JP3608605B2 - Positioning jig - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a positioning jig, and more particularly to a positioning jig for positioning a second member with respect to a first member.
[0002]
[Prior art]
For example, when assembling and manufacturing an IC chip or the like, generally, after performing a dicing process for separating a wafer on which a predetermined circuit is formed into each element, a die bonding process for bonding each element to a die such as a substrate or a frame Then, a wire bonding step for connecting the element and the electrode lead of the lead frame is performed.
[0003]
In the die bonding process, an element to be an adhesive member is positioned and arranged at a predetermined position via a solder foil, a gold tape, a metal foil, or a solder paste such as a silver paste resin with respect to a die to be an adhesive member. Mount by reflow soldering in a reducing furnace, eutectic bonding or resin bonding.
[0004]
Thus, as a conventional positioning jig for positioning the element as the second member with respect to the die as the first member, as shown in FIG. 12, the first jig for positioning and supporting the die S is used. A tool 6 and a second jig 7 provided with an insertion portion 70 for positioning and positioning the element C on the surface of the die S, which is positioned opposite to the first jig 6. It was used. In this positioning jig, a plurality of recesses 60 for positioning and supporting a plurality of dies S are formed on the first jig 6, and each recess 60 is slightly smaller than the size of the die S for positioning and supporting. The surface of the die S is formed shallower than the thickness of the die S so that the surface of the die S protrudes from the surface of the first jig 60. A pin 63 is erected on the surface of the first jig 6 facing the second jig 7, and a fitting hole 73 is formed in the second jig 7 so as to correspond to the pin 63. . On the other hand, the shape of the insertion portion 70 of the second jig 7 is formed according to the size, shape, etc. of each element C bonded to the die S. In general, since the size of the mounted element C is smaller than that of the die S, the size of the opening of the insertion portion 70 of the second jig 7 with respect to the die S is also smaller than that of the die S. 7 is in contact with the surface of the die S protruding from the surface of the first jig 60.
[0005]
When positioning the element C with respect to each die S, the positioning is supported by fitting the die S into the recess 60 of the first jig 6, and the fitting of the second jig 7 to the pin 63 of the first jig 6. The joint hole 73 is fitted. As a result, the insertion portion 70 formed in the second jig 7 opens at a predetermined position with respect to the die S positioned and supported by the first jig 6. Therefore, the element C is inserted from the insertion portion 70. By doing so, the element C is positioned at a predetermined position of the die S. At this time, since the periphery of the opening of the insertion portion 70 of the second jig 7 is in contact with the surface of the die S, the position of the second jig 7 in the height direction is the first jig on the surface of the die S. The height varies depending on the height of the tool 6 protruding from the surface. Thereafter, when the element C is inserted together with the solder foil F from the insertion portion 70 of the second jig, the element C is positioned at a predetermined position of the die S via the solder foil F.
[0006]
Japanese Patent Application Laid-Open No. 4-339666 discloses a first jig that moves integrally with a first joined body in a brazing joining method for brazing the first joined body and the second joined body in a furnace. A second jig that moves integrally with the second assembly and moves relative to the first jig in contact with the first jig, the first jig or A first step in which at least one of the second jigs is slid to align the first joined body and the second joined body, and the first jig and the second jig are bonded after the positioning. A second step of bonding using an agent, and the bonded first and second jigs in a furnace for brazing and joining the first and second assemblies. A brazing joining method including three steps is known. In the first step of this method, it is described that alignment is performed by optical image processing using a CCD camera or the like.
[0007]
[Problems to be solved by the invention]
However, the die to be die-bonded has an error in its thickness. When the element C is positioned at a time with respect to the plurality of dies S by the conventional positioning jig shown in FIG. 12, the plurality of dies S positioned and supported by the first jig 6 are used. Of these, it is determined by the surface of the thickest die S, that is, the surface of the die S that protrudes most from the surface of the first jig 6 (see the die S on the left side of FIG. 12). Therefore, for a die S other than the thickest die S (see the right-side die S in FIG. 12), a clearance T is generated between the surface and the opening of the insertion portion 70 of the second jig 7. As a result, there is a problem in that the element C enters the gap T and a misalignment occurs. In addition, the thickest die S has a problem that the second jig 7 is directly brought into contact with the surface thereof, so that there is a possibility of being damaged. Further, when performing reflow soldering in a reducing furnace, carbon is often used as a material for a positioning jig. Since the jig using carbon is fragile, especially when the second jig 7 is damaged by friction or impact when the element C is inserted from the insertion portion 70 of the second jig 7, the second jig is used. There was also a problem that the entire tool 7 had to be replaced.
[0008]
Further, in the brazing joining method disclosed in Japanese Patent Laid-Open No. 4-339666, in the first step, optical image processing is performed in order to perform alignment between the first joined body and the second joined body. There is a problem in that at least one of the first jig and the second jig is used to slide, and not only the equipment becomes large, but also the processing control becomes complicated.
[0009]
The present invention has been made in view of the above problems, and can easily and surely position the second member with a simple configuration, particularly when positioning the second member with respect to the plurality of first members at a time. An object of the present invention is to provide a positioning jig that can be used.
[0010]
[Means for Solving the Problems]
The invention according to claim 1 is a positioning jig for positioning the second member with respect to the first member in order to solve the above problem, and is a first jig for positioning and supporting the first member. A jig, a second jig provided with an insertion portion, opposite to the first jig and positioned at a predetermined distance from the surface of the first member, and the insertion of the second jig A third jig formed with an insertion portion for guiding and positioning the second member on the surface of the first member, which is inserted into the portion so as to be able to move relative to the surface of the first member; It is characterized by comprising.
[0011]
In the first aspect of the invention, the first member is positioned and supported by the first jig, the second jig is positioned and arranged opposite to the first jig, and then the third jig is inserted into the second jig. The second jig is positioned and arranged opposite to the first jig with the third jig inserted through the insertion section of the second jig. The third jig inserted through the insertion part of the second jig comes into contact with the surface of the first member according to the thickness or the like of the first member positioned and supported by the first jig. Move relative. In this state, the second member is guided and positioned on the surface of the first member from the insertion portion of the third jig.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
One embodiment of the positioning jig of the present invention will be described in detail with reference to FIGS. In the drawings, the same reference numerals denote the same or corresponding parts. In this embodiment, for example, the first member is a substrate to be an adhesive member used in an IGBT (insulated gate bipolar mode transistor) module, and the second member is a member as shown in FIGS. A description will be given of a case where the adhesive member is an element such as an IGBT chip or a diode chip, which is an adhesive member, and each adhesive member is positioned and bonded to a plurality of substrates at a predetermined position at a time.
[0013]
The positioning jig of the present invention is a positioning and bonding jig for positioning and bonding the adhesive members C1 and C2 with respect to the adherend member S, and is a first jig for positioning and supporting the adherend member S. A tool 2, a second jig 2 provided with an insertion portion 20, positioned opposite to the first jig 1 and spaced from the surface of the adherend member S by a predetermined distance, and the second jig 2. An insertion portion 30 for guiding and positioning the adhesive members C1 and C2 inserted into the insertion portion 20 of the jig so as to be relatively movable so as to come into contact with the surface of the adherend member S. The 3rd jig | tool 3 in which was formed.
[0014]
In this embodiment, as shown in FIGS. 9 and 10, the substrate G to be bonded is formed by laminating metal conductor layers Sn and Sn made of, for example, copper or aluminum on both surfaces of the insulating base plate Sb. Therefore, the periphery of the insulating base plate Sb is formed so as to protrude from the periphery of the metal conductor layers Sn and Sn. In this embodiment, on the surface of the substrate S, the IGBT chip C1 and the diode chip C2 as adhesive members are respectively positioned through the solder foil F, and are reflow soldered in a reduction furnace in a later process. The
[0015]
FIG. 2 shows a plan view of the first jig 1, and FIG. 3 shows a cross-sectional view taken along the line III-III of the first jig 1 shown in FIG. On the upper surface of the first jig 1, a plurality of recesses 10 (eight locations in the illustrated embodiment) having a size capable of fitting and positioning the insulating base plate Sb of the substrate S are formed. In the case of this embodiment, the depth of each recess 10 is set to be shallower (thinner) than the minimum thickness (height) among the set molding errors of the substrate S. Therefore, even the thinnest substrate S comes out from the upper surface of the first jig 1. An inclined portion 10a is formed around the opening periphery of each recess 10 so that the insulating base plate Sb of the substrate S can be easily fitted and positioned. Also, between the center of each recess 10 and between each recess 10, for the purpose of improving heat circulation and reducing gas circulation by reducing heat capacity when being put into a reduction furnace in the subsequent process. A hole 11 penetrating from the lower surface of the first jig 1 to the recess 10 is formed. Further, a groove 12 is formed around each recess 10. In addition to the same purpose as the hole 11, the groove 12 facilitates the manual loading of the substrate S into the recess 10 and the unloading of the elements C <b> 1 and C <b> 2 that have been soldered, or the loading / unloading thereof. This is formed to insert a finger (not shown) of the robot that performs the operation. In the case of this embodiment, three pins 13 are erected near the upper corner of the first jig 1.
[0016]
4 is a plan view of the second jig 2, FIG. 5 is a front view of the second jig 2 shown in FIG. 4, and FIG. 6 is shown in FIG. FIG. 3 is a cross-sectional view of the second jig 2 substantially along the line VI-VI. The second jig 2 is formed with a plurality of insertion portions 20 (eight locations in the illustrated embodiment) through which the third jig 3 is inserted, corresponding to the recesses 10 of the first jig 1. The insertion part 20 is formed larger than the size of the substrate S positioned in the recess 10 of the first jig 1. Between the adjacent insertion parts 20, the protrusion 21 in which the flange 3a (FIG. 7, FIG. 8) of the 3rd jig | tool 3 is slidably fitted and positioned is formed. In addition, the pin 13 is fitted in a position corresponding to the three pins 13 provided upright on the first jig 1 of the second jig 2, and the second jig 2 is horizontal with respect to the first jig 1. A fitting hole 23 for positioning the position in the direction is formed, and the pin 13 and the fitting hole 23 constitute positioning means for the first jig 1 and the second jig 2. Then, as shown in the broken line of FIG. 4 and FIG. 5, when extracting the second jig 2 fitted with the pin 13 from the first jig 1, A notch 24 for hooking a robot finger is formed. Further, as indicated by a chain line in FIGS. 2 and 4, the elements C <b> 1 and C <b> 2 of the substrate S are positioned on one side edge of the first jig 1 and the second jig 2 and positioned in the reduction furnace. A hole 25 is formed at a position set by the product number so that the product number to be soldered can be determined.
[0017]
FIG. 7 shows a plan view of the third jig 3, and FIG. 8 shows a cross-sectional view taken along the line VIII-VIII of the third jig 3 shown in FIG. The outer periphery 3b of the side wall of the third jig 3 is formed to be slightly smaller than the insertion portion 20 of the second jig 2, and extends outwardly above it and into the ridge 21 of the second jig 2. A flange 3a to be slidably fitted is formed. And the length from the boundary with the flange 3a of the side wall 3b of the 3rd jig | tool 3 to a lower end is positioned in the recessed part 10 of the 1st jig | tool 1 when it penetrates in the insertion part 20 of the 2nd jig | tool 2. It is set so that the lower end surface of the bottom portion 3c can come into contact with the surface of the thinnest substrate S. Further, a window-like insertion portion 30 for guiding and positioning the IGBT chip C1 and the solder foil F and the diode chip C2 and the solder foil F on the surface of the substrate S is formed in the bottom 3c of the third jig 3. . An inclined portion 30a is formed at the upper end of each insertion portion 30 so that the IGBT chip C1 and the solder foil F and the diode chip C2 and the solder foil F can be easily inserted and positioned without being damaged. .
[0018]
The first, second, and third jigs 1, 2, 3 described above are reflowed to join the substrate S and the elements C 1, C 2 by remelting the solder foil in a reduction furnace in a later step. Carbon is used as the material for soldering. However, the present invention is not limited to this embodiment, and in the case where an adhesive member such as the elements C1 and C2 is mounted on an adhesive member such as the substrate S by eutectic bonding or resin adhesion, the resin or metal For example, other materials can be used, and further, it can be used for positioning other than when the elements C1 and C2 are mounted on the substrate S.
[0019]
In the above-described embodiment, the case where the pin 13 and the fitting hole 23 are used as means for positioning the second jig 2 in the horizontal direction with respect to the first jig 1 has been described. Although not shown in the drawings, the invention may be replaced with other known means such as forming either the concave portion or the convex portion engaged with the concave portion on the first jig 1 or the second jig 2, respectively. it can.
[0020]
Next, a usage form of the positioning jig of the present invention configured as described above will be described in the case where the elements C1 and C2 are mounted on the substrate S. First, the second jig 2 is in a state in which the fitting hole 23 is extracted from the pin 13 of the first jig 1. In this state, the substrate S is supported so as to be fitted in each recess 10 of the first jig 1. The substrate S is positioned by bringing the end surface of the insulating base plate Sb into contact with the side wall of the recess 10. The height of the surface of the substrate S coming out of the surface of the first jig 1 differs for each substrate S due to the molding error.
[0021]
Next, the second jig 2 is opposed to the first jig 1, and the fitting hole 23 is aligned with the pin 13 and fitted. At this time, since the insertion portion 20 of the second jig 2 is formed larger than the size of the substrate S positioned in the recess 10 of the first jig 1, the second jig 2 is placed on the surface of the substrate S. In other words, the second jig 2 is positioned and arranged in a state of being spaced apart from the surface of the substrate S by a predetermined distance.
[0022]
Thereafter, the side wall 3b of the third jig 3 is inserted into each insertion portion 20 of the second jig 2 so that the lower end surface of the bottom 3c of the third jig 3 is in contact with the surface of the substrate S. As is clear from the comparison of the heights of the left and right substrates S and the third jig 3 shown in FIG. 1, the first jig 1 varies depending on the height from the surface of the first jig 1 depending on the molding error of the substrate S. The 3 jig 3 can move up and down relatively within the insertion part 20 of the inserted second jig 2.
[0023]
Next, the IGBT chip C1 and the solder foil F and the diode chip C2 and the solder foil F are inserted in an overlapped state from the insertion portion 30 of each third jig 3 inserted according to the substrate S, and the surface of the substrate S Position to. In this embodiment, the substrate S, the solder foil F, and the elements C1 and C2 are sequentially stacked and positioned together with the first to third jigs 1, 2 and 3 in this state, and are carried into the reduction furnace. And reflow soldered.
[0024]
In the above-described usage mode, the second jig 2 is positioned with respect to the first jig 1 and the third jig 3 is positioned with respect to the second jig 2 later. The jig is not limited to this, and the third jig 3 is positioned on the second jig 2 in advance, and then the second jig 2 on which the third jig 3 is positioned is used as the first jig. 1 can also be positioned.
[0025]
Next, another embodiment of the positioning jig of the present invention will be described with reference to FIG. Note that portions that are the same as or correspond to those in the above-described embodiment are denoted by the same reference numerals, description thereof is omitted, and only different portions are described.
[0026]
In the embodiment described above, by forming the insertion portion 20 of the second jig 2 larger than the size of the substrate S positioned in the concave portion 10 of the first jig 1, the second jig 2 is formed on the substrate S. In this embodiment, the first jig is placed around the fitting hole 23 to be fitted with the pin 13 of the second jig 2 while being positioned and arranged at a predetermined distance from the surface. By providing the spacer 26 that protrudes toward the front, at least the periphery of the insertion portion 20 is configured to be separated from the surface of the first member by a predetermined distance. Further, in the above-described embodiment, the concave portion 10 of the first jig 1 is formed so that the surface of the substrate S comes out from the upper surface of the first jig 1, and the third jig 3 is formed more than the inner periphery of the concave portion 10. In this embodiment, the outer periphery of the bottom 3c of the third jig 3 is formed smaller than the inner periphery of the recess 10 of the first jig 1. Has been. Therefore, it is not necessary to set the depth of the concave portion 10 of the first jig 1 so that the surface of the substrate S comes out from the upper surface of the first jig 1.
[0027]
【The invention's effect】
According to the first aspect of the present invention, the first jig for positioning and supporting the adherend member, and the first jig is opposed to the first jig, and is positioned and spaced apart from the surface of the adherend member by a predetermined distance. A second jig provided with an insertion portion, and an adhesive member inserted into the insertion portion of the second jig so as to be movable relative to the surface of the member to be bonded. A third jig formed with an insertion portion for guiding and positioning, with a simple configuration, particularly when positioning the second member with respect to the plurality of first members at a time. Moreover, the positioning jig which can be positioned easily and reliably can be provided.
[Brief description of the drawings]
FIG. 1 is a partial sectional view showing an embodiment of a positioning jig of the present invention.
FIG. 2 is a plan view of a first jig.
3 is a cross-sectional view of the first jig shown in FIG. 2 taken along the line III-III.
FIG. 4 is a plan view of a second jig.
FIG. 5 is a front view of a second jig.
6 is a cross-sectional view taken substantially along the line VI-VI of the second jig shown in FIG. 4;
FIG. 7 is a plan view of a third jig.
FIG. 8 is a cross-sectional view taken along line VIII-VIII of the third jig shown in FIG.
FIG. 9 is a plan view showing an embodiment of a substrate to which elements are bonded.
10 is a front view of FIG. 9. FIG.
FIG. 11 is a partial cross-sectional view showing another embodiment of the positioning jig of the present invention.
FIG. 12 is a partial cross-sectional view showing a state in which elements are positioned with respect to substrates having different thicknesses by a conventional positioning jig.
[Explanation of symbols]
S substrate (first member)
C1, C2 element (second member)
DESCRIPTION OF SYMBOLS 1 1st jig | tool 2 2nd jig | tool 3 3rd jig | tool 10 Recessed part 20 Insertion part 30 Insertion part

Claims (1)

A positioning jig for positioning the second member relative to the first member,
A first jig for positioning and supporting the first member;
A second jig provided with an insertion portion, positioned opposite to the first jig and positioned at a predetermined distance from the surface of the first member;
An insertion portion for guiding and positioning the second member on the surface of the first member is formed in the insertion portion of the second jig so as to be relatively movable so as to come into contact with the surface of the first member. A third jig,
A positioning jig characterized by comprising:

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