JP3705521B2 - Terminal bending machine - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a terminal bending apparatus for bending an external lead-out terminal of a composite semiconductor device.
[0002]
[Prior art]
An appearance of a relatively general composite semiconductor device is shown in FIG.
In the figure, a composite semiconductor device 1 has circuit components such as a semiconductor chip and external lead-out terminals 3 mounted and fixed on an insulating substrate (not shown) fixed on a heat sink 2, and an insulating case is provided on the outer periphery of the heat sink 2. 4 is covered. Further, after the lid 5 is inserted so as to close the opening of the insulating case 4 and one end of the external lead-out terminal 3 is led out from the through hole of the lid 5, the end of the terminal 3 is substantially perpendicular. The nut is bent so that the nut housed in the bottomed hole of the lid 5 does not deviate.
[0003]
Next, the process of bending the external lead-out terminal 3 will be described with reference to FIG.
That is, the external lead-out terminal 3 led out from the through-hole 5a of the lid 5 is pressed from above by a bending mold 6 having a recessed surface 6a having an inclination angle of about 45 degrees, and is folded at about 45 degrees. It is bent (see FIG. 6). Next, as shown in FIG. 7, the nut 7 is accommodated in the bottomed hole 5 b of the lid 5, and then the finishing mold 8 is pressed so that the external lead-out terminal 3 is flattened.
[0004]
[Problems to be solved by the invention]
As described above, in the conventional terminal bending process, as shown in FIG. 6, the external lead-out terminal 3 is bent to approximately 45 degrees as a preliminary process without being bent until it becomes flat at once. In this case, since the cross-sectional area of the screw insertion hole 3a portion of the external lead-out terminal 3 is smaller than that of the other portions, the portion of the insertion hole 3a is bent into a “<” shape, and FIG. As shown in FIG. 4, there is a case where the substrate cannot be completely flattened even after the process of flattening the terminals.
[0005]
OBJECT OF THE INVENTION
The present invention has been made to solve the above problems, in a preliminary bending step of the terminal, without causing the bent shape of the "V" at the location of the screw insertion hole 3a, the next step In the present invention, it is an object to provide a terminal bending apparatus for an external lead-out terminal in a composite semiconductor device that can be easily flattened.
[0006]
[Means for Solving the Problems]
The terminal bending apparatus according to the present invention includes an arm mounting shaft that is rotatably attached to a plate, and is attached to the arm mounting shaft, and rotates together with the arm mounting shaft to arm an external lead-out terminal of the composite semiconductor device. A terminal bending arm that abuts the front end portion, and a cam plate that slides on the side surface of the terminal bending arm and descends along with the lowering operation of the processing device, and slides on the cam plate as the cam plate descends. In the terminal bending apparatus for rotating the terminal bending arm and pre-bending the external lead-out terminal contacting the arm tip to a predetermined angle, the arm tip is below the screw insertion hole of the external lead-out terminal. The abutting position of the arm tip is set so as to be positioned at the position .
[0007]
【Example】
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a front view showing the entire terminal bending apparatus of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is an enlarged front view showing a main part of the terminal bending apparatus.
In these drawings, reference numeral 10 denotes the entire terminal bending apparatus. This terminal bending apparatus 10 has an air cylinder 11 attached to a frame 12, and a base 14 is fixed to the tip of a piston rod 13 of the air cylinder 11. A terminal preliminary bending jig 15 is attached to the base 14. A cam plate 16 protruding downward is attached to the seat plate 15A of the jig 15 by screws 17 as is apparent from the enlarged view of the main part of FIG.
[0008]
The lower end of the cam plate 16 is cut obliquely at an angle of approximately 45 degrees, and the cut side surface 16A is brought into sliding contact with the back surface of the arm tip 18A of the terminal bending arm 18. The leg 18B of the terminal bending arm 18 is attached to the arm attachment shaft 20 by a screw 19. The shaft 20 is rotatably fixed to the plate 21. The pair of arm mounting shafts 20, 20 arranged in parallel is connected by a coil spring 22, and as a result, the terminal bending arms 18, 18 are normally urged so as to be pulled upward.
[0009]
Reference numeral 23 denotes a lid pressing member for pressing the lid 5 when the external lead-out terminal 3 is bent by the terminal bending arm 18.
[0010]
Next, a description will be given of a procedure for performing a preliminary bending of the external lead terminal 3 by using a terminal bending apparatus 10, such as schematically above configuration. First, the composite semiconductor device 1 is fixed at a predetermined position on the bed 24 of the terminal bending apparatus 10 of FIG.
[0011]
Next, when the air cylinder 11 of the processing apparatus 10 is operated, the piston rod 13 of the air cylinder 11 is extended, and the base 14 fixed to the tip of the piston rod 13 is lowered. As a result, the seat plate 15A of the terminal preliminary bending jig 15 mounted on the base 14 is lowered against the spring (see FIG. 3) 25. Since the cam plate 16 is attached to the seat plate 15A, the cam plate 16 descends together with the seat plate 15A.
[0012]
On the other hand, since the cam plate 16 is in sliding contact with the terminal bending arm 18, as the cam plate 16 descends, the cam 18 is regulated by its cam shape and the arm 18 rotates together with the arm mounting shaft 20. As a result, the arm tip 18A of the arm 18 comes into contact with a position below the screw insertion hole 3a of the external lead-out terminal 3, and the arm 18 rotates as the cam plate 16 descends. In this case, the arm 18 is restricted by the cam shape of the cam plate 16 and is rotated by approximately 45 degrees, so that the bending angle of the distal end portion of the external lead-out terminal 3 is also approximately 45 degrees.
[0013]
In the above case, since the terminal bending arm 18 that directly contacts the lower position than the screw insertion hole 3a of the external lead-out terminal 3 is used without using a conventional bending mold, the sectional area is small. There is no case where the screw insertion hole 3a is bent into a "<" shape.
[0014]
Next, the terminal pre-bending jig 15 is removed from the base 14 portion of the processing apparatus 10, and the finishing die 8 for flattening the external lead-out terminal 3 described in FIG. To make the external lead-out terminal 3 flat.
[0015]
In FIG. 1 of the above-described embodiment, two pairs of terminal bending arms 18 are provided, and FIG. 3 shows an example in which a pair of arms 18 are provided. The number of arms 18 is not particularly limited in the present invention. The same applies to the cam plate 16. Furthermore, when bending the external lead terminals 3 fold by the terminal folding arm 18 it has been described as having a lid pressing member 2 3 for pressing the lid 5, the pressing member 2 3 may be omitted. Furthermore, in the above-described embodiment, the power source of the terminal bending apparatus 10 is the air cylinder 11, but it goes without saying that it may be a hydraulic cylinder or other power source.
[0016]
【The invention's effect】
As described above, the terminal bending apparatus of the present invention uses a terminal bending arm that directly contacts the lower side of the screw insertion hole of the external lead-out terminal without using a conventional bending die. As a result, the screw insertion hole with a small cross-sectional area does not bend into a "<" shape.
[Brief description of the drawings]
FIG. 1 is a front view showing an entire terminal bending apparatus of the present invention.
FIG. 2 is a side view showing the entire terminal bending apparatus of the present invention.
FIG. 3 is an enlarged front view showing a main part of the terminal bending apparatus according to the present invention.
FIG. 4 is an external view of a composite semiconductor device using the processing apparatus.
FIG. 5 is a cross-sectional view for explaining a conventional method of pre-bending an external lead-out terminal of a composite semiconductor device.
FIG. 6 is an explanatory view showing a bent state of an external lead-out terminal after preliminary bending by the conventional method.
FIG. 7 is an explanatory view showing a bent state of an external lead-out terminal after final bending by the conventional method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Composite semiconductor device 2 Heat sink 3 External lead-out terminal 4 Insulation case 5 Lid 10 Terminal bending device 14 Base 15 Terminal preliminary bending jig 15A Seat plate 16 Cam plate 18 Terminal bending arm 20 Arm mounting shaft 21 Plate 23 Lid Body pressing member

Claims (3)

An arm mounting shaft pivotally mounted to the plate, mounted on the arm mounting axis, and rotates together with the arm mounting axis bending pin folding is brought into contact with the arm tip to the external lead terminals of the composite semiconductor device an arm, sliding contact with the side surface of the terminal folded arms, and a cam plate which moves downward together with the machining device downward movement, by rotating the pin bending arm in sliding contact with the cam plate with the descent of the cam plate in preliminary bending to that terminal bending device externally drawn terminals in contact with the arm tip portion at a predetermined angle,
The terminal bending apparatus characterized by setting the contact position of the said arm front-end | tip part so that the said arm front-end | tip part may be located below the screw insertion hole of the said external derivation | leading-out terminal . The terminal folding arm and the cam plate, the terminal bending device according to claim 1, characterized in that it is mutually opposed equipped plurality. When folding the externally leading terminals by said terminal bending arm, according to claim 1 or 2, further comprising a lid pressing member for pressing the lid for closing the insulating case opening of the composite semiconductor device terminal bending apparatus.

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