JP3723424B2 - Laser equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser apparatus.
[0002]
[Prior art]
Conventionally, this type of apparatus is disclosed in, for example, Japanese Patent Laid-Open No. 6-45703. According to this publication, a lead, a laser element provided on the lead, and a resin frame for protecting the laser element are shown. One part of the upper side of the lead and both side surfaces are set as the lead attachment reference part.
[0003]
[Problems to be solved by the invention]
However, in the above apparatus, there is a first drawback that a resin leak occurs in one part of the upper side of the lead, which is the attachment reference part, and the attachment reference part becomes inaccurate. As a result of investigating the cause, the present inventor found that the resin frame is located outside the upper side of the lead, so that the resin accumulates in the lead extraction generated during pressing.
[0004]
In the above apparatus, a laser element is disposed at the tip of the lead so that the laser beam is not reflected on the surface of the lead. Therefore, when handling this laser apparatus, there is a second drawback that a finger, tweezers, etc. are likely to come into contact with the laser element. Accordingly, the present invention provides a laser device that takes into account such conventional drawbacks and is unlikely to cause resin leakage and to prevent a finger or the like from coming into contact with the laser element.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, in the present invention of claim 1, a lead, a laser element provided on the lead, and a resin frame that protects the laser element are provided, and the outer shape of the resin frame is the lead. The laser device is configured to be positioned inside a reference portion serving as an attachment reference for the lead, wherein a notch portion is formed in front of the laser element attachment portion of the lead, and a protrusion is provided next to the notch portion, The protruding portion protrudes in a laser beam emitting direction from a surface defined by a reference portion at the tip of the lead, and the outer shape of the resin frame is provided on the inner side of the tip of the protruding portion .
[0010]
DETAILED DESCRIPTION OF THE INVENTION
A laser apparatus 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 is a front view of the laser device 1, FIG. 2 is a plan view of the laser device 1, and FIG. 3 is a cross-sectional view taken along line A1A2 of FIG. In these figures, the lead 2 is made of, for example, a plated metal material such as copper and has a thickness of 0.2 to 1.0 mm, for example.
[0011]
The lead 2 is formed in a substantially T shape when viewed from the front (see FIG. 1). The lead 2 includes a terminal portion 3, a base portion 4, projecting portions 5 and 6, a cutout portion 7 and the like.
[0012]
The terminal portion 3 has a substantially rectangular shape when viewed from the plane. The base portion 4 is formed to be connected to the terminal portion 3 and has a substantially rectangular shape (partially cutout).
[0013]
In the outer shape of the base portion 4, reference portions 8 and 9 are formed along the vertical direction (Y direction), and reference portions 10 and 11 are formed along the horizontal direction (X direction). When the reference portions 8, 9, 10, 11 are brought into contact with the inner surface of a counterpart component (not shown) to which the laser device 1 is attached, the laser device 1 is positioned at an accurate position on the counterpart component. The For the above reasons, the reference portions 8, 9, 10, and 11 serve as attachment standards for the leads 2.
[0014]
Protruding portions 5 and 6 are formed adjacent to the reference portions 10 and 11, and a notch 7 is formed between the protruding portions 5 and 6. The protrusions 5 and 6 protrude from the reference parts 10 and 11 in the vertical direction (Y direction). That is, the protrusions 5 and 6 are provided outside the reference portions 10 and 11 (on the side far from a laser element described later).
[0015]
In this way, the notch 7 is formed in front of the attachment portion of the laser element (described later) of the lead 2, and the protrusions 5 and 6 are formed on both sides of the notch 7. Further, through holes 12 and 13 are formed at appropriate positions of the base 4 of the lead 2.
[0016]
The light receiving element 16 is formed by providing front surface electrodes 17 and 18 and a back surface electrode (not shown) on a silicon-based crystal having a PIN structure, for example. The surface electrode 18 is formed in ohmic contact with the light receiving portion 19 formed of a P-type diffusion region. The back electrode of the light receiving element 16 is fixed on the base 4 of the lead 2 via a conductive adhesive such as silver paste.
[0017]
The laser element 20 is made of, for example, a GaAlAs layer including an active layer and a clad layer sandwiching the active layer. The laser element 20 has a back electrode (not shown) of the laser element 20 on the front electrode 17 of the light receiving element 16 via silver paste or the like so that the main emission surface is located in the front (A1 direction). It is fixed. Thus, the laser element 20 is provided on the lead 2.
[0018]
The laser element 20 is formed so that the reflectance of the reflective film on the rear surface is higher than that on the front surface so that the secondary emission for monitoring is performed rearward.
[0019]
The other leads 14 and 15 are both made of, for example, a metal material such as plated copper. The other leads 14 and 15 are arranged at positions adjacent to the terminal portion 3 of the lead 2.
[0020]
The fine metal wire 21 is made of gold or the like and wired so as to connect the surface electrode of the laser element 20 and the base 4 of the lead 2. The fine metal wire 22 is made of gold or the like, and is wired so as to connect the surface electrode 17 of the light receiving element 16 and the other lead 14. The fine metal wires 23 are made of gold or the like, and are wired so as to connect the surface electrode 18 of the light receiving element 16 and the other leads 15.
[0021]
The resin frame 24 is made of, for example, polycarbonate resin or epoxy resin. The resin frame 24 has, for example, a substantially U-shape when viewed from the top so as to expose the emission surface of the laser element 20 and sandwiches the front and back surfaces of the lead 2 and the other leads 14 and 15. In addition, it is formed by transfer molding.
[0022]
Thus, the resin frame 24 protects the laser element 20. The resin frame 24 is formed so that the portion 25 on the surface of the lead 2 and the portion 26 on the back surface of the lead 2 are connected via the through holes 12 and 13 formed in the base portion 4 of the lead 2. ing.
[0023]
The outer shape 27 of the resin frame 24 is provided so as to be located on the inner side (side closer to the laser element 20) than the tip of the lead 2, that is, located on the inner side of the protruding portions 5 and 6 of the lead 2. Further, the outer shapes 28 and 29 of the resin frame 24 are provided so as to be located on the inner side (side closer to the laser element 20) than both sides of the lead 2.
[0024]
In other words, the outer shapes 27, 28, and 29 of the resin frame 24 are provided so as to be located on the inner side (side closer to the laser element 20) than the reference portions 8, 9, 10, and 11 that serve as the attachment reference of the lead 2. . By configuring in this way, when the resin frame 24 is molded, the lead 2 is removed in the reference portions 8, 9, 10, 11 (which occurs on the opposite side of the punching burr during the punching process). It is possible to prevent resin leakage due to a slightly curved cross section.
[0025]
A window 31 is provided in front of the resin frame so as to expose the main emission surface of the laser element 20 (that is, not to obstruct the main emission light). The laser device 1 is configured by the above components.
[0026]
As described above, the laser element 20 is mounted on the light receiving element 16, but the laser element 20 may be mounted directly on the lead 2 in front of the light receiving element 16 or via a submount.
[0027]
【The invention's effect】
According to the present invention, the protruding portion is provided outside the reference portion, and the outer shape of the resin frame is provided inside the tip of the protruding portion. As described above, by positioning the outer shape of the resin frame inside the tip of the protruding portion, it is possible to prevent the resin leak in the resin frame due to the lead being pulled out at the tip .
[Brief description of the drawings]
FIG. 1 is a front view of a laser apparatus 1 according to an embodiment of the present invention.
FIG. 2 is a plan view of the laser device 1;
FIG. 3 is a cross-sectional view taken along the line A1A2 of FIG.
[Explanation of symbols]
2 Lead 20 Laser element 24 Resin frame 27, 28, 29 Outline of resin frame 24

Claims (1)

A lead, a laser element provided on the lead, and a resin frame that protects the laser element are configured such that the outer shape of the resin frame is located inside a reference portion that is a reference for mounting the lead . In the laser device, a notch is formed in front of the laser element mounting portion of the lead, and a protrusion is provided next to the notch. The protrusion is a laser from a surface defined by a reference portion at the tip of the lead. A laser device that protrudes in a light emitting direction, and an outer shape of the resin frame is provided inside a tip of the protruding portion .

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