JP3647274B2 - Method and apparatus for removing printed circuit board components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed circuit board component removal method and apparatus for removing a mounted component from a printed circuit board in order to recycle the printed circuit board built in a home appliance or an information communication device.
[0002]
[Prior art]
In recent years, technological development for recycling of waste has been promoted in various fields in order to preserve the global environment. Among them, the recycling of household electrical appliances that continue to occur in large quantities every year is a development issue that household electrical appliance manufacturers should urgently advance. Especially in home appliances, it is necessary to urgently promote the recycling of printed circuit boards that have a high content of valuable resources and a high content of harmful substances (such as lead).
[0003]
Conventionally, as a method of removing a mounting component from a printed circuit board of home appliances, for example, a method of heating the printed circuit board in a tunnel furnace and rotating a metal blade to scrape the mounting component, or a soldering part of the printed circuit board is molten solder. There are proposed methods such as immersing in a bath to melt the solder and lifting the mounted components, removing the mounted components by putting the board into a mesh drum whose internal temperature is higher than the solder melting temperature, and rotating the mesh drum. ing.
[0004]
[Problems to be solved by the invention]
However, in each of the conventional methods as described above, for example, in the first method, it is mainly limited to the surface-mount printed circuit board, and the components inserted into the insertion holes of the printed circuit board cannot be easily removed. Among these mounted parts, when the lead part is clinched, the part is difficult to come off, and the lead is cut and the resin package part of the part is damaged. Was.
[0005]
Further, in the second method, a large number of dedicated jigs for lifting the components are required, and it is impossible to apply to a processing apparatus that needs to process a wide variety of waste printed boards. In the case that is clinched, the part cannot be removed.
[0006]
Furthermore, in the third method, in order to set the temperature of all the soldered portions of the printed circuit board to be equal to or higher than the solder melting temperature, it is necessary to set the ambient temperature to the solder melting temperature +30 to 40 ° C. At this temperature, There is a high possibility of the electrolytic capacitor bursting, which is disadvantageous and problematic in terms of safety. Further, similarly to the first and second methods, when the lead portion is clinched, there is a problem that the component cannot be removed.
[0007]
Further, there is a problem that the printed circuit board in which the parts are inserted and mounted by using eyelets cannot be processed by any of the first to third methods.
[0008]
The present invention solves the above-mentioned conventional problems, and even if there are surface-mounted components, leaded components, clinch components, eyelet components, etc. as components mounted on a printed circuit board, they are heated and excited. Provided is a component removal method for a printed circuit board and an apparatus thereof, which can easily and safely remove components from the printed circuit board.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the printed circuit board component removal method and apparatus according to the present invention cut the lead soldered portion of the printed circuit board and remove the printed circuit board when removing the component mounted on the printed circuit board. The mounting component is removed from the printed circuit board by heating and vibrating at the same time.
[0010]
As described above, even if there are surface mounted components, leaded components, clinch components, eyelet components, etc. as components mounted on the printed circuit board, the components can be easily and safely removed from the printed circuit board by heating and vibration. can do.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
A printed circuit board component removal apparatus according to claim 1 of the present invention is a printed circuit board component removal apparatus for removing a component mounted on a printed circuit board by soldering from the printed circuit board. Means for cutting a component lead soldered portion of the printed circuit board to remove the component leads soldered to the circuit board and the surrounding solder, and heating the printed circuit board after the cutting, And a means for vibrating the printed circuit board. The mounted component is removed by the heating and vibration.
[0012]
The printed circuit board component removal method according to claim 6 is a printed circuit board component removal method for removing a mounted component on the printed circuit board from the printed circuit board, and after positioning the printed circuit board at a predetermined position, Cutting the component lead bonding portion of the printed circuit board to remove the component lead bonded to the printed circuit board and the surrounding bonding material , heating the printed circuit board after the cutting process, and the heating And a step of applying vibration to the printed circuit board after the process or simultaneously with the heating process, thereby removing the mounted component from the printed circuit board.
[0013]
According to these configurations and methods, even when components are clinched after being inserted into a printed circuit board or inserted components that are fixed by eyelets, the joints by soldering between these components and the substrate are cut and heated and excited. Allows removal from the printed circuit board.
[0014]
The component removal apparatus for a printed circuit board according to claim 2 is provided with a means for heating only the solder surface of the printed circuit board when the printed circuit board is heated by the heating means according to claim 1. To do.
[0015]
According to a seventh aspect of the present invention, there is provided a printed circuit board component removal method in which only the solder surface of the printed circuit board is heated in the step of heating the printed circuit board obtained by cutting the component lead joint portion according to the sixth aspect.
[0016]
According to these configurations and methods, the surface on the component side does not become high when the printed circuit board is heated, so that the electrolytic capacitor or the like mounted as a component is prevented from bursting.
[0017]
According to a third aspect of the present invention, there is provided a printed circuit board component removing device that detects only a portion that requires cutting when the component lead soldering portion of the printed circuit board is cut by the cutting means according to the first or second aspect. The image recognition device is provided.
[0018]
A method for removing a printed circuit board component according to claim 8 is a method of detecting only a portion that needs to be cut by an image recognition device in the step of cutting the component lead joint portion according to claim 6 or 7. To do.
[0019]
According to these configurations and methods, when cutting a soldered portion, by detecting only the portion that needs to be cut and cutting, the cutting is completed in a short time and the cutting used for the cutting is performed. The tool life can be extended.
[0020]
According to a fourth aspect of the present invention, there is provided a printed circuit board component removing apparatus using an ultrasonic vibrator as a vibration means for the printed circuit board according to any one of the first to third aspects.
[0021]
According to this configuration, when removing the mounted component, the component is removed efficiently and reliably by removing the mounted component by vibrating the printed board with the ultrasonic vibrator.
[0022]
According to a fifth aspect of the present invention, there is provided a printed circuit board component removing apparatus using a motor-driven cam as vibration means for the printed circuit board according to any one of the first to third aspects.
[0023]
According to this configuration, when removing the mounted component, the component is removed efficiently and reliably by removing the mounted component by vibrating the printed board using the motor-driven cam.
[0024]
Hereinafter, a printed circuit board component removal method and apparatus according to an embodiment of the present invention will be specifically described with reference to the drawings.
(Embodiment 1)
A printed circuit board component removal method and apparatus according to Embodiment 1 of the present invention will be described.
[0025]
FIG. 1 is a cross-sectional view showing a configuration of a printed circuit board component removal apparatus according to the first embodiment. In FIG. 1, 1 is a component removing device main body, 2 is a board solder surface cutting section, 3 is a board heating section, 4 is a printed circuit board, 5 is a cutting tool, 6 is a resistor with leads, 7 is a capacitor with leads, and 8 is a lead. IC, 9 is a soldered lead, 10 is a substrate holder, 11 is a slide table, 12a and 12b are conveying conveyors, 13 is a drop part receiver, 14 is a substrate holder with built-in vibrator, and 15 is a solder surface lead And a printed circuit board from which the solder is removed, 16 is an IC that is dropped due to vibration, 17 is a board heating unit incorporating a heater and a fan, 18 is a hot air outlet, 20 is a dropped component receiver, 21 is a component outlet, a Is the moving direction of the slide table.
[0026]
The operation of the component removal apparatus for a printed circuit board configured as described above will be described below with reference to FIG.
The target printed circuit board 4 is carried by the transport conveyor 12a, and is fixed by the board holder 10 provided on the slide table 11 in the board solder surface cutting part 2. Next, after being positioned at a predetermined position, the slide table 11 is moved in the X and Y directions which are its movement coordinate system, whereby the lead 9 soldered on the solder surface of the printed circuit board 4 and the solder around the lead. Is removed by the cutting tool 5. At this time, some of the components fall and are collected in the dropped component receiver 13. Further, the printed circuit board 15 whose solder surface has been cut is transferred from the board solder surface cutting unit 2 to the substrate heating unit 3 by the transfer conveyor 12b, and fixed by the substrate holder 14 incorporating the vibrator. Hot air is blown onto the solder surface of the printed circuit board 15 from the hot air outlet 18 of the substrate heating unit 17 to melt the solder adhering to the component lead and the component lead hole, and at the same time the printed circuit board 15 is vibrated by the substrate holder 14. As a result, components such as the IC 16 mounted on the printed circuit board 15 fall on the dropped component receiver 20, and thereafter, these components are taken out from the component takeout port 21.
[0027]
As described above, according to the present embodiment, by cutting the lead soldering portion of the printed circuit board, the printed circuit board is heated and vibrated to remove components mounted on the printed circuit board. Since all the joints between the component and the substrate are cut, even if there are clinch components, eyelet components, etc., the mounted components can be easily and safely removed from the printed circuit board by heating and vibration.
(Embodiment 2)
A component removal method and apparatus for a printed circuit board according to Embodiment 2 of the present invention will be described.
[0028]
FIG. 2 is a cross-sectional view showing the configuration of the printed circuit board component removal apparatus of the second embodiment. In FIG. 2, 29 is a component removal apparatus main body, 2 is a board solder surface cutting part, 30 is a board heating part, 31 is a space on the solder surface side of the board heating part 30, 32 is a part side space, and 33 is a heat insulating wall. It is. The other parts are the same as those in the first embodiment, and a detailed description thereof is omitted here.
[0029]
The operation of the component removal apparatus for a printed circuit board configured as described above will be described below with reference to FIG.
The process in the board solder surface cutting part 2 is the same as in the first embodiment. Then, the printed circuit board 15 whose solder surface has been cut is transferred from the board solder surface cutting unit 2 to the substrate heating unit 30 by the transfer conveyor 12b and fixed by the substrate holder 14 incorporating the vibrator. Hot air is blown onto the solder surface of the printed board 15 from the hot air outlet 18 of the board heating unit 17 to melt the solder adhering to the component lead and the component lead hole, and at the same time, the printed board 15 is vibrated by the board holder 14. By doing so, components such as the IC 16 mounted on the printed circuit board 15 are dropped onto the falling component receiver 20.
[0030]
At this time, the space 31 on the solder surface side and the space 32 on the component surface side of the substrate heating unit 30 are thermally insulated by a heat insulating wall 33 provided therebetween, and thus are a kind of the leaded capacitor 7 and the like. It is possible to prevent the electrolytic capacitor from being heated, and it is possible to prevent such explosion of the component.
[0031]
At this time, in order to prevent an increase in the temperature of the component due to heat conduction from the solder surface of the printed circuit board 15, it is possible to reliably prevent overheating and heat generation of the component by providing a cooling device in the space 32 on the component surface side. it can.
[0032]
As described above, according to the present embodiment, the heating device such as the substrate heating unit heats only the solder surface of the printed circuit board when heating the printed circuit board, and the heat resistant component such as the electrolytic capacitor on the component surface side. Since this structure prevents overheating, it is possible to prevent such parts from bursting.
(Embodiment 3)
A component removal method and apparatus for a printed circuit board according to Embodiment 3 of the present invention will be described.
[0033]
FIG. 3 is a cross-sectional view showing the configuration of the printed circuit board component removal apparatus of the third embodiment. In FIG. 3, 34 is a component removing device main body, 35 is a board solder surface cutting section, 30 is a board heating section, and 36 is a board solder surface recognition camera which is an image recognition apparatus. The other parts are the same as those in the first and second embodiments, and thus detailed description thereof is omitted here.
[0034]
4 is a processing locus diagram of the cutting tool 5 when the board solder surface recognition camera 36 is not used. FIG. 5 shows a printed circuit board using the board solder surface recognition camera 36 according to the third embodiment. 4 is a processing locus diagram of the cutting tool 5 when cutting the component lead when the presence or absence of the component lead is recognized and the presence of the component lead is recognized. FIG. FIG. 6 is a processing locus diagram of the cutting tool 5 when the solder surface recognition camera 36 is used to recognize the presence or absence of a component lead on the printed circuit board 4 and whether or not the component lead is clinched and cut the component lead. .
[0035]
4, 4 is a printed circuit board, 37 is a rotation locus of the cutting tool 5 for cutting the solder surface of the printed circuit board 4, 38 is a movement locus of the cutting tool 5, 39 is a lead of a soldered lead component, and 40 is a lead. It is a clinch lead of a lead component soldered after being clinched. In FIG. 5, reference numeral 41 denotes a processing locus of the cutting tool 5 when cutting is performed by recognizing the presence or absence of a lead on the printed circuit board 4, and in FIG. It is a processing locus of the cutting tool 5 when cutting.
[0036]
The operation of the printed circuit board component removing apparatus configured as described above will be described below with reference to FIG. 7 based on FIGS. 3, 4, 5, and 6. FIG.
If the recognition camera 36 is not used when cutting the solder surface of the printed circuit board 4 in the board solder surface cutting portion 35, the locus of the cutting tool 5 is like a movement locus 38 indicated by a dotted line in FIG. Then, the entire solder surface of the printed circuit board 4 is cut all over. For this reason, even a portion that does not need to be cut is cut, so that the life of the cutting tool 5 is shortened and the processing tact for cutting the solder surface of the printed circuit board 4 is lengthened.
[0037]
Therefore, as shown in FIG. 5, when the presence or absence of the lead 39 on the printed circuit board 4 is detected by the board solder surface recognition camera 36, the locus of the cutting tool 5 becomes a machining locus 41, which is more than the case shown in FIG. It can be shortened, the life of the cutting tool 5 is lengthened, and the machining tact time is also shortened. Further, as shown in FIG. 6, when cutting is performed by recognizing whether or not the lead 39 is present and whether or not the lead is clinched lead 40, the locus of the cutting tool 5 becomes a machining locus 42, which is made shorter than in the case of FIG. As a result, the life of the cutting tool 5 is further prolonged and the machining tact time is further shortened.
[0038]
As described above, according to the present embodiment, when cutting a lead soldering portion of a printed circuit board, a portion that requires cutting is detected by an image recognition device such as the substrate solder surface recognition camera 36, and the necessary portion is detected. By making it possible to cut only the workpiece, the life of the machining tool is increased and the machining tact time is also shortened.
[0039]
In each of the above embodiments, when removing the mounted components, for example, an ultrasonic vibrator may be used as a means for vibrating the printed circuit board. When removing the component, the component can be efficiently and reliably removed by vibrating the printed board with an ultrasonic vibrator to remove the mounted component.
[0040]
Further, as a means for vibrating the printed circuit board, for example, an eccentric cam rotated by a motor drive can be used. When removing, the printed circuit board is vibrated using a cam that rotates eccentrically by driving a motor to remove the mounted component, so that the component can be removed efficiently and reliably.
[0041]
【The invention's effect】
As described above, according to the first and sixth aspects of the present invention, a component that has been clinched after being inserted into a printed circuit board or an inserted component that has been fixed by eyelets is joined by soldering the component and the substrate. By cutting the part, it can be removed from the printed circuit board by heating and vibration.
[0042]
Further, according to the second and seventh aspects of the invention, since the surface on the component side does not become high when the printed circuit board is heated, it is possible to prevent rupture of the electrolytic capacitor mounted as a component.
[0043]
According to the invention of claim 3 and claim 8, when cutting the soldered portion, by detecting only the portion that needs to be cut and cutting, the cutting is completed in a short time, The life of the cutting tool used for the cutting can also be extended.
[0044]
According to the invention described in claim 4, when removing the mounted component, the printed board is vibrated by an ultrasonic vibrator to remove the mounted component, thereby efficiently removing the component. It can be done reliably.
[0045]
According to the fifth aspect of the present invention, when removing a mounted component, the component is efficiently removed by vibrating the printed board using a motor-driven cam to remove the mounted component. This can be done reliably and reliably.
[0046]
As described above, when removing the component mounted on the printed circuit board, after cutting the lead soldering portion of the printed circuit board, the printed circuit board can be heated and simultaneously vibrated to remove the mounted component from the printed circuit board. .
[0047]
Therefore, even if there are surface-mounted components, leaded components, clinch components, eyelet components, etc. as components mounted on the printed circuit board, the components are easily and safely removed from the printed circuit board by heating and vibration. be able to.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of a printed circuit board component removal device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a configuration of a printed circuit board component removal device according to a second embodiment of the present invention. 3 is a cross-sectional view showing the configuration of a printed circuit board component removal apparatus according to a third embodiment of the present invention. FIG. 4 is an explanatory diagram when the recognition camera according to the third embodiment is not used. FIG. 6 is an explanatory diagram when using the recognition camera in FIG. 3; FIG. 6 is an explanatory diagram of component lead shape recognition by the recognition camera in the third embodiment. FIG. 7 is a flowchart showing an operation in each embodiment of the present invention. [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Parts removal apparatus main body 2 Board | substrate solder surface cutting part 3 Board | substrate heating part 4 Printed circuit board 5 Cutting tool 6 Resistance with lead 7 Capacitor with lead 8 IC with lead
9 Soldered lead 10 Substrate holder 11 Slide table 12a, 12b Conveyor 13, 20 Dropped component receiver 14 Substrate holder 15 (with built-in vibrator) Printed substrate 16 (Lead lead solder on the solder surface is cut off) Printed substrate 16 IC that has fallen by
17 Substrate heating unit (with built-in heater and fan) 18 Hot air outlet 21 Component outlet

Claims (8)

A printed circuit board component removal apparatus for removing a component mounted by soldering on a printed circuit board from the printed circuit board, wherein the component leads soldered to the printed circuit board and the surrounding solder are removed. And a means for cutting the component lead soldering portion of the printed circuit board , and a means for heating the printed circuit board after the cutting and simultaneously vibrating the printed circuit board, by the heating and vibration. A component removing apparatus for a printed circuit board configured to remove a mounted component.   2. The component removing apparatus for a printed circuit board according to claim 1, further comprising means for heating only the solder surface of the printed circuit board when the printed circuit board is heated by the heating unit.   3. The printed circuit board according to claim 1, further comprising an image recognition device configured to detect only a portion that needs to be cut when the component lead soldering portion of the printed circuit board is cut by the cutting unit. Parts removal equipment.   The component removal apparatus for a printed circuit board according to any one of claims 1 to 3, wherein an ultrasonic vibrator is used as the vibration means for the printed circuit board.   4. The printed circuit board component removing apparatus according to claim 1, wherein a motor-driven cam is used as the vibration means for the printed circuit board. A printed circuit board component removal method for removing a mounted component on a printed circuit board from a printed circuit board, wherein the printed circuit board is positioned at a predetermined position, and then a component lead bonded to the printed circuit board and its peripheral bonding material In order to remove the substrate, vibration is applied to the printed circuit board after the cutting process, the process of heating the printed circuit board after the cutting process, and the heating process or simultaneously with the heating process. A component removing method for a printed circuit board, comprising: removing a mounted component from the printed circuit board.   7. The method of removing a printed circuit board component according to claim 6, wherein in the step of heating the printed circuit board from which the component lead joint portion has been cut, only the solder surface of the printed circuit board is heated.   8. The printed circuit board component removal method according to claim 6, wherein in the step of cutting the component lead joint portion, only the portion that requires cutting is detected by an image recognition device.

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