates to an electronic component packaging method and a packaging bag that can be performed appropriately, quickly and simply.
[0002]
[Prior art]
Conventionally, as a means of packing a plurality of electronic parts having the same shape, it has been common to pack a relatively small number of parts together in a single synthetic resin packaging bag. It is.
[0003]
However, in this case, parts of the same packaging bag collide with each other during transportation, and are easily damaged externally. In this case, it is very complicated to check individual parts one by one.
[0004]
From this point of view, for example, those having the required electrode lead terminals have a taping method in which the end portions of the electrode lead terminals are supported at a predetermined interval on a long tape, and these electronic components are arranged and arranged. Proposed. According to such a taping method, the number of electronic components to be stored can be easily counted, for example, when boxed, and can be easily and quickly aligned and stored by appropriately positioning the tape with respect to the boxing operation. it can.
[0005]
Further, package-like storage portions are formed on a continuous synthetic resin carrier tape at a predetermined interval, and necessary electronic components are sequentially inserted into the storage portions, and then the storage portion is sealed with a continuous cover tape. Such a packing method has also been proposed. In this case, as with the taping method, the number of electronic components can be easily counted, and not only can the boxing operation be easily and quickly performed, but the entire electronic component is packaged and packaged. Damage can be prevented.
[0006]
[Problems to be solved by the invention]
However, in the previously proposed packing method described above, according to the former taping method, the main body of the electronic component itself is not packaged. May be damaged. The latter packing method has an advantage of preventing external damage, but requires a means such as forming a package-like storage portion in advance on the carrier tape or further sealing with a cover tape. There are problems such as an increase in the processing cost of the material.
[0007]
Therefore, the purpose of the present invention is to arrange and store electronic parts of the same shape for each unit number in a bag made of a synthetic resin sheet so as not to move and prevent external damage, Electronic components can be easily checked for individual stored parts, and the packaging can be facilitated, the storage parts can be easily removed, and the electronic parts can be packaged at low cost. It is to provide a method and packing bag.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the electronic component packaging method according to the present invention includes forming a synthetic resin sheet into a bag shape, arranging and arranging a plurality of electronic components inside the sheet, and arranging each side edge. The parts were welded appropriately by heat sealing to seal the electronic components, and a part of each electronic component was clamped and fixed by heat sealing to the sheet so that a plurality of adjacent electronic components did not move, and further sealed In an electronic component packaging method in which an open perforation is provided on at least one side of the sheet, the synthetic resin sheet is a continuously manufactured cylindrical sheet, and the cylindrical sheet is cut into a predetermined dimension in the longitudinal direction, and the cut is performed. A plurality of electronic components can be arranged and accommodated in the width direction of the sheet .
[0010]
The electronic component packaging method according to the present invention includes forming a synthetic resin sheet into a bag shape, arranging and arranging a plurality of electronic components inside the sheet, and appropriately heat-sealing each side edge. In addition to sealing the electronic components by welding, a part of each electronic component is held and fixed by heat sealing to the sheet so that a plurality of adjacent electronic components do not move, and at least one side of the sealed sheet In the method of packing electronic parts, the synthetic resin sheet is made of a continuously manufactured cylindrical sheet, and the cylindrical sheet is cut into two in the longitudinal direction, and the longitudinal direction of these cut sheets A plurality of electronic components can be arranged and housed in a line.
[0013]
On the other hand, a packaging bag for electronic parts according to the present invention arranges and arranges a plurality of electronic parts inside a synthetic resin sheet formed in a bag shape, and welds each side edge of the sheet by heat sealing. In a packaging bag for electronic parts in which a part of each electronic component is sandwiched and fixed by heat sealing and an opening perforation is provided on one side of the sealed sheet , the synthetic resin sheet is a continuously manufactured cylinder. The cylindrical sheet is cut to a predetermined size in the longitudinal direction, and a plurality of electronic components can be aligned and accommodated in the width direction of the cut sheet .
[0015]
Also, the electronic parts packaging bag according to the present invention has a plurality of electronic parts arranged and accommodated inside a synthetic resin sheet formed in a bag shape, and each side edge of the sheet is welded by heat sealing. In a packaging bag for electronic parts in which a part of each electronic component is sandwiched and fixed by heat sealing and an opening perforation is provided on one side of the sealed sheet, the synthetic resin sheet is a continuously manufactured cylinder. The cylindrical sheet may be cut into two in the longitudinal direction, and a plurality of electronic components may be aligned and stored in the longitudinal direction of the cut sheets.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Next, an electronic component packaging method and a packaging bag according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0019]
Example 1
1 and 2 show an embodiment of a packaging bag for electronic parts and a packaging method thereof according to the present invention.
[0020]
That is, in FIGS. 1 and 2, reference numeral 10 indicates a transparent flexible synthetic resin cylindrical sheet continuously manufactured by, for example, blow molding, and the sheet 10 is cut by a predetermined dimension L in the longitudinal direction. Next, a plurality of electronic components 12 having the same shape are stored and arranged side by side in the cut cylindrical sheet 10 ′. In this case, the upper and lower sheets are previously welded to the lower edge of the cylindrical sheet 10 ′ by the heat seal 14.
[0021]
In the present embodiment, the electronic component 12 is an electrolytic capacitor element having two electrode lead terminals 12a and 12b, respectively.
[0022]
Next, in this embodiment, upper and lower sheets are welded to the upper edge of the cylindrical sheet 10 ′ containing the electronic component 12 by a heat seal 16, and the electrode lead terminals 12 a and 12 b of the electronic component 12 are provided. A heat seal 18 is applied in parallel with the heat seal 16 at the extending portion.
[0023]
Therefore, in this embodiment, the heat seals 14 and 16 form a bag body that accommodates the entire electronic component 12, and the intermediate heat seal 18 provides the electrode lead terminals 12 a and 12 b of the electronic component 12. Can be fixed so that a plurality of adjacent electronic components 12 do not move. The intermediate heat seal 18 can be applied not only as a single unit but also as a plurality of parallel heat seals spaced apart by a predetermined distance.
[0024]
Further, in this embodiment, in order to easily open the packing bag, the perforated perforations 20 are provided in advance on one side or both sides of the cylindrical sheet 10 in the longitudinal direction, thereby arranging the arranged electrons. The component 12 can be easily taken out from the opening. Further, as an opening means of the packing bag, the intermediate heat seal 18 and / or the heat seal 14 at the lower edge and adjacent to the electronic perforation 12 instead of the opening perforation 20 or together with the opening perforation 20. Opening perforations 20 ′, 20 ′ parallel to the heat seal 18 and / or the heat seal 14 can be appropriately provided on the storage side.
[0025]
Example 2
3 and 4 show another embodiment of a packaging bag for electronic parts and a packaging method thereof according to the present invention.
[0026]
That is, in FIG. 3 and FIG. 4, reference numeral 30 indicates a transparent flexible synthetic resin cylindrical sheet that is continuously manufactured in the same manner as in the above-described embodiment, and the sheet 30 is cut into two parts in the width direction. To do. The two sheets 30a and 30b cut in this way are each formed into a U-shaped cross section.
[0027]
Therefore, in the present embodiment, a plurality of electronic components 12 having the same shape are arranged side by side and stored in the inside with the open end portions of the cut sheets 30a and 30b facing upward. In this case, in the longitudinal direction of the sheets 30a and 30b, the cut perforations 32 are provided vertically at predetermined intervals W, and the heat seals 34a and 34b are sandwiched in parallel with both sides of the cut perforations 32. And weld the upper and lower sheets. In addition, the said space | interval W can be set according to the dimension of the box used as the object of boxing.
[0028]
Next, in the present embodiment, the upper and lower sheets of the cylindrical sheets 30a and 30b containing the electronic component 12 on the open end side thereof are welded to the upper and lower sheets by a heat seal 36, and the electrodes of the electronic component 12 are also welded. A plurality of heat seals 38 a and 38 b are applied in parallel with the heat seal 36 at the portion where the lead terminals 12 a and 12 b extend.
[0029]
Therefore, in the present embodiment, a bag body that accommodates the entire electronic component 12 is formed by the heat seal 36. Further, the electrode lead terminals 12a and 12b of the electronic component 12 can be fixed by the intermediate heat seals 38a and 38b so that the plurality of adjacent electronic components 12 do not move.
[0030]
Further, in this embodiment, in order to easily open the packing bag, the opening perforations 40 and 41 are provided in advance on both side edges in the longitudinal direction of the cylindrical sheet 10 so that the electronic components arranged in an aligned manner are provided. 12 can be easily taken out from the opening. Further, as the means for opening the packaging bag, the heat perforations 40, 41 may be replaced with or together with the opening perforations 40, 41 adjacent to the intermediate heat seal 38b and on the storage side of the electronic component 12. Opening perforations 40 ', 41' parallel to the seal 38b can also be provided.
[0031]
FIG. 5 shows a state in which a packaging bag 50 of electronic components constructed according to the above embodiments is packed in a required cardboard box 52. That is, according to the electronic component packing bag 50 obtained by the present invention, as shown in the figure, a predetermined number of electronic components are packed in a sheet formed in accordance with the dimensions of the box, so that a predetermined number of pieces are packed in the box. Electronic parts can be appropriately and quickly packed in a simple manner.
[0032]
As mentioned above, although the suitable Example of this invention was described, this invention is not limited to the said Example, For example, as a synthetic resin manufacturing sheet material used in this invention, it is well-known as what is used for a packaging. A flexible sheet material can be applied, and the thickness and other dimensions can be selected and used in accordance with the dimensions of the electronic component. In addition, various design changes can be made without departing from the spirit of the present invention.
[0033]
【The invention's effect】
As is apparent from the above-described embodiments, according to the electronic component packaging method of the present invention, a synthetic resin sheet is formed in a bag shape, and a plurality of electronic components are aligned and accommodated inside the sheet. In addition, each side edge is welded appropriately by heat sealing to seal the electronic components, and a part of each electronic component is held and fixed by heat sealing to the sheet so that a plurality of adjacent electronic components do not move. In addition, since the electronic perforation can be completely sealed by providing a perforation perforation on at least one side of the sealed sheet, each electronic part is not damaged by the outside, and each electronic component is heat-sealed to the sheet. It can be fixed so that it does not move, and by storing a certain number of electronic parts each, it can be carried out properly and quickly even during boxing work Kill.
[0034]
Further, according to the packaging bag for electronic parts according to the present invention, it can be obtained by appropriately heat-sealing the synthetic resin sheet, so that it can be manufactured at a low cost, is easy to handle, and is packed. Each of the electronic components obtained can be easily checked, and the number of the calculations can be easily achieved.
[Brief description of the drawings]
FIG. 1 is a schematic explanatory view showing an embodiment of a packaging method for electronic components according to the present invention.
FIG. 2 is a cross-sectional view taken along line II-II of the packaging bag shown in FIG.
FIG. 3 is a schematic explanatory view showing another embodiment of the electronic component packaging method according to the present invention.
4 is a cross-sectional view taken along line IV-IV of the packaging bag shown in FIG.
FIG. 5 is a schematic explanatory view showing a packaging state of a packaging bag obtained by the electronic component packaging method according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Synthetic resin cylindrical sheet 10 'Cut cylindrical sheet 12 Electronic component 12a, 12b Electrode lead terminal 14 Heat seal 16 Heat seal 18 Heat seal 20 Open perforation 20' Open perforation 30 Synthetic resin cylindrical sheet 30a, 30b Cylindrical sheet 32 Cut perforation 34a, 34b Heat seal 36 Heat seal 38a, 38b Heat seal 40, 41 Open perforation 40 ', 41' Open perforation 50 Packaging bag 52 Cardboard box

Claims (4)

A synthetic resin sheet is formed in a bag shape, and a plurality of electronic components are arranged and accommodated inside the sheet, and each side edge is welded by heat sealing as appropriate to seal the electronic components. In a packaging method for electronic parts, a part of the parts is clamped and fixed by heat sealing to the sheet so that a plurality of adjacent electronic parts do not move, and an open perforation is provided on at least one side of the sealed sheet . ,
The synthetic resin sheet is composed of a continuously manufactured cylindrical sheet, and the cylindrical sheet is cut into a predetermined dimension in the longitudinal direction, and a plurality of electronic components are aligned and stored in the width direction of the cut sheet. A packaging method for electronic parts , characterized by the above . A synthetic resin sheet is formed in a bag shape, and a plurality of electronic components are arranged and accommodated inside the sheet, and each side edge is welded by heat sealing as appropriate to seal the electronic components. In a packaging method for electronic parts, a part of the parts is clamped and fixed by heat sealing to the sheet so that a plurality of adjacent electronic parts do not move, and an open perforation is provided on at least one side of the sealed sheet . ,
The synthetic resin sheet is made of a continuously manufactured cylindrical sheet, and the cylindrical sheet is cut into two in the longitudinal direction, and a plurality of electronic components are aligned and stored in the longitudinal direction of the cut sheets. configuration and packing method of the electronic component comprising. A plurality of electronic components are arranged and accommodated inside a synthetic resin sheet formed in a bag shape, each side edge of the sheet is welded and sealed by heat sealing, and one electronic component is further sealed by heat sealing. In a packaging bag of electronic parts that holds and fixes the part and provides an open perforation on one side of the sealed sheet ,
The synthetic resin sheet is composed of a continuously manufactured cylindrical sheet, the cylindrical sheet is cut in a predetermined dimension in the longitudinal direction, and a plurality of electronic components are aligned and stored in the width direction of the cut sheet. And electronic parts packing bag. A plurality of electronic components are arranged and accommodated inside a synthetic resin sheet formed in a bag shape, each side edge of the sheet is welded and sealed by heat sealing, and one electronic component is further sealed by heat sealing. In a packaging bag of electronic parts that holds and fixes the part and provides an open perforation on one side of the sealed sheet,
The synthetic resin sheet is made of a continuously manufactured cylindrical sheet, and the cylindrical sheet is cut into two in the longitudinal direction, and a plurality of electronic components are aligned and stored in the longitudinal direction of the cut sheets. packing bag of electronic components characterized by.

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