JP3586526B2 - Composite film - Google Patents

Composite film Download PDF

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Publication number
JP3586526B2
JP3586526B2 JP29875096A JP29875096A JP3586526B2 JP 3586526 B2 JP3586526 B2 JP 3586526B2 JP 29875096 A JP29875096 A JP 29875096A JP 29875096 A JP29875096 A JP 29875096A JP 3586526 B2 JP3586526 B2 JP 3586526B2
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JP
Japan
Prior art keywords
layer
resin layer
composite film
thickness
vinyl acetate
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JP29875096A
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Japanese (ja)
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JPH10138411A (en
Inventor
和秀 石井
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Mitsubishi Plastics Inc
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Mitsubishi Plastics Inc
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Description

【0001】
【発明の属する技術分野】
本発明は主として食品の深絞り包装用底材に使用できる複合フイルムであって、透明性が良好でかつボイル時の成形部の収縮が少なく、蓋材とのシール部のカールや波打ちが少ない包装体を得るのに好適な複合フイルムに関する。
【0002】
【従来の技術】
従来、ボイル用の深絞り包装用底材としてはナイロン樹脂と直鎖状低密度ポリエチレン樹脂層との積層体やナイロン樹脂層とポリプロレン樹脂層との積層体等が使用されている。
【0003】
またハイガスバリアー性のタイプとしてはナイロン樹脂層/エチレン酢酸ビニル共重合体ケン化物樹脂層/直鎖状低密度ポリエチレン樹脂層からなる積層体、ポリプロピレン樹脂層/エチレン酢酸ビニル共重合体ケン化物樹脂層/ナイロン樹脂層/直鎖状低密度ポリエチレン樹脂層からなる積層体及びエチレン酢酸ビニル共重合体ケン化物樹脂層/ナイロン樹脂層/エチレン酢酸ビニル共重合体樹脂層との積層体のエチレン酢酸ビニル共重合体ケン化物樹脂層側にポリプロピレンフイルムをドライラミネートした積層体等が使用されている。
【0004】
しかしながらヒートシール層に直鎖状低密度ポリエチレン樹脂を用いたものではヒートシール時に直鎖状低密度ポリエチレン樹脂の結晶化によるフイルムの白化を生じ、シール部の透明性を著しく低下させてしまうという欠点があった。
【0005】
また直鎖状低密度ポリエチレン樹脂自体が非常に収縮し易い樹脂であり、通常深絞り成形は直鎖状低密度ポリエチレン樹脂の融点以下で行うため、蓋材をシールした包装体のシール部のカールや波打ちが防止できないという欠点があった。
【0006】
一方ヒートシール層にエチレン酢酸ビニル共重合体樹脂を用いたものでは深絞り成形時、成形温度が高いとシール部側から加熱する熱板に、ヒートシール層が溶けてとられてしまい、そのため、低温成形せざるを得なくなり、このため低温成形ではナイロン樹脂等他の高融点樹脂に成形歪が強く残り、ボイル時に収縮し易いという欠点があった。さらにナイロン樹脂層とポリプロピレン樹脂層との構成では成形温度が上げられ、収縮も押えられるが柔らかさ及び耐ピンホール性に問題があった。
【0007】
【発明が解決しようとする課題】
本発明は従来技術の前記の問題点を解決した新規の複合フイルムを提供することを目的とする。
【0008】
【課題を解決するための手段】
前記の目的は以下の手段によって達成される。
【0009】
すなわち、本発明は、第1層がポリプロピレン樹脂層、あるいは12ナイロン樹脂層、第2層が接着樹脂層、第3層がポリアミド樹脂層、第4層が接着樹脂層からなり、第5層が低密度ポリエチレン樹脂層または酢酸ビニル含量5モル%以下のエチレン酢酸ビニル樹脂層、あるいはそれらを主原料とするブレンド物層であり、第6層が厚みが3〜15μmでJISK7206によるビカット軟化点が105℃〜145℃の範囲の直鎖状低密度ポリエチレン樹脂層またはポリプロピレン樹脂層からなることを特徴とする複合フイルムを提案するものであり、また本発明は前記の複合フイルムのポリアミド樹脂層に隣接、または接着樹脂層を介して、エチレン酢酸ビニル共重合体ケン化物樹脂層を設けたことを特徴とする複合フイルム提案するものである。さらに、本発明は前記第1層のポリプロピレン樹脂層を、その他の層を共押出法により積層した共押出複合フイルム表面にドライラミネートしてなることを含む。
【0010】
【発明の実施の形態】
以下、本発明を更に詳細に説明する。
【0011】
本発明の請求項1の複合フイルムの構成が第1層はポリプロピレン樹脂層(以下PPという)あるいは、12ナイロン樹脂層(以下12Nyという)であり、その厚みは5〜70μmの範囲が好ましい。また第2層は接着樹脂層、第3層はポリアミド樹脂層(以下Nyという)、第4層は接着樹脂層、第5層は低密度ポリエチレン樹脂層(以下LDPEという)あるいは酢酸ビニル含量が5モル%以下のエチレン酢酸ビニル樹脂層(以下EVAという)あるいはそれらを主原料とするブレンド物の層であり、第6層のシール層は厚みが3〜15μmでJISK7206によるビカット軟化点が105℃〜145℃の範囲の直鎖状低密度ポリエチレン樹脂層(以下LLDPEという)またはPPからなる複合フイルムである。シール層の厚みが3μm未満ではヒートシール時に熱板にとられ易く、15μmを越えるとシール時の結晶化による白化を低く押えることができないという問題がある。第2層及び第4層の接着樹脂としては酸変性ポリオレフィン樹脂等が挙げられ厚みは3〜20μmの範囲が好ましい。また第3層のNyとしては6ナイロン、6−66ナイロン、12ナイロン、6−12ナイロン等が挙げられるが6ナイロンが成形品の収縮応力は小さく、ボイル時の収縮がより押えられるのでより好ましい。
【0012】
上記Nyの厚みは5〜70μmの範囲が好ましい。LDPEもしくはEVAもしくはそれらを主原料とするブレンド物からなる第5層の厚みは15〜150μmの範囲が好ましい。EVAの酢酸ビニル含量は0〜5モル%の範囲が好ましい。
含量5モル%を越えると収縮率大きくなりボイル時に収縮し易いという問題がある。
【0013】
またLDPE、EVAを主原料とするブレンド物の割合は特に制限されず、適宜収縮性を考慮して決めればよい。
【0014】
第6層のシール層はJISK7206によるビカット軟化点が105℃〜145℃の範囲とすることが肝要である。
【0015】
ビカット軟化点が105℃未満ではNy及び他の層の成形歪を小さく押えることができず、ボイル時の成形部の収縮を小さくすることができず、好ましくなく145℃を越えるとヒートシール性悪くなり好ましくない。
【0016】
第6層のシール層のPPはランダム共重合タイプのPPを用いる方がより成形温度を高くすることができ好ましいが隣接する第5層との層間接着強度が不充分となる場合は第5層の樹脂にポリエチレンとα−オレフィンの共重合体で密度0.9以下の低結晶性樹脂を添加することにより層間強度を向上を図ることができて好ましい。
【0017】
第1の外層のPPはホモポリマーの方が収縮応力が小さく良好であるが光沢、透明性の良いランダム共重合タイプのPPを用いることもできる。その場合はPPの厚みを厚めにする方が収縮は小さくなり良好である。
【0018】
また請求項2の複合フイルムはガスバリアー性を付与するために上記層構成でNyに隣接または接着樹脂層を介してエチレン酢酸ビニル共重合体ケン化物樹脂層(以下EVOHという)を設けたものであり、食品等の長期保存を可能にできる。さらに請求項3の複合フイルムは、上述した第1層のPPをドライラミネートによりその他の層の共押出複合フイルムに積層したものであり、ボイル時の収縮を低減し易いという利点がある。
【0019】
【実施例】
以下、本発明を実施例により具体的に説明する。
【0020】
実施例1
層構成が下記6層からなる複合フイルムを共押出して共押出複合フイルムを得た。
PP(厚み40μm)/接着樹脂(10μm)/Ny(厚み30μm)/接着樹脂(厚み10μm)/LDPE(厚み50μm)/LLDPE(厚み10μm)なお、外層のPPはエチレンとのランダムコーポリマーであり、LLDPEのビカット軟化点は110℃であった。得られた共押出複合フイルムを表1に示す成形可能な上限温度(熱板とのとられが発生しない上限温度)で大森機械工業社製深絞り包装機FV6300を使用して1.5秒間加熱して成形し、得られた底材に内容物を充填した後、蓋材を面シールし、包装体を得、包装体をボイル条件98℃×20分でボイルし、ボイル時の収縮状態及び面シール部の透明性及び耐ピンホール性を評価した。結果を表1に示す。
【0021】
なお、蓋材は延伸NyとEVAのドライラミネート積層体を用いた。
【0022】
評価法
・ボイル時の収縮状態
ボイル時に波打ち傾向の全くないものを〇とし、収縮して波打ち気味のものを△とし、収縮して波打ちを発生したものを×とした。
・面シール部の透明性
ヒートシール部に白化の全くなかったものを〇とし、白化の小さいものを△とし、白化したものを×とした。
・耐ピンホール性
ボイルによりピンホールが全くないものを〇とし、ピンホールを発生したものを×とした。
【0023】
実施例2
層構成が下記7層からなる複合フイルムを共押出して共押出複合フイルムを得た。
【0024】
PP(厚み40μm)/接着樹脂(厚み10μm)/Ny(厚み30μm)/EVOH(厚み10μm)/接着樹脂(厚み10μm)/LDPE(厚み40μm)/LLDPE(厚み10μm)
なお、PPとLLDPEは実施例1と同様のものを用いた。得られた共押出複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0025】
実施例3
層構成が下記5層からなる複合フイルムを共押出して共押出複合フイルムを得た。
【0026】
EVOH(厚み20μm)/Ny(厚み20μm)/接着樹脂(厚み10μm)/EVA(厚み40μm)/LLDPE(厚み10μm)
上記共押出複合フイルムのEVOH側に厚み50μmのPPをドライラミネートして6層の複合フイルムを得た。
【0027】
なお、PPとLLDPEは実施例1と同様のものを用いた。
【0028】
得られた複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0029】
実施例4
層構成が下記6層からなる複合フイルムを共押出し、共押出複合フイルムを得た。
【0030】
PP (厚み40μm)/接着樹脂(厚み10μm)/Ny(厚み30μm)/接着樹脂(厚み10μm)/LL(厚み50μm)/PP (厚み10μm)
なお、PP としてエチレンとのランダムコーポリマーのPPを、PP としてホモポリマーのPPを用いた。
【0031】
得られた共押出複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0032】
実施例5
層構成が下記7層からなる複合フイルムを共押出し、本発明の複合フイルムを得た。
【0033】
12Ny(厚み10μm)/接着樹脂(厚み10μm)/Ny(厚み30μm)/EVOH(厚み10μm)/接着樹脂(厚み10μm)/EVA(厚み70μm)/LLDPE(厚み10μm)
なお、LLDPEは実施例1と同様のものを用いた。EVAの酢酸ビニル含量は3モル%。
【0034】
得られた共押出複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0035】
比較例1
層構成が下記5層からなる複合フイルムを共押出し、共押出複合フイルムを得た。
【0036】
PP(厚み40μm)/接着樹脂(厚み10μm)/Ny(厚み30μm)/接着樹脂(厚み10μm)/LLDPE(厚み60μm)
なお、LLDPEは実施例1と同様のものを用いた。
【0037】
得られた複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0038】
比較例2
層構成が下記6層からなる複合フイルムを共押出し、共押出複合フイルムを得た。
【0039】
PP(厚み40μm)/接着樹脂(厚み10μm)/Ny(厚み30μm)/接着樹脂(厚み10μm)/LDPE(厚み40μm)/LLDPE(厚み20μm)
なお、LLDPEは実施例1と同様のものを用いた。
【0040】
得られた複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0041】
比較例3
層構成が下記6層の複合フイルムを共押出し、複合フイルムを得た。
【0042】
PP(厚み40μm)/接着樹脂(厚み10μm)/Ny(厚み30μm)/接着樹脂(厚み10μm)/LDPE(厚み50μm)/LLDPE(厚み10μm)
なお、LLDPEはビカット軟化点100℃のものを用いた。
【0043】
得られた複合フイルムを実施例1と同様に評価した。結果を表1に示す。
【0044】
比較例4
層構成が下記5層からなる複合フイルムを共押出して複合フイルムを得た。
【0045】
EVOH(厚み20μm)/Ny(厚み20μm)/接着樹脂(厚み10μm)/EVA(厚み40μm)/LLDPE(厚み10μm)
なお、LLDPEは比較例3と同様のものを用いた。EVAの酢酸ビニル含量は3モル%。
【0046】
前記の共押出複合フイルムのEVOH側に厚み50μmのPPをドライラミネートして複合フイルムを得た。
【0047】
得られた複合フイルムを実施例1と同様に評価した。その結果を表1に示す。
比較例5
層構成が下記3層からなる複合フイルムを共押出し、複合フイルムを得た。
【0048】
Ny(厚み50μm)/接着樹脂(厚み10μm)/PP(厚み90μm)
得られた複合フイルムを実施例1と同様に評価した。その結果を表1に示す。
【0049】
表1から本発明の複合フイルムを用いた包装体である実施例1乃至5はいずれもボイル時に収縮が発生せず、また面シール部の透明性が良好であり、耐ピンホール性も良好であることが判る。これに対して、シール層の厚みが厚すぎる比較例1、2では面シール部の透明性に劣り、シール層のLLDPEのビカット軟化点が低い比較例3、4ではボイル時に収縮して波打ちが発生し、問題があることが判る。さらに比較例5では、ボイル時の収縮はないがシール部の白化や耐ピンホール性に劣ることが判る。
【0050】
【表1】

Figure 0003586526
【0051】
【発明の効果】
本発明によれば透明性が良好でかつボイル時の成形部の収縮が少なく、蓋材とのシール部のカールや波打ちが少ない包装体を得るのに好適な複合フイルムを提供できる。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is a composite film that can be used mainly as a bottom material for deep drawing packaging of foods, and has good transparency, little shrinkage of a molded part at the time of boiling, and little curling or waving of a sealing part with a lid material. The present invention relates to a composite film suitable for obtaining a body.
[0002]
[Prior art]
Conventionally, as a bottom material for deep drawing packaging for boiling, a laminate of a nylon resin and a linear low-density polyethylene resin layer, a laminate of a nylon resin layer and a polypropylene resin layer, and the like have been used.
[0003]
The high gas barrier type includes a laminate composed of a nylon resin layer / a saponified ethylene vinyl acetate copolymer resin layer / a linear low-density polyethylene resin layer, a polypropylene resin layer / a saponified ethylene vinyl acetate copolymer resin. Layer / nylon resin layer / straight line low density polyethylene resin layer laminate and ethylene vinyl acetate copolymer saponified resin layer / nylon resin layer / ethylene vinyl acetate copolymer resin layer laminate A laminate or the like in which a polypropylene film is dry-laminated on the saponified copolymer resin layer side is used.
[0004]
However, in the case where the linear low-density polyethylene resin is used for the heat-sealing layer, the film is whitened due to crystallization of the linear low-density polyethylene resin at the time of heat sealing, and the transparency of the seal portion is significantly reduced. was there.
[0005]
In addition, since the linear low-density polyethylene resin itself is a resin that is very liable to shrink, usually deep drawing is performed at a temperature lower than the melting point of the linear low-density polyethylene resin. There was a drawback that ripples and waves could not be prevented.
[0006]
On the other hand, in the case of using the ethylene vinyl acetate copolymer resin for the heat seal layer, at the time of deep drawing, if the molding temperature is high, the heat seal layer is melted and taken off on the hot plate heated from the seal part side, There is no choice but to perform low-temperature molding. For this reason, in low-temperature molding, there is a drawback that molding distortion is strongly left in other high-melting point resins such as nylon resin, and the resin easily shrinks during boiling. Further, in the configuration of the nylon resin layer and the polypropylene resin layer, the molding temperature is increased and the shrinkage is suppressed, but there is a problem in softness and pinhole resistance.
[0007]
[Problems to be solved by the invention]
An object of the present invention is to provide a novel composite film which solves the above-mentioned problems of the prior art.
[0008]
[Means for Solving the Problems]
The above object is achieved by the following means.
[0009]
That is, in the present invention, the first layer is a polypropylene resin layer or a 12 nylon resin layer, the second layer is an adhesive resin layer, the third layer is a polyamide resin layer, the fourth layer is an adhesive resin layer, and the fifth layer is A low-density polyethylene resin layer or an ethylene-vinyl acetate resin layer having a vinyl acetate content of 5 mol% or less, or a blend layer containing them as a main raw material, wherein the sixth layer has a thickness of 3 to 15 μm and a Vicat softening point according to JIS K7206 of 105 The present invention proposes a composite film comprising a linear low-density polyethylene resin layer or a polypropylene resin layer in the range of from 0 ° C. to 145 ° C., and the present invention provides a composite film adjacent to the polyamide resin layer of the composite film, Alternatively, a composite film is proposed in which a saponified ethylene vinyl acetate copolymer resin layer is provided via an adhesive resin layer. It is. Further, the present invention includes that the first polypropylene resin layer is dry-laminated on the surface of a co-extruded composite film in which other layers are laminated by a co-extrusion method.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in more detail.
[0011]
In the composite film according to the first aspect of the present invention, the first layer is a polypropylene resin layer (hereinafter referred to as PP) or a 12 nylon resin layer (hereinafter referred to as 12Ny), and the thickness thereof is preferably in a range of 5 to 70 μm. The second layer is an adhesive resin layer, the third layer is a polyamide resin layer (hereinafter referred to as Ny), the fourth layer is an adhesive resin layer, the fifth layer is a low-density polyethylene resin layer (hereinafter referred to as LDPE) or a vinyl acetate content of 5%. Mol% or less of ethylene vinyl acetate resin layer (hereinafter referred to as EVA) or a layer of a blend containing them as a main raw material. The sixth sealing layer has a thickness of 3 to 15 μm and a Vicat softening point according to JIS K7206 of 105 ° C. A composite film comprising a linear low-density polyethylene resin layer (hereinafter referred to as LLDPE) or PP at a temperature of 145 ° C. If the thickness of the sealing layer is less than 3 μm, it tends to be formed on a hot plate during heat sealing, and if it exceeds 15 μm, there is a problem that whitening due to crystallization during sealing cannot be suppressed low. Examples of the adhesive resin for the second and fourth layers include an acid-modified polyolefin resin and the like, and the thickness is preferably in the range of 3 to 20 μm. Further, as Ny of the third layer, 6 nylon, 6-66 nylon, 12 nylon, 6-12 nylon and the like can be mentioned, but 6 nylon is more preferable because the shrinkage stress of the molded product is small and the shrinkage during boiling is suppressed more. .
[0012]
The thickness of Ny is preferably in the range of 5 to 70 μm. The thickness of the fifth layer made of LDPE or EVA or a blend containing them as a main raw material is preferably in the range of 15 to 150 μm. The vinyl acetate content of EVA is preferably in the range of 0 to 5 mol%.
If the content exceeds 5 mol%, there is a problem that the shrinkage rate increases and the shrinkage easily occurs during boiling.
[0013]
The proportion of the blend containing LDPE and EVA as main raw materials is not particularly limited, and may be determined in consideration of shrinkage.
[0014]
It is important that the sixth seal layer has a Vicat softening point in the range of 105 ° C to 145 ° C according to JIS K7206.
[0015]
If the Vicat softening point is less than 105 ° C., the molding distortion of Ny and other layers cannot be suppressed small, and the shrinkage of the molded portion during boiling cannot be reduced. If it exceeds 145 ° C., the heat sealing property is poor. It is not preferable.
[0016]
It is preferable to use a random copolymer type PP as the PP for the sixth seal layer because the molding temperature can be further increased. However, when the interlayer adhesion strength with the adjacent fifth layer becomes insufficient, the fifth layer is used. By adding a low-crystalline resin having a density of 0.9 or less as a copolymer of polyethylene and α-olefin to the above resin, the interlayer strength can be improved, which is preferable.
[0017]
As the PP of the first outer layer, a homopolymer is preferable because it has a small shrinkage stress and is good, but a PP of a random copolymer type having good gloss and transparency can also be used. In that case, the larger the thickness of PP, the better the shrinkage is reduced.
[0018]
Further, the composite film according to claim 2 is provided with a saponified ethylene vinyl acetate copolymer resin layer (hereinafter referred to as EVOH) adjacent to Ny or with an adhesive resin layer interposed therebetween in order to impart gas barrier properties. Yes, it enables long-term preservation of foods and the like. Further, the composite film of the third aspect is obtained by laminating the above-mentioned first layer of PP on a co-extruded composite film of another layer by dry lamination, and has an advantage that shrinkage during boiling is easily reduced.
[0019]
【Example】
Hereinafter, the present invention will be described specifically with reference to examples.
[0020]
Example 1
A composite film having the following six layers was co-extruded to obtain a co-extruded composite film.
PP (thickness 40 μm) / adhesive resin (10 μm) / Ny (thickness 30 μm) / adhesive resin (thickness 10 μm) / LDPE (thickness 50 μm) / LLDPE (thickness 10 μm) PP in the outer layer is a random copolymer with ethylene. , LLDPE had a Vicat softening point of 110 ° C. The obtained co-extruded composite film was heated for 1.5 seconds using a deep drawing packaging machine FV6300 manufactured by Omori Machinery Co., Ltd. at the maximum moldable temperature shown in Table 1 (the maximum temperature at which the hot film was not removed). After filling the obtained bottom material with the contents, the lid material is face-sealed to obtain a package, and the package is boiled at a boil condition of 98 ° C. × 20 minutes, and the shrinkage state at the time of boil and The transparency and pinhole resistance of the face seal were evaluated. Table 1 shows the results.
[0021]
Note that a dry laminate laminate of stretched Ny and EVA was used as the lid material.
[0022]
Evaluation method: Shrinking state at the time of boiling Boil when there was no tendency to undulate at the time of boiling, △ when shrinking and slightly undulating, and X when shrinking and undulating.
-Transparency of the face seal portion The white heat seal portion having no whitening was denoted by Δ, the one with little whitening was denoted by Δ, and the whitened one was denoted by ×.
-Pinhole resistance: No pinhole due to the boil was indicated by 〇, and a pinhole generated was indicated by ×.
[0023]
Example 2
A composite film having the following seven layers was co-extruded to obtain a co-extruded composite film.
[0024]
PP (thickness 40 μm) / adhesive resin (thickness 10 μm) / Ny (thickness 30 μm) / EVOH (thickness 10 μm) / adhesive resin (thickness 10 μm) / LDPE (thickness 40 μm) / LLDPE (thickness 10 μm)
The same PP and LLDPE as in Example 1 were used. The obtained co-extruded composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0025]
Example 3
A composite film having the following five layers was coextruded to obtain a coextruded composite film.
[0026]
EVOH (thickness 20 μm) / Ny (thickness 20 μm) / adhesive resin (thickness 10 μm) / EVA (thickness 40 μm) / LLDPE (thickness 10 μm)
A 50 μm-thick PP was dry-laminated on the EVOH side of the co-extruded composite film to obtain a six-layer composite film.
[0027]
The same PP and LLDPE as in Example 1 were used.
[0028]
The obtained composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0029]
Example 4
A composite film having the following six layers was co-extruded to obtain a co-extruded composite film.
[0030]
PP 1 (thickness 40 μm) / adhesive resin (thickness 10 μm) / Ny (thickness 30 μm) / adhesive resin (thickness 10 μm) / LL (thickness 50 μm) / PP 2 (thickness 10 μm)
Note that the PP random copolymer of ethylene as PP 2, using PP homopolymer as PP 1.
[0031]
The obtained co-extruded composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0032]
Example 5
A composite film having the following seven layers was co-extruded to obtain a composite film of the present invention.
[0033]
12 Ny (thickness 10 μm) / adhesive resin (thickness 10 μm) / Ny (thickness 30 μm) / EVOH (thickness 10 μm) / adhesive resin (thickness 10 μm) / EVA (thickness 70 μm) / LLDPE (thickness 10 μm)
Note that the same LLDPE as in Example 1 was used. EVA has a vinyl acetate content of 3 mol%.
[0034]
The obtained co-extruded composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0035]
Comparative Example 1
A composite film having the following five layers was co-extruded to obtain a co-extruded composite film.
[0036]
PP (thickness 40 μm) / adhesive resin (thickness 10 μm) / Ny (thickness 30 μm) / adhesive resin (thickness 10 μm) / LLDPE (thickness 60 μm)
Note that the same LLDPE as in Example 1 was used.
[0037]
The obtained composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0038]
Comparative Example 2
A composite film having the following six layers was co-extruded to obtain a co-extruded composite film.
[0039]
PP (thickness 40 μm) / adhesive resin (thickness 10 μm) / Ny (thickness 30 μm) / adhesive resin (thickness 10 μm) / LDPE (thickness 40 μm) / LLDPE (thickness 20 μm)
Note that the same LLDPE as in Example 1 was used.
[0040]
The obtained composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0041]
Comparative Example 3
A composite film having the following six layers was co-extruded to obtain a composite film.
[0042]
PP (thickness 40 μm) / adhesive resin (thickness 10 μm) / Ny (thickness 30 μm) / adhesive resin (thickness 10 μm) / LDPE (thickness 50 μm) / LLDPE (thickness 10 μm)
The LLDPE used had a Vicat softening point of 100 ° C.
[0043]
The obtained composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0044]
Comparative Example 4
A composite film having the following five layers was co-extruded to obtain a composite film.
[0045]
EVOH (thickness 20 μm) / Ny (thickness 20 μm) / adhesive resin (thickness 10 μm) / EVA (thickness 40 μm) / LLDPE (thickness 10 μm)
The same LLDPE as in Comparative Example 3 was used. EVA has a vinyl acetate content of 3 mol%.
[0046]
A 50 μm-thick PP was dry-laminated on the EVOH side of the co-extruded composite film to obtain a composite film.
[0047]
The obtained composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
Comparative Example 5
A composite film having the following three layers was co-extruded to obtain a composite film.
[0048]
Ny (50 μm thickness) / adhesive resin (10 μm thickness) / PP (90 μm thickness)
The obtained composite film was evaluated in the same manner as in Example 1. Table 1 shows the results.
[0049]
As shown in Table 1, Examples 1 to 5 which are packages using the composite film of the present invention do not shrink during boiling, have good transparency of the face seal portion, and have good pinhole resistance. It turns out there is. On the other hand, in Comparative Examples 1 and 2 where the thickness of the seal layer is too thick, the transparency of the face seal portion is inferior, and in Comparative Examples 3 and 4 where the Vicat softening point of LLDPE of the seal layer is low, shrinkage occurs at the time of boiling and undulation occurs. Occurs and indicates a problem. Furthermore, in Comparative Example 5, although there is no shrinkage at the time of boiling, it is found that the whitening of the seal portion and the pinhole resistance are poor.
[0050]
[Table 1]
Figure 0003586526
[0051]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the transparency which is favorable, the shrinkage | contraction of a shaping | molding part at the time of a boil is small, and the composite film suitable for obtaining the curl | curling of a seal | sticker part with a lid | cover, and a wavy can be provided.

Claims (3)

第1層がポリプロピレン樹脂層、あるいは12ナイロン樹脂層、第2層が接着樹脂層、第3層がポリアミド樹脂層、第4層が接着樹脂層からなり、第5層が低密度ポリエチレン樹脂層または酢酸ビニル含量5モル%以下のエチレン酢酸ビニル樹脂層、あるいはそれらを主原料とするブレンド物層であり、第6層が厚みが3〜15μmでJISK7206によるビカット軟化点が105℃〜145℃の範囲の直鎖状低密度ポリエチレン樹脂層またはポリプロピレン樹脂層からなることを特徴とする複合フイルム。The first layer is a polypropylene resin layer or a 12 nylon resin layer, the second layer is an adhesive resin layer, the third layer is a polyamide resin layer, the fourth layer is an adhesive resin layer, and the fifth layer is a low density polyethylene resin layer or An ethylene vinyl acetate resin layer having a vinyl acetate content of 5 mol% or less, or a blend layer containing them as a main raw material, wherein the sixth layer has a thickness of 3 to 15 μm and a Vicat softening point according to JIS K7206 of 105 ° C. to 145 ° C. A composite film comprising a linear low-density polyethylene resin layer or a polypropylene resin layer. 請求項1に記載の複合フイルムのポリアミド樹脂層に隣接、または接着樹脂層を介して、エチレン酢酸ビニル共重合体ケン化物樹脂層を設けたことを特徴とする複合フイルム。A composite film according to claim 1, wherein a saponified ethylene vinyl acetate copolymer resin layer is provided adjacent to the polyamide resin layer of the composite film or via an adhesive resin layer. 第1層のポリプロピレン樹脂層を、その他の層を共押出法により積層した共押出複合フイルム表面にドライラミネートしてなる請求項1または請求項2記載の複合フイルム。3. The composite film according to claim 1, wherein the first polypropylene resin layer is dry-laminated on the surface of a co-extruded composite film in which other layers are laminated by a co-extrusion method.
JP29875096A 1996-11-11 1996-11-11 Composite film Expired - Lifetime JP3586526B2 (en)

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JP3795205B2 (en) * 1997-10-21 2006-07-12 三菱樹脂株式会社 Easy-open composite film
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DE102011084523A1 (en) * 2011-10-14 2013-04-18 Evonik Industries Ag Use of a multi-layer film with Sauerstoffpermeationssperre for the production of photovoltaic modules

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