JP3583167B2 - Ketimine structure-containing organosilicon compound and method for producing the same - Google Patents

Ketimine structure-containing organosilicon compound and method for producing the same Download PDF

Info

Publication number
JP3583167B2
JP3583167B2 JP18062794A JP18062794A JP3583167B2 JP 3583167 B2 JP3583167 B2 JP 3583167B2 JP 18062794 A JP18062794 A JP 18062794A JP 18062794 A JP18062794 A JP 18062794A JP 3583167 B2 JP3583167 B2 JP 3583167B2
Authority
JP
Japan
Prior art keywords
formula
embedded image
organosilicon compound
hydrocarbon group
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP18062794A
Other languages
Japanese (ja)
Other versions
JPH0827167A (en
Inventor
秀好 柳澤
和彦 新井
省二 一戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP18062794A priority Critical patent/JP3583167B2/en
Publication of JPH0827167A publication Critical patent/JPH0827167A/en
Application granted granted Critical
Publication of JP3583167B2 publication Critical patent/JP3583167B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Biological Depolymerization Polymers (AREA)

Description

【0001】
【産業上の利用分野】
本発明は、新規なケチミン構造含有有機ケイ素化合物及びその製造方法に関する。さらに詳しくは、湿気或いは水分と接触すると容易に崩壊し、1級アミノ基が再生され、アミノ基としての反応性を有するようになるという特徴をもつ新規なケチミン構造含有有機ケイ素化合物及びその製造方法に関する。
【0002】
本発明の化合物は従来知られたケチミン構造をもつ有機ケイ素化合物と同様な応用が可能であり、例えばエポキシ樹脂やポリイミド樹脂等の樹脂に添加し、接着向上剤または硬化剤とすることができる。
【0003】
【従来の技術】
最初の構造のままでは不活性でアミノ基の反応性を示さないが、湿気或いは水分と接触すると容易に崩壊し、1級アミノ基が再生され、アミノ基としての反応性を持つようになるという特徴をもつ有機ケイ素化合物は従来知られている。
【0004】
例えば、式
【化4】
(EtO)Si(CHN=C(CH)CHCH(CH
で表わされる湿気崩壊型アミノ官能性シランカップリング剤が知られている。
【0005】
このような化合物は、例えば、エポキシ樹脂とポリイミド樹脂の混合系に添加して接着向上剤または硬化剤とする方法(特公昭57−11582)や、エポキシ樹脂と変性シリコーン樹脂の混合系に添加して接着向上剤兼硬化剤とする方法(特開平3−263421)などが知られている。
【0006】
上記式「化4」で表わされる化合物の製造方法としては、本発明者らが提案しているヒドロシリル化反応を応用する方法により、分子内にケチミン構造を有する有機不飽和化合物とヒドロアルコキシシランとを遷移金属化合物を触媒としてヒドロシリル化反応させるものがある(特開平5−247065)。また、アミノ基含有アルコキシシランとケトン化合物とを脱水反応させる方法(米国特許第2942019号)も知られている。
【0007】
【発明が解決しようとする課題】
しかしながら、前者の製造方法はシラン化合物を純粋なものとして得ることができるが、原料が高価なため製造コストが高いものとなるという欠点があり、また後者の製造方法はシッフ塩基を形成する際、生成する水分がシラン化合物を加水分解するために、かなりの部分がオリゴマー化してしまうという本質的な欠点があった。
【0008】
本発明は、前記した従来公知のケチミン構造をもつシラン化合物とは構造が異なる新規な湿気崩壊型アミノ官能性有機ケイ素化合物を提供するものであり、その製造方法は原料が安く低コストでの製造が可能であり、またアルコキシシラン製造時においても水分が生じることがないためシラン化合物のオリゴマー化が進行せず収率良く純度の高いシラン化合物を製造できるいう特徴を有する。
【0009】
【課題を解決するための手段】
すなわち、本発明は、一般式
【化5】

Figure 0003583167
(式中、R、Rは同時に水素原子とならない水素原子又は炭素数1〜10の1価炭化水素基、またRとRが結合して環状構造となっている場合には炭素数5〜7の2価炭化水素基となる基を表し、R、Rは同時に水素原子とならない水素原子又は炭素数1〜10の1価炭化水素基、またRとRが結合して環状構造となっている場合には炭素数5〜7の2価炭化水素基を表し、Rは炭素数1〜10の2価炭化水素基、Rは炭素数1〜4の1価炭化水素基を表し、nは1、2、3、mは0、1、2、を表す)
で示される新規なケチミン構造含有有機ケイ素化合物を提供するものである。
【0010】
また、本発明は、上記の一般式「化5」において、R、Rがメチル基、R、Rがイソブチル基である新規なケチミン構造含有有機ケイ素化合物を提供するものである。
【0011】
さらに、本発明は、一般式
【化6】
Figure 0003583167
(式中のR、R、R、R、nは前記の通り)
と、一般式
【化7】
Figure 0003583167
(式中、R、R、mは前記の通り。またXはハロゲン原子を表わす。)
で示される化合物とを反応させ、脱ハロゲン化水素反応により、「化5」で示されるケチミン構造含有有機ケイ素化合物を製造する方法を提供するものである。
【0012】
以下、本発明を詳述する。
本発明の化合物は新規なシラン化合物である。その製造方法は、脱ハロゲン水素反応により製造するため製造時に水分が生じることなく、したがってアルコキシシランが加水分解せずに得られ、また、原料も安く低コストで製造することができる。
【0013】
式「化5」中のR、Rは同時に水素原子とはならない水素原子又は炭素数1〜10の1価の炭化水素基であり、具体的には、
【化8】
H、CH−、CHCH−、CH(CH−、CHC(CH)H−、
CH(CH−、CHC(CH)HCH−、CHCHC(CH)H−、
CH(CH−、CH(CH−、CH(CH−、CH(CH−、
CH(CH−、CH(CH−、
等が挙げられる。
【0014】
また、RとRが結合して環状構造となっていてもよく、その場合には炭素数5〜7の2価炭化水素基となる基を表し、具体的には、
【化9】
−(CH−、−(CH−、−(CH−、
等が挙げられる。
【0015】
式「化5」中のR、Rも同事に水素原子とならない水素原子または炭素数1〜10の1価の炭素水素基であり、具体的には、前記R、Rと同様な基が挙げられる。
【0016】
また、RとRが結合して環状構造となっていてもよく、その場合は炭素数5〜7の2価の炭化水素基を表し、具体的には、前記R、Rが結合して環状構造となっている場合と同様な基が挙げられる。
【0017】
とR、RとRは異なった基でもよいが、本発明の一般的な製造方法によれば同一の基である場合が多く、低コスト化のためには、RとR、RとRがそれぞれ同一の基であることが好ましい。
【0018】
また、式「化5」中のRは炭素数1〜10の2価炭化水素基であり、具体的には、例えば、
【化10】
−CH−、−(CH−、−(CH−、−(CH−、
−(CH−、−(CH−、−(CH10−、−CHCH(CH)CH−、
等が挙げられる。
【0019】
また、式「化5」中のRは炭素数1〜4の1価の炭素水素基であり、例えば
【化11】
CH−、CHCH−、CH(CH−、CHC(CH)H−、
CH(CH−、
等が挙げられる。
【0020】
また、式「化5」中のXはハロゲン原子を表わし、具体的には、Cl、Brが好ましい。
【0021】
また、式「化5」中のnは1、2、3、mは0、1、2、を表す。
【0022】
本発明の新規なケチミン構造含有有機ケイ素化合物の具体例としては
【化12】
Figure 0003583167
【化13】
Figure 0003583167
【化14】
Figure 0003583167
【化15】
Figure 0003583167
【化16】
Figure 0003583167
【化17】
Figure 0003583167
【化18】
Figure 0003583167
【化19】
Figure 0003583167
【化20】
Figure 0003583167
【化21】
Figure 0003583167
【化22】
Figure 0003583167
【化23】
Figure 0003583167
【化24】
Figure 0003583167
が挙げられる。
【0023】
本発明の新規なケチミン構造含有有機ケイ素化合物の製造方法は、式「化6」で表わされる化合物と、式「化7」で表わされる化合物とを脱ハロゲン化水素反応させれば良い。その際、反応温度は20℃〜150℃にて1時間から30時間行なえば良く、ハロゲン原子がクロルの場合は好ましくは80℃〜130℃であり、ブロムの場合には20℃〜80℃程度で行なうことが好ましい。
【0024】
原料である式「化6」で表わされる化合物の具体例としては、
【化25】
Figure 0003583167
【化26】
Figure 0003583167
【化27】
Figure 0003583167
【化28】
Figure 0003583167
【化29】
Figure 0003583167
【化30】
Figure 0003583167
等が挙げられる。
【0025】
また、もう一方の原料である式「化7」で表わされる化合物の具体例としては、
【化31】
Figure 0003583167
【化32】
Figure 0003583167
【化33】
Figure 0003583167
【化34】
Figure 0003583167
【化35】
Figure 0003583167
【化36】
Figure 0003583167
【化37】
Figure 0003583167
【化38】
Figure 0003583167
【化39】
Figure 0003583167
【化40】
Figure 0003583167
【化41】
Figure 0003583167
【化42】
Figure 0003583167
【化43】
Figure 0003583167
【化44】
Figure 0003583167
【化45】
Figure 0003583167
等が挙げられる。
【0026】
また、この反応において溶媒の使用は任意であり、例えばメタノール、エタノール、イソプロパノール、n−プロパノール、n−ブタノール等のアルコール類;酢酸エチル等のエステル類;N,N−ジメチルホルムアミド等のアミド類;ジエチルエーテル、ジブチルエーテル、テトラヒドロフラン、ジオキサン等のエーテル類;トルエン、キシレン、ベンゼン等の芳香族炭化水素類;ペンタン、ヘキサン、オクタン、デカン等の脂肪族炭化水素類が挙げられる。
【0027】
また、脱ハロゲン化水素剤、触媒の使用は任意であり、脱ハロゲン化水素剤の例としては、トリエチルアミン、ジメチルアニリン、ジメチルベンジルアミン、N,N,N’N’−テトラメチルエチレンジアミン、ジアザビシクロウンデセン等が使用でき、触媒としてはNaIやKIなどを使用することができる。
【0028】
また、生成するハロゲン化水素を除去するために、ソディウムエチラートやリチウムメチラート等の金属アルコラートを用いても良い。
【0029】
式「化6」と式「化7」で表される原料化合物の反応モル比は1対1で行なえば良いが、どちらかを過剰にしても良い。但し、式「化6」の化合物を過剰にすると、最終生成物に残存する式「化6」の化合物に活性水素が存在するため、最終生成物である本発明の化合物を樹脂に添加した場合、系の保存安定性が悪くなる可能性がある。
【0030】
以下に本発明を実施例を挙げてさらに説明するが、本発明はかかる実施例に限定されるものではない。
【実施例】
[実施例1]
窒素ガス導入菅、温度計、ジムロート型冷却器及び滴下ロートを備えた1リットルのセパラブルフラスコに式
【化46】
Figure 0003583167
で表わされる原料化合物267g(1.0モル)を仕込み、窒素ガス気流下、80℃にて、γ−ブロモプロピルトリメトキシシラン243g(1.0モル)をゆっくり滴下した。滴下終了後、3時間、80℃にて攪拌を続けた。
その後、ガスクロマトグラフにより、γ−ブロモプロピルトリメトキシシランのピークの消失を確認してから、60℃にてソディウムメチラート28%のメタノール溶液183g(0.95モル)をゆっくり滴下し、滴下終了後60℃にて1時間攪拌を続けた。生成したNaBrを濾別し、メタノールを溜去した。新たに析出したNaBrを濾別したところ、褐色透明な液体を得た。得られた褐色透明液体は、25℃における粘度が56.9cs、比重が0.956、屈折率が1.4728であった。次いで、この褐色透明液体を、H−核磁気共鳴スペクトル分析、赤外吸収スペクトル分析を行なったところ、式
【化47】
Figure 0003583167
で表される有機ケイ素化合物であることが確認できた。図1にH−核磁気共鳴スペクトルを示し、図2に赤外吸収スペクトルを示す。
【0031】
[実施例2〜5]
表1から4に示した原料化合物を用いて、実施例1と同様な方法にて本発明の有機ケイ素化合物の製造を行なった。得られた生成物を、H−核磁気共鳴スペクトル分析、赤外吸収スペクトル分析を行なったところ、表1から4に示した構造を有する有機ケイ素化合物であることが確認できた。
【0032】
【表1】
Figure 0003583167
【0033】
【表2】
Figure 0003583167
【0034】
【表3】
Figure 0003583167
【0035】
【表4】
Figure 0003583167
【0036】
[実施例6]
2リットルのオートクレーブに、式
【化48】
Figure 0003583167
で表わされる原料化合物267g(1.0モル)、γ−クロロプロピルトリメトキシシラン198.5g(1.0モル)及びメタノール300gを仕込み、密閉下、120℃〜130℃にて5時間反応を行なった。
反応終了後、60℃にてソディウムメチラート28%のメタノール溶液183g(0.95モル)をゆっくり滴下し、滴下終了後60℃にて1時間攪拌を続けた。生成したNaClを濾別し、メタノールを溜去した後、新たに析出したNaClを濾別したところ、褐色透明な液体を得た。
得られた褐色液体について、H−核磁気共鳴スペクトル分析、赤外吸収スペクトル分析、元素分析を行なったところ、式
【化49】
Figure 0003583167
で表される構造を有する有機ケイ素化合物であることが確認できた。
【0037】
【発明の効果】
本発明は、新規な湿気崩壊型アミノ官能性有機ケイ素化合物を提供するものである。本発明の有機ケイ素化合物は、従来知られたケチミン構造をもつシラン化合物と同様な応用が可能な化合物であり、例えばエポキシ樹脂やポリイミド樹脂等の樹脂に添加し、接着向上剤または硬化剤とすることができる。
【0038】
また、本発明の有機ケイ素化合物の製造方法は、原料が安く低コストでの製造が可能であり、またアルコキシシラン製造時においても水分が生じることがないためシラン化合物のオリゴマー化が進行せず収率良く純度の高い有機ケイ素化合物を製造できるいう特徴を有する。
【図面の簡単な説明】
【図1】実施例1で得られた本発明の有機ケイ素化合物のH−核磁気共鳴スペクトルである。
【図2】実施例1で得られた本発明の有機ケイ素化合物の赤外吸収スペクトルである。[0001]
[Industrial applications]
The present invention relates to a novel ketimine structure-containing organosilicon compound and a method for producing the same. More specifically, a novel ketimine structure-containing organosilicon compound having a characteristic of easily disintegrating upon contact with moisture or moisture and regenerating a primary amino group and having reactivity as an amino group, and a method for producing the same About.
[0002]
The compound of the present invention can be applied in the same manner as a conventionally known organosilicon compound having a ketimine structure, and can be added to a resin such as an epoxy resin or a polyimide resin to be used as an adhesion improver or a curing agent.
[0003]
[Prior art]
In the original structure, it is inert and does not show the reactivity of amino groups, but when it comes into contact with moisture or moisture it breaks down easily and the primary amino groups are regenerated and become reactive as amino groups. Organosilicon compounds having characteristics are conventionally known.
[0004]
For example, the formula
(EtO) 3 Si (CH 2 ) 3 N = C (CH 3) CH 2 CH (CH 3) 2
A moisture-disintegrating amino-functional silane coupling agent represented by the following formula is known.
[0005]
Such a compound is added to a mixed system of an epoxy resin and a modified silicone resin, for example, by adding it to a mixed system of an epoxy resin and a polyimide resin to make it an adhesion improver or a curing agent (Japanese Patent Publication No. 57-15882). And a method of using the same as an adhesion improving agent and a curing agent (JP-A-3-263421).
[0006]
As a method for producing the compound represented by the above-mentioned formula “Formula 4”, an organic unsaturated compound having a ketimine structure in the molecule and a hydroalkoxysilane are produced by a method applying a hydrosilylation reaction proposed by the present inventors. Are subjected to a hydrosilylation reaction using a transition metal compound as a catalyst (JP-A-5-247065). Further, a method of dehydrating an amino-containing alkoxysilane with a ketone compound (US Pat. No. 2,942,019) is also known.
[0007]
[Problems to be solved by the invention]
However, the former production method can obtain the silane compound as a pure substance, but has a disadvantage that the production cost is high because the raw materials are expensive, and when the latter production method forms a Schiff base, Since the generated water hydrolyzes the silane compound, there is an essential disadvantage that a considerable part of the product is oligomerized.
[0008]
The present invention provides a novel moisture-disintegrating amino-functional organosilicon compound having a structure different from that of the above-described conventionally known silane compound having a ketimine structure. In addition, since no water is generated during the production of the alkoxysilane, the oligomerization of the silane compound does not proceed, and a high-purity silane compound can be produced with good yield.
[0009]
[Means for Solving the Problems]
That is, the present invention relates to a compound represented by the general formula:
Figure 0003583167
(In the formula, R 1 and R 2 represent a hydrogen atom which is not simultaneously a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a carbon atom when R 1 and R 2 are bonded to form a cyclic structure. R 3 and R 4 represent a hydrogen atom which is not simultaneously a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, and R 3 and R 4 are bonded to each other. When it has a cyclic structure, it represents a divalent hydrocarbon group having 5 to 7 carbon atoms, R 5 is a divalent hydrocarbon group having 1 to 10 carbon atoms, and R 6 is a 1-valent hydrocarbon group having 1 to 4 carbon atoms. Represents a valent hydrocarbon group, n represents 1, 2, 3, and m represents 0, 1, 2,
And a novel ketimine structure-containing organosilicon compound represented by the formula:
[0010]
Further, the present invention provides a novel organosilicon compound having a ketimine structure, wherein R 1 and R 3 are methyl groups and R 2 and R 4 are isobutyl groups in the above general formula [Formula 5].
[0011]
Further, the present invention provides a compound represented by the general formula:
Figure 0003583167
(Wherein R 1 , R 2 , R 3 , R 4 and n are as described above)
And the general formula
Figure 0003583167
(In the formula, R 5 , R 6 and m are as described above, and X represents a halogen atom.)
And a method for producing a ketimine structure-containing organosilicon compound represented by Chemical Formula 5 by reacting the compound with a compound represented by Chemical Formula 5.
[0012]
Hereinafter, the present invention will be described in detail.
The compound of the present invention is a novel silane compound. In the production method, since the production is carried out by a dehalogenation hydrogen reaction, no water is generated at the time of production, and therefore, the alkoxysilane is obtained without hydrolysis, and the raw materials can be produced at low cost at low cost.
[0013]
R 1 and R 2 in the formula “Chemical formula 5” are a hydrogen atom which is not simultaneously a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms.
Embedded image
H, CH 3 -, CH 3 CH 2 -, CH 3 (CH 2) 2 -, CH 3 C (CH 3) H-,
CH 3 (CH 2) 3 - , CH 3 C (CH 3) HCH 2 -, CH 3 CH 2 C (CH 3) H-,
CH 3 (CH 2) 4 - , CH 3 (CH 2) 5 -, CH 3 (CH 2) 6 -, CH 3 (CH 2) 7 -,
CH 3 (CH 2) 8 - , CH 3 (CH 2) 9 -,
And the like.
[0014]
Further, R 1 and R 2 may be bonded to each other to form a cyclic structure. In this case, the group represents a divalent hydrocarbon group having 5 to 7 carbon atoms, and specifically,
Embedded image
- (CH 2) 5 -, - (CH 2) 6 -, - (CH 2) 7 -,
And the like.
[0015]
R 3 and R 4 in the formula “Chemical formula 5” are also hydrogen atoms that are not simultaneously hydrogen atoms or monovalent carbon hydrogen groups having 1 to 10 carbon atoms, and specifically, are the same as R 1 and R 2 described above. Groups.
[0016]
Further, R 3 and R 4 may be bonded to each other to form a cyclic structure, and in this case, it represents a divalent hydrocarbon group having 5 to 7 carbon atoms. Specifically, when R 1 and R 2 are The same groups as those in the case of bonding to form a cyclic structure can be mentioned.
[0017]
R 1 and R 3, R 2 and R 4 may be a different group, but often of the same group, according to a general production method of the present invention, for cost reduction, and R 1 It is preferred that R 3 , R 2 and R 4 are the same group.
[0018]
Further, R 5 in the formula “Chemical Formula 5” is a divalent hydrocarbon group having 1 to 10 carbon atoms, and specifically, for example,
Embedded image
-CH 2 -, - (CH 2 ) 2 -, - (CH 2) 3 -, - (CH 2) 4 -,
- (CH 2) 6 -, - (CH 2) 8 -, - (CH 2) 10 -, - CH 2 CH (CH 3) CH 2 -,
And the like.
[0019]
R 6 in the formula “Chemical formula 5” is a monovalent hydrocarbon group having 1 to 4 carbon atoms.
CH 3 —, CH 3 CH 2 —, CH 3 (CH 2 ) 2 —, CH 3 C (CH 3 ) H—,
CH 3 (CH 2 ) 3 —,
And the like.
[0020]
X in the formula (5) represents a halogen atom, and specifically, Cl and Br are preferable.
[0021]
Further, n in the chemical formula 5 represents 1, 2, 3, and m represents 0, 1, 2.
[0022]
Specific examples of the novel organosilicon compound having a ketimine structure of the present invention include:
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Is mentioned.
[0023]
The method for producing the novel organosilicon compound having a ketimine structure of the present invention may be carried out by subjecting the compound represented by the formula [Formula 6] and the compound represented by the formula [Formula 7] to a dehydrohalogenation reaction. At that time, the reaction may be carried out at a temperature of 20 ° C. to 150 ° C. for 1 hour to 30 hours, preferably 80 ° C. to 130 ° C. when the halogen atom is chloro, and about 20 ° C. to 80 ° C. when the halogen is bromo. It is preferable to carry out in.
[0024]
Specific examples of the compound represented by the formula “Formula 6” as a raw material include:
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
And the like.
[0025]
Further, specific examples of the compound represented by the formula “Formula 7” as the other raw material include:
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
Embedded image
Figure 0003583167
And the like.
[0026]
The use of a solvent in this reaction is optional, for example, alcohols such as methanol, ethanol, isopropanol, n-propanol and n-butanol; esters such as ethyl acetate; amides such as N, N-dimethylformamide; Ethers such as diethyl ether, dibutyl ether, tetrahydrofuran, and dioxane; aromatic hydrocarbons such as toluene, xylene, and benzene; and aliphatic hydrocarbons such as pentane, hexane, octane, and decane.
[0027]
The use of a dehydrohalogenating agent and a catalyst is optional. Examples of the dehydrohalogenating agent include triethylamine, dimethylaniline, dimethylbenzylamine, N, N, N'N'-tetramethylethylenediamine, diaza Bicycloundecene or the like can be used, and NaI or KI can be used as a catalyst.
[0028]
Further, in order to remove generated hydrogen halide, a metal alcoholate such as sodium ethylate or lithium methylate may be used.
[0029]
The reaction molar ratio of the starting compounds represented by the formulas “Formula 6” and “Formula 7” may be 1: 1 but may be either one or more. However, if the compound of the formula [Chemical Formula 6] is excessive, active hydrogen is present in the compound of the formula [Chemical Formula 6] remaining in the final product. Therefore, when the compound of the present invention as the final product is added to the resin. However, the storage stability of the system may be deteriorated.
[0030]
Hereinafter, the present invention will be further described with reference to examples, but the present invention is not limited to these examples.
【Example】
[Example 1]
A 1-liter separable flask equipped with a nitrogen gas inlet tube, a thermometer, a Dimroth type cooler and a dropping funnel has the formula
Figure 0003583167
Was charged, and 243 g (1.0 mol) of γ-bromopropyltrimethoxysilane was slowly added dropwise at 80 ° C. under a nitrogen gas stream. After completion of the dropwise addition, stirring was continued at 80 ° C. for 3 hours.
Then, after confirming disappearance of the peak of γ-bromopropyltrimethoxysilane by gas chromatography, 183 g (0.95 mol) of a methanol solution of 28% sodium methylate was slowly added dropwise at 60 ° C. Stirring was continued at 60 ° C. for 1 hour. The produced NaBr was separated by filtration, and methanol was distilled off. When newly precipitated NaBr was separated by filtration, a brown transparent liquid was obtained. The obtained brown transparent liquid had a viscosity at 25 ° C. of 56.9 cs, a specific gravity of 0.956, and a refractive index of 1.4728. Next, when the brown transparent liquid was subjected to 1 H-nuclear magnetic resonance spectrum analysis and infrared absorption spectrum analysis, the following formula was obtained.
Figure 0003583167
It was confirmed that the compound was an organosilicon compound represented by the formula: FIG. 1 shows a 1 H-nuclear magnetic resonance spectrum, and FIG. 2 shows an infrared absorption spectrum.
[0031]
[Examples 2 to 5]
Using the starting compounds shown in Tables 1 to 4, the organosilicon compound of the present invention was produced in the same manner as in Example 1. When the obtained product was analyzed by 1 H-nuclear magnetic resonance spectrum analysis and infrared absorption spectrum analysis, it was confirmed that the product was an organosilicon compound having a structure shown in Tables 1 to 4.
[0032]
[Table 1]
Figure 0003583167
[0033]
[Table 2]
Figure 0003583167
[0034]
[Table 3]
Figure 0003583167
[0035]
[Table 4]
Figure 0003583167
[0036]
[Example 6]
In a 2 liter autoclave, the formula
Figure 0003583167
The starting compound 267 g (1.0 mol), 198.5 g (1.0 mol) of γ-chloropropyltrimethoxysilane, and 300 g of methanol were charged and reacted at 120 ° C. to 130 ° C. for 5 hours in a sealed state. Was.
After completion of the reaction, 183 g (0.95 mol) of a methanol solution of 28% sodium methylate was slowly added dropwise at 60 ° C, and after completion of the addition, stirring was continued at 60 ° C for 1 hour. The produced NaCl was separated by filtration, methanol was distilled off, and newly precipitated NaCl was separated by filtration to obtain a brown transparent liquid.
The obtained brown liquid was analyzed by 1 H-nuclear magnetic resonance spectroscopy, infrared absorption spectroscopy and elemental analysis.
Figure 0003583167
It was confirmed that the compound was an organosilicon compound having a structure represented by the following formula:
[0037]
【The invention's effect】
The present invention provides a novel moisture-disintegrating amino-functional organosilicon compound. The organosilicon compound of the present invention is a compound that can be applied in the same manner as a conventionally known silane compound having a ketimine structure, and is added to a resin such as an epoxy resin or a polyimide resin, and is used as an adhesion improver or a curing agent. be able to.
[0038]
In addition, the method for producing an organosilicon compound of the present invention can be produced at a low cost using a low-cost raw material, and since no water is generated even during the production of alkoxysilane, the oligomerization of the silane compound does not proceed and the yield is low. It has the feature that an organosilicon compound having high purity can be produced efficiently.
[Brief description of the drawings]
FIG. 1 is a 1 H-nuclear magnetic resonance spectrum of the organosilicon compound of the present invention obtained in Example 1.
FIG. 2 is an infrared absorption spectrum of the organosilicon compound of the present invention obtained in Example 1.

Claims (3)

一般式
Figure 0003583167
(式中、R、Rは同時に水素原子とならない水素原子又は炭素数1〜10の1価炭化水素基、またRとRが結合して環状構造となっている場合には炭素数5〜7の2価炭化水素基となる基を表し、R、Rは同時に水素原子とならない水素原子又は炭素数1〜10の1価炭化水素基、またRとRが結合して環状構造となっている場合には炭素数5〜7の2価炭化水素基を表し、Rは炭素数1〜10の2価炭化水素基、Rは炭素数1〜4の1価炭化水素基を表し、nは1、2、3、mは0、1、2、を表す)
で示されるケチミン構造含有有機ケイ素化合物。
General formula
Figure 0003583167
(In the formula, R 1 and R 2 represent a hydrogen atom which is not simultaneously a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a carbon atom when R 1 and R 2 are bonded to form a cyclic structure. R 3 and R 4 represent a hydrogen atom which is not simultaneously a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, and R 3 and R 4 are bonded to each other. When it has a cyclic structure, it represents a divalent hydrocarbon group having 5 to 7 carbon atoms, R 5 is a divalent hydrocarbon group having 1 to 10 carbon atoms, and R 6 is a 1-valent hydrocarbon group having 1 to 4 carbon atoms. Represents a valent hydrocarbon group, n represents 1, 2, 3, and m represents 0, 1, 2,
A ketimine structure-containing organosilicon compound represented by the formula:
一般式(化1)において、R、Rがメチル基、R、Rがイソブチル基である請求項1記載のケチミン構造含有有機ケイ素化合物。The ketimine structure-containing organosilicon compound according to claim 1 , wherein, in the general formula (Chemical Formula 1), R 1 and R 3 are a methyl group, and R 2 and R 4 are an isobutyl group. 一般式
Figure 0003583167
(式中のR、R、R、R、nは前記の通り)
と、一般式
Figure 0003583167
(式中、R、R、mは前記の通り。またXはハロゲン原子を表わす。)
で示される化合物とを反応させ、脱ハロゲン化水素反応により、請求項1記載ののケチミン構造含有有機ケイ素化合物を製造する方法。
General formula
Figure 0003583167
(Wherein R 1 , R 2 , R 3 , R 4 and n are as described above)
And the general formula
Figure 0003583167
(In the formula, R 5 , R 6 and m are as described above, and X represents a halogen atom.)
A method for producing the ketimine structure-containing organosilicon compound according to claim 1, wherein the compound is reacted with a compound represented by the formula (1) and subjected to a dehydrohalogenation reaction.
JP18062794A 1994-07-08 1994-07-08 Ketimine structure-containing organosilicon compound and method for producing the same Expired - Fee Related JP3583167B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18062794A JP3583167B2 (en) 1994-07-08 1994-07-08 Ketimine structure-containing organosilicon compound and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18062794A JP3583167B2 (en) 1994-07-08 1994-07-08 Ketimine structure-containing organosilicon compound and method for producing the same

Publications (2)

Publication Number Publication Date
JPH0827167A JPH0827167A (en) 1996-01-30
JP3583167B2 true JP3583167B2 (en) 2004-10-27

Family

ID=16086511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18062794A Expired - Fee Related JP3583167B2 (en) 1994-07-08 1994-07-08 Ketimine structure-containing organosilicon compound and method for producing the same

Country Status (1)

Country Link
JP (1) JP3583167B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3230819B2 (en) 1997-01-21 2001-11-19 横浜ゴム株式会社 One-part normal-temperature moisture-curable resin composition
MX2020012307A (en) 2018-05-18 2021-01-29 Henkel Ag & Co Kgaa Curable compositions comprising adhesion promoters.
EP3936347A4 (en) * 2019-03-07 2022-04-27 JSR Corporation Method for producing modified conjugated diene polymer, modified conjugated diene polymer, polymer composition, crosslinked body and tire

Also Published As

Publication number Publication date
JPH0827167A (en) 1996-01-30

Similar Documents

Publication Publication Date Title
JPS60222492A (en) Preparation of tertiary hydrocarbon silyl compound
JP3414134B2 (en) N, N-bis (trimethylsilyl) aminopropylsilane compound and method for producing the same
JP3583167B2 (en) Ketimine structure-containing organosilicon compound and method for producing the same
JP2530391B2 (en) Sterically shielded aminohydrocarbylsilanes and method of making
JPS6320834B2 (en)
JP2013170123A (en) Method for producing silanol under anhydrous condition
JPH01305094A (en) Omega-silylalkynylsilane compound and production thereof
JP2701103B2 (en) Fluorine-containing organosilicon compound and method for producing the same
JP3915883B2 (en) Organosilicon compound
JP2002020392A (en) N-alkenylazasilacyclopentane and method for producing the same
JPS6328426B2 (en)
JP2827858B2 (en) Organic silicon compound and method for producing the same
JPH0717981A (en) Organosilicon compound and production thereof
JP2631800B2 (en) Cycloalkenylalkylsilane
JP3821191B2 (en) Organosilicon compound and method for producing the same
JPH05247065A (en) Organic silicon compound and its production
JPH07126272A (en) Organosilicon compound and its production
JPH06107671A (en) Organosilicon compound and its production
EP0661290B1 (en) Compounds containing 1-aza-3-oxa-4-silacyclohex-1-enyl groups, and tautomers of said compounds
JPS63253090A (en) Silyl (meth)acrylate having trimethylsiloxy group
JPH0559070A (en) Siloxane compound containing vinyl group and its production
JPH01275586A (en) Fluorine-containing silane coupling agent and production thereof
JPH0820560A (en) Production of ester compound
JPH07267967A (en) Cycloalkyl(2-norbornyl)dialkoxyhsilane compound
JPH11171891A (en) Production of silicon compound

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040713

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040728

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070806

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100806

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100806

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130806

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees