JP3699074B2 - Plate material bonding machine by high frequency dielectric heating - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a laminated material capable of obtaining a pillar material by bonding a plurality of small plate materials A, A by high frequency dielectric heating and cutting them to a constant width W as shown in FIG. 10 (a). The invention relates to a plate material bonding machine that manufactures or manufactures a wide plate material by connecting small plate materials A and A as shown in FIG. 10 (b).
[0002]
[Prior art]
Conventionally, when a plurality of small plate materials are assembled or joined, a plurality of small plate materials A and A are stacked with a heating adhesive as shown in FIG. 11 (a), or as shown in FIG. 11 (b). A plurality of small plate materials A and A are arranged in the width direction with a heating adhesive interposed therebetween to form a plate material group B. High frequency electrodes C and D are brought into contact with both surfaces of the plate material group B to apply a high frequency current. There is known a plate material bonding machine that performs heat bonding.
In this seed plate material bonding machine, one end of a plate material group B is supported by a fixed member E at a fixed position and the other end is pressed by a pressing cylinder F, and is arranged on the side of the pressed plate material group B. , D, for example, a high-frequency electrode D arranged at an upper position in the drawing is brought into contact with the plate group B by a cylinder G.
[0003]
In addition, one end of the plate group B that is sandwiched between the pair of high-frequency electrodes C and D is supported by the fixing member E, and the pusher H is fixed to the tip of the cylinder head in order to press the other end reliably by the cylinder F. In addition, the entire other end of the plate group B can be surely pressed by attaching the discard plate I having a thickness corresponding to the thickness of the plate group B to the pusher H. The discarded plate I needs to be changed according to the thickness of the plate group B as shown in FIGS.
[0004]
[Problems to be solved by the invention]
In the conventional method using the above-mentioned discarding plate, it is necessary to change the discarding plate every time the size of the plate group that is the object to be processed is changed. There is a disadvantage that it is uneconomical because it is necessary to prepare various kinds of discarded boards. In addition, since the discard plate mounted on the pusher is heated together with the plate material group that is the workpiece, there is a disadvantage that the thermal efficiency is deteriorated. In view of the drawbacks of the prior art, there is no need to change the discarded plate one by one, and it is possible to efficiently perform the bonding processing of the plate group having different thicknesses, and the plate bonding machine by high-frequency heating excellent in thermal efficiency. It is an invention aiming at obtaining.
[0005]
Further, as is apparent from FIG. 11, in the conventional method, the plate group B is pressed via the discard plate I by the pressing cylinder F at the same position. Therefore, since the pressing position by the pressing cylinder F and the center of the thickness of the plate group B do not coincide with each other, the plate group B is bonded in a state where an offset load is applied. As a result, there is a defect that the finished plate material and column material are easily distorted. Another object of the present invention is to realize a plate material bonding machine capable of completing a plate material and a column material that do not cause distortion as described above by performing high-frequency heat bonding while pressing the center position of the thickness of the plate material group. It is.
In the plate material bonding machine shown in FIG. 11, it has been devised that the discard plate I is mounted at the center position of the pusher H and the cylinder F is moved in the vertical direction of the drawing, but depending on the thickness of the small plate material A to be processed. There was no change in the need to replace it.
[0006]
[Means for Solving the Problems]
The basic structure of the plate material bonding machine according to the present invention is that a plurality of small plate materials A and A are arranged in the width direction or the thickness direction with a heating adhesive interposed therebetween to form a plate material group B, and one end of the plate material group B is provided. While being supported by the fixing member 2, the other end is pressed by a pressing means, specifically, a pressing piece 3, placed on both sides of the plate group B and brought into a pressed state by a pair of high-frequency electrodes brought into contact with the plate group B This is a plate bonding machine that heats the bonding surface of a certain plate group.
The present invention provides a fixed high-frequency electrode 4 that does not move in the pressing direction of the plate group, and the other high-frequency electrode that can move in the pressing direction of the plate group B in the plate bonding machine. 5 The pressing means of the plate group B is movable without colliding with the fixed-position high-frequency electrode 4, while the movable high-frequency electrode 5 is moved by being pushed by the pressing means.
[0007]
The pressing means for pressing the plate group B uses a pressing piece 3 having a size corresponding to the largest thickness of the plate group B to be processed, that is, a relatively large thickness, and this pressing piece 3 is used as the plate group B. A pressing piece moving means for moving in the thickness direction is provided, and a pressing operation means for pushing the pressing piece 3 movable in the thickness direction of the plate material group B toward the plate material group is provided. Further, if a pressing position moving means for moving the operating position of the pressing operation means for pressing the pressing piece 3 in the thickness direction of the plate material group B is provided, the center position of the thickness of the plate material group B is always pressed and distortion occurs. It will be possible to produce a plate material without.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a plate material bonding machine using high frequency dielectric heating according to the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a front view of a whole plate bonding machine of a type in which small plate materials are stacked and bonded in the vertical direction, and FIG. 2 is a schematic view of only the main part thereof.
[0009]
In the plate material bonding machine of the embodiment shown in FIGS. 1 and 2, a fixing member 2 for stacking and setting small plate materials A and A, which are workpieces, is placed in a main body frame 1 at a substantially central position. 2, a pressing piece 3 for pressing the plate group B on which the small plate members are stacked is disposed, and a pair of members for heating the stacked plate group B on the left and right sides of the fixing member. A high frequency electrode is provided. Of the pair of high-frequency electrodes, the electrode located on the left side in the drawing is the fixed-position high-frequency electrode 4 that can be moved in the horizontal direction by the link mechanism and brought into contact with the side surface of the plate group B. The electrode located at is a movable high-frequency electrode 5 movable in the pressing direction of the plate group B. A high frequency current is applied to the pair of high frequency electrodes 4 and 5 by a high frequency oscillator 6.
[0010]
The fixed-position high-frequency electrode 4 and the fixed-position high-frequency electrode support base 7 can be moved in a substantially horizontal direction by supporting the lower ends thereof with support rods 8 and 9 that are pivotally supported by the main body frame 1. The position high-frequency electrode 4 can be advanced and retracted from the side toward the plate member group B set on the fixed member 2. On the other hand, the movable high-frequency electrode 5 that is movable in the pressing direction of the plate group B is supported while being movable in the pressing direction, that is, in the vertical direction on the drawing, with respect to the support base 11 fixed to the main body frame 1. Yes. The movable high-frequency electrode 5 is supported on the support base 11 by a movable structure such as an ant fitting or a linear way module, and is always in the upper position and can be moved downward by being pushed by the pressing piece 3. It is like that.
[0011]
The pressing piece 3 is driven up and down by a pressing cylinder 12. The pressing cylinder 12 is supported by a cylinder support 13 and the cylinder head is in the thickness direction of the plate group B with respect to the pressing piece 3, that is, It is engaged in a state where it can freely move in the left-right direction on the drawing. The cylinder support 13 on which the pressing cylinder 12 is supported can be moved in the width direction of the plate group B by a feed screw mechanism 15 driven by a motor 14. On the other hand, the pressing piece 3 has a connecting rod 16 connected to the upper side position, and the connecting piece 16 is engaged with a feed screw mechanism 18 driven by a motor 17, whereby the pressing piece 3 is connected to the motor 17. It is comprised so that it can be moved to the desired position of the width direction of a board | plate material group by drive.
[0012]
The feed screw mechanism 18 for moving the pressing piece 3 in the left-right direction is provided with a guide bar 19 in the vertical direction at the tip, and is engaged so that the connecting rod 16 can move freely along the guide bar 19. are doing. Therefore, as indicated by arrows in FIG. 2, the fixed-position high-frequency electrode 4 positioned on the left side of the plate group B set on the fixing member 2 can be moved in the left-right direction by the electrode cylinder 10, and the plate group The movable high-frequency electrode 5 located on the right side of B is movable in the vertical direction. A high frequency current is applied to the fixed position high frequency electrode 4 and the movable high frequency electrode 5 by a high frequency oscillator 6.
Further, the pressing piece 3 moved up and down by the pressing cylinder 12 can be moved in the thickness direction of the plate group B, that is, in the left-right direction in the drawing by a feed screw mechanism. Further, the pressing cylinder 12 for driving the pressing piece 3 has a support base 13 that can be moved by the feed screw mechanism 15 in the thickness direction of the plate group B, that is, in the left-right direction in the drawing.
[0013]
Next, the operating state of the plate material bonding machine will be described.
As shown in FIG. 3, a plurality of small plate materials A and A to be bonded onto the fixing member 2 are set with a heating adhesive interposed therebetween to form a plate material group B. At this time, the right side surface of the plate group B is disposed in contact with the movable high-frequency electrode 5. From this state, as shown in FIG. 4, the fixed-position high-frequency electrode 4 is pushed out by the electrode cylinder 10, brought into contact with the left side surface of the plate group B, and the plate group B is sandwiched between the pair of high-frequency electrodes. Next, the cylinder support 13 is moved by the feed screw mechanism 15 so that the center position of the thickness of the plate group B matches the center position of the pressing cylinder 12 in the operating direction.
[0014]
Subsequently, as shown in FIG. 5, the pressing piece 3 is moved in the thickness direction of the plate group B by the feed screw mechanism 18, and the inner surface of the fixed-position high-frequency electrode 4 in contact with the left end of the plate group B and the pressing piece 3. Align (slightly inward) the outer faces of. Thereby, the fixed-position high-frequency electrode 4 does not collide when the pressing piece 3 moves up and down. When the pressing piece 3 is pushed down in this state, the pressing piece 3 collides with the movable high-frequency electrode 5 on the way, and finally presses the plate group B while pushing the movable high-frequency electrode 5 as shown in FIG. . In this state, when a high-frequency current is applied to the fixed position high-frequency electrode 4 and the movable high-frequency electrode 5, the small plate materials A and A of the plate group B are heat-bonded to each other.
[0015]
Since the force acting on the plate group B is a pressing force by the pressing cylinder 12 disposed on the center line of the thickness of the plate group B, the bonding surfaces of the small plates A and A are equal regardless of the size and position of the pressing piece 3. Bonded in a state of being pressed with a strong force. Therefore, it is possible to obtain a uniform product with a stable overall bonding state, and since there is no residual internal stress in the bonded plate material group, that is, the finished laminated material, there is no distortion immediately after bonding or due to changes over time. High quality plate and pillar products can be manufactured.
[0016]
1 is mainly for assembling small plate materials, but the width of the small plate materials to be assembled (thickness of the laminated material) and the number of sheets (width of the laminated material) are arbitrary. FIG. 7 shows a usage example in which small plate members having a width smaller than that in the usage state described in FIGS. 3 to 6 are used. In this use state, approximately half of the width of the pressing piece 3 is at the position of the movable high-frequency electrode 5, and substantially left half of the pressing piece 3 is in contact with the upper surface of the plate group B that is a workpiece. The pressing cylinder 12 presses a position biased to the left side of the pressing piece 3. Thus, regardless of the width of the small plate material to be processed, the processing using the small plate material having an arbitrary width can be performed without replacing the pressing piece corresponding to the conventional pusher, and the center position of the plate material group B is always set. By pressing with the pressing cylinder 12, heat-bonding can be performed in a state where the pressing state is not biased.
[0017]
1 to 7, the vertical plate material bonding machine has been described. However, the present invention can also be applied to a horizontal plate material bonding machine. That is, in FIG.8 and FIG.9, an example of embodiment which implements the board | plate material bonding machine which concerns on this invention by a horizontal type is shown with the schematic.
In the embodiment shown in FIGS. 8 and 9, a lower electrode 21 that is a movable high-frequency electrode is disposed on an electrode support board 20 so as to be movable in the left-right direction in the drawing. Above the lower electrode 21, an upper electrode 23, which is a fixed-position high-frequency electrode driven up and down by a cylinder 22, is disposed. This plate material bonding machine can be used mainly as a plate material bonding machine for producing flat plates, and a plate material group in which a plurality of small plate materials A and A are arranged with a heating adhesive interposed on the lower electrode 21. The upper electrode 23 is brought into contact with the upper surface of B, and the plate group B is heated by high-frequency dielectric heating between the lower electrode 21 and the upper electrode 23.
[0018]
A receiving member 26 whose lower end surface is positioned slightly above the upper surface of the lower electrode is disposed on one side of the pair of upper and lower high-frequency electrodes (right side in the drawing). This receiving member 26 is a fixed member, and is configured to support one end of the plate group B arranged on the lower electrode 21 and to move the lower electrode 21 under the receiving member 26.
On the other side of the pair of upper and lower high-frequency electrodes 21 and 23 (left side in the drawing), a pressing piece 25 that presses the plate group B by the pressing cylinder 24 is disposed. The pressing piece 25 is configured to pass under the upper electrode 23 and push the lower electrode 21 to the right in the drawing.
[0019]
With the above configuration, as shown in FIG. 8A, when the plate cylinder B is disposed on the lower electrode 21 and the pressing cylinder 24 is operated with the upper electrode 23 lowered, As shown in (b), the lower electrode 21 is pushed out and moved in the right direction, and the left end of the plate group B is pressed by the pressing piece 25. By applying a high frequency current between the lower electrode 21 and the upper electrode 23 in this pressed state, the entire plate group B is heated. That is, the heating adhesive is heated to bond the small plate materials A and A to complete a large plate material.
[0020]
FIG. 8 shows a state in which a wide plate material is manufactured by contacting small thin plate materials A and A, and FIG. 9 shows a state in which a thin plate material is assembled to manufacture a thick plate material and a column material. In the use state shown in FIG. 8 and the use state shown in FIG. 9, the pressing cylinder 24 is moved in the vertical direction so that the pressing piece 25 does not collide with the upper electrode 23 (the description of the specific structure is omitted). (See Figure 1). However, the positional relationship between the pressing piece 25 and the pressing cylinder 24 is shown in a fixed state. Like the vertical plate material bonding machine described above, the positional relationship between the pressing piece 25 and the pressing cylinder 24 may be changed, but even if the positional relationship is not changed, it may be implemented in practice. it can. In particular, in the case of manufacturing a thin plate material, distortion due to an uneven load in the range of a thin thickness will be negligible. On the contrary, there is a possibility that the influence of the unbalanced load becomes large in the case of a plate material having a large thickness. For this reason, in the illustrated example, the approximate center position of the thickness of the pressing piece 25 is pushed out by the pressing cylinder 24, so that the center of the thickness can be pressed when processing a thick plate material.
[0021]
【The invention's effect】
According to the plate material bonding apparatus using high frequency dielectric heating according to the first aspect of the present invention, a plurality of small plate materials are arranged in the width direction or the thickness direction with a heating adhesive interposed therebetween to form a plate material group on both sides of the plate material group. In the plate bonding machine that heats the bonding surface of the plate group in a pressed state by the arranged high-frequency electrode, it is not necessary to replace the pusher one by one according to the size of the plate member to be processed in the pressing means for pressing the plate group. There is an effect that the plate material can be efficiently bonded. Further, the pusher is attached as in the conventional case, and the attached pusher is not heated. Therefore, there is an actual benefit that can be made excellent in thermal efficiency.
[0022]
According to invention of Claim 2, in addition to the effect of invention of Claim 1, it can press in the state which presses the center of the thickness of a board | plate material and an unbalanced load does not act. Therefore, it is possible to provide a high-quality product without distorting the finished plate material or column material due to the internal stress due to the uneven load.
[Brief description of the drawings]
FIG. 1 is a front view of an entire plate material bonding machine in which small plate materials are stacked and bonded in a vertical direction;
FIG. 2 is a schematic view of only the main part of the plate material bonding machine shown in FIG.
3 is a schematic diagram showing a setting state of a manufacturing process by the plate material bonding machine shown in FIG.
FIG. 4 is a schematic diagram showing a state in which the fixed-position high-frequency electrode is operated from the state shown in FIG.
FIG. 5 is a schematic view of a state in which the cylinder support and the pressing piece of the pressing cylinder are moved from the state shown in FIG.
6 is a schematic diagram of a heating state in which the pressing cylinder is operated from the state shown in FIG. 5 to press the plate group and to apply a high-frequency current;
7 is a schematic diagram of a heat-bonded state in which a plate material group having a thickness different from that of FIG. 3 is processed by the plate material bonding machine shown in FIG.
FIG. 8 is a schematic view of an embodiment in which a thin plate is bonded in the width direction by a horizontal plate bonding machine;
9 is a schematic diagram showing a state in which the plate material is bonded and bonded by the plate material bonding machine shown in FIG.
FIG. 10 is a perspective view showing an example of a product processed by a plate material bonding machine;
FIG. 11 is a schematic view showing an example of a conventional plate material bonding machine.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Main body frame, 2 ... Fixed member, 3 ... Pressing piece, 4 ... Fixed-position high frequency electrode, 5 ... Movable high frequency electrode, 6 ... High frequency oscillator, 7 ... Support stand, 8, 9 ... Support rod, 10 ... Electrode cylinder, 11 ... Support base, 12 ... Pressing cylinder, 13 ... Cylinder support base, 14, 17 ... Motor, 15, 18 ... Feed screw mechanism, 16 ... Connecting rod, 19 ... Guide bar, 20 ... Electrode support board, 21 ... Lower electrode 22 ... cylinder, 23 ... upper electrode, 24 ... pressing cylinder, 25 ... pressing piece, 26 ... receiving member, A ... small plate material,
B ... Plate material group.

Claims (2)

A plurality of small plate materials are arranged in the width direction or the thickness direction by interposing a heating adhesive to form a plate material group, one end of the plate material group is supported by a fixing member, and the other end is pressed by a pressing means, and the plate material group In the plate material bonding machine that heats the bonding surface of the plate material group that is in a pressed state by a pair of high-frequency electrodes that are arranged on both sides of the plate and abutted against the plate material group,
One of the pair of high-frequency electrodes is a fixed-position high-frequency electrode that maintains a fixed position with respect to the pressing direction of the plate group, and the other is a movable high-frequency electrode that is movable in the pressing direction of the plate group, and the pressing of the plate group A plate material bonding machine using high-frequency dielectric heating, wherein the means is movable without colliding with the fixed-position high-frequency electrode, while the movable high-frequency electrode is moved by being pushed by the pressing means. The pressing means for pressing the plate material group includes a pressing piece having a size capable of corresponding to a large thickness plate material group, a pressing piece moving means for moving the pressing piece in the thickness direction of the plate material group, and the pressing piece as a plate material group. 2. A plate bonding machine using high-frequency dielectric heating according to claim 1, further comprising: pressing operation means that pushes out toward the plate, and pressing position moving means that moves the operating position of the pressing operation means in the thickness direction of the plate group with respect to the pressing pieces. .

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