JP3682797B2 - Non-reciprocal circuit element - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a nonreciprocal circuit device used as an isolator / circulator.
[0002]
[Prior art]
FIG. 9 shows an exploded perspective view of an example of a lumped constant type isolator as an example of a conventional non-reciprocal circuit device. In this conventional example, a dielectric substrate 63 on which a pattern electrode is formed is disposed on a lower case 65, and a central conductor portion made up of a ferrite 64 and a central conductor 66 that is overlapped in an insulated state is formed on the dielectric substrate. The center conductor and a predetermined pattern electrode on the dielectric substrate are connected to each other and covered with an upper case 68 on which a magnet 67 is mounted. 69 of the dielectric substrate 63 is a dummy resistor, and 70 is a ground electrode. One terminal of the central conductor is terminated by a dummy resistor 69 connected to the ground electrode.
[0003]
[Problems to be solved by the invention]
Since conventional lumped constant isolators are used for mobile phones, for example, there is a strong demand for miniaturization and thinning. Of course, it is required to have electrical characteristics that can withstand use and to be inexpensive.
Considering this miniaturization, the outer diameter of the ferrite 64 is required to some extent in order to obtain desired electrical characteristics, and there is a limit to the miniaturization of the ferrite 64. Therefore, when the entire size is reduced, the hole 72 into which the ferrite is inserted becomes relatively large as shown in FIG. As a result, a weakly strong portion 71 is formed on the dielectric substrate, which increases the risk of the substrate being cracked during handling in the production process and lowers mass productivity. For this reason, it is difficult to reduce the size of the conventional structure.
The dummy resistor is formed by a resistor printed on a dielectric substrate. In this dielectric substrate, heat dissipation is not good, and other electrostatic capacity and ground pattern electrodes are also formed, so there is no room in terms of space. For this reason, the power resistance in the dummy resistance portion is small, and only a power resistance of about 1 W can be realized.
Therefore, if the space is expanded, the size of the device is reversed against the trend of miniaturization, and it is difficult to construct a small lumped constant isolator for applications that require a relatively large power resistance.
In view of the above, it is an object of the present invention to provide a nonreciprocal circuit device that is small in size and has high power durability.
[0004]
[Means for Solving the Problems]
According to a first aspect of the present invention, a metal case, a metal case, a central conductor portion having a central conductor disposed in a ferrite core, a plate capacitor connected to the central conductor portion, a chip resistor, a permanent magnet , the irreversible circuit element including a resin case, the resin case has a respective output terminal and ground terminal of the opposing sides on the inside of the resin case, conductive plate connected to the ground terminal A circuit connection terminal formed by a ground electrode plate formed by the above, a projection formed on a surface on which the ground electrode plate is disposed, and another conductor plate connected to the input / output terminal on the projection Each of the conductor plates is partially embedded in a resin portion, and a metal case provided with a notch portion corresponding to the protrusion on the ground electrode plate of the resin case. Installed, the metal casing The inner bottom surface of the bottom scan, place the central conductor portion having a central conductor folded to wrap the ferrite core, as well as have a projection for locking the outer periphery of the ferrite core, under external shape of the resin case and the metal case the size of the resin mold that is the housed inside, is arranged on the upper side of the central conductor portion, a permanent magnet is disposed on the upper side of the resin mold, is a non-reciprocal circuit element to cover over the metal case.
In the first invention, as the chip resistor, a resistance film and a terminal electrode are formed on both ends of the resistance film on one surface of the substrate, the central conductor is connected to one of the terminal electrodes, and the one surface of the substrate It is preferable that a chip resistor having a back-side terminal electrode that is electrically connected to the other of the terminal electrodes is used on the back side of the chip, and the chip resistor is grounded by the back-side terminal electrode.
According to a second aspect of the present invention, a metal case, a metal case, a central conductor portion having a central conductor disposed in a ferrite core, a plate capacitor connected to the central conductor portion, a chip resistor, a permanent magnet , the irreversible circuit element including a resin case, the resin case has a respective output terminal and ground terminal of the opposing sides on the inside of the resin case, conductive plate connected to the ground terminal A circuit connection terminal formed by a ground electrode plate formed by the above, a projection formed on a surface on which the ground electrode plate is disposed, and another conductor plate connected to the input / output terminal on the projection Each of the conductor plates is partially embedded in a resin portion, the plate capacitor has electrodes formed on the upper and lower surfaces of the dielectric plate, and the chip resistor On one side Terminal electrodes are formed at both ends of the resistance film, the central conductor is connected to one of the terminal electrodes, and a back-side terminal electrode that is electrically connected to the other of the terminal electrodes is formed on the back side of the one surface of the substrate. The center conductor portion has three center conductors folded so as to wrap the ferrite core, the metal case bottom is installed on the ground electrode plate of the resin case, and the metal case bottom is above the metal case A central conductor portion, the plate capacitor, and the chip resistor are arranged, and each of them is directly grounded to the bottom of the metal case, and one of the plate capacitors and the chip resistor are connected to an end of one central conductor. The other two of the plate capacitors are connected to each other at the same portion, and the other two central conductors have upper surface electrodes that are substantially the same height as the circuit connection terminals formed on the resin protrusions. End of A non-reciprocal circuit element connected to each of the circuit connecting terminals.
In the nonreciprocal circuit device according to a second aspect of the present invention, the plate capacitor has one end of the center conductor connected to one of the electrodes, the other electrode connected under the metal case, and the chip resistor connected to the back surface. The side terminal electrode is preferably connected under the metal case.
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
An exploded perspective view of an embodiment according to the present invention is shown in FIG. This embodiment will be described. First, there is a resin case 1 at the bottom. A plan view and a side view of the resin case 1 in three directions are shown in FIG. 2, and a bottom view is shown in FIG. 2 and 3, the conductor portion is indicated by hatching. 2 is a sectional view taken along the line AA ′ of FIG. 2 and FIG. 5 is a sectional view taken along the line BB ′ of FIG. In the resin case 1, three conductor plates are formed integrally with the resin portion. This one conductor plate is a ground electrode plate 2, which is widely arranged at the bottom of the resin case 1, and a ground terminal 3 connected thereto is led out to the back surface serving as a mounting surface of the resin case 1. The other two conductor plates are for input / output terminals, and are U-shaped conductor plates in which the inner circuit connection terminal 4 and the outer input / output terminal 5 are connected. The inner circuit connection terminal 4 has a protrusion 6 formed on the surface on which the ground plate electrode 2 is disposed, and is disposed on the protrusion 6.
[0006]
A metal case lower 7 is placed on the resin case 1. The lower metal case 7 has a notch 8 corresponding to the protrusion 6 of the resin case 1 and is soldered to the ground electrode plate 2 of the resin case 1.
On the lower metal case 7, the plate capacitor 9 having electrodes formed on the upper and lower surfaces of the dielectric plate, the chip resistor 10, and the central conductor 12 on the ferrite core 11 are insulated from each other at intervals of 120 degrees. A central conductor portion disposed in a rotationally symmetrical manner is disposed. As shown in FIG. 6, the center conductor portion is composed of two conductors each extending radially from the disc portion 14 at intervals of 120 degrees, and is composed of three center conductors 12 connected at the tips. The ferrite core 11 is disposed on the portion 14, each center conductor 14 is bent, and an insulating sheet is sandwiched between the center conductors. Of the three central conductors 12, the tip portions 13a and 13b of the two central conductors 12 are connected to the plate-like capacitor 9 and the inner circuit connection terminal 4 on the resin case 1, respectively, and the other central conductor 12 The tip portion 13 c is connected to the plate capacitor 9 and the chip resistor 10. The disk portion 14 of the central conductor portion is connected to the lower metal case 7 and is grounded. The plate capacitor 9 is also connected to the lower metal case 7 on the opposite side of the surface to which the tip of the central conductor is connected, and is grounded.
[0007]
A plan view, a side view, and a bottom view of the chip resistor 10 are shown in FIG. The chip resistor 10 has two terminal electrodes 15 and 16 on one surface, and a resistance film 17 made of ruthenium oxide is formed between the terminal electrodes. An insulating coat is applied on the resistance film. One terminal electrode 16 is electrically connected to the terminal electrode 18 on the bottom surface via the electrode 19 formed on the side surface. The front end portion 13c of one central conductor is connected to the terminal electrode 15 of the chip resistor 10, and the terminal electrode 18 of the chip resistor 10 is connected to the lower metal case 7 and grounded.
[0008]
Next, the resin mold 20 is put on the central conductor portion. The resin mold 20 has a through hole 21 having a size substantially equal to the outer diameter of the ferrite core at the center, and three claw portions 22 that are in contact with the outer peripheral portion of the ferrite core 11 at the lower portion. The pawl portion 22 is positioned at the central conductor portion on the side surface of the ferrite core, and performs positioning of the ferrite core and also serves as protection and insulation for the central conductor on the side surface of the ferrite core. The resin mold 20 has a size that allows the outer shape to be accommodated inside the resin case 1 and the lower metal case 7, and a protrusion 23 for positioning the magnet 24 is formed on the upper surface. And the magnet 24 is arrange | positioned in the position positioned by this protrusion part 23. FIG. And the metal case upper part 25 was covered, and the metal case upper part 25 and the metal case lower part 7 were soldered, and the nonreciprocal circuit element was comprised.
One opposing surface 26 on the side surface of the upper metal case 25 is inserted inside the side surface 28 of the lower metal case 7 and soldered. The other facing surface 27 is located on the upper end of the side surface 29 of the resin case 1.
This embodiment is a lumped constant type isolator, and a perspective view thereof is shown in FIG.
[0009]
In the above embodiment, one of the central conductors 12 is connected to the chip resistor 10 and terminated, so that it is an isolator. However, if the central conductor is not terminated and used as an input / output terminal, it is used as a circulator. I can do it.
[0010]
In the embodiment of the present invention, the height of the protrusion 6 on which the inner circuit connection terminal 4 of the resin case 1 is formed is substantially the same as that of the plate capacitor 9, and the connection between the tip portions 13 a and 13 b of the center conductor 12 is performed. Easy going. Further, the projection 6 ensures the insulation between the connection terminal 4 and the ground electrode plate 2. Further, the resin case 1 enables surface mounting.
In the chip resistor 10 of the present invention, one terminal electrode 16 is led out to the bottom surface through the side surface, and the terminal electrode 18 is formed on the bottom surface. The terminal electrode 18 directly connects the bottom surface on the lower metal case 7. Since it is connected, it is connected to the bottom of the metal case over a wide area, has high heat dissipation, and is easy to connect. With improved heat dissipation, power durability can be improved. In the embodiment of the present invention, since the ferrite core and the magnet are positioned by one resin mold, the positioning is easy and the mounting is also easy. Further, since the claw portion of the resin mold covers the center conductor on the side surface of the ferrite core, a short circuit between the center conductor on the side surface of the ferrite core and the plate capacitor is prevented.
According to the structure of this embodiment, even if the size of the ferrite core is relatively increased, the conventional dielectric substrate is not used, so that a reduction in size can be achieved.
[0011]
【The invention's effect】
According to the present invention, it is possible to obtain a lumped constant isolator that is small in size and has high power resistance, and is extremely effective for protecting an amplifier due to an increase in reflection power resistance due to mismatching in, for example, a mobile phone.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an embodiment according to the present invention.
FIG. 2 is a plan view and a side view of a resin case according to an embodiment of the present invention.
FIG. 3 is a bottom view of a resin case according to an embodiment of the present invention.
4 is a cross-sectional view taken along line AA ′ of FIG.
FIG. 5 is a cross-sectional view taken along the line BB ′ of FIG.
FIG. 6 is a plan view of a central conductor according to an embodiment of the present invention.
7 is a plan view, a side view, and a bottom view of a chip resistor according to an embodiment of the present invention. FIG.
FIG. 8 is a perspective view of an embodiment according to the present invention.
FIG. 9 is an exploded perspective view of a conventional example.
FIG. 10 is a plan view of a conventional dielectric substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Resin case 2 Ground electrode plate 3 Ground terminal 4 Inner circuit connection terminal 5 Input / output terminal 6 Protrusion part 7 Metal case bottom 8 Notch part 9 Plate-like capacitor 10 Chip resistor 11 Ferrite core 12 Center conductor 13a, 13b, 13c Tip part 14 Disc parts 15, 16, 18 Terminal electrode 17 Resistive film 19 Electrode 20 Resin mold 21 Through hole 22 Claw part 23 Projection part 24 Magnet 25 Metal case top 26, 27 Opposing faces 28, 29 Side face

Claims (4)

A non-metal case comprising a metal case, a metal case, a central conductor portion having a central conductor disposed on a ferrite core, a plate capacitor connected to the central conductor portion, a chip resistor, a permanent magnet, and a resin case. A reversible circuit element,
The resin case has a ground terminal and an input / output terminal on each of opposite side surfaces,
The inside of the resin case, and the earth electrode plate formed of conductive plate connected to the ground terminal, and a protruding portion to which the ground electrode plate is formed on a surface that is located, entering-on the protrusion It has a circuit connection terminal formed of another conductor plate connected to the output terminal, each of the conductor plates is embedded in a resin part,
The bottom of the metal case having a notch corresponding to the protruding portion is installed on the ground electrode plate of the resin case, and the inner bottom surface under the metal case has a center conductor folded so as to wrap the ferrite core. Place the central conductor,
As well as have a projection for locking the outer periphery of the ferrite core, the size of the resin mold contour is housed inside under the resin case and the metal case, it is arranged on the upper side of the center conductor portion,
Nonreciprocal circuit device in which the permanent magnets on the upper side of the resin mold is placed, further characterized in that the covering on the metal case.   As the chip resistor, a resistance electrode and a terminal electrode are formed on both ends of the resistance film on one surface of the substrate, the central conductor is connected to one of the terminal electrodes, and on the back surface side of the one surface of the substrate, 2. The nonreciprocal circuit device according to claim 1, wherein a chip resistor having a back-side terminal electrode that is electrically connected to the other of the terminal electrodes is used, and the chip resistor is grounded by the back-side terminal electrode. A non-metal case comprising a metal case, a metal case, a central conductor portion having a central conductor disposed on a ferrite core, a plate capacitor connected to the central conductor portion, a chip resistor, a permanent magnet, and a resin case. A reversible circuit element,
The resin case has a ground terminal and an input / output terminal on each of opposite side surfaces,
The inside of the resin case, and the earth electrode plate formed of conductive plate connected to the ground terminal, and a protruding portion to which the ground electrode plate is formed on a surface that is located, entering-on the protrusion It has a circuit connection terminal formed of another conductor plate connected to the output terminal, each of the conductor plates is embedded in a resin part,
The plate capacitor has electrodes formed on the upper and lower surfaces of a dielectric plate,
The chip resistor has a resistance film and a terminal electrode formed on both ends of the resistance film on one surface of the substrate, the central conductor is connected to one of the terminal electrodes, A back side terminal electrode that is electrically connected to the other of the terminal electrodes is formed,
The central conductor portion has three central conductors folded so as to wrap the ferrite core,
The bottom of the metal case is installed on the ground electrode plate of the resin case, and the central conductor portion, the plate capacitor, and the chip resistor are arranged on the bottom of the metal case, and each is directly below the metal case. Connect to ground,
One of the plate capacitors and the chip resistor are connected to each other at the end of one central conductor,
The other two of the plate capacitors have upper surface electrodes that are substantially the same height as the circuit connection terminals formed on the resin protrusions, respectively, at the ends of the other two central conductors. A nonreciprocal circuit element connected to the circuit connection terminal.   The plate capacitor has one end of the center conductor connected to one of the electrodes, the other electrode connected under the metal case, and the chip resistor has the back terminal electrode connected under the metal case. The non-reciprocal circuit device according to claim 3.

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