JP3583853B2 - Hybrid integrated circuit device integrated with actuator - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device integrated with an actuator that has a case material and does not require an overall sealing structure.
[0002]
[Prior art]
First, as an example, a brief description will be given using a hybrid, integrated circuit device (FIG. 5) mounted on a washing machine. The structure of this washing machine relates to Japanese Utility Model Laid-Open No. 2-1390. In FIG. 5, 1 is a machine frame, and 2 is a water supply unit, a power switch, and the like provided at an upper rear portion of the machine frame 1. A water supply unit 3 is accommodated in an outer tub elastically provided in the machine frame 1, a dehydration and washing tub 4 is provided in the outer tub 3, and has a large number of dehydration holes 5. Rotating blades 7 provided at the bottom of the washing tub are drive motors provided at the outer bottom of the outer tub, and the small tub 8, the large pulley 9, the belt 10 and the power transmission mechanism are provided to the washing tub 3 and the rotating wings. The washing tub 4 and the rotating wing 6 are rotated at high speed in one direction at the time of dehydration. Reference numeral 12 denotes a drain port provided at the bottom of the outer tank 3, 13 denotes a water pipe connected to the drain port, 14 denotes a motorized drain valve interposed in the water pipe 13, and 15 denotes a water supply electromagnetic interposed in the water suction pipe 16. It is a valve.
[0003]
The power switch has, for example, a drive circuit for a drive motor mounted on a printed go board or the like, and includes a semiconductor IC, or a hybrid IC having the same mounted thereon, a transformer, a buzzer, a capacitor, and the like. Switches for washing and dehydration are arranged on the surface of the water supply unit, and are electrically connected to the printed circuit board and connected to the back of the switches. Wiring is provided behind the machine frame 1 and is electrically connected to the drive motor.
[0004]
[Problems to be solved by the invention]
As described above, an actuator such as a drive motor and a hybrid board for controlling the same are installed in the water supply unit 2 via a very long wiring as shown in FIG. There is a problem that noise from the device enters the wiring and causes malfunctions in the actuator and the hybrid IC. Further, the wiring through which a large current for driving flows is connected between the hybrid substrate and the driving means. However, since the large current flows, noise is generated, and there is a problem that the circuit invades other circuits and malfunctions. Further, there is a problem in that the long wiring itself is, for example, incorporated into the main body 1 shown in FIG.
[0005]
In addition, while there is a demand for miniaturization and cost reduction of the entire system, there is a problem with the structure shown in FIG. That is, the case material 22 is provided around the element 20 and the metal substrate 21 to which the leads are attached, and the region surrounded by the case material is filled with resin. These raise the cost as a whole, and the distortion caused by the resin filling is applied to the bonding part of the semiconductor element, etc., and it is particularly difficult to prevent the characteristic deterioration in places where the temperature fluctuates sharply or where high temperatures are constantly applied. was there.
[0006]
These problems are not limited to washing machines, but also include devices in which a drive unit and a hybrid IC that drives the drive unit are separated, devices that rotate a vacuum cleaner, an air conditioner, a fan, and the like, and devices that perform a certain operation. It has a similar problem.
[0007]
[Means for Solving the Problems]
The present invention has been made in view of the above conventional problems,
First, a support substrate that is larger in size than the hybrid integrated circuit board, is mounted at the center with the hybrid integrated circuit board as an upper layer, and has a non-overlapping area around the periphery of the hybrid integrated circuit board;
A first step area surrounding the upper surface of the hybrid integrated circuit board and a non-overlapping area of the support substrate, the first step area having a recess for accommodating an electronic component mounted on the hybrid integrated circuit board; And an actuator having a second step region abutting on
Sealing means having elasticity over the entire periphery is provided around the upper surface of the hybrid integrated circuit board where the first step region abuts, and the first step region is brought into contact with the periphery of the upper surface of the hybrid integrated circuit substrate The mounting space formed between the upper surface of the hybrid integrated circuit board and the recess of the actuator is sealed by the sealing means, and the external leads are electrically connected to the conductive means attached to the actuator. Is the solution.
[0008]
In other words, by providing a space in which the hybrid integrated circuit board can be fitted in the actuator itself, a case material can be made unnecessary, and by fitting the case material, the leads can be electrically connected in the actuator. The wiring can be completely sealed by the sealing material without jumping out. Therefore, the resin injected into the case material is not required at all.
[0009]
Second, the hybrid integrated circuit board or the actuator corresponding to the arrangement area of the sealing means has a concave portion, and a convex portion corresponding to the concave portion is provided on the actuator or the hybrid integrated circuit substrate, and the concave portion, The problem is solved by having the convex portion and a sealing means provided therebetween.
That is, in the fitting structure on the left side of FIG. 2, a sealing material is provided in one of the dents, and the projection on the actuator side cuts into this sealing material, so that the sealing can be completed completely. Further, in the fitting structure on the right side, in a structure in which one dent and the other convex portion can be fitted with almost no gap, the resin serving as the sealing material enters into this gap, so that it is possible to completely seal.
[0010]
Further, in both the first means and the second means, a support substrate is disposed on the back surface of the hybrid integrated circuit substrate, and if the support substrate is mounted on the actuator by screwing, the entire substrate is firmly mounted with uniform pressure. be able to.
Third, the hybrid integrated circuit has a hollow portion that is smaller in size than the hybrid integrated circuit, houses the electronic component mounted on the hybrid integrated circuit board , and has a face where the stored electronic component is exposed. A frame having a non-overlapping area around the periphery of the hybrid integrated circuit board, with the board mounted at the center with the lower layer,
An actuator having a recess for accommodating an electronic component mounted on the hybrid integrated circuit board and having a step region abutting a frame around the recess,
Sealing means having elasticity is provided all around the upper surface of the frame body where the stepped region comes into contact, and the hybrid integrated circuit board is provided by the sealing means by contacting the stepped region with the periphery of the upper surface of the frame. The problem is solved by adopting a configuration in which the mounting space formed between the upper surface and the concave portion of the actuator is sealed, and the external leads are electrically connected to conductive means attached to the actuator.
[0011]
By setting the frame to the thickness of the circuit element or more, if the water resistance of the element at the fitting portion is insufficient, a space is obtained between the frame and the hybrid integrated circuit board, so that the resin can be injected. Two types can be selected. Fourth, the problem is solved by injecting an insulating resin into a space defined by the hybrid integrated circuit board and the hollow portion.
[0012]
By making the frame body the thickness of the chip or more, resin can be injected into the space formed by the frame body and the hybrid integrated circuit board. Therefore, even if a gap occurs due to heat or the like in the sealing structure, the sealing resin is used to seal the space. be able to.
Fifth, the frame or actuator corresponding to the arrangement area of the sealing means has a concave portion, and a convex portion corresponding to the concave portion is provided on the actuator or the frame, and the concave portion, the convex portion and The problem is solved by having a sealing means provided between them.
[0013]
That is, in the fitting structure on the left side in FIG. 4, a sealing material is provided in one of the dents, and the projection on the actuator side cuts into this sealing material, so that the seal can be completely sealed. Further, in the fitting structure on the right side, in a structure in which one dent and the other convex portion can be fitted with almost no gap, the resin serving as the sealing material enters into this gap, so that it is possible to completely seal.
[0014]
In addition, it is possible to drive the actuator and the hybrid integrated circuit board without providing a long wiring as in the related art, and it is possible to reduce noise or noise.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described. FIG. 1 shows a diagram in which two substrates 30 and 31 of a hybrid integrated circuit board and a support substrate are bonded, and FIG. 2 shows a structure when the hybrid integrated circuit device of FIG. 1 is mounted on an actuator. FIG. 6 is a cross-sectional view for explaining the method.
[0016]
First, as the substrate 30, a metal substrate is used to form a structure on which a power element that generates a large amount of heat can be mounted. Here, copper, iron, and aluminum can be considered. In order to form electrodes such as the wirings 32 and the islands 33 thereon, it is necessary to perform an insulation treatment. For example, the entire surface is coated with a polyimide resin or an epoxy resin, which is an insulating resin material, and is adhered thereon. .
[0017]
As an example adopted here, an example in which an aluminum substrate is employed is shown, and anodized aluminum oxide films of about 10 to 20 μm are formed on both surfaces of the hybrid integrated circuit substrate 30 in order to improve the withstand voltage and harden the surface. Then, a polyimide or epoxy resin 37 is applied to the entire surface of the mounting surface, and a patterned copper foil of about 8 to 500 μm is adhered by thermocompression bonding. As will be understood from the description below, the patterned copper foil is a wiring, a land, an electrode integrated with the wiring, a land integrated with the wiring, and the like. Naturally, the semiconductor chip 34 is bonded to the land, and the thin metal wire is bonded to the pad 35.
[0018]
Further, the wiring constituting the circuit is provided with a fixed portion of a lead, that is, a pad, at a slight distance from the periphery of the substrate, and the external lead 36 is fixed to the pad via solder. Further, a seal member 37 is provided between the external lead 36 and the periphery of the hybrid integrated circuit board 30. This may be a packing or a resin having a certain degree of viscosity applied in a line.
[0019]
On the other hand, the support substrate 31 may be a metallic substrate of AI or Cu, or an insulating substrate of ceramic or resin, but a metal substrate is preferable in consideration of heat dissipation. Further, a metal substrate whose surface is coated with an insulating material such as an insulating resin may be used in order to prevent a short circuit of the hybrid integrated circuit substrate via the supporting substrate 31. In addition, the support substrate and the hybrid integrated circuit substrate may be bonded together in consideration of workability and heat dissipation. However, in the case of bonding, if it is difficult to fit the actuator and the actuator due to the displacement of the two substrates, they may be separated. Hereinafter, the two substrates will be described as being bonded together.
[0020]
On the other hand, the actuator 40 is driven by a circuit mounted on the hybrid integrated circuit board 30, for example, a motor or the like is mounted, and has an indentation 41 in its outer shape. Around this recess, around the hybrid IC substrate 30 and the support substrate 31 is stepped portion 43 abuts is provided, the two substrates and the actuator 40 is fitted. When the two substrates are fitted, the external leads 36 mounted on the hybrid integrated circuit substrate 30 are connected to the female connector 44 incorporated on the actuator 40 side. Further , the convex portions are formed on the step portions 42 and 43 on the actuator side and the corresponding hybrid integrated circuit substrate 30, and the concave portions are formed on the support substrate 31 .
[0021]
A feature of the present invention is where the recessed portion 41 to the hybrid IC substrate 30 of the actuator 40, the supporting substrate 31 is fitted, has its feature in that case member used in the conventional example can be eliminated. Further, since the external leads 36 are connected in the recesses 41, the wiring required for connecting the hybrid integrated circuit device and the actuator can be significantly shortened as compared with the conventional example. By adopting the resin, the resin injected into the case material can be omitted.
[0022]
Two types of this seal structure are shown in FIG. That is, reference numerals A and B shown at both ends of the hybrid integrated circuit board have different structures, and actually one of them is provided over the entire circumference like the seal 37 in FIG. First, in A, a recess is provided on the hybrid integrated circuit board 30 side, and a sealing material is embedded in the recess. On the other hand, a convex portion is provided on the step portion 42 of the actuator 40 opposed thereto, and the convex portion cuts into the sealing material. In the second step, a female screw hole 45 having a screw cut inside is formed, and a hole 46 through which the screw passes is formed in the corresponding support substrate 31. That is, when screws are screwed through the holes 45 and 46, the pressure causes the protrusion provided on the step 42 to bite into the sealing material, and as a result, a structure is realized in which sealing can be realized.
[0023]
Subsequently, the structure of B will be described. The relationship between the irregularities is just the opposite. Here, in addition to the structure in which the protruding portion bites, the structure in which the sealing material is interposed in the gap is described. That is, the convex portion on the hybrid integrated circuit board side is a structure that fits into the concave portion on the actuator side, and has a structure in which an adhesive is inserted in the gap. Relatively low viscosity resin is placed, when screwed through the holes 45 and 46, irregularities so on are fitted, in which the adhesive is completely sealed rest into the gap.
[0024]
Therefore, this sealing structure eliminates the need for a case material, and eliminates the need for an injected resin to enter the case material. In addition, since the external lead is achieved in the recess 41, the wiring does not extend to the outside of the actuator 40, thereby preventing the intrusion of noise and the like. Can be stopped. Further, the whole of the hybrid integrated circuit substrate can be pressed uniformly by the support substrate, and no substrate distortion occurs.
[0025]
Next, another embodiment will be described with reference to FIGS. First, the hybrid integrated circuit board 50 will be described. Since this embodiment is almost the same as the above embodiment, only different portions will be described here. The frame 51 is smaller in size than the hybrid integrated circuit board 30 and houses electronic components mounted on the hybrid integrated circuit board 30. The frame 51 has a hollow portion where the stored electronic components are exposed, and is mounted at the center with the hybrid integrated circuit board as a lower layer, and has a non-overlapping area around the hybrid integrated circuit board. Therefore, since the frame body 51 is disposed on the hybrid integrated circuit board , no concave portion or convex portion is formed. The inside of the hybrid bond collecting circuit board is exposed from the lead 52, and the outside from the lead 52 has some space for abutting on the frame. Then, a sealing material 53 is provided on the frame body 51.
[0026]
Feature of the present invention resides in a seal structure, since the frame is fitted to the recessed portion 55 of the actuator 54, is where the casing material similar to the embodiment noted before becomes unnecessary. That peripheral step portion 56 and Wakukyu 51 of the actuator 54 is fitted. Also, by this fitting, the external lead 52 is electrically connected to the female connector 57 incorporated in the actuator 54. Furthermore, a seal structure of a convex portion or a concave portion is employed around the frame. That is, FIG. 4 shows two types of seal structures A and B. First, in A, a concave portion is provided on the frame body 51 side, and a sealing material is embedded therein. .. Are provided on the stepped portion 56 of the actuator 54 opposed thereto, and the projected portion cuts into the sealing material. On the actuator side corresponding to the outside thereof, a female screw hole 56 in which a screw is cut inward is formed, and in the corresponding frame body, a hole 57 through which the screw passes is formed. That is, when screws are screwed through the holes 58 and 59, the pressure causes the protrusion provided on the step 56 to bite into the sealing material, and as a result, a structure can be realized in which sealing is realized.
[0027]
Subsequently, the structure of B will be described. The relationship between the irregularities is just the opposite. Here, in addition to the structure in which the protruding portion bites, the structure in which the sealing material is interposed in the gap is described. In other words, the convex portion on the frame side has a structure that fits into the concave portion on the actuator side, and has a structure in which an adhesive is rather contained in the gap. Relatively low viscosity resin is placed, when screwed through the holes 58 and 59, irregularities so on are fitted, in which the adhesive is completely sealed rest into the gap.
[0028]
Therefore, this sealing structure eliminates the need for a case material, and eliminates the need for an injected resin that enters the width of the case material. In addition, since the external lead is achieved in the recess 41, the wiring does not extend to the outside of the actuator 40, so that noise can be prevented from entering.
Further, the present structure is characterized in that a structure capable of injecting a resin into a space defined by the hybrid integrated circuit substrate 50 can be selected by employing the frame 51. The seal is almost complete with the dents, protrusions and sealing material described above, but the actuator is placed in a poor environment (high temperature and high humidity atmosphere) to further protect the elements mounted on the hybrid integrated circuit board. If desired, a resin may be injected into the space.
[0029]
Since the large base frame 61 is arranged on the hybrid integrated circuit board 50, the lower surface has a step 60. When viewed as a whole incorporated in the actuator, the step portion 60 is concave, and the base frame 61 indicated by oblique lines may be provided integrally with or separately from the frame 51 in consideration of appearance and pressure resistance.
[0030]
【The invention's effect】
As described above, according to the hybrid integrated circuit device of the present invention, since the hybrid integrated circuit board is incorporated in the actuator and external leads are connected in the actuator, no case material is required, and the driving means is driven. The large current wiring does not require a long wiring as in the prior art, and does not pick up noise. Further, since it is not necessary to route a thick wire for a large current to the main body, the work at the time of assembly can be simplified. Therefore, it is possible to realize a hybrid integrated circuit device integrated with the actuator with reduced cost.
[0031]
Second, by providing a recess or a protrusion on the actuator and the hybrid integrated circuit board and interposing a sealant therebetween, the seal structure can be completed. In particular, the uneven portion and the sealing material therebetween are completely sealed by the screwing pressure. Therefore, the work of injecting a resin for protecting the elements mounted on the hybrid integrated circuit board can be omitted, and the number of process steps and the cost can be reduced.
[0032]
Third, if the frame is mounted on the hybrid integrated circuit board, a space for resin injection can be provided in addition to the effects described above. Therefore, when the environment is poor, resin can be injected into the space formed by the frame and the hybrid integrated circuit board for the purpose of prevention, and a double sealing structure can be selected.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a relationship between a hybrid substrate and a support substrate according to the present invention.
FIG. 2 is a cross-sectional view illustrating a structure in which the hybrid integrated circuit device of FIG. 1 is incorporated into an actuator.
FIG. 3 is a perspective view illustrating a relationship between a hybrid substrate and a frame according to the present invention.
FIG. 4 is a cross-sectional view illustrating a structure in which the hybrid integrated circuit device of FIG. 3 is incorporated into an actuator.
FIG. 5 is a cross-sectional view of a washing machine in which a hybrid integrated circuit stack according to a conventional example is mounted.
FIG. 6 is a sectional view of the hybrid integrated circuit device mounted on FIG. 5;

Claims (5)

A hybrid integrated circuit board on which electronic components are mounted and have a predetermined circuit, at least a surface of which has insulating properties,
External leads derived from the circuit of the hybrid integrated circuit board and provided on at least one side,
A support substrate having a larger size than the hybrid integrated circuit board, mounted on the center with the hybrid integrated circuit board as an upper layer, and having a non-overlapping region around the hybrid integrated circuit board;
A first step area surrounding the upper surface of the hybrid integrated circuit board and a non-overlapping area of the support substrate, the first step area having a recess for accommodating an electronic component mounted on the hybrid integrated circuit board; And an actuator having a second step region abutting on
Sealing means having elasticity over the entire periphery is provided around the upper surface of the hybrid integrated circuit board where the first step region abuts, and the first step region is brought into contact with the periphery of the upper surface of the hybrid integrated circuit substrate The sealing means seals a mounting space formed between the upper surface of the hybrid integrated circuit board and the recess of the actuator, and the external leads are electrically connected to conductive means attached to the actuator. Hybrid integrated circuit device integrated with the selected actuator. The hybrid integrated circuit board or the actuator corresponding to the arrangement area of the sealing means has a concave portion, and a convex portion corresponding to the concave portion is provided on the actuator or the hybrid integrated circuit substrate, and the concave portion, the convex portion, and the 2. A hybrid integrated circuit device integrated with an actuator according to claim 1, further comprising a sealing means provided on the actuator. A hybrid integrated circuit board on which electronic components are mounted and have a predetermined circuit, at least a surface of which has insulating properties,
External leads derived from the circuit of the hybrid integrated circuit board and provided on at least one side,
The hybrid integrated circuit than the substrate accommodating an electronic component size thereof is smaller mounted on the hybrid IC substrate, and having the accommodating electronic components hollow is Kaowodasu portion, the hybrid integrated circuit substrate A frame having a non-overlapping area around the hybrid integrated circuit board,
An actuator having a recess for accommodating an electronic component mounted on the hybrid integrated circuit board and having a step region around which the frame abuts around the recess,
Sealing means having elasticity is provided all around the upper surface of the frame body where the stepped region comes into contact, and the hybrid integrated circuit board is provided by the sealing means by contacting the stepped region with the periphery of the upper surface of the frame. A hybrid integrated circuit integrated with an actuator, wherein the mounting space formed between the upper surface and the recess of the actuator is sealed, and the external leads are electrically connected to conductive means attached to the actuator. apparatus. 4. A hybrid integrated circuit device integrated with an actuator according to claim 3, wherein an insulating resin is injected into a space defined by said hybrid integrated circuit board and said hollow portion. The frame or the actuator corresponding to the arrangement area of the sealing means has a concave portion, and a convex portion corresponding to the concave portion is provided on the actuator or the frame, and the concave portion, the convex portion, and the intermediate portion are provided. 4. A hybrid integrated circuit device integrated with an actuator according to claim 3, further comprising sealing means.

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