JP3566027B2 - Method for evaluating connection performance of wiring board, evaluation kit for the method, and wiring board - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for evaluating connection performance between wiring boards, an evaluation kit for performing the evaluation, and a wiring board used for performing the evaluation.
[0002]
[Prior art]
As an IC mounting wiring board, for example, an IC chip is mounted on the front surface of a wiring board, and solder balls are attached to pads arranged in a grid on the back surface of the wiring board (this is a ball grid array (BGA) type wiring). Etc.) are known.
[0003]
Such an IC mounting wiring board is electrically connected to a printed wiring board (PCB) via a conductive material. Specifically, in the case of a BGA type wiring board, solder balls are connected to wiring pads formed on the PCB via solder.
Here, the reliability of bonding between the IC mounting wiring board and the PCB differs depending on the material and shape of the substrate of the IC mounting wiring board, the type of solder, and the like. For example, in a use environment where a low temperature and a high temperature are repeated, stress is applied to the IC mounting wiring board due to a difference in thermal expansion coefficient between the IC mounting wiring board made of ceramic such as alumina and the PCB made of resin such as glass epoxy. The electrical connection on the outer peripheral side may be broken. For this reason, before commercialization, it is necessary to conduct a connection reliability evaluation test in advance to confirm that the device can be used without any problem under actual use conditions.
[0004]
Conventionally, such a connection reliability evaluation test has been performed by, for example, the following procedure. That is, as shown in FIG. 12, the PCB test piece 80 having the first wiring pattern 81 formed intermittently over the entire length of the virtual zigzag line ZL (indicated by the broken line), and the same intermittently over the entire length of the virtual zigzag line ZL. And a land grid array (LGA) test piece 90 as a wiring board having the second wiring pattern 91 formed on the substrate. Next, by connecting both wiring patterns 81 and 91 with solder or the like, an assembly A90 having an electric circuit ZC formed over the entire length of the virtual zigzag line ZL is manufactured, and a heat cycle test and the like are performed on the assembly A90. The electrical connection between one end and the other end of the electric circuit ZC has been determined by inspecting with a measuring instrument. In the electric circuit ZC, as shown in a schematic sectional view of FIG. 13, both wiring patterns 81 and 91 are alternately connected via solder balls SB to form a so-called daisy chain.
[0005]
[Problems to be solved by the invention]
However, when the connection performance between the LGA test piece and the PCB test piece of various sizes is evaluated by various tests including the connection reliability evaluation test as described above, each time the size of the LGA test piece differs, the evaluation is performed. Since a PCB test piece corresponding to the size is required, there has been a problem that the manufacturing cost of the PCB test piece increases and the cost of evaluating the connection performance increases.
[0006]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a connection performance evaluation method capable of evaluating connection performance of wiring boards of various sizes at low cost, a kit for evaluating the connection performance, and a wiring board. Is to do.
[0007]
Means for Solving the Problems and Effects of the Invention
In order to solve the above problems, the connection performance evaluation method of the wiring board of the present invention,
A first wiring board having a first wiring pattern intermittently formed over the entire length along a virtual line having a shape extending outward from the center point so as to surround the center point; A second wiring board having a second wiring pattern formed intermittently over the entire length or a part thereof;
By electrically connecting the first wiring pattern and the second wiring pattern via a conductive material, an electrical circuit is formed that is electrically conductive along the entire length or a part thereof along the virtual line,
Perform a performance evaluation test with this electric circuit formed,
Before and after performing this performance evaluation test, by examining a change in a conduction state between a center position corresponding to the center point of the virtual line and an inspection position outside the center point of the virtual line in the electric circuit. Evaluating the connection performance between the first wiring board and the second wiring board
It is characterized by.
[0008]
In the connection performance evaluation method of the present invention, the imaginary line extending outward from the center point while surrounding the center point is, as shown in FIGS. 11A and 11B, a spiral line extending from the center point. 11 (c) to 11 (e), a shape which extends outward while changing direction (U-turn) as needed so as to surround the center point from the center point as shown in FIGS. Virtual line is exemplified. These imaginary lines can correspond to wiring boards having different sizes for each circumference. Specifically, for example, in FIGS. 11 (a), (d) and (e), the number of connection points (indicated by black circles in FIG. 11) is 3 × 3 (= 9), 4 × 4 (= 16), 5 It is possible to correspond to a wiring board having a size of × 5 (= 25), 6 × 6 (= 36), 7 × 7, 8 × 8, 9 × 9, 10 × 10, 11 × 11,. . Also, in FIGS. 11B and 11C, the number of connection points is 3 × 3 (= 9), 5 × 5 (= 25), 7 × 7, 9 × 9, 11 × 11,. ) Can correspond to a wiring board having a size of 4 × 4 (= 16), 6 × 6 (= 36), 8 × 8, 10 × 10,.
[0009]
In addition, the first wiring substrate is, for example, a substrate having a ceramic material such as alumina, aluminum nitride, mullite, glass ceramic or the like as a base material, and the second wiring substrate is, for example, glass-epoxy resin, glass-BT resin. , A resin material such as an epoxy resin, a BT resin, and a polyimide resin as a base material. Conversely, the above-mentioned resin material may be used as the base material of the first wiring board, and the above-mentioned ceramic material may be used as the base material of the second wiring board. Alternatively, the base materials of the first wiring base material and the second wiring base material may be ceramic materials or resin materials.
[0010]
Further, the conductive material refers to a material that electrically connects the first wiring pattern and the second wiring pattern, and includes, for example, a metal ball made of solder, copper, or the like, a metal pin, a columnar solder, and a material that holds these. , A relay board and the like interposed between the first wiring board and the second wiring board.
[0011]
Further, the performance evaluation test refers to a test for evaluating the electrical connection performance between the first wiring pattern and the second wiring pattern, such as a cooling / heating cycle test, a repeated thermal shock test, and a high temperature standing (or load) test. In addition to endurance tests such as low temperature (or load) test, wet (or load) test, heat test, cold test, tensile test, etc. which can be completed once or several times or in a short time Tests and the like. Among these, the performance evaluation test is preferably an endurance test in consideration of a test for confirming that the device can be used without any problem under actual use conditions.
[0012]
By the way, the first wiring pattern of the first wiring board and the second wiring pattern of the second wiring board used in the connection performance evaluation method of the present invention are both formed intermittently along the virtual line. For this reason, when an electric circuit is formed by electrically connecting the first wiring pattern and the second wiring pattern via a conductive material, the second wiring pattern is formed intermittently over the entire length along the virtual line. If the second wiring pattern is formed intermittently along a part of the virtual line, the electric circuit is formed over the entire length of the virtual line. An electrical circuit is formed across the parts.
[0013]
In the connection performance evaluation method of the present invention, for example, by connecting various types of second wiring patterns having different sizes to one type of first wiring pattern, various types of different sizes along the virtual line are connected. An electric circuit is formed. After performing a performance evaluation test on each formed electric circuit, the electric circuit is formed by examining a change in a conduction state between a center position of the virtual line and an inspection position outside the virtual line in the electric circuit. The connection performance between the first wiring board and the second wiring board which has been evaluated is evaluated.
[0014]
Here, the inspection position outside the center position in each electric circuit may be, for example, the outermost position of the second wiring pattern or a position closer to the center position than the outermost position. Good. In the former case, a change in the conduction state from one end (center position) to the other end (outermost position) of the formed electric circuit can be examined. On the other hand, in the latter case, it is possible to examine a change in the conduction state from one end (center position) of the formed electric circuit to the middle thereof.
[0015]
As described above, when various second wiring patterns having different sizes are prepared, in the present invention, it is not necessary to prepare various first wiring patterns corresponding thereto, and only one kind of first wiring pattern is prepared. Is enough. For this reason, the effect that the connection performance evaluation of the wiring board which has various wiring patterns from which a size differs can be performed at low cost.
[0016]
Also, for example, by connecting one type of first wiring pattern to one type of second wiring pattern having the same or smaller size as the first wiring pattern, the same size as the second wiring pattern can be obtained. An electric circuit is formed. After performing a performance evaluation test on the formed electric circuit, the electric circuit is formed by examining a change in the conduction state between the center position of the virtual line and a plurality of inspection positions outside the virtual line in the electric circuit. In addition to the connection performance between the first wiring board and the second wiring board, the connection performance between the first wiring board and a wiring board smaller in size than the second wiring board is evaluated.
[0017]
Here, the plurality of inspection positions outside the center position in each electric circuit refer to, for example, a position obtained by adding a position closer to the center position than the outermost position in addition to the outermost position of the second wiring pattern. . If the inspection position is the outermost position of the second wiring pattern, it is possible to check the change in the conduction state from one end (center position) to the other end (outermost position) of the electric circuit to be formed. On the other hand, when the inspection position is a position closer to the center position than the outermost contour of the second wiring pattern, it is possible to check a change in the conduction state from one end (center position) of the formed electric circuit to the middle thereof. In the latter case, since the imaginary line is formed so as to surround the center point, as a result, a change in the conduction state of a thing smaller in size than the second wiring pattern forming the electric circuit was examined. Become.
[0018]
As described above, even if various second wiring patterns having different sizes are not prepared, if only one type of second wiring pattern is prepared and one type of first wiring pattern having the same size or more is prepared, as a result, In addition, performance evaluation can be performed for the second wiring pattern having a size smaller than the prepared second wiring pattern. For this reason, the effect that the connection performance of the wiring board having various wiring patterns having different sizes can be evaluated at low cost can be obtained.
[0019]
As described above, by connecting one type of first wiring pattern to one type of second wiring pattern having the same size as or smaller than this first wiring pattern, the second wiring pattern After forming an electric circuit of the same size and performing a performance evaluation test on the electric circuit, when examining the conduction state of the electric circuit, only the center position of the virtual line and only one outside the It is only necessary to check the change of the conduction state with the inspection position.
[0020]
In addition, an inspection terminal may be provided at an inspection position of the electric circuit. When a plurality of such inspection terminals are provided, a change in a conduction state between the inspection terminals may be examined.
In the above connection evaluation method of the present invention, when the electrical circuit is disconnected from the center position and the inspection position, the electric line is closer to the virtual line than the inspection position and closer to the virtual line than the inspection position. By examining the continuity between another inspection position located in the center direction along with the center position (or the inspection position), there is a break between the two inspection positions in the electric circuit. Or not.
[0021]
That is, when the electrical connection between the center position and the inspection position in the electric circuit is disconnected, if the electrical connection between the center position and the other inspection position is conducted, or the electrical connection between the inspection position and the other inspection position. If there is no electrical connection between them, it is determined that there is a break between the inspection position in the electric circuit and another inspection position. In this case, an effect is obtained that the break point can be easily specified.
[0022]
The connection performance evaluation kit used to evaluate the connection performance includes a first portion formed intermittently over the entire length along an imaginary line extending outward from a center point while surrounding the center point. It is suitable to have a first wiring board having a wiring pattern and a second wiring board having a second wiring pattern formed intermittently over the entire length or a part thereof along the virtual line.
[0023]
In addition, the wiring board used for evaluating the connection performance is formed intermittently over the entire length or a part thereof along an imaginary line extending outward from the center point while surrounding the center point. Those having a wiring pattern that is suitable are suitable.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described as examples based on the drawings.
[First embodiment]
In this embodiment, a description will be given of an example in which the connection performance of two large and small LGA test pieces is evaluated using one PCB test piece.
[0025]
[1-1] PCB test piece
1A and 1B are explanatory views of a PCB test piece, wherein FIG. 1A is a plan view, FIG. 1B is an internal explanatory view, and FIG. 1C is a partial sectional view.
The PCB test piece 10 (the first wiring board of the present invention) is made of a glass epoxy resin having a substantially square shape, and as shown in FIG. 1A, a large number of PCB pads 13 having a predetermined diameter are provided on one surface in a grid pattern. A first wiring pattern 11 formed intermittently along the entire length of a predetermined virtual spiral line WL (indicated by a dotted line in FIG. 1B) is provided therein. In the first wiring pattern 11, a large number of first mini wirings 12 are intermittently arranged along the virtual spiral line WL over the entire length thereof. As shown in FIG. 1C, the first mini-wiring 12 has PCB pads 13, 13 exposed on the surface of the PCB test piece 10 on both sides thereof.
[0026]
The PCB test piece 10 is formed in a size that matches the largest size of the LGA test pieces 20 and 30 described later (the LGA test piece 20 in this embodiment). The PCB test pieces 10 are prepared only for the types of LGA test pieces (two types in this embodiment) for evaluating the connection performance.
[0027]
Of the many PCB pads 13, a common terminal 14 is provided as a center terminal on the PCB pad 13 substantially at the center of the virtual spiral line WL, and each of the LGA test pieces 20, 30 is located on the outer peripheral side of the common terminal 14. Inspection terminals 15 and 16 are provided at positions corresponding to the sizes.
[0028]
Further, the PCB pads 13, 13 at positions advanced by a predetermined number (two in this case) in the center direction along the virtual spiral line WL from the PCB pads 13, 13 provided with the inspection terminals 15, 16 are provided. , Break point identification inspection terminals 17 and 18 are provided.
[0029]
[1-2] LGA test piece
In the present embodiment, two types of large and small LGA test pieces 20, 30 (both are second wiring boards of the present invention) are used. 2A and 2B are explanatory diagrams of a large LGA test piece, in which FIG. 2A is a rear view, FIG. 2B is an internal explanatory diagram, and FIG. 2C is a partial sectional view. 3A and 3B are explanatory views of an LGA test piece having a small size. FIG. 3A is a rear view, FIG. 3B is an internal explanatory view, and FIG. 3C is a partial sectional view.
[0030]
The large LGA test piece 20 is made of a substantially square alumina ceramic, and as shown in FIG. 2 (a), a large number of LGA pads 23 having a predetermined diameter are provided on one surface in a lattice shape, and the PCB test A second wiring pattern 21 is provided intermittently along the same virtual spiral line WL as the piece 10 over its entire length. As shown in FIG. 2B, the second wiring pattern 21 also includes a large number of second mini-wirings 22 intermittently arranged over the entire length of the virtual spiral WL. The second mini-wiring 22 has LGA pads 23, 23 exposed on the back surface of the LGA test piece 20 on both sides thereof, as shown in a cross section in FIG.
[0031]
Here, when the first wiring pattern 11 and the second wiring pattern 21 are overlapped with each other, a portion of the second wiring pattern 21 where the second mini wiring 22 exists is the first mini pattern of the first wiring pattern 11. The wiring 12 is formed so as not to exist, and the second wiring pattern 21 is formed so that the first mini wiring 12 of the first wiring pattern 11 exists in a portion where the second mini wiring 22 does not exist.
[0032]
3A and 3B are explanatory diagrams of a small-sized LGA test piece. FIG. 3A is a rear view, FIG. 3B is an internal explanatory diagram, and FIG. 3C is a partial sectional view. The LGA test piece 30 is made of a substantially square alumina ceramic. As shown in FIG. 3A, a large number of LGA pads 33 having a predetermined diameter are provided on one surface in a lattice shape, and inside the LGA pad 33, along the virtual spiral line WL. A second wiring pattern 31 formed intermittently over a part of the second wiring pattern 31 is provided. As shown in FIG. 3B, the second wiring pattern 31 includes a plurality of second mini-wirings 32 extending along a part of the virtual spiral line WL, specifically, a predetermined distance from the center of the virtual spiral line WL. Are arranged intermittently up to the outer peripheral position of The second mini-wiring 32 has LGA pads 33, 33 exposed on the back surface of the LGA test piece 30 on both sides as shown in a cross section in FIG.
[0033]
Here, when the first wiring pattern 11 and the second wiring pattern 31 are overlapped with each other, a portion of the second wiring pattern 31 where the second mini wiring 32 exists is the first mini pattern of the first wiring pattern 11. The wiring 12 is formed so as not to exist, and the second wiring pattern 31 is formed so that the first mini wiring 12 of the first wiring pattern 11 exists in a portion where the second mini wiring 32 does not exist.
[0034]
[1-3] Assembly for connection performance evaluation (hereinafter referred to as assembly)
FIG. 4 is a process diagram for providing a solder paste layer on a PCB pad. The surface of the PCB test piece 10 is covered with a metal mask M formed so as to expose only the portion of the PCB pad 13 (see FIG. 4A), and a solder paste (63Sn / 37Pb, Crystal solder) was applied (see FIG. 4B). Thereafter, the metal mask M was removed (see FIG. 4C) to form the solder paste layer SP on the PCB pad 13.
[0035]
FIG. 5 is a process diagram for fixing a solder ball to the LGA pad. The solder paste layer SP was formed on the LGA pad 23 in the same manner as in FIG. 4 for the large LGA test piece 20. Subsequently, as shown in FIG. 5, a jig J having a shape exposing only the LGA pad 23 is set in order to set the solder ball SB, and the solder ball SB (90 Pb / 10 Sn, high-temperature solder) is applied to the solder paste. It was set on the layer SP (see FIG. 5A), and then the jig J was removed. Next, by performing reflow at a low temperature (about 220 ° C.), the solder paste layer SP was melted and solidified to form a solder layer S. Thus, the solder ball SB was fixed to the LGA pad 23 via the solder layer S (see FIG. 5B).
[0036]
6 and 7 are process diagrams for manufacturing the assembly. The PCB test piece 10 and the LGA test piece 20 were joined by the package mounter 40 shown in FIG. 6 to produce an assembly A20 (see FIG. 7). The package mounter 40 includes a base 41, a rotation arm 42 rotatably attached to the base 41, and a support 43 provided at a tip of the rotation arm 42.
[0037]
The procedure for producing the assembly A20 will be described below. First, the PCB test piece 10 having the solder paste layer SP formed on the PCB pad 13 was fixed on the base 41. Further, the LGA test piece 20 having the solder ball SB fixed on the LGA pad 23 via the solder layer S was fixed to the support 43. At this time, the images of the test pieces 10 and 20 on the base 41 and the support 43 via the prism 44 are captured by the CCD camera 45, and the two images are superimposed so that the PCB pad 13 and the LGA pad 23 match. The positioning of both test pieces 10 and 20 was performed. After the positioning, the rotating arm 42 is rotated so that the test pieces 10 and 20 are overlapped, and the solder ball SB of the LGA pad 23 is set on the solder paste layer SP of the PCB pad 13 (see FIG. 7A). . By performing reflow at a low temperature in this state, the solder paste layer SP of the PCB test piece 10 is melted and solidified to form a solder layer S, and the PCB pad 13 and the LGA pad 23 are connected to the solder layer S, the solder ball SB, and the solder layer. The assembly A20 joined via S was obtained (see FIG. 7B).
[0038]
FIG. 8 is an explanatory diagram of the assembly A20. In the assembly A20, the first mini-wirings 12 and the second mini-wirings 22 are alternately connected, so that a so-called daisy chain is completed, and the electric circuit WC1 is formed over the entire length of the virtual spiral WL. I have.
[0039]
Similarly, for the small LGA test piece 30, the solder ball SB is fixed to the LGA pad 33 via the solder layer S in the same manner as described above, and then the PCB test piece 10 and the LGA test piece are mounted by the package mounter 40. 30 were joined to produce an assembly A30. FIG. 9 is an explanatory diagram of the assembly A30. In the assembly A30, a so-called daisy chain is completed by alternately connecting the first mini-wirings 12 and the second mini-wirings 32, and the electric circuit WC2 extends over a part thereof along the virtual spiral WL. Is formed.
[0040]
[1-4] Connection reliability evaluation test
The assembly A20 of FIG. 8 is subjected to a gas phase heat cycle test with 0 ° C. × 20 minutes and 100 ° C. × 20 minutes as one cycle, and for each cycle, the common terminal 14 and the inspection terminal 15 of the PCB test piece 10 The conduction state during was examined. Then, at the time when the conduction is interrupted, one of the connection points of the electric circuit WC1 formed over the entire length of the virtual spiral line WL, that is, the PCB pad 13-the solder layer S-the solder ball SB-the solder layer S-LGA pad 23, It was determined that the destruction had occurred.
[0041]
Furthermore, at the time when the conduction between the common terminal 14 and the inspection terminal 15 is interrupted, the conduction state between the common terminal 14 and the inspection terminal 17 for identifying a break point near the inspection terminal 15 is checked, and the conduction is maintained. I confirmed that In this case, it is considered that one of the two connection points a and b existing between the connection point where the inspection terminal 15 is provided and the connection point where the break point identification inspection terminal 17 is provided is broken. Therefore, the cross sections of these connection points a and b were examined, the broken connection points were specified, and the state of the cross section of the broken connection points was observed. By observing the cross section, it was possible to investigate at which part of the LGA pad 23-the solder layer S-the solder ball SB-the solder layer S-the PCB pad 13 was broken.
[0042]
The connection reliability evaluation test was similarly performed for the assembly A30 in FIG. In this case, the conduction state between the common terminal 14 and the inspection terminal 16 was examined. When the conduction between the common terminal 14 and the break point identification inspection terminal 18 is checked at the time when the conduction between the two is stopped, if the conduction is maintained between the common terminal 14 and the break point identification inspection terminal 18, the connection points c and d are determined. It was found that the fracture occurred in any of the above cases, so that the broken portion could be easily specified.
[0043]
The number of cycles at which the common terminal 14 and the inspection terminal 15 become non-conductive in the assembly A20 using the large LGA test piece 20 depends on the common terminal 14 and the inspection in the assembly A30 using the small LGA test piece 30. The number was smaller than the number of cycles at which the terminals 16 became non-conductive. This is because the LGA test pieces 20 and 30 are made of ceramics while the PCB test piece 10 is made of resin, and thus a stress is generated due to a difference in the coefficient of thermal expansion. Since the outermost portion becomes larger, it is considered that the conduction of the electric circuit is interrupted by the smaller number of cycles in the assembly A20.
[0044]
In this connection reliability evaluation test, for example, various changes are made to the ceramic material of the LGA test pieces 20 and 30, the material of the PCB test piece 10, and the type and shape of the solder used for the solder paste SP or the solder ball SB. Can evaluate how the connection performance changes. For this reason, the ceramic material and the type of solder can be appropriately determined for the IC mounting wiring board in consideration of the actual use conditions.
[0045]
As described above, according to the present embodiment, when various second wiring patterns 21 and 31 having different sizes are prepared, it is not necessary to prepare first wiring patterns of a type corresponding thereto, and only one type of first wiring pattern is required. It is sufficient to prepare the wiring pattern 11. For this reason, the effect that the connection reliability of the wiring board having various wiring patterns having different sizes can be evaluated at low cost can be obtained.
[0046]
In the first embodiment, two types of large and small LGA test pieces 20 and 30 are illustrated. However, the LGA test pieces are manufactured in more sizes, and the connection reliability is evaluated by using the PCB test pieces 10 for each. You may do. Specifically, LGA test pieces having a size of 21 mm, 25 mm, 29 mm, 35 mm, 40 mm, and 45 mm were prepared, and PCB test pieces having a size of 45 mm were prepared to evaluate connection performance. For example, six types of LGA test pieces can be evaluated with one type of PCB test piece.
[0047]
In addition, it is preferable to select a standard size for the pitch of the LGA pads 23 and 33 of the LGA test pieces 20 and 30 (distance between centers of adjacent LGA pads), for example, 1.00 mm or 1.27 mm. Good. In this case, the pitch of the PCB pads 13 of the PCB test piece 10 is also selected to be 1.00 mm or 1.27 mm.
[0048]
[Second embodiment]
FIG. 10 is an explanatory diagram of a PCB test piece according to the second embodiment. The PCB test piece 50 of the present embodiment is made of a substantially rectangular glass epoxy resin, and includes a plurality of (eight in this case) first wiring patterns 11 of the PCB test piece 10 of the first embodiment. A terminal provided with a terminal group 51 which is a set of terminals drawn out from the common terminal 14, inspection terminals 15 and 16, and inspection points 17 and 18 for identifying break points of one wiring pattern 11 was used. When such a PCB test piece 50 is used, an assembly with eight LGA test pieces can be manufactured on one PCB test piece 50, so that the assembly of the assemblies can be subjected to a heat cycle test at a time. For this reason, compared with the case where an assembly is manufactured for each LGA test piece and the heat cycle test of each assembly is performed, the effect that the operation of the heat cycle test can be simplified is obtained.
[0049]
[Third embodiment]
In the present embodiment, only the assembly A20 of the first embodiment was prepared, and a heat cycle test was performed on the assembly A20, and conduction between the common terminal 14 and each of the inspection terminals 15 and 16 was checked every cycle. Generally, when the number of heat cycle tests is increased, a disconnection occurs between the common terminal 14 and the outermost inspection terminal 15, and when the number of cycle tests is further increased, the inner peripheral side inspection terminal 16 is disconnected. A disconnection occurs between the two. For this reason, if only the LGA test piece 20 of the maximum size is prepared, the heat cycle test results of the LGA test pieces of various sizes can be easily obtained without dare to prepare the LGA test piece 30 of a smaller size. The effect that it can be obtained is obtained.
[0050]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that the present invention can be implemented in various modes as long as they fall within the technical scope of the present invention.
For example, in the above embodiment, the case where the LGA test pieces 20 and 30 are joined to the PCB test piece 10 using the solder balls SB, that is, the BGA type has been described as an example. The connection performance may be examined by connecting the pins to the PGA type.
[0051]
Although the common terminal (center terminal) and the inspection terminal are provided in the above-described embodiment, the conduction state between the center position of the electric circuit and the inspection position may be examined without providing such a terminal. .
[Brief description of the drawings]
FIG. 1 is an explanatory view of a PCB test piece of a first embodiment, (a) is a plan view, (b) is an internal explanatory view, and (c) is a partial sectional view.
FIGS. 2A and 2B are explanatory views of the LGA test piece of the first embodiment, wherein FIG. 2A is a rear view, FIG. 2B is an internal explanatory view, and FIG.
3A and 3B are explanatory views of the LGA test piece of the first embodiment, wherein FIG. 3A is a rear view, FIG. 3B is an internal explanatory view, and FIG. 3C is a partial sectional view.
FIG. 4 is a process diagram for providing a solder paste layer on a PCB pad.
FIG. 5 is a process diagram for fixing a solder ball to an LGA pad.
FIG. 6 is a process chart for manufacturing an assembly.
FIG. 7 is a process chart for manufacturing an assembly.
FIG. 8 is an explanatory diagram of the assembly.
FIG. 9 is an explanatory view of the assembly.
FIG. 10 is an explanatory view of a PCB test piece of a second embodiment.
FIG. 11 is an explanatory diagram of a virtual line according to the present invention.
FIG. 12 is an explanatory diagram of a conventional example.
FIG. 13 is a longitudinal sectional view of a conventional electric circuit.
[Explanation of symbols]
Reference numeral 10: PCB test piece, 11: first wiring pattern, 12: first mini wiring, 13: PCB pad, 14: common terminal, 15, 16: inspection terminal, 17 , 18 ... inspection terminal for breaking point identification, 20, 30 ... LGA test piece, 21, 31 ... second wiring pattern, 22, 32 ... second mini wiring, 23, 33 ... LGA pad, 40: package mounter, 41: base, 42: rotating arm, 43: support, 44: prism, 45: CCD camera, 50: PCB Test piece, 51: Terminal group, A20, A30: Assembly, J: Jig, M: Metal mask, S: Solder layer, SB: Solder ball, SP ... Solder paste layer, WC1, WC2 ... electric circuit WL ··· virtual spiral.

Claims (6)

A first wiring board having a first wiring pattern intermittently formed over the entire length along a virtual line having a shape extending outward from the center point so as to surround the center point; A second wiring board having a second wiring pattern formed intermittently over the entire length or a part thereof;
By electrically connecting the first wiring pattern and the second wiring pattern via a conductive material, an electrical circuit is formed that is electrically conductive along the entire length or a part thereof along the virtual line,
Perform a performance evaluation test with this electric circuit formed,
Before and after performing this performance evaluation test, by examining a change in a conduction state between a center position corresponding to the center point of the virtual line and an inspection position outside the center point of the virtual line in the electric circuit. And evaluating the connection performance between the first wiring board and the second wiring board. One kind of a first wiring board having a first wiring pattern formed intermittently over the entire length along a virtual line having a shape extending outward from the center point so as to surround the center point; Along with the entire length or a part thereof, a plurality of types of second wiring boards having a second wiring pattern formed intermittently,
The various types of second wiring boards have different sizes of second wiring patterns, respectively.
By electrically connecting the first wiring pattern and any of the second wiring patterns of the various types of second wiring boards via a conductive material, the entire length or a part thereof along the virtual line Form an electrical circuit that conducts over
Perform a performance evaluation test with this electric circuit formed,
Before and after performing this performance evaluation test, by examining a change in a conduction state between a center position corresponding to the center point of the virtual line and an inspection position outside the center point of the virtual line in the electric circuit. And evaluating the connection performance between the first wiring board and the second wiring board forming the electric circuit. One kind of a first wiring board having a first wiring pattern formed intermittently over the entire length along a virtual line having a shape extending outward from the center point so as to surround the center point; A second wiring board having a second wiring pattern formed intermittently along the entire length or a part thereof along
By electrically connecting the first wiring pattern and the second wiring pattern via a conductive material, an electrical circuit is formed that is electrically conductive along the entire length or a part thereof along the virtual line,
Perform a performance evaluation test with this electric circuit formed,
Before and after performing the performance evaluation test, a change in a conduction state between a center position of the electric circuit corresponding to the center point of the virtual line and a plurality of inspection positions outside the center point of the virtual line is examined. Thereby, in addition to the connection performance between the first wiring board and the second wiring board, the connection performance between the first wiring board and a wiring board smaller in size than the second wiring board is also evaluated. Method for evaluating the connection performance of printed wiring boards. It is a connection performance evaluation method of the wiring board according to any one of claims 1 to 3,
When the electrical circuit becomes non-conductive between the center position and the inspection position, another inspection is performed near the inspection position and located closer to the center along the virtual line than the inspection position. Determining whether there is a break between the two inspection positions in the electric circuit by examining a conduction state between a position and the center position (or the inspection position). Method for evaluating the connection performance of printed wiring boards. A connection performance evaluation kit for evaluating connection performance when wiring boards are connected to each other via a conductive material,
A first wiring board having a first wiring pattern intermittently formed over the entire length along a virtual line having a shape extending outward from the center point so as to surround the center point;
A second wiring board having a second wiring pattern formed intermittently over the entire length or a part thereof along the imaginary line, and a connection performance evaluation kit for a wiring board. A wiring board used to evaluate the connection performance when the wiring boards are connected via a conductive material,
A wiring substrate having a wiring pattern formed intermittently over the entire length or a part thereof along an imaginary line extending outward from a center point while surrounding the center point.

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