JP3639063B2

JP3639063B2 - High frequency switch

Info

Publication number: JP3639063B2
Application number: JP26967096A
Authority: JP
Inventors: 智徳重松; 憲治末松; 義忠伊山
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 1996-10-11
Filing date: 1996-10-11
Publication date: 2005-04-13
Anticipated expiration: 2016-10-11
Also published as: JPH10117103A

Description

【０００１】
【発明の属する技術分野】
この発明はＵＨＦ／ＳＨＦ／ＥＨＦ帯に適用しアイソレーションを向上する高周波スイッチに関する。
【０００２】
【従来の技術】
たとえば文献（Ｄ．Ｌ．Ｄｕｎｎｅｔａｌ．：ＭｕｌｔｉｏｃｔａｖｅＭｕｌｔｉｔｈｒｏｗＡｃｔｉｖｅＳｗｉｔｃｈｅｓ、ＩＥＥＥＭＴＴ−ＳＩｎｔｅｒｎａｔｉｏｎａｌＭｉｃｒｏｗａｖｅＳｙｍｐｏｓｉｕｍＤｉｇｅｓｔ、ｐｐ．５４９−５５１、１９８７）に示す従来の高周波スイッチは図８のように、バイアス電圧等切換手段による入力端子２からの入力信号に対し、地導体となる筺体１の上面に設ける第１の誘電体基板４上に形成するマイクロストリップ入力線路６を伝搬し、当該入力線路６および第１のマイクロストリップ出力線路７ａと７ｂと７ｃと７ｄ間を接続し１つの入力と４つの出力を有するＳＰ４Ｔ（ＳｉｎｇｌｅＰｏｌｅ４−Ｔｈｒｏｗ）スイッチ回路５ａ（当該駆動用バイアスを印加するバイアス回路は図示しない）を介して第１の出力線路７ａと７ｂと７ｃと７ｄのいずれか１つを伝搬し、当該第１の出力線路７ａと７ｂと７ｃと７ｄおよび出力端子３ａと３ｂと３ｃと３ｄ間に２段直列に設ける増幅器２４を介し出力端子３ａと３ｂと３ｃと３ｄのいずれか１つに出力する。
【０００３】
上記従来の高周波スイッチは、スイッチ回路による複数の出力線路を同じ誘電体基板上に形成する方式（同一誘電体基板出力線路形成による高周波スイッチ方式）を採る。
【０００４】
【発明が解決しようとする課題】
上記のような従来の高周波スイッチでは、同一誘電体基板出力線路形成による高周波スイッチ方式を採るから、スイッチ回路の出力数が多くなると当該周辺に複数の出力線路が密集し隣接出力線路間隔が狭くなり、出力線路間結合によるアイソレーション劣化を生じる問題点があった。
【０００５】
この発明が解決しようとする課題は、高周波スイッチで出力線路間結合によるアイソレーション劣化を防ぐように、スイッチ回路による複数の出力線路のうち一部を異なる誘電体基板層上に形成する方式（異なる誘電体基板層出力線路形成による高周波スイッチ方式）を提供することにある。
【０００６】
【課題を解決するための手段】
この発明の高周波スイッチは、上記課題を解決するためつぎの手段を設け、異なる誘電体基板層出力線路形成による高周波スイッチ方式を採ることを特徴とする。
【０００７】
この発明に係る高周波スイッチは、入力端子から信号を入力し伝搬するマイクロストリップ入力線路と信号を複数信号出力のいずれか１つに切り換えるスイッチ回路と複数信号出力のうちの一部を伝搬し一端に接続される出力端子に出力する第１のマイクロストリップ出力線路とを同じ面に形成し地導体となる筺体の上面に設ける第１の誘電体基板と、第１の誘電体基板との間に貫通して設ける第１のスルーホール経由でスイッチ回路から切り換えられた複数信号出力のうちの他の一部を伝搬し一端に接続される出力端子に出力する第２のマイクロストリップ出力線路を形成し筺体の下面に設けるものである。
また、入力端子から信号を入力し伝搬するマイクロストリップ入力線路と信号を複数信号出力のいずれか１つに切り換えるスイッチ回路からの複数信号出力のうちの一部を伝搬し一端に接続される出力端子に出力する第１のマイクロストリップ出力線路とを同じ面に形成し地導体となる筺体の上面に設ける第１の誘電体基板と、第１の誘電体基板の開口部で筐体の上面に設けるスイッチ回路としてのモノリシックマイクロ波集積回路スイッチと、開口部で筐体を貫通して設ける第１のスルーホール経由でモノリシックマイクロ波集積回路スイッチから切り換えられた複数信号出力のうちの他の一部を伝搬し一端に接続される出力端子に出力する第２のマイクロストリップ出力線路を形成し筺体の下面に設ける第２の誘電体基板とを備えるものである。
また、入力端子から信号を入力し伝搬するマイクロストリップ入力線路と信号を複数信号出力のいずれか１つに切り換えるスイッチ回路からの複数信号出力のうちの一部を伝搬し一端に接続される出力端子に出力する第１のマイクロストリップ出力線路と第２のスルーホール経由で地導体となる筺体の上面と導通する第１の地導体とを同じ面に形成し筺体の上面に設ける第１の誘電体基板と、第１の地導体の上面に設けるスイッチ回路としてのモノリシックマイクロ波集積回路スイッチと、第１の誘電体基板との間に貫通して設ける第１のスルーホール経由でモノリシックマイクロ波集積回路スイッチから切り換えられた複数信号出力のうちの他の一部を伝搬し一端に接続される出力端子に出力する第２のマイクロストリップ出力線路を形成し筺体の下面に設ける第２の誘電体基板とを備えるものである。
【０００８】
また、この発明に係る高周波スイッチは、中心に地導体層を有し、上面に入力端子から信号を入力し伝搬するマイクロストリップ入力線路と信号を複数信号出力のいずれか１つに切り換えるスイッチ回路と複数信号出力のうちの一部を伝搬し一端に接続される出力端子に出力する第１のマイクロストリップ出力線路とを同じ面に形成し、さらに下面に上面との間に貫通して設ける第１のスルーホール経由でスイッチ回路から切り換えられた複数信号出力のうちの他の一部を伝搬し一端に接続される出力端子に出力する第２のマイクロストリップ出力線路を形成した３層誘電体基板を備えたものである。
【０００９】
また、この発明に係る高周波スイッチは、上面に入力端子から信号を入力し伝搬するコプレナ入力線路と信号を複数信号出力のいずれか１つに切り換えるスイッチ回路と複数信号出力のうちの一部を伝搬し一端に接続される出力端子に出力する第１のコプレナ出力線路と第２の地導体を同じ面に形成し、さらに下面に上面との間に貫通して設ける第１のスルーホール経由でスイッチ回路から切り換えられた複数信号出力のうちの他の一部を伝搬し一端に接続される出力端子に出力する第２のコプレナ出力線路と第３の地導体を形成した誘電体基板を備えたものである。
また、このスイッチ回路としてモノリシックマイクロ波集積回路スイッチを用い、第２の地導体の上に設けたものである。
【００１０】
また、この発明に係る高周波スイッチは、入力端子から信号を入力し伝搬するマイクロストリップ入力線路と信号を複数信号出力のいずれか１つに切り換えるスイッチ回路と複数信号出力のうちの一部を伝搬し一端に接続される出力端子に出力する第１のマイクロストリップ出力線路とを同じ面に形成した第１の誘電体基板と、第４の地導体と、第２の誘電体基板と、第１の誘電体基板との間に貫通して設ける第３のスルーホール経由でスイッチ回路から切り換えられた複数信号出力のうちの他の一部を伝搬し一端に接続される出力端子に出力するトリプレート出力線路を形成した第３の誘電体基板と、第５の地導体と、第１の誘電体基板との間に貫通して設ける第４のスルーホール経由でスイッチ回路から切り換えられた複数信号出力のうちのさらに他の一部を伝搬し一端に接続される出力端子に出力する第３のマイクロストリップ出力線路を形成した第４の誘電体基板とを順に積層する多層誘電体基板を用い、スイッチ回路の複数信号出力のうちの一部を第１のマイクロストリップ出力線路、他の一部をトリプレート出力線路、さらに他の一部を第３のマイクロストリップ出力線路に伝搬し各出力線路の一端に接続される出力端子に出力するものである。
【００１１】
【発明の実施の形態】
この発明の実施の一形態を示す高周波スイッチは図１（ａ）と（ｂ）と（ｃ）のように、バイアス電圧等切換手段による入力端子２からの入力信号に対し、地導体となる筺体１の上面に設ける第１の誘電体基板４上に形成するマイクロストリップ入力線路６を伝搬し、当該入力線路６および第１のマイクロストリップ出力線路７ａと７ｂと７ｃ間をディスクリート・スイッチング半導体素子（電解効果トランジスタ（ＦＥＴ）、ＰＩＮダイオードなど）で接続し１つの入力と５つの出力を有するＳＰ５Ｔ（ＳｉｎｇｌｅＰｏｌｅ５−Ｔｈｒｏｗ）スイッチ回路５（当該駆動用バイアスを印加するバイアス回路は図示しない）を介して当該５つの出力のうちの一部に対しては第１の誘電体基板４上に形成する第１のマイクロストリップ出力線路７ａと７ｂと７ｃおよび他の一部に対しては第１の誘電体基板４との間に貫通して設ける第１のスルーホール８ａと８ｂ経由で筺体１の下面に設ける第２の誘電体基板９上に形成する第２のマイクロストリップ出力線路１０ａと１０ｂのいずれか１つを伝搬し、出力端子３ａと３ｂと３ｃおよび３ｄと３ｅのいずれか１つに出力する。すべての出力線路を同じ誘電体基板上に形成しないで第１の出力線路７ａと７ｂと７ｃおよび第２の出力線路１０ａと１０ｂを異なる誘電体基板上に形成し、隣接する出力線路間結合を抑え当該アイソレーション劣化を防止できる。
【００１２】
上記実施の形態の高周波スイッチは、スイッチ回路による複数の出力線路のうち一部を異なる誘電体基板層上に形成する方式（異なる誘電体基板層出力線路形成による高周波スイッチ方式）を採る。
【００１３】
なお上記図１（ａ）と（ｂ）と（ｃ）に示す発明の実施の形態でスイッチ回路５はスイッチング素子としてディスクリート半導体素子を第１の誘電体基板４上に装着し、第１と第２の誘電体基板４と９間を貫通して第１のスルーホール８ａと８ｂを設けるとして説明したが、図２（ａ）と（ｂ）と（ｃ）のように当該ディスクリート半導体素子に代えてモノリシックマイクロ波集積回路（ＭＭＩＣ）を用いるスイッチ１１を第１の誘電体基板４に設ける開口部内で筺体１上に直接装着し、第２の誘電体基板９にも開口部を設け、筺体１だけを貫通して第１のスルーホール８ａと８ｂを設けてもよい。高い信頼性と容易な組立性で上記に同じ効果を得る。
【００１４】
また上記図２（ａ）と（ｃ）に示す発明の実施の形態で第１と第２の誘電体基板４と９は開口部を設け、第１のスルーホール８ａと８ｂは筺体１だけを貫通して設けるとして説明したが、図３（ａ）と（ｂ）のように第１と第２の誘電体基板４と９間を貫通して第１のスルーホール８ａと８ｂを設け、第１の誘電体基板４に設ける開口部に代えて別途設ける第２のスルーホール１２ａと１２ｂで筺体１と導通するように第１の誘電体基板４上に別途設ける第１の地導体１３上にＭＭＩＣスイッチ１１を装着してもよい。第１と第２の誘電体基板４と９に開口部を設けないで組立がより容易になる。
【００１５】
また上記図１（ｃ）に示す発明の実施の形態で図４のように、地導体となる筺体１の上面と下面に設ける第１と第２の誘電体基板４と９に代えて、中心に地導体層を有し、当該上面に当該入力線路６および当該第１の出力線路７ａと７ｂと７ｃさらに当該下面に当該第２の出力線路１０ａと１０ｂをそれぞれ形成し設ける３層誘電体基板１４を用いてもよい。筺体に誘電体基板を個別に取り付ける場合に比べ、確実に地導体を形成できかつ部品点数低減で組立が容易になる。
【００１６】
また上記図１（ａ）と（ｂ）と（ｃ）に示す発明の実施の形態で図５（ａ）と（ｂ）と（ｃ）のように、地導体となる筺体１の上面と下面に設ける第１と第２の誘電体基板４と９に代えて、上面にコプレナ線路で構成する入力線路６と第１の出力線路７ａと７ｂと７ｃとスイッチ回路５および第２の地導体１５さらに下面にコプレナ線路で構成する第２の出力線路１０ａと１０ｂおよび第３の地導体１６をそれぞれ形成し設ける第１の誘電体基板４を用いてもよい。マイクロストリップ線路で構成する入出力線路に比べ、簡易構造による部品点数低減で組立が容易になる。
【００１７】
また上記図５（ａ）と（ｃ）に示す発明の実施の形態で図６（ａ）と（ｂ）のように、スイッチ回路５に代えてＭＭＩＣスイッチ１１を装着してもよい。部品点数低減で組立が容易になりかつ高い信頼性を得る。
【００１８】
また上記図１（ａ）に示す発明の実施の形態で図７（ａ）のように、地導体となる筺体１の上面および下面にマイクロストリップ線路で構成する入力線路６と第１の出力線路７ａと７ｂと７ｃとスイッチ回路５および第２の出力線路１０ａと１０ｂをそれぞれ形成し設ける第１および第２の誘電体基板４と９に代えて、マイクロストリップ線路で構成する入力線路６と第１の出力線路７とスイッチ回路５とを形成し設ける第１の誘電体基板４と、別途設ける第４の地導体１９と、マイクロストリップ線路で構成する第２の出力線路１０ａと１０ｂを形成しないで設ける第２の誘電体基板９と、トリプレート線路で構成する第２の出力線路１０ａと１０ｂを形成し別途設ける第３の誘電体基板２０と、別途設ける第５の地導体２１と、マイクロストリップ線路で構成する第３の出力線路２３ａと２３ｂを形成し別途設ける第４の誘電体基板２２とを上から順に積層する誘電体基板を用い、また第１と第２の誘電体基板４と９間を貫通して設ける第１のスルーホール８ａと８ｂに代えて、第１と第２の誘電体基板４と９間を貫通して設ける第３のスルーホール１７ａと１７ｂおよび第１と第４の誘電体基板４と２２間を貫通して設ける第４のスルーホール１８ａと１８ｂを用い、スイッチ回路５の複数信号出力のうちの一部を第１の出力線路７、他の一部を第２の出力線路１０ａと１０ｂ、さらに他の一部を第３の出力線路２３ａと２３ｂに伝搬し当該出力端子に出力してもよい。同じ誘電体基板層上に形成する出力線路数が少ない構造の積層誘電体基板を用いより高いアイソレーションを得る。
【００１９】
また上記図１〜図７に示す発明の実施の形態でスイッチ回路５とＭＭＩＣスイッチ１１はＳＰ５Ｔスイッチとして説明したが、ｍ個の出力を有するＳＰｍＴスイッチに適用してもよいのはいうまでもない。また１つの入力端子と複数の出力端子を有するとして説明したが、複数の入力端子と１つの出力端子を有してもよい。
【００２０】
【発明の効果】
上記のようなこの発明の高周波スイッチでは、スイッチ回路による複数の出力線路のうち一部を異なる誘電体基板層上に形成する方式を採るから、従来のようにスイッチ回路による複数の出力線路を同じ誘電体基板上に形成する方式に比べ隣接する出力線路間結合を抑え、当該アイソレーション劣化を防止できるほか各発明ごとにつぎの効果がある。
（１）高い信頼性と容易な組立性を得る。
（２）誘電体基板に開口部を設けないで組立がより容易になる。
（３）筺体に誘電体基板を個別に取り付ける場合に比べ、確実に地導体を形成できかつ部品点数低減で組立が容易になる。
（４）マイクロストリップ線路で構成する入出力線路に比べ、簡易構造による部品点数低減で組立が容易になる。
（５）部品点数低減で組立が容易になりかつ高い信頼性を得る。
（６）同じ誘電体基板層上に形成する出力線路数が少ない構造の積層誘電体基板を用い、より高いアイソレーションを得る。
【図面の簡単な説明】
【図１】この発明の実施の一形態を示す高周波スイッチの構成斜視／断面図。
【図２】この発明の実施の他の一形態を示す構成斜視／断面図。
【図３】この発明の実施の他の一形態を示す構成斜視／断面図。
【図４】この発明の実施の他の一形態を示す構成断面図。
【図５】この発明の実施の他の一形態を示す構成斜視／断面図。
【図６】この発明の実施の他の一形態を示す構成斜視／断面図。
【図７】この発明の実施の他の一形態を示す構成斜視図と当該積層誘電体基板の分解斜視図。
【図８】従来の技術を示す高周波スイッチの構成平面図。
【符号の説明】
１筺体、２入力端子、３ａ、３ｂ、３ｃ、３ｄ、３ｅ出力端子、４第１の誘電体基板、５スイッチ回路、６入力線路、７ａ、７ｂ、７ｃ第１の出力線路、８ａ、８ｂ第１のスルーホール、９第２の誘電体基板、１０ａ、１０ｂ第２の出力線路、１１ＭＭＩＣスイッチ、１２ａ、１２ｂ第２のスルーホール、１３第１の地導体、１４３層誘電体基板、１５第２の地導体、１６第３の地導体、１７ａ、１７ｂ第３のスルーホール、１８ａ、１８ｂ第４のスルーホール、１９第４の地導体、２０第３の誘電体基板、２１第５の地導体、２２第４の誘電体基板、２３ａ、２３ｂ第３の出力線路。
なお図中、同一符号は同一または相当部分を示す。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a high-frequency switch that is applied to the UHF / SHF / EHF band and improves isolation.
[0002]
[Prior art]
For example, as shown in the literature (DL Dunn et al .: Multiactive Multithrow Active Switches, IEEE MTT-Sational International Symposium Digest, pp.549-551, 1987) as shown in FIG. Is propagated through the microstrip input line 6 formed on the first dielectric substrate 4 provided on the upper surface of the casing 1 serving as the ground conductor, and the input line 6 and the first micro SP4T (Single Pole 4-Through) switch circuit 5a (a bias circuit for applying the driving bias) having striped output lines 7a, 7b, 7c and 7d connected to each other and having one input and four outputs Is propagated through any one of the first output lines 7a, 7b, 7c and 7d via the first output lines 7a, 7b, 7c and 7d, and the output terminals 3a, 3b and 3c. The signal is output to any one of the output terminals 3a, 3b, 3c, and 3d via an amplifier 24 provided in two stages in series between 3d.
[0003]
The conventional high-frequency switch adopts a method of forming a plurality of output lines by a switch circuit on the same dielectric substrate (a high-frequency switch method by forming the same dielectric substrate output line).
[0004]
[Problems to be solved by the invention]
Since the conventional high frequency switch as described above adopts a high frequency switch method by forming the same dielectric substrate output line, when the number of outputs of the switch circuit increases, a plurality of output lines are concentrated in the periphery, and the interval between adjacent output lines is reduced. There is a problem in that isolation degradation occurs due to coupling between output lines.
[0005]
The problem to be solved by the present invention is that a part of a plurality of output lines by a switch circuit is formed on different dielectric substrate layers so as to prevent isolation degradation due to coupling between output lines in a high-frequency switch (different The object is to provide a high-frequency switch system by forming a dielectric substrate layer output line.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the high-frequency switch of the present invention is provided with the following means and adopts a high-frequency switch system by forming different dielectric substrate layer output lines.
[0007]
RF switch propagates the part of the switch circuits and a plurality signal outputs for switching the microstrip input line and signal to one of a plurality signal output for inputting a signal from the input terminal propagate one end according to the present invention a first dielectric substrate to provide a first microstrip output line for output to the output terminal on the upper surface of the housing to be formed ground conductor on the same surface to be connected to, between the first dielectric substrate forming a second microstrip output line for output to the output terminal connected to another part to the propagation end of the first plurality signal is switched from the through hole through Death switch circuit provided through output It is provided on the lower surface of the shishi body.
Also, a microstrip input line that inputs and propagates a signal from the input terminal and an output terminal that propagates a part of a plurality of signal outputs from a switch circuit that switches the signal to any one of the plurality of signal outputs and is connected to one end A first dielectric strip that is formed on the same surface and provided on the upper surface of the casing serving as a ground conductor, and provided on the upper surface of the housing at the opening of the first dielectric substrate. A monolithic microwave integrated circuit switch as a switch circuit, and another part of the plurality of signal outputs switched from the monolithic microwave integrated circuit switch via the first through hole provided through the housing at the opening. which second microstrip output line for outputting propagates to the output terminal connected to one end to form and a second dielectric substrate provided on the underside of the housing A.
Also, a microstrip input line that inputs and propagates a signal from the input terminal and an output terminal that propagates a part of a plurality of signal outputs from a switch circuit that switches the signal to any one of the plurality of signal outputs and is connected to one end The first microstrip output line that outputs to the first conductor and the first ground conductor that is electrically connected to the upper surface of the housing serving as the ground conductor via the second through hole are formed on the same surface and provided on the upper surface of the housing Monolithic microwave integrated circuit via a first through hole provided between the substrate, a monolithic microwave integrated circuit switch as a switch circuit provided on the upper surface of the first ground conductor, and the first dielectric substrate Forms a second microstrip output line that propagates another part of the plurality of signal outputs switched from the switch and outputs it to an output terminal connected to one end In which and a second dielectric substrate disposed on the lower surface of the housing.
[0008]
The high frequency switch according to the present invention, the center has a ground conductor layer, the switch switched to one of a plurality signal output microstrip input line and signal to enter a signal from the input terminal to the upper surface propagation circuit And a first microstrip output line that propagates a part of the plurality of signal outputs and outputs to the output terminal connected to one end is formed on the same surface, and further provided on the lower surface so as to penetrate between the upper surface and the lower surface. 3-layer dielectric forming a second microstrip output line for outputting the other portion of the plurality signal output is switched from the first through-hole via Death switch circuit to an output terminal connected to the propagated end A body substrate is provided.
[0009]
The high frequency switch according to the present invention, a part of the switch circuits and a plurality signal outputs for switching the coplanar input line and signal to enter a signal from the input terminal to the upper surface propagating in one of a plurality signal outputs a first coplanar output line and the second ground conductor to be output propagates to the output terminal connected to one end formed in the same plane, further via the first through-hole provided through between the upper surface to the lower surface a second coplanar output line and the dielectric substrate forming the third ground conductor for outputting switch circuit another portion of the plurality signal output is switched from the output terminal connected to the propagated end It is provided.
Further, using a monolithic microwave integrated circuit switch as the switch circuit, in which provided on the second ground conductor.
[0010]
The high frequency switch according to the invention, propagation part of the switch circuits and a plurality signal outputs for switching the microstrip input line and signal to one of a plurality signal output for inputting a signal from the input terminal propagation A first dielectric substrate having a first microstrip output line output to an output terminal connected to one end formed on the same surface, a fourth ground conductor, a second dielectric substrate, to the output terminal connected to another part to the propagation end of a plurality signal output is switched from the third through-hole via death switch circuit which is provided through between the first dielectric substrate a third dielectric substrate provided with the tri-plate output line, and the ground conductor of the fifth, is switched from the fourth through hole through Death switch circuit which is provided through between the first dielectric substrate Multiple signal output Further propagates another part of a multilayer dielectric substrate laminating a fourth dielectric substrate formed with the third microstrip output line for output to the output terminal connected to one end of the order, the switching circuit Propagating part of the multiple signal outputs to the first microstrip output line, the other part to the triplate output line, and the other part to the third microstrip output line and connecting to one end of each output line Output to the output terminal.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIGS. 1A, 1B, and 1C, a high-frequency switch showing an embodiment of the present invention is a housing that serves as a ground conductor for an input signal from an input terminal 2 by a switching means such as a bias voltage. 1 is propagated through a microstrip input line 6 formed on a first dielectric substrate 4 provided on the upper surface of the first discrete circuit, and a discrete switching semiconductor element (between the input line 6 and the first microstrip output lines 7a, 7b and 7c) Through an SP5T (Single Pole 5-Throw) switch circuit 5 (a bias circuit for applying the driving bias is not shown) having one input and five outputs connected by a field effect transistor (FET), a PIN diode, etc. Thus, a first microstrip output line formed on the first dielectric substrate 4 for a part of the five outputs 7a, 7b, 7c and other parts of the second dielectric provided on the lower surface of the housing 1 through first through holes 8a and 8b provided between the first dielectric substrate 4 and the first dielectric substrate 4. It propagates through any one of the second microstrip output lines 10a and 10b formed on the substrate 9, and outputs it to any one of the output terminals 3a and 3b and 3c and 3d and 3e. The first output lines 7a, 7b and 7c and the second output lines 10a and 10b are formed on different dielectric substrates without forming all output lines on the same dielectric substrate, and coupling between adjacent output lines is established. It is possible to suppress the isolation deterioration.
[0012]
The high-frequency switch according to the embodiment employs a system in which a part of a plurality of output lines by the switch circuit is formed on different dielectric substrate layers (a high-frequency switch system by forming different dielectric substrate layer output lines).
[0013]
In the embodiment of the invention shown in FIGS. 1 (a), 1 (b) and 1 (c), the switch circuit 5 has discrete semiconductor elements mounted on the first dielectric substrate 4 as switching elements. The first through holes 8a and 8b are provided to penetrate between the two dielectric substrates 4 and 9, but instead of the discrete semiconductor element as shown in FIGS. 2 (a), (b) and (c). A switch 11 using a monolithic microwave integrated circuit (MMIC) is directly mounted on the housing 1 in the opening provided in the first dielectric substrate 4, and the opening is also provided in the second dielectric substrate 9. Only the first through holes 8a and 8b may be provided. The same effect is obtained with high reliability and easy assembly.
[0014]
In the embodiment of the invention shown in FIGS. 2A and 2C, the first and second dielectric substrates 4 and 9 are provided with openings, and the first through-holes 8a and 8b are provided with only the housing 1. Although described as being provided through, the first through holes 8a and 8b are provided through the first and second dielectric substrates 4 and 9 as shown in FIGS. On the first ground conductor 13 separately provided on the first dielectric substrate 4 so as to be electrically connected to the housing 1 through the second through holes 12a and 12b separately provided instead of the openings provided in the one dielectric substrate 4. The MMIC switch 11 may be attached. Assembly is facilitated without providing openings in the first and second dielectric substrates 4 and 9.
[0015]
Further, as shown in FIG. 4 in the embodiment of the invention shown in FIG. 1 (c), instead of the first and second dielectric substrates 4 and 9 provided on the upper surface and the lower surface of the casing 1 serving as the ground conductor, A three-layer dielectric substrate having a ground conductor layer on the upper surface, and forming the input line 6 and the first output lines 7a, 7b and 7c on the upper surface, and forming the second output lines 10a and 10b on the lower surface, respectively. 14 may be used. Compared to the case where the dielectric substrate is individually attached to the housing, the ground conductor can be reliably formed and the number of parts can be reduced to facilitate assembly.
[0016]
Further, in the embodiment of the invention shown in FIGS. 1 (a), (b) and (c), as shown in FIGS. 5 (a), 5 (b) and 5 (c), the upper surface and the lower surface of the casing 1 serving as a ground conductor. In place of the first and second dielectric substrates 4 and 9 provided in the input circuit 6, the input line 6, the first output lines 7 a, 7 b and 7 c, the switch circuit 5, and the second ground conductor 15 are formed on the upper surface by coplanar lines. Further, the first dielectric substrate 4 provided with the second output lines 10a and 10b and the third ground conductor 16 formed of coplanar lines on the lower surface may be used. Compared to an input / output line composed of a microstrip line, assembly is facilitated by reducing the number of parts with a simple structure.
[0017]
In the embodiment of the invention shown in FIGS. 5A and 5C, the MMIC switch 11 may be mounted instead of the switch circuit 5 as shown in FIGS. 6A and 6B. Assembly is facilitated by reducing the number of parts, and high reliability is obtained.
[0018]
In the embodiment of the invention shown in FIG. 1 (a), as shown in FIG. 7 (a), the input line 6 and the first output line constituted by microstrip lines on the upper and lower surfaces of the casing 1 serving as a ground conductor. 7a, 7b and 7c, switch circuit 5 and second output lines 10a and 10b are formed and provided in place of first and second dielectric substrates 4 and 9, respectively, and input line 6 and microstrip line are provided. The first dielectric substrate 4 provided by forming one output line 7 and the switch circuit 5, the fourth ground conductor 19 provided separately, and the second output lines 10a and 10b constituted by microstrip lines are not formed. A second dielectric substrate 9 provided in the above, a third dielectric substrate 20 formed separately by forming second output lines 10a and 10b composed of triplate lines, a fifth ground conductor 21 provided separately, and a micro A dielectric substrate is used in which third output lines 23a and 23b formed of trip lines are formed and a fourth dielectric substrate 22 provided separately is laminated in order from the top, and the first and second dielectric substrates 4 Instead of the first through holes 8a and 8b provided between the first and second dielectric substrates 4, the third through holes 17a and 17b and the first and second through holes provided between the first and second dielectric substrates 4 and 9 are provided. The fourth through holes 18a and 18b provided between the four dielectric substrates 4 and 22 are used, and a part of the plurality of signal outputs of the switch circuit 5 is used as the first output line 7 and the other part is used. The second output lines 10a and 10b and some other part may be propagated to the third output lines 23a and 23b and output to the output terminals. Higher isolation is obtained by using a laminated dielectric substrate having a structure with a small number of output lines formed on the same dielectric substrate layer.
[0019]
Although the switch circuit 5 and the MMIC switch 11 are described as SP5T switches in the embodiments of the invention shown in FIGS. 1 to 7, it goes without saying that the present invention may be applied to an SPmT switch having m outputs. . Moreover, although it demonstrated as having one input terminal and several output terminal, you may have several input terminal and one output terminal.
[0020]
【The invention's effect】
In the high frequency switch of the present invention as described above, a part of the plurality of output lines by the switch circuit is formed on different dielectric substrate layers, so that the plurality of output lines by the switch circuit are the same as in the prior art. Compared with the method of forming on a dielectric substrate, the coupling between adjacent output lines can be suppressed, and the isolation deterioration can be prevented.
(1) High reliability and easy assembly are obtained.
(2) Assembly is facilitated without providing an opening in the dielectric substrate.
(3) Compared to the case where the dielectric substrates are individually attached to the housing, the ground conductor can be reliably formed, and the assembly is facilitated by reducing the number of parts.
(4) Compared to an input / output line composed of a microstrip line, assembly is facilitated by reducing the number of parts with a simple structure.
(5) Assembly is facilitated by reducing the number of parts and high reliability is obtained.
(6) Using a laminated dielectric substrate having a structure with a small number of output lines formed on the same dielectric substrate layer, higher isolation is obtained.
[Brief description of the drawings]
FIG. 1 is a perspective / sectional view of a configuration of a high-frequency switch showing an embodiment of the present invention.
FIG. 2 is a structural perspective view / sectional view showing another embodiment of the present invention.
FIG. 3 is a structural perspective / sectional view showing another embodiment of the present invention.
FIG. 4 is a structural cross-sectional view showing another embodiment of the present invention.
FIG. 5 is a structural perspective view / sectional view showing another embodiment of the present invention.
FIG. 6 is a structural perspective view / sectional view showing another embodiment of the present invention.
FIG. 7 is a structural perspective view showing another embodiment of the present invention and an exploded perspective view of the multilayer dielectric substrate.
FIG. 8 is a configuration plan view of a high-frequency switch showing a conventional technique.
[Explanation of symbols]
1 housing 2 input terminal 3a 3b 3c 3d 3e output terminal 4 first dielectric substrate 5 switch circuit 6 input line 7a 7b 7c first output line 8a 8b first 1 through-hole, 9 second dielectric substrate, 10a, 10b second output line, 11 MMIC switch, 12a, 12b second through-hole, 13 first ground conductor, 14 three-layer dielectric substrate, 15 2nd ground conductor, 16 3rd ground conductor, 17a, 17b 3rd through hole, 18a, 18b 4th through hole, 19 4th ground conductor, 20 3rd dielectric substrate, 21 5th Ground conductor, 22 4th dielectric substrate, 23a, 23b 3rd output line.
In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims

Output terminal connected to the signal microstrip input line for inputting a signal from the input terminal propagate in propagation to an end part of said switch circuit for switching to one of a plurality signal outputs a plurality signal outputs a first dielectric substrate provided on the upper surface of the first microstrip output line and the formation and ground conductor on the same surface casing to be output to, first provided through between the first dielectric substrate Forming a second microstrip output line that propagates another part of the plurality of signal outputs switched from the switch circuit via one through hole and outputs the signal to an output terminal connected to one end of the housing ; A high frequency switch comprising a second dielectric substrate provided on a lower surface.

A microstrip input line that inputs and propagates a signal from an input terminal and an output terminal that propagates a part of the plurality of signal outputs from a switch circuit that switches the signal to one of a plurality of signal outputs and is connected to one end A first dielectric substrate that is formed on the same surface as the first microstrip output line that outputs to the ground, and is provided on the upper surface of the casing serving as a ground conductor, and the upper surface of the housing at the opening of the first dielectric substrate A monolithic microwave integrated circuit switch as the switch circuit provided in the circuit, and a plurality of signal outputs switched from the monolithic microwave integrated circuit switch through a first through hole provided through the housing at the opening. A second microstrip output line that propagates the other part of the signal and outputs to the output terminal connected to one end is formed and provided on the lower surface of the casing. A second dielectric high frequency switch and a substrate that.

A microstrip input line that inputs and propagates a signal from an input terminal and an output terminal that propagates a part of the plurality of signal outputs from a switch circuit that switches the signal to one of a plurality of signal outputs and is connected to one end The first microstrip output line that outputs to the first conductor and the first ground conductor that is electrically connected to the upper surface of the housing serving as the ground conductor via the second through hole are formed on the same surface, and the first dielectric is provided on the upper surface of the housing. Via the first through hole provided between the body substrate, the monolithic microwave integrated circuit switch as the switch circuit provided on the upper surface of the first ground conductor, and the first dielectric substrate. A second microphone that propagates another part of the plurality of signal outputs switched from the monolithic microwave integrated circuit switch and outputs the signal to an output terminal connected to one end. A second dielectric high frequency switch and a substrate to form a strip output lines provided on the lower surface of the housing.

Center has a ground conductor layer, of the signal microstrip input line for inputting a signal from the input terminal to the upper surface propagates switching circuit for switching to one of a plurality signal outputs of the plurality signal output first through hole and a first microstrip output line for output to the output terminal of propagating part is connected to one end formed on the same surface, provided through between the upper surface underneath surface further A three-layer dielectric substrate formed with a second microstrip output line that propagates through another part of the plurality of signal outputs switched from the switch circuit via the first output and outputs to the output terminal connected to one end; A high frequency switch characterized by comprising.

It is connected to the signal and coplanar input line for inputting a signal from the input terminal to the upper surface propagating in a propagation and an end part of said switch circuit for switching to one of a plurality signal output multiple signal output Output The first coplanar output line to be output to the terminal and the second ground conductor are formed on the same surface, and further switched from the switch circuit via a first through hole provided on the lower surface and penetrating between the upper surface. A dielectric substrate on which a second coplanar output line that propagates another part of the plurality of signal outputs and outputs to the output terminal connected to one end and a third ground conductor is formed; High frequency switch to do.

6. The high frequency switch according to claim 5, wherein the switch circuit is a monolithic microwave integrated circuit switch , and is provided on the second ground conductor .

Output terminal connected to the signal microstrip input line for inputting a signal from the input terminal propagate in propagation to an end part of said switch circuit for switching to one of a plurality signal outputs a plurality signal outputs And a first dielectric substrate formed on the same surface, a fourth ground conductor, a second dielectric substrate, and the first dielectric substrate. A triplate output line is formed which propagates another part of the plurality of signal outputs switched from the switch circuit via a third through hole provided between them and outputs the signal to an output terminal connected to one end. The plurality of signal outputs switched from the switch circuit through a fourth through hole provided between the third dielectric substrate, the fifth ground conductor, and the first dielectric substrate. My house A multilayer dielectric substrate laminating a fourth dielectric substrate formed with the third microstrip output line for output to the output terminal connected to one end propagates a portion of the other in order to, in the switching circuit A part of the plurality of signal outputs is propagated to the first microstrip output line, another part is propagated to the triplate output line, and another part is propagated to the third microstrip output line. A high-frequency switch that outputs to an output terminal connected to one end.