JP3563726B2

JP3563726B2 - Wafer support member

Info

Publication number: JP3563726B2
Application number: JP2002092548A
Authority: JP
Inventors: 恒彦中村
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2002-03-28
Filing date: 2002-03-28
Publication date: 2004-09-08
Anticipated expiration: 2022-03-28
Also published as: JP2003297714A

Description

【０００１】
【発明の属する技術分野】
本発明は、主にウエハを加熱するのに用いるウエハ支持部材に関するものであり、例えば、半導体ウエハや液晶基板あるいは回路基板等のウエハ上に導体膜や絶縁膜を生成したり、前記ウエハ上に塗布されたレジスト液を乾燥焼き付けしてレジスト膜を形成するのに好適なウエハ支持部材に関するものである。
【０００２】
【従来の技術】
例えば、半導体製造装置の製造工程における、導体膜や絶縁膜の成膜処理、エッチング処理、レジスト膜の焼き付け処理等の半導体ウェハ（以下ウェハと略す）への加工において、ウエハを加熱するためにウエハ支持部材が用いられている。
【０００３】
従来の半導体製造装置は、まとめて複数のウエハを成膜処理するバッチ式のものが使用されていたが、ウエハの大きさが８インチから１２インチと大型化するにつれ、処理精度を高めるために、一枚づつ処理する枚葉式と呼ばれる装置が近年使われている。しかしながら、枚葉式にすると１回当たりの処理数が減少するため、ウエハの加工時間の短縮が必要とされている。このため、ウエハ支持部材に対して、ウエハの加熱時間の短縮、ウエハの吸着・脱着の迅速化と同時に加熱温度の精度の向上が要求されていた。
【０００４】
上記のようなウエハ支持部材の例として、例えば特開平１１−２８３７２９号公報に示してあるようなウエハ支持部材２１がある。このウエハ支持部材２１は、図８に示すように、ケーシング３１、板状セラミック体２２および板状反射体としてのステンレス板３３を主要な構成要素としている。ケーシング３１は有底状の金属製部材（ここでは、アルミニウム製部材）であって、断面円形状の開口部３４をその上部側に備えている。このケーシング３１の中心部には、図示しないウエハ支持ピンを挿通するためのピン挿通孔３５が３つ形成されている。ピン挿通孔３５に挿通されたウエハ支持ピンを上下させれば、ウエハＷを搬送機に受け渡したり、ウエハＷを搬送機から受け取ったりすることができる。また、図９に示す抵抗発熱体２５の導通端子部には、導通端子２７がロウ付けされており、該導通端子２７がステンレス板３３に形成された穴５７を挿通する構造となっている。また、底部３１ａの外周部にはリード線引出用の孔３６がいくつか形成されている。この孔３６には、抵抗発熱体に電流を供給するための不図示のリード線が挿通され、該リード線は前記導通端子２７に接続されている。
【０００５】
また、板状セラミック体２２を構成するセラミック材料としては、窒化物セラミックスまたは炭化物セラミックスが用いられ、抵抗発熱体２５は、図９に示すように、同心円状に形成した複数のパターンに通電することにより、板状セラミック体２２を加熱するウエハ支持部材２１が提案されている。
【０００６】
このようなウエハ支持部材２１において、ウエハＷの表面全体に均質な膜を形成したり、レジスト膜の加熱反応状態を均質に加工処理するためには、ウエハＷの温度を正確に測定するとともにウェハＷの温度を一定に温度制御することが重要である。そこで、ウェハＷの温度を測定する測温素子が使われ、上記ウエハ支持部材の凹部２３に測温素子が取り付けられている。
【０００７】
特開平９−４５７５２号公報には、図１０に示すように、ウエハ支持部材に載せたウェハＷの温度を測定し、金属製の板状体４０の上面４０ａの温度を制御する測温抵抗体素子１５０の配置方法が示されている。前記板状体４０の温度の精度やレスポンス等が優れ、温度調節の精度を高める方法として、凹部４１に挿入された測温素子１５０の長手方向の温度差を小さくし、前記測温抵抗体素子１５０を板状体４０の上面に平行に配置する方法が示されている。この測温素子はＰｔからなる測温素子１５０が保護管１５１に挿入され、板状体４０の上面４０ａに対し平行となるように配置されている。
【０００８】
さらに保護管１５１内の隙間には伝熱セメント５２が充填されている。特に、抵抗発熱体を分割制御する場合は、測定の正確さと同時に測定バラツキを管理しないと上記板状体４０の正確な温度制御ができなくなるので、このような取付構造とすることが好ましいとされていた。
【０００９】
また、特開平４−９８７８４号には、単一の抵抗発熱体を板状セラミック体に埋設したウェハ加熱装置において、ウェハ加熱面の温度が最適値から外れることを防止するために、測温点をウェハ加熱領域の中心からウェハ加熱領域の半径のほぼ１／√２の位置とすることが示されている。
【００１０】
また、特開２００１−８５１４４号公報には、図９に記載の厚み３ｍｍの板状セラミック体２２に深さ２ｍｍ、直径１．２ｍｍの凹部２３に測温素子として線径０．５ｍｍ以下の熱電対を挿入し耐熱性樹脂で封したウエハ支持部材２１が開示されている。
【００１１】
【発明が解決しようとする課題】
しかしながら、近年注目されている枚葉式のウエハ支持部材に使用される板状セラミック体は、ウエハ１枚あたりの加工処理時間を短縮するために、厚みを２〜５ｍｍと薄くし、加熱および冷却のサイクルタイムが短くなるように調整する必要がある。しかしながら、ウエハの表面全体を±０．５℃というレベルに均一に加熱するには、板状セラミック体に測温素子を従来の方法で配設するだけではウェハを均一に加熱するとの目標を達成できないとの課題があった。
【００１２】
上記のようなウエハ支持部材において、特開平９−４５７５２号公報のように測温素子１５０を板状体４０のウェハＷを載せる載置面４０ａに平行に配置しても、金属からなる板状体４０は厚みが３０ｍｍ以上と厚く板状体４０を急速に昇温したり降温したりすることが出来なかった。更に、測温素子１５０本体や測温素子１５０への接続部材から熱が板状体４０の外に流れ、測温部の温度が低下したり、測温素子１５０が板状体４０の凹部４１の底面に熱的に確実に接続できないことから板状体４０や前記ウェハＷの温度を正確に測定できない虞があるとの課題があった。
【００１３】
また、前記板状体４０に備えた抵抗発熱体や前記載置面４０ａから測温素子１５０までの距離により設定温度に対しウェハＷの温度の追従性が悪く温度が変動し一定の温度に制御するまでの時間が掛かりウェハＷの加工処理時間が長くなるとの問題があった。
【００１４】
【課題を解決するための手段】
そこで、上記課題に鑑み、本発明のウエハ支持部材は、板状セラミック体の一方の主面側を、ウェハを載せる載置面とし、上記板状セラミック体の他方の主面又は内部に抵抗発熱体を備えるとともに、上記板状セラミック体の他方の主面に凹部を有し、該凹部内に、測温素子とリード線とからなる測温体を挿入し、固定部材にて保持させ、上記測温体の測温素子からリード線が固定部材より露出するまでのリード線の長さを、上記リード線の線径の２倍より大きく３０倍以下としたことを特徴とする。
【００１５】
また、上記測温体のリード線の線径をＡ、測温素子から抵抗発熱体までの最短距離をＬ１、測温素子から板状セラミック体の一方の主面へ鉛直に延ばした垂線と、板状セラミック体の一方の主面との交点から抵抗発熱体までの最短距離をＬ２とした時、次の関係を満足するようにすることが好ましい。
【００１６】
（Ｌ２−７×Ａ）＜Ｌ１＜（Ｌ２−Ａ）
さらに、上記固定部材の熱伝導率は、板状セラミック体の熱伝導率の６０％以上、３００％以下とし、さらにはビッカース硬度が５０以下の金属により形成することが好ましい。
【００１７】
また、上記測温体の測温素子は、凹部底面に対して平行に配接することが好ましい。
【００１８】
【発明の実施の形態】
以下、本発明の実施の形態について説明する。
【００１９】
図１は本発明に係るウエハ支持部材１の一例を示す断面図であり、炭化珪素、アルミナまたは窒化アルミニウムを主成分とするセラミックスの板状体からなる板状セラミック体２の一方の主面３をウエハＷを載せる載置面とするとともに、他方の主面に抵抗発熱体５を形成し、該抵抗発熱体５に電気的に接続する給電部６を具備し、前記抵抗発熱体５による加熱温度を板状セラミック体２の凹部９に固定した測温素子８ａで測定してウエハ支持部材１を構成したものである。支持ピン１２は板状セラミック体２を貫通する孔を通してウェハＷを上下に移動させウェハＷを主面３に載せたり降ろしたりすることができる。そして、給電部６に給電端子１１が接続し外部から電力が供給され、測温素子８ａとリード線８からなる測温体で温度を測定しながらウェハＷを加熱することができる。
【００２０】
抵抗発熱体５のパターン形状としては、図２に示したような渦巻き状のパターン、もしくは図３、４に示したように複数のブロックに分割され、個々のブロックが円弧状のパターンと直線状のパターンとからなる渦巻き状やジグザクな折り返し形状をしたものとすることができる。そして、抵抗発熱体５を複数のブロックに分割する場合、それぞれのブロックの温度を独立に測定し制御することにより、主面３上のウェハＷを均一に加熱できるように構成している。
【００２１】
また、抵抗発熱体５は、導電性の金属粒子にガラスフリットや金属酸化物を含むペーストを印刷法で板状セラミック体２に印刷したもので、前記金属粒子としてはＡｕ、Ａｇ、Ｃｕ、Ｐｄ、Ｐｔ、Ｒｈの少なくとも一種を含む成分からなる。ガラスフリットはＢ、Ｓｉ、Ｚｎを含む酸化物からなるものが好ましい。この様なガラスや金属酸化物と金属粒子を混合した抵抗発熱体５とすることで、抵抗発熱体５の熱膨張係数を板状セラミック体２の熱膨張係数に近いものとすることができる。
【００２２】
また、主面３には図５に示すように、板状セラミック体２の一方の主面３から一定の距離にウェハＷを保持する様に、前記主面３に複数の支持ピン４から構成されていても良い。
【００２３】
本発明のウエハ支持部材１は、板状セラミック体２の一方の一主面３を、ウェハＷを載せる載置面とするか、あるいは、前記主面３から一定の距離にウェハＷを保持し、前記主面の反対側から加熱面に向けて凹部９を設けると共に、前記凹部９に測温素子８ａを挿入したウエハ支持部材１において、前記凹部９に測温素子８ａを固定する固定部材１７を備え、前記板状セラミック体２に前記固定部材１７に覆われるか或いは挟まれた部分の前記測温素子８ａの長さが前記測温素子８ａの線径Ａの２倍より大きく３０倍以下であることを特徴とする。
【００２４】
ウェハＷを載せるか或いは一定の距離にウェハＷを支持する板状セラミック体２の一方の主面と異なる他方の主面に凹部９を形成し、凹部９に測温素子８ａを挿入し、板状セラミック体２の温度を測定する。前記凹部９の大きさは直径２〜５ｍｍで、板状セラミック体２の好ましい厚み２〜５ｍｍの３分の２程の深さに穿孔され、板状セラミック体２の一方の主面３の温度が正確に反映され、測温素子８ａと、凹部９の底面９ａとの接触界面との熱的抵抗が小さくなるように、凹部９の底面９ａに測温素子８ａを直接接触させるか、或いは熱的抵抗を小さくするよう凹部９の底面９ａに熱伝導率が１００Ｗ／（ｍ・Ｋ）以上と大きく、変形し易い金属箔やペーストからなる熱的接続部材１５を介して測温素子８ａを接続することが好ましい。
【００２５】
更に、厚みが２〜５ｍｍの板状セラミック体２の主面３の温度を正確に測温するために、板状セラミック体２の主面３の温度を測温素子８ａに伝えることが必要であり、測温素子８ａとして例えば熱電対であれば、測温点から熱電対の線径の２倍より大きい長さに渡り凹部９と熱的接続部分があると主面３の温度を感度良く正確に測定できる。例えば熱電対からなる、測温素子８ａのリード線８の線径の２倍以下であると、測温点の熱が測温素子８ａから延びるリード線８自身を介して板状セラミック体２の外部へ流れ、測温点の温度が低下する虞があるからである。好ましくは２倍より大きく、より好ましくは５倍以上で、更に好ましくはリード線８の７倍以上であり、特に測温点からの測温素子８ａからリード線８の直線部がリード線８の線径の４倍以上あると好ましく、更にこの直線部は凹部底面９ａに平行とすることで主面３の温度を感度良く測温できることから好ましい。そして、前記直線部が板状セラミック体２の一方の主面に平行であるとより好ましい。
【００２６】
尚、前記の凹部９との熱的接続部分とは、凹部９の底面９ａに固定部材１７としてロウ材や熱導伝性ペーストで測温素子８ａを固定する場合には、測温素子８ａから延びるリード線８及び又は測温素子８ａが凹部９内の前記ロウ材や熱導伝性ペーストで覆われた部分を示す。前記固定部材１７として固形物を使用した場合、前記熱的接続部分は凹部９の固定部材１７と測温素子８ａや測温素子８ａから延びるリード線８が接触している部分を指す。また、固形の固定部材１７を使用した場合には固定部材１７で測温素子８ａが埋設されてないことから雰囲気ガスの影響を受けるが、大気中で使われるコータデベロッパ用のウエハ支持部材１では雰囲気ガスの影響はなく、取り扱い上からも好適である。
【００２７】
特に、図５に示す固定部材１７が固形の場合、測温素子８ａがセラミック製の凹部９と熱的接続が確実になされるように、凹部９の底面９ａに熱的接続部材１５として軟質の金属箔からなるアルミニウム箔等を置き、このアルミニウム箔等からなる熱的接続部材１５を介して、測温素子８ａを固定部材１７で押し付け、測温素子８ａが凹部９と面で接触するように配接することが好ましい。
【００２８】
凹部９がヤング率２００ＧＰａ以上の剛性の大きな板状セラミック体２からなり、凹部底面９ａは加圧による変形が小さいことから、測温素子８ａを凹部９と面接触させるには、凹部９の底面９ａに熱的接続部材１５を介し底面９ａと熱的接続部材１５を面接触させ、熱的接続部材１５と測温素子８ａや測温素子８ａから延びるリード線８を面で接触させることが好ましい。通常、セラミック製の凹部底面９ａの変形が小さいことから直接測温素子と凹部底面９ａが面接触し難いので、測温素子８ａを加圧することにより、熱的接触部材１５として変形が大きく面接触し易いアルミニウム、銀等の金属箔を介して測温素子８ａを取り付けることは、凹部９と測温素子８ａの界面の熱的な抵抗を小さくする上で効果的であり、主面３の正確な温度を測定する上で有効である。
【００２９】
前記凹部９に前記測温素子８ａや測温素子８ａから延びるリード線８を固定する固定部材１７を備え、前記板状セラミック体２に前記固定部材１７に覆われるか或いは挟まれた前記測温素子８ａからリード線８の長さが、前記リード線８の線径Ａの３０倍以下であることが重要である。前記測温素子８ａを固定する凹部９を大きくしたり、前記リード線８を渦巻き状に旋回したりして線径Ａの３０倍を越えると、凹部９内のリード線８の長さが大きくなることから、２〜５ｍｍと薄い板状セラミック体２とリード線８の熱伝導率や熱容量の違いにより板状セラミック体２の主面３の温度分布が変化する虞があるためである。好ましくは、前記固定部材１７に覆われるか或いは挟まれた前記測温素子８ａからリード線８の長さが前記リード線８の線径Ａの２０倍以下である。この様に設定することにより測温素子８ａの温度は板状セラミック体２の主面の温度と０．３℃以内に抑えることが可能であり、しかも主面３の温度変化に対して追従性を高めることが可能である。
【００３０】
次に、上記ウエハ支持部材１の主面３の温度は上述の様に測温素子８ａやリード線８を配設することで正確に測定できるのであるが、ウェハＷの温度を一定に制御するには、上述の測温素子８ａで板状セラミック体２の主面の温度を測定しながら板状セラミック体２に備えた抵抗発熱体５に電力を供給し発熱させ、前記主面の温度を均一になるよう制御している。そのためには、抵抗発熱体５から板状セラミック体２までの熱の伝導性及び板状セラミック体２の主面から測温素子８ａへの熱の伝わり、抵抗発熱体５から測温素子８ａへの熱の伝わり方が特に重要である。抵抗発熱体５の熱は前記主面３に伝わり、しかもウェハＷの温度分布が均一であることが要求される。
【００３１】
しかし、抵抗発熱体５の熱が前記主面３より遅く測温素子８ａを加熱すると前記主面３の温度を測温素子８ａで追従性良く正確に測定することが困難となる。この点から、前記測温素子８ａから前記抵抗発熱体５までの最短距離Ｌ１と、測温素子８ａから板状セラミック体２の一方の主面３へ鉛直に延ばした垂線と、板状セラミック体２の一方の主面３との交点Ｐから前記抵抗発熱体５までの最短距離Ｌ２とが同等で、しかも各最短距離の間隔における熱抵抗ができる限り小さいことが好ましい。そこで、本願発明者は、この間隔Ｌ１、Ｌ２は測温素子の線径と関連し、間隔Ｌ１、Ｌ２と適切な関係を満足させることが重要であり、適切な関係を満足させることでウェハＷの温度分布が均一で、しかも温度変更が迅速・容易なウエハ支持部材１を提供できることを究明した。
【００３２】
前記の適切な関係とは、Ｌ１は間隔（Ｌ２−７×Ａ）より大きく、（Ｌ２−Ａ）より小さいことが好ましい。
（式１）
（Ｌ２−７×Ａ）＜Ｌ１＜（Ｌ２−Ａ）
Ｌ１が（Ｌ２−Ａ）より大きいと測温素子８ａが主面３に接近し過ぎることから主面３の測温素子に近い部分の温度が低下しウェハＷの温度分布が悪くなると共に主面３を代表する温度を測定できなく虞があるからである。また、Ｌ１が（Ｌ２−７×Ａ）より小さいと主面３の温度より抵抗発熱体５の温度の影響が大きく、主面３の温度を正確且つ迅速に測温素子８ａで測定することが困難となり、ウェハＷの温度を一定に制御したり／ウェハを急速に昇温すると、ウェハＷの温度を設定温度に制御できないばかりか、ウェハＷの温度がオバーシュートしたりする可能性が大きくなるからである。
【００３３】
また、凹部９に測温素子８ａやリード線８を固定する熱的接続部材１５や固定部材１７の熱伝導率は１００Ｗ／（ｍ・Ｋ）以上が好ましく、更に板状セラミック体２の熱伝導率の６０％より大きく、板状セラミック体２の熱伝導率の３００％以下であることが好ましい。熱的接続部材１５や固定部材１７の熱伝導率が１００Ｗ／（ｍ・Ｋ）未満であったり、板状セラミック体２の熱伝導率の６０％より小さいと、板状セラミック体２の主面３の温度が速やかに測温素子８ａに伝わらないことから、ウェハＷの温度を精度良くしかも迅速に制御し難くなる虞があり、熱的接続部材１５や前記固定部材１７の熱伝導率が板状セラミック体２の熱伝導率の３００％以上では、板状セラミック体２との熱伝導率の差が大きすぎることから前記凹部９に測温素子８ａと熱的接続部材１５や固定部材１７を装填すると、凹部９直上の主面３にホットスポットやクールスポットが発生しウェハＷの温度分布が悪くなる虞があり好ましくない。
【００３４】
更に、前記熱的接続部材１５は、１Ｎの荷重を３０秒間加え測定したビッカース硬度Ｈｖが５０以下であることが好ましい。ビッカース硬度が５０以上では測温素子８ａと熱的接触部材５１や熱的接触部材５１と凹部底面８ａとの接触面積が小さく板状セラミック体２の主面３の温度を迅速に測定することが難しく、ウェハＷの温度を一定に制御したり、急速にウェハＷ温度を昇温すると温度がオーバシュートすることがあった。従って熱的接続部材１５の硬度Ｈｖは５０以下が好ましく、更に好ましくは３０以下である。
【００３５】
この様な熱的接続部材１５としては銀、アルミニウム、白金や金が好ましく、熱的接続部材１５の厚みは１０μｍから３００μｍが好ましい。熱的接続部材１５の厚みが１０μｍ以下では測温素子８ａやリード線８を押し付けても面接触する範囲が小さく厚みが３００μｍ以上では熱の伝達が遅くなり迅速な測温が難しくなる。好ましくは、熱的接続部材１５の厚みは５０〜２００μｍである。
【００３６】
また、前記凹部９の底面９ａに前記測温素子８ａやリード線８の先端部が主面３に平行に配設することが好ましい。測温素子８ａやリード線８の先端部が主面３に平行に配設されていないと、測温素子８ａの熱がリード線８を伝わり逃げることから測温した温度が低下し、正確なウェハＷの温度を測定できないからである。測温素子８ａの先端部が主面３と平行な長さは２〜３ｍｍが好ましい。２ｍｍ以下では測温部の検知部が短いことから熱の逃げが大きく正確な測温をすることが難しい。また、３ｍｍ以上では凹部の内径が大きくなり過ぎて凹部上面にクールスポットを生じる危険性があるからである。
【００３７】
次に、本発明の他の実施形態を示す。
【００３８】
図６は、抵抗発熱体５により加熱が容易で加熱による変形が小さな２から５ｍｍの板厚の板状セラミック体２に測温素子８ａを取り付けた本発明の他の実施形態を示す図である。凹部の深さは板厚の２／３程で、凹部の直径は３ｍｍであり、測温素子８ａやリード線８として０．３から０．８ｍｍで表面を絶縁処理した熱電対を使い、熱電対の先端２〜３ｍｍを折り曲げ凹部９にロウ付けしたもので、例えば金錫ロウや銀銅ロウが使用できる。ロウ付けの他、硬化収縮の非常に小さな例えば銀・エポキシ樹脂を混合した熱伝導性ペーストで接着しても良い。そして、これらのロウ材や熱伝導性ペーストは測温素子８ａや測温素子８ａに近いリード線８を固定する前記固定部材１７の熱的特性や機械的特性を有していると、ウェハＷの温度を正確に精度良くしかも感度良く測定することができることを究明できた。
【００３９】
図７は、図６と同様の板状セラミック体２に同様の凹部９を形成し、熱的接続部材１５を凹部底面９ａに備え、測温素子８ａとリード線８を固定部材１７で押圧したもので、固定部材１７を押圧する加圧ピン１６を有しており、加圧ピン１６と固定部材１７の間には断熱層として熱伝導率が５Ｗ／（ｍ・Ｋ）以下のアルミナ・ジルコニア複合セラミックやテフロン等の耐熱樹脂からなる断熱部材２０が用いられれる。そして加圧ピン１６は外部に備えたスプリングバネ１８で断熱部材２０を押圧する構造としている。
【００４０】
一方、ウエハ支持部材１を構成する板状セラミック体２の材質としては、耐摩耗性、耐熱性に優れるアルミナ、窒化珪素、サイアロン、窒化アルミニウム、炭化珪素を用いることができ、この中でも特に窒化アルミニウムや炭化珪素は熱伝導率が５０Ｗ／（ｍ・Ｋ）以上、さらには１００Ｗ／（ｍ・Ｋ）以上の高い熱伝導率を有するとともに、ヤング率が３００ＧＰａ、４００ＧＰａと大きく、加熱による板状セラミック体２の変形が小さく好ましい。更に、フッ素系や塩素系等の腐食性ガスに対する耐蝕性や耐プレズマ性にも優れることから、板状セラミック体２の材質として好適である。
【００４１】
このようなウエハ支持部材１を製造する方法として、まず、板状セラミック体２をなすＡｌＮ粉末に炭酸カルシウム等の焼結助剤を加え、アクリル系のバインダを添加し板状に成形し、カーボン残さを残した成形体を２０００℃程で加圧焼結させる。または、窒化アルミニウム粉末に０．１質量％のカルシアを添加しバインダを添加し造粒した粉末を板状に成形し窒素雰囲気中で２０００℃以上で焼成する。焼結した板状セラミック体２の表裏面を研削加工し、円板状に加工する。そして他方の主面に前記抵抗発熱体５を印刷し抵抗発熱体５を設ける。抵抗発熱体５の存在領域が略円形をした図２に示す中央から外周へ向かう渦巻き状の抵抗発熱体５や図３、４に示す抵抗発熱体５を配設した板状セラミック体２を形成する。
【００４２】
しかるのち、板状セラミック体２の上面に研摩加工を施してウェハＷを載置するかあるいは主面３から一定の距離にウェハＷを支持する主面３を形成するとともに、下面に給電端子１１と板状セラミック体２を固定する有底筒状体１９に取り付け固定している。
【００４３】
なお、図１では板状セラミック体２の他方の主面３に抵抗発熱体５のみを備えたウエハ支持部材１について示したが、本発明は、主面３と抵抗発熱体５との間に静電吸着用やプラズマ発生用としての電極を埋設したものであっても良いことは言うまでもない。更に抵抗発熱体５を板状セラミック体２の他方の主面に設けたヒータについて述べたが、抵抗発熱体５を板状セラミック体２の載置面３と異なる主面に形成しガラス等で埋設しても同様の効果が得られる。
【００４４】
また、抵抗発熱体５が板状セラミクス体２の主面３に設けられた例を示したが、板状セラミックス体２の載置面と異なる主面側に抵抗発熱体５を埋設したウエハ支持部材でも同様の効果が得られる。
【００４５】
【実施例】
（実施例１）
ここで、板状セラミック体２として平均粒径１．２μｍの窒化アルミニウム粉末に平均粒径１μｍのカルシアを０．１質量％添加し混合粉砕しアクリルバインダを添加しφ４００ｍｍの板状に成形し、空気中と窒素雰囲気中の４００℃で１時間脱バインダ処理した後、２０００℃の窒素雰囲気中で焼結した。焼結体の表裏面を研削加工しφ３２０ｍｍで厚み３ｍｍの円板状の板状セラミック体２を得た。そして、この板状セラミック体２の他方の主面３に金属銀５０質量％含み、Ｂ２Ｏ３・ＳｉＯ２・ＺｎＯガラス（熱膨張係数４．４ｘ１０^−６／℃）を５０質量％含む粉体に溶剤を添加しペーストを作製した。
【００４６】
そして、板状セラミック体２の他方の主面に抵抗発熱体５として上記ペーストを２０μｍの厚みにスクリーン印刷法で印刷した。そして、個々の各抵抗発熱体５に対応して直径３ｍｍで深さ２ｍｍの凹部９を作製した。そして、凹部９の底面９ａに熱的接続部材１５として１００μｍの厚みのアルミニウム箔を置き、測温素子８ａやリード線８として線径０．５ｍｍと０．３ｍｍの熱電対を先端から数ミリの位置で渦巻き状に巻き先端部をアルミ箔の上に置き、アルミニウム製のφ２．９ｍｍ、厚み２ｍｍで測温素子が通過する溝を取り付けた固定部材１７で測温素子を押さえた。固定部材１７は外径２．５ｍｍで厚み５００μｍのジルコニアセラミックからなる断熱部材２０を介して加圧ピン１６で測温素子８ａやリード線８を加圧し凹部９の底面９ａと熱的に接続させた。尚、熱的接続をする上で、固定部材１７に覆われるか或いは挟まれた測温素子８ａからリード線８の長さはリード線８を渦巻き状に巻いた長さで調整した。
【００４７】
また、試料Ｎｏ．７は、銀―銅ロウからなる固定部材を３５０℃に加熱後圧入して作製した。
【００４８】
そして、固定部材に覆われるか或いは挟まれた測温素子８ａからリード線８の長さを変えたウエハ支持部材を作製し、夫々のウエハ支持部材に電源を取り付け２５℃から２００℃まで５分間でウェハＷを昇温し、ウェハＷの温度を２００℃に設定してからウェハＷの平均温度が２００℃±０．５℃の範囲で一定となるまでの時間を応答時間として測定した。また２００℃に設定し３０分後のウェハ温度の最大値と最小値の差をウェハＷの温度差として測定した。そして、表１の結果を得た。
【００４９】
【表１】

【００５０】
試料Ｎｏ．１は固定部材に挟まれた測温素子８ａからリード線８の長さがリード線８の外形の２倍と小さ過ぎることから応答時間が６４秒と大きく、しかもウェハの温度差も１．５℃と大きく本願発明の範囲外であることが分る。また、試料Ｎｏ．１０は逆に固定部材に挟まれた測温素子８ａからリード線８の長さが測温素子の外形の３３倍と大き過ぎることから応答時間が６５秒と大きく、しかもウェハの温度差１．２℃と大きく好ましくないことが判明した。
【００５１】
一方、試料Ｎｏ．２〜９は固定部材に挟まれた測温素子８ａからリード線８の長さが測温素子の外形の２倍より大きく３０倍以下で、何れも応答時間が６０秒以下と小さくしかもウェハの温度差は１℃以下と小さくウエハ支持部材として優れた特性を示すことが分る。試料Ｎｏ．３は応答時間が５０秒以下で且つウェハの温度差は０．９℃以下と小さく、更に試料Ｎｏ．４〜６、８は応答時間が４０秒以下で且つウェハの温度差は０．８℃以下と小さく更に好ましい事が判明した。
【００５２】
従って、板状セラミック体の凹部に備えた固定部材に覆われるか或いは挟まれた測温素子８ａからリード線８の長さが測温素子の線径Ａの２倍より大きく３０倍以下であると優れた特性を示すことが分った。
（実施例２）
実施例１と同様の工程でウエハ支持部材を作製し凹部の位置と深さを変えて凹部に測温素子８ａやリード線８として直径（Ａ）０．５ｍｍの熱電対を挿入し、図７の構造となるように測温素子８ａやリード線８を固定した。そして、凹部の測温素子８から抵抗発熱体５までの距離Ｌ１と、測温素子８ａと主面上の点の距離が最低距離となる点Ｐから抵抗発熱体までの距離Ｌ２を変えたウエハ支持部材を作製し、実施例１と同様にウエハ支持部材の特性を評価した。
【００５３】
また、試料Ｎｏ．２５は抵抗発熱体を印刷した後、更に同種のＡＬＮシートを印刷面に重ね抵抗発熱体をＡＬＮで埋設したウエハ支持部材を作製した。
【００５４】
そしてこれらウエハ支持部材の特性を表２に示す。
【００５５】
【表２】

【００５６】
（Ｌ２−７×Ａ）＜Ｌ１＜（Ｌ２−Ａ）が成立している試料Ｎｏ．２２から２４は応答時間が３５秒以下と小さく、ウェハの温度差も０．７℃以下と小さく好ましい事が分った。
【００５７】
一方、試料Ｎｏ．２１はＬ１＜（Ｌ２−Ａ）が成立せず、応答時間は５９秒と大きく、ウェハの温度差も０．９℃と大きかった。
【００５８】
また、試料Ｎｏ．２５はＬ１＞（Ｌ２−７×Ａ）が成立せず、応答時間も５８秒と大きく、ウェハの温度差も０．９℃と大きかった。
【００５９】
そして、板状セラミック体２の他方の主面に抵抗発熱体５の形状で上記ペーストを２０μｍの厚みにスクリーン印刷法で印刷した。そして、個々の各抵抗発熱体５に対応して直径３ｍｍで深さを変えて凹部９を作製した。そして、凹部９の底面９ａに熱的接続部材１５として１００μｍの厚みのアルミニウム箔を置き、測温素子８ａやリード線８として線径０．５ｍｍと０．３ｍｍの熱電対を先端から３ミリの位置で直角に折り曲げ、その先端部をアルミ箔の上に置き、金属製のφ２．９ｍｍ、厚み２ｍｍで測温素子が通過する溝を取り付けた固定部材１７で測温素子を押さえた。固定部材１７は外径２．５ｍｍで厚み５００μｍのジルコニアセラミックからなる断熱部材２０を介して、加圧ピン１６で測温素子８ａやリード線８を加圧し凹部９の底面９ａと熱的に接続させた。そして、夫々のウエハ支持部材に電源を取り付け２５℃から２００℃まで５分間でウェハＷを昇温し、ウェハＷの温度を２００℃に設定してからウェハＷの平均温度が２００℃±０．５℃の範囲で一定となるまでの時間を応答時間として測定した。また２００℃に設定し３０分後のウェハ温度の最大値と最小値の差をウェハＷの温度差として測定した。そして、表３の結果を得た。
【００６０】
【表３】

【００６１】
固定部材の熱伝導率が１００Ｗ／（ｍ・Ｋ）以上で板状セラミック体の熱伝導率の６０％以上、３００％以下の熱伝導率を有する試料Ｎｏ．３３、３４、３６、３７は応答時間が２８秒以下と優れていた。また、ウェハの温度差も０．７℃以下と好ましいものであった。
【００６２】
それに対し、固定部材の熱伝導率が板状セラミックの熱伝導率の３４１％や５０２％の試料Ｎｏ．３１、３２はウェハの温度差が夫々０．９℃と大きかった。
【００６３】
また、試料Ｎｏ．３５のように固定部材の熱伝導率が板状セラミック体の熱伝導率の５７％と６０％以上でないものは応答時間が３５秒とやや大きかった。
【００６４】
従って、上記結果より凹部に測温素子を備え、板状セラミック体の熱伝導率に対して６０％以上、３００％以下でである熱伝導率を有する固定部材で測温素子８ａからリード線８を固定することで更に応答時間が小さく、ウェハの温度差の小さなウエハ支持部材を得る事ができる。
（実施例４）
実施例１と同様に板状セラミック体２を作製し、抵抗発熱体５となるペーストとして種種の金属とガラス成分や金属酸化物を混合しペースト状に作製したのちスクリーン印刷しウエハ支持部材を作製した。
【００６５】
そして、ウエハ支持部材の板状セラミック体の凹部に測温素子を固定する固定部材を硬度の異なる金属やＡｇ−Ｎｉ系合金で作製し、夫々同じ形状の板状セラミック体に取り付けた。
【００６６】
作製した夫々のウエハ支持部材に電源を取り付け２５℃から２００℃まで５分間でウェハＷを昇温し、ウェハＷの温度を２００℃に設定してからウェハＷの平均温度が２００℃±０．５℃の範囲で一定となるまでの時間を応答時間として測定した。また２００℃に設定し３０分後のウェハ温度の最大値と最小値の差をウェハＷの温度差として測定した。
【００６７】
また試料Ｎｏ．４４は測温素子を凹部に挿入した後、ロウ材を載せ、ロウ材をレーザビームで局部加熱して凹部にロウ材を圧入した。
【００６８】
その結果を表４に示す。
【００６９】
【表４】

【００７０】
固定部材のビッカース硬度が５０以下の試料Ｎｏ．４１から４４は応答時間が１９秒以下でしかもウェハの温度差が０．５℃以下と最も優れた特性を示す事が判明した。
【００７１】
更に、固定部材のビッカース硬度が３０以下の試料Ｎｏ．４１から４２は応答時間が１６秒以下でしかもウェハの温度差が０．４℃以下と更に優れた特性を示す事が判明した。
【００７２】
従って、測温素子を固定する固定部材はビッカース硬度が５０以下の材料で固定することが優れたウエハ支持部材を作製する上で重要である事を究明できた。
【００７３】
【発明の効果】
以上のように、本発明のウエハ支持部材によれば、板状セラミック体の一方の主面側を、ウェハを載せる載置面とし、上記板状セラミック体の他方の主面又は内部に抵抗発熱体を備えるとともに、上記板状セラミック体の他方の主面に凹部を有し、該凹部内に、測温素子とリード線とからなる測温体を挿入し、固定部材にて保持させ、上記測温体の測温素子からリード線が固定部材より露出するまでのリード線の長さを、上記リード線の線径の２倍より大きく３０倍以下としたことによって、ウェハの表面温度を正確にかつ追従性良く測定することができるため、ウェハを３５℃／分以上の速度で急速昇温することができる。
【００７４】
また、上記測温体のリード線の線径をＡ、測温素子から抵抗発熱体までの最短距離をＬ１、測温素子から板状セラミック体の一方の主面へ鉛直に延ばした垂線と、板状セラミック体の一方の主面との交点から抵抗発熱体までの最短距離をＬ２とした時、以下の関係を満足するようにすることで、ウェハ温度の応答時間が短く優れ、しかもウェハの面内温度差を０．７℃以下とすることができる。
【００７５】
（Ｌ２−７×Ａ）＜Ｌ１＜（Ｌ２−Ａ）
さらに、上記固定部材の熱伝導率は、板状セラミック体の熱伝導率の６０％以上、３００％以下とし、さらにはビッカース硬度が５０以下の金属により形成することで、ウェハ温度の応答時間は３０秒以下と短く優れ、しかもウェハの面内温度差を０．４〜０．７℃以下と小さくすることができる。
【００７６】
また、上記測温体の測温素子は、凹部底面に対して平行に配接することで、ウェハの表面温度をさらに正確にかつ追従性良く測定することができる。
【図面の簡単な説明】
【図１】本発明にウエハ支持部材の一例を示す断面図である。
【図２】本発明の抵抗発熱体の形状を示す概略図である。
【図３】本発明の他の抵抗発熱体の形状を示す概略図である。
【図４】本発明のさらに他の抵抗発熱体の形状を示す概略図である。
【図５】本発明の測温素子を取り付け部を示す概略図である。
【図６】本発明の他の測温素子を取り付け部を示す概略図である。
【図７】本発明の他の測温素子を取り付け部を示す概略図である。
【図８】従来のウエハ支持部材を示す、部品展開図である。
【図９】従来のウエハ支持部材の抵抗発熱体の概略図である。
【図１０】（ａ）（ｂ）従来の測温素子を取り付け部を示す概略図である。
【符号の説明】
１・・・ウエハ支持部材
２・・・板状セラミック体
３・・・一方の主面
４・・・支持ピン
５・・・抵抗発熱体
６・・・給電部
８・・・リード線
８ａ・・・測温素子
９・・・凹部
９ａ・・・底部
１１・・・給電端子
１２・・・ウェハ突き上げピン
１５・・・熱的接続部材
Ｐ・・・測温素子から板状セラミック体の一方の主面へ鉛直に引いた垂線と板状セラミック体の一方の主面との交点
１６・・・加圧ピン
１７・・・固定部材
１８・・・スプリングバネ
１９・・・有底筒状体
２０・・・断熱部材
２２・・・板状セラミック体
２３・・・凹部
２５・・・抵抗発熱体
２７・・・導通端子
３１・・・ケーシング
３１ａ・・・ケーシングの底部
３３・・・ステンレス板
３４・・・開口部
３５・・・ピン挿通孔
３６・・・リード線取り出し用の孔
４０・・・板状体
４１・・・凹部
５７・・・穴
１５０・・・測温素子
１５１・・・保護菅
Ｗ・・・半導体ウェハ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wafer support member mainly used for heating a wafer, for example, a conductor film or an insulating film is formed on a wafer such as a semiconductor wafer, a liquid crystal substrate, or a circuit board, or the wafer is formed on the wafer. The present invention relates to a wafer support member suitable for forming a resist film by drying and baking an applied resist solution.
[0002]
[Prior art]
For example, in the processing of a semiconductor wafer (hereinafter abbreviated as “wafer”) in a manufacturing process of a semiconductor manufacturing apparatus, such as a process of forming a conductive film or an insulating film, an etching process, a baking process of a resist film, and the like, the wafer is heated. A support member is used.
[0003]
A conventional semiconductor manufacturing apparatus uses a batch type in which a plurality of wafers are collectively formed. However, as the size of a wafer increases from 8 inches to 12 inches, it is necessary to improve processing accuracy. In recent years, an apparatus called a single-wafer type for processing one sheet at a time has been used. However, in the case of the single-wafer method, the number of processes per one processing is reduced, so that the processing time of the wafer is required to be shortened. For this reason, it has been required for the wafer support member to shorten the heating time of the wafer, speed up the suction and desorption of the wafer, and improve the accuracy of the heating temperature.
[0004]
As an example of the above-described wafer support member, there is a wafer support member 21 as disclosed in, for example, JP-A-11-283729. As shown in FIG. 8, the wafer support member 21 has a casing 31, a plate-shaped ceramic body 22, and a stainless plate 33 as a plate-shaped reflector as main components. The casing 31 is a bottomed metal member (in this case, an aluminum member), and has an opening 34 having a circular cross section on an upper side thereof. In the center of the casing 31, three pin insertion holes 35 for inserting wafer support pins (not shown) are formed. If the wafer support pins inserted into the pin insertion holes 35 are moved up and down, the wafer W can be transferred to the transfer device or the wafer W can be received from the transfer device. Further, a conduction terminal 27 is brazed to the conduction terminal portion of the resistance heating element 25 shown in FIG. 9, and the conduction terminal 27 is configured to pass through a hole 57 formed in the stainless steel plate 33. Further, several holes 36 for leading out lead wires are formed in the outer peripheral portion of the bottom portion 31a. A lead wire (not shown) for supplying a current to the resistance heating element is inserted through the hole 36, and the lead wire is connected to the conduction terminal 27.
[0005]
Nitride ceramics or carbide ceramics are used as the ceramic material constituting the plate-shaped ceramic body 22, and the resistance heating element 25 is energized in a plurality of concentrically formed patterns as shown in FIG. Accordingly, a wafer support member 21 for heating a plate-like ceramic body 22 has been proposed.
[0006]
In order to form a uniform film on the entire surface of the wafer W or to uniformly process the heating reaction state of the resist film in such a wafer support member 21, the temperature of the wafer W is measured accurately and the wafer is heated. It is important to keep the temperature of W constant. Therefore, a temperature measuring element for measuring the temperature of the wafer W is used, and the temperature measuring element is attached to the concave portion 23 of the wafer support member.
[0007]
Japanese Patent Application Laid-Open No. 9-45752 discloses a temperature measuring resistor for measuring the temperature of a wafer W placed on a wafer support member and controlling the temperature of an upper surface 40a of a metal plate 40 as shown in FIG. An arrangement method of the element 150 is shown. As a method of improving the accuracy and response of the temperature of the plate-like body 40 and improving the accuracy of the temperature control, the temperature difference in the longitudinal direction of the temperature measuring element 150 inserted into the concave portion 41 is reduced, and the temperature measuring resistor element is used. The method of arranging 150 in parallel with the upper surface of the plate-like body 40 is shown. This temperature measuring element is arranged such that a temperature measuring element 150 made of Pt is inserted into the protective tube 151 and is parallel to the upper surface 40 a of the plate-shaped body 40.
[0008]
Further, the gap in the protection tube 151 is filled with the heat transfer cement 52. In particular, when the resistance heating element is divided and controlled, it is preferable to adopt such a mounting structure because accurate temperature control of the plate-shaped body 40 cannot be performed unless the measurement accuracy and the measurement variation are managed at the same time. I was
[0009]
Japanese Patent Application Laid-Open No. 4-98784 discloses a temperature measuring point in a wafer heating apparatus in which a single resistance heating element is embedded in a plate-shaped ceramic body in order to prevent the temperature of the wafer heating surface from deviating from an optimum value. Is set to a position approximately 1 / √2 of the radius of the wafer heating area from the center of the wafer heating area.
[0010]
Japanese Patent Application Laid-Open No. 2001-85144 discloses that a thermoelectric element having a wire diameter of 0.5 mm or less is formed as a temperature measuring element in a recess 2 having a depth of 2 mm and a diameter of 1.2 mm in a plate-shaped ceramic body 22 having a thickness of 3 mm shown in FIG. A wafer support member 21 in which a pair is inserted and sealed with a heat-resistant resin is disclosed.
[0011]
[Problems to be solved by the invention]
However, in order to shorten the processing time per wafer, the thickness of the plate-like ceramic body used for a single wafer type wafer supporting member, which has been attracting attention in recent years, is reduced to 2 to 5 mm, and heating and cooling are performed. It is necessary to make an adjustment so that the cycle time is shorter. However, in order to uniformly heat the entire surface of the wafer to the level of ± 0.5 ° C, the goal of uniformly heating the wafer was achieved by simply arranging a temperature measuring element on the plate-shaped ceramic body using the conventional method. There was a problem that it could not be done.
[0012]
In the wafer support member as described above, even if the temperature measuring element 150 is arranged in parallel with the mounting surface 40a on which the wafer W of the plate-shaped body 40 is mounted as in Japanese Patent Application Laid-Open No. 9-45752, The body 40 was as thick as 30 mm or more, and the temperature of the plate-like body 40 could not be rapidly increased or decreased. Further, heat flows from the main body of the temperature measuring element 150 and a connecting member to the temperature measuring element 150 to the outside of the plate-shaped body 40, and the temperature of the temperature measuring unit decreases, or the temperature measuring element 150 is There is a problem that the temperature of the plate-like body 40 and the temperature of the wafer W may not be accurately measured because the temperature of the plate-like body 40 and the wafer W may not be accurately measured.
[0013]
In addition, the temperature of the wafer W is poorly responsive to the set temperature due to the resistance heating element provided on the plate-shaped body 40 and the distance from the mounting surface 40a to the temperature measuring element 150, and the temperature fluctuates and is controlled to a constant temperature. There is a problem that the processing time of the wafer W becomes longer and the processing time of the wafer W becomes longer.
[0014]
[Means for Solving the Problems]
In view of the above problems, in the wafer support member of the present invention, one of the main surfaces of the plate-shaped ceramic body is used as a mounting surface on which a wafer is mounted, and the other main surface or the inside of the plate-shaped ceramic body has resistance heating. A body having a concave portion on the other main surface of the plate-shaped ceramic body, a temperature measuring element including a temperature measuring element and a lead wire is inserted into the concave portion, and held by a fixing member. The length of the lead wire from the temperature measuring element of the temperature measuring element until the lead wire is exposed from the fixing member is set to be more than twice and 30 times or less the wire diameter of the lead wire.
[0015]
Further, the wire diameter of the lead wire of the temperature measuring element is A, the shortest distance from the temperature measuring element to the resistance heating element is L1, a perpendicular line extending vertically from the temperature measuring element to one main surface of the plate-shaped ceramic body, When the shortest distance from the intersection with one main surface of the plate-shaped ceramic body to the resistance heating element is L2, it is preferable to satisfy the following relationship.
[0016]
(L2-7 × A) <L1 <(L2-A)
Further, it is preferable that the fixing member has a thermal conductivity of not less than 60% and not more than 300% of the thermal conductivity of the plate-shaped ceramic body, and more preferably, is formed of a metal having a Vickers hardness of 50 or less.
[0017]
Further, it is preferable that the temperature measuring element of the temperature measuring body is connected in parallel to the bottom surface of the concave portion.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
[0019]
FIG. 1 is a cross-sectional view showing an example of a wafer support member 1 according to the present invention. One main surface 3 of a plate-like ceramic body 2 made of a ceramic plate containing silicon carbide, alumina or aluminum nitride as a main component. Is provided as a mounting surface on which the wafer W is mounted, and a resistance heating element 5 is formed on the other main surface, and a power supply section 6 electrically connected to the resistance heating element 5 is provided. The temperature is measured by a temperature measuring element 8a fixed to the concave portion 9 of the plate-shaped ceramic body 2 to constitute the wafer support member 1. The support pins 12 can move the wafer W up and down through a hole penetrating the plate-shaped ceramic body 2 so that the wafer W can be placed on the main surface 3 and lowered. Then, the power supply terminal 11 is connected to the power supply unit 6 and power is supplied from the outside, so that the wafer W can be heated while measuring the temperature with the temperature measuring element including the temperature measuring element 8 a and the lead wire 8.
[0020]
The pattern shape of the resistance heating element 5 may be a spiral pattern as shown in FIG. 2 or divided into a plurality of blocks as shown in FIGS. And a zigzag folded shape composed of the above pattern. When the resistance heating element 5 is divided into a plurality of blocks, the temperature of each block is independently measured and controlled, so that the wafer W on the main surface 3 can be uniformly heated.
[0021]
The resistance heating element 5 is formed by printing a paste containing glass frit or metal oxide on conductive metal particles on the plate-shaped ceramic body 2 by a printing method. The metal particles include Au, Ag, Cu, and Pd. , Pt, and Rh. The glass frit is preferably made of an oxide containing B, Si, and Zn. By using such a resistance heating element 5 in which glass or a metal oxide is mixed with metal particles, the coefficient of thermal expansion of the resistance heating element 5 can be made close to that of the plate-shaped ceramic body 2.
[0022]
As shown in FIG. 5, the main surface 3 includes a plurality of support pins 4 on the main surface 3 so as to hold the wafer W at a fixed distance from one main surface 3 of the plate-shaped ceramic body 2. It may be.
[0023]
In the wafer support member 1 of the present invention, one main surface 3 of the plate-shaped ceramic body 2 is used as a mounting surface on which the wafer W is mounted, or the wafer W is held at a predetermined distance from the main surface 3. A fixing member 17 for fixing the temperature measuring element 8a to the concave portion 9 in the wafer support member 1 in which the concave portion 9 is provided from the side opposite to the main surface toward the heating surface and the temperature measuring element 8a is inserted into the concave portion 9; And the length of the temperature measuring element 8a at a portion covered or sandwiched by the fixing member 17 on the plate-shaped ceramic body 2 is larger than twice the wire diameter A of the temperature measuring element 8a and is 30 times or less. It is characterized by being.
[0024]
A concave portion 9 is formed on the other main surface of the plate-shaped ceramic body 2 that supports the wafer W at a predetermined distance or on which the wafer W is mounted, and a temperature measuring element 8a is inserted into the concave portion 9; The temperature of the ceramic body 2 is measured. The size of the concave portion 9 is 2-5 mm in diameter, and is pierced to a depth of about two-thirds of the preferred thickness of the plate-shaped ceramic body 2, and the temperature of one main surface 3 of the plate-shaped ceramic body 2 is increased. Is directly reflected on the bottom surface 9a of the recess 9 so that the thermal resistance between the temperature measurement element 8a and the contact interface between the bottom surface 9a of the recess 9 and the temperature measurement element 8a is reduced. The temperature measuring element 8a is connected to the bottom surface 9a of the concave portion 9 via a thermal connecting member 15 made of a metal foil or paste that is easily deformable and has a large thermal conductivity of 100 W / (m · K) or more so as to reduce the electrical resistance. Is preferred.
[0025]
Further, in order to accurately measure the temperature of the main surface 3 of the plate-shaped ceramic body 2 having a thickness of 2 to 5 mm, it is necessary to transmit the temperature of the main surface 3 of the plate-shaped ceramic body 2 to the temperature measuring element 8a. For example, if the temperature measuring element 8a is, for example, a thermocouple, if there is a thermally connected portion with the concave portion 9 over a length greater than twice the wire diameter of the thermocouple from the temperature measuring point, the temperature of the main surface 3 can be increased with high sensitivity. Can be measured accurately. For example, if the diameter of the lead wire 8 of the temperature measuring element 8a is not more than twice the diameter of the lead wire 8 made of a thermocouple, the heat at the temperature measuring point is transferred to the plate-like ceramic body 2 via the lead wire 8 extending from the temperature measuring element 8a. This is because there is a possibility that the gas flows to the outside and the temperature at the temperature measuring point decreases. It is preferably larger than 2 times, more preferably 5 times or more, and still more preferably 7 times or more of the lead wire 8. In particular, the linear portion of the lead wire 8 from the temperature measuring element 8 a from the temperature measuring point It is preferable that the diameter is at least four times the wire diameter, and furthermore, it is preferable that this linear portion be parallel to the bottom surface 9a of the concave portion so that the temperature of the main surface 3 can be measured with high sensitivity. And it is more preferable that the linear portion is parallel to one main surface of the plate-shaped ceramic body 2.
[0026]
When the temperature measuring element 8a is fixed to the bottom surface 9a of the concave portion 9 with a brazing material or a heat conductive paste as the fixing member 17, the thermal connection portion with the concave portion 9 is defined as The extended lead wire 8 and / or the temperature measuring element 8a shows a portion in the concave portion 9 covered with the brazing material or the heat conductive paste. When a solid material is used as the fixing member 17, the thermal connection portion indicates a portion where the fixing member 17 of the concave portion 9 is in contact with the temperature measuring element 8a or the lead wire 8 extending from the temperature measuring element 8a. When a solid fixing member 17 is used, the temperature measuring element 8a is not buried in the fixing member 17, so that it is affected by the atmospheric gas. However, the wafer supporting member 1 for a coater developer used in the atmosphere is not used. There is no influence of the atmospheric gas, and it is preferable from the viewpoint of handling.
[0027]
In particular, when the fixing member 17 shown in FIG. 5 is solid, a soft thermal connection member 15 is formed on the bottom surface 9a of the concave portion 9 so that the temperature measuring element 8a is thermally connected to the concave portion 9 made of ceramic. An aluminum foil or the like made of a metal foil is placed, and the temperature measuring element 8a is pressed by the fixing member 17 via the thermal connecting member 15 made of the aluminum foil or the like so that the temperature measuring element 8a comes into contact with the concave portion 9 at the surface. It is preferred to be connected.
[0028]
Since the concave portion 9 is made of the rigid plate-like ceramic body 2 having a Young's modulus of 200 GPa or more and the concave bottom surface 9a is less deformed by pressurization, the bottom surface of the concave portion 9 is required to bring the temperature measuring element 8a into surface contact with the concave portion 9. It is preferable that the bottom surface 9a and the thermal connection member 15 be brought into surface contact with the thermal connection member 9 via the thermal connection member 15, and the thermal connection member 15 be brought into contact with the temperature measuring element 8a or the lead wire 8 extending from the temperature measuring element 8a. . Usually, since the deformation of the bottom surface 9a made of ceramic is small, it is difficult for the temperature measuring element and the bottom surface 9a of the concave portion to directly come into surface contact with each other. Attachment of the temperature measuring element 8a via a metal foil such as aluminum or silver, which is easy to perform, is effective in reducing the thermal resistance at the interface between the recess 9 and the temperature measuring element 8a. It is effective in measuring a proper temperature.
[0029]
A fixing member 17 for fixing the temperature measuring element 8a and the lead wire 8 extending from the temperature measuring element 8a is provided in the concave portion 9, and the temperature measurement covered or sandwiched by the plate-shaped ceramic body 2 with the fixing member 17 is provided. It is important that the length of the lead wire 8 from the element 8a is not more than 30 times the wire diameter A of the lead wire 8. If the concave portion 9 for fixing the temperature measuring element 8a is increased or the lead wire 8 is swirled and swirled to exceed 30 times the wire diameter A, the length of the lead wire 8 in the concave portion 9 increases. Therefore, the temperature distribution of the main surface 3 of the plate-shaped ceramic body 2 may change due to a difference in thermal conductivity or heat capacity between the plate-shaped ceramic body 2 and the lead wire 8 which is as thin as 2 to 5 mm. Preferably, the length of the lead wire 8 from the temperature measuring element 8 a covered or sandwiched by the fixing member 17 is 20 times or less the wire diameter A of the lead wire 8. By setting in this manner, the temperature of the temperature measuring element 8a can be suppressed to within 0.3 ° C. of the temperature of the main surface of the plate-shaped ceramic body 2 and, moreover, the ability to follow the temperature change of the main surface 3 It is possible to increase.
[0030]
Next, the temperature of the main surface 3 of the wafer support member 1 can be accurately measured by arranging the temperature measuring element 8a and the lead wire 8 as described above. However, the temperature of the wafer W is controlled to be constant. In the meantime, while measuring the temperature of the main surface of the plate-shaped ceramic body 2 with the above-mentioned temperature measuring element 8a, power is supplied to the resistance heating element 5 provided in the plate-shaped ceramic body 2 to generate heat, and the temperature of the main surface is reduced. It is controlled to be uniform. For that purpose, heat conductivity from the resistance heating element 5 to the plate-shaped ceramic body 2 and heat transmission from the main surface of the plate-shaped ceramic body 2 to the temperature measuring element 8a, and from the resistance heating element 5 to the temperature measuring element 8a. The way heat is transmitted is especially important. It is required that the heat of the resistance heating element 5 be transmitted to the main surface 3 and that the temperature distribution of the wafer W be uniform.
[0031]
However, if the resistance heating element 5 heats the temperature measuring element 8a later than the main surface 3, it becomes difficult to accurately and accurately measure the temperature of the main surface 3 with the temperature measuring element 8a. From this point, the shortest distance L1 from the temperature measuring element 8a to the resistance heating element 5, the perpendicular extending vertically from the temperature measuring element 8a to one main surface 3 of the plate-shaped ceramic body 2, and the plate-shaped ceramic body It is preferable that the shortest distance L2 from the intersection P with one of the main surfaces 3 to the resistance heating element 5 is equal, and that the thermal resistance at the intervals of the shortest distances is as small as possible. Therefore, the inventor of the present application has found that the distances L1 and L2 are related to the wire diameter of the temperature measuring element, and it is important to satisfy an appropriate relationship with the distances L1 and L2. It has been found that the temperature distribution of the wafer support member 1 can be provided, and the temperature can be changed quickly and easily.
[0032]
The above-mentioned appropriate relationship means that L1 is preferably larger than the interval (L2-7 × A) and smaller than (L2-A).
(Equation 1)
(L2-7 × A) <L1 <(L2-A)
If L1 is larger than (L2-A), the temperature measuring element 8a is too close to the main surface 3, so that the temperature of the portion of the main surface 3 close to the temperature measuring element decreases, the temperature distribution of the wafer W deteriorates, and the main surface is deteriorated. This is because there is a possibility that the temperature representative of No. 3 cannot be measured. Further, when L1 is smaller than (L2-7 × A), the temperature of the resistance heating element 5 has a greater effect than the temperature of the main surface 3, and the temperature of the main surface 3 can be accurately and quickly measured by the temperature measuring element 8a. If the temperature of the wafer W is controlled to be constant or the temperature of the wafer is rapidly increased, not only the temperature of the wafer W cannot be controlled to the set temperature but also the possibility that the temperature of the wafer W may overshoot increases. Because.
[0033]
The thermal conductivity of the thermal connecting member 15 and the fixing member 17 for fixing the temperature measuring element 8a and the lead wire 8 to the recess 9 is preferably 100 W / (m · K) or more. It is preferable that the heat conductivity is greater than 60% and 300% or less of the thermal conductivity of the plate-shaped ceramic body 2. If the thermal conductivity of the thermal connection member 15 or the fixing member 17 is less than 100 W / (m · K) or less than 60% of the thermal conductivity of the plate-shaped ceramic body 2, the main surface of the plate-shaped ceramic body 2 3, the temperature of the wafer W may be difficult to control accurately and promptly because the temperature of the thermal connection 8 is not transmitted to the temperature measuring element 8a quickly. When the thermal conductivity of the ceramic body 2 is 300% or more, the difference in thermal conductivity between the ceramic body 2 and the plate-shaped ceramic body 2 is too large. When the wafer W is loaded, a hot spot or a cool spot may be generated on the main surface 3 immediately above the concave portion 9 and the temperature distribution of the wafer W may be deteriorated, which is not preferable.
[0034]
Further, the thermal connection member 15 preferably has a Vickers hardness Hv of 50 or less measured by applying a load of 1 N for 30 seconds. When the Vickers hardness is 50 or more, the contact area between the temperature measuring element 8a and the thermal contact member 51 or the contact area between the thermal contact member 51 and the concave bottom surface 8a is small and the temperature of the main surface 3 of the plate-shaped ceramic body 2 can be quickly measured. When the temperature of the wafer W is controlled to be constant or when the temperature of the wafer W is rapidly increased, the temperature may overshoot. Therefore, the hardness Hv of the thermal connecting member 15 is preferably 50 or less, more preferably 30 or less.
[0035]
Such a thermal connection member 15 is preferably silver, aluminum, platinum or gold, and the thickness of the thermal connection member 15 is preferably 10 μm to 300 μm. When the thickness of the thermal connection member 15 is 10 μm or less, the area of surface contact even when the temperature measuring element 8 a or the lead wire 8 is pressed is small, and when the thickness is 300 μm or more, heat transfer becomes slow and rapid temperature measurement becomes difficult. Preferably, thermal connecting member 15 has a thickness of 50 to 200 μm.
[0036]
In addition, it is preferable that the temperature measuring element 8 a and the tip of the lead wire 8 are disposed on the bottom surface 9 a of the concave portion 9 in parallel with the main surface 3. If the tip of the temperature measuring element 8a or the lead wire 8 is not arranged in parallel with the main surface 3, the heat of the temperature measuring element 8a is transmitted through the lead wire 8 and escapes, so that the temperature measured decreases and accurate This is because the temperature of the wafer W cannot be measured. The length of the tip of the temperature measuring element 8a parallel to the main surface 3 is preferably 2-3 mm. If it is less than 2 mm, the detection part of the temperature measuring part is short, so that the escape of heat is large and it is difficult to measure the temperature accurately. On the other hand, if it is 3 mm or more, the inner diameter of the concave portion becomes too large, and there is a risk that a cool spot may be formed on the upper surface of the concave portion.
[0037]
Next, another embodiment of the present invention will be described.
[0038]
FIG. 6 is a view showing another embodiment of the present invention in which the temperature measuring element 8a is attached to the plate-like ceramic body 2 having a thickness of 2 to 5 mm, which is easily heated by the resistance heating element 5 and whose deformation due to heating is small. . The depth of the recess is about 2/3 of the plate thickness, the diameter of the recess is 3 mm, and a thermocouple whose surface is insulated by 0.3 to 0.8 mm is used as the temperature measuring element 8a or the lead wire 8. Two to three millimeters of the tip of the pair are bent and brazed to the concave portion 9, and for example, gold tin brazing or silver copper brazing can be used. In addition to brazing, bonding may be performed using a heat conductive paste in which, for example, silver / epoxy resin having a very small curing shrinkage is mixed. If the brazing material or the thermally conductive paste has the thermal or mechanical characteristics of the temperature measuring element 8a or the fixing member 17 for fixing the lead wire 8 close to the temperature measuring element 8a, the wafer W It has been found that the temperature can be measured accurately, precisely and with high sensitivity.
[0039]
FIG. 7 shows a similar recess 9 formed in the same plate-like ceramic body 2 as in FIG. 6, a thermal connection member 15 provided on the bottom surface 9 a of the recess, and a temperature measuring element 8 a and a lead wire 8 pressed by a fixing member 17. A pressurizing pin 16 for pressing the fixing member 17, and an alumina-zirconia having a heat conductivity of 5 W / (m · K) or less as a heat insulating layer between the pressing pin 16 and the fixing member 17. A heat insulating member 20 made of a heat-resistant resin such as a composite ceramic or Teflon is used. The pressure pin 16 has a structure in which a heat insulating member 20 is pressed by a spring 18 provided outside.
[0040]
On the other hand, as a material of the plate-shaped ceramic body 2 constituting the wafer support member 1, alumina, silicon nitride, sialon, aluminum nitride, and silicon carbide which are excellent in wear resistance and heat resistance can be used. And silicon carbide have a high thermal conductivity of 50 W / (m · K) or more, and more than 100 W / (m · K), and have a large Young's modulus of 300 GPa or 400 GPa. The deformation of the body 2 is small and preferable. Furthermore, since it has excellent corrosion resistance and plasma resistance to corrosive gases such as fluorine-based and chlorine-based gases, it is suitable as a material for the plate-shaped ceramic body 2.
[0041]
As a method of manufacturing such a wafer support member 1, first, a sintering aid such as calcium carbonate is added to AlN powder forming the plate-shaped ceramic body 2, an acrylic binder is added, and the plate-shaped is formed. The compact with the residue left is sintered under pressure at about 2000 ° C. Alternatively, 0.1 mass% of calcia is added to the aluminum nitride powder, a binder is added, and the granulated powder is formed into a plate shape and fired at 2000 ° C. or more in a nitrogen atmosphere. The front and back surfaces of the sintered plate-shaped ceramic body 2 are ground and processed into a disk shape. Then, the resistance heating element 5 is printed on the other main surface to provide the resistance heating element 5. The resistance heating element 5 has a substantially circular area where the resistance heating element 5 is formed in a spiral shape from the center to the outer periphery shown in FIG. 2 and the plate-shaped ceramic body 2 provided with the resistance heating element 5 shown in FIGS. I do.
[0042]
Thereafter, the upper surface of the plate-shaped ceramic body 2 is polished to place the wafer W thereon, or the main surface 3 for supporting the wafer W at a predetermined distance from the main surface 3 is formed, and the power supply terminal 11 is formed on the lower surface. And the plate-shaped ceramic body 2 are fixed to a bottomed tubular body 19 for fixing the same.
[0043]
Although FIG. 1 shows the wafer support member 1 having only the resistance heating element 5 on the other main surface 3 of the plate-shaped ceramic body 2, the present invention relates to a configuration in which the main surface 3 and the resistance heating element 5 are provided between the main surface 3 and the resistance heating element 5. It goes without saying that electrodes for electrostatic adsorption or plasma generation may be embedded. Furthermore, although the heater in which the resistance heating element 5 is provided on the other main surface of the plate-shaped ceramic body 2 has been described, the resistance heating element 5 is formed on a main surface different from the mounting surface 3 of the plate-shaped ceramic body 2 and is made of glass or the like. The same effect can be obtained even when buried.
[0044]
Although the example in which the resistance heating element 5 is provided on the main surface 3 of the plate-shaped ceramic body 2 has been described, the wafer support in which the resistance heating element 5 is embedded on the main surface side different from the mounting surface of the plate-shaped ceramic body 2 is shown. Similar effects can be obtained with members.
[0045]
【Example】
(Example 1)
Here, 0.1 mass% of calcia having an average particle diameter of 1 μm was added to aluminum nitride powder having an average particle diameter of 1.2 μm as a plate-shaped ceramic body 2, mixed and pulverized, and an acrylic binder was added to form a plate having a diameter of 400 mm. After performing binder removal treatment at 400 ° C. for 1 hour in air and a nitrogen atmosphere, sintering was performed in a nitrogen atmosphere at 2000 ° C. The front and back surfaces of the sintered body were ground to obtain a disc-shaped plate-shaped ceramic body 2 having a diameter of 320 mm and a thickness of 3 mm. The other main surface 3 of the plate-shaped ceramic body 2 contains 50% by mass of metallic silver and is made of B2O3.SiO2.ZnO glass (having a thermal expansion coefficient of 4.4.times.10.sup.3). ^-6 / ° C) was added with a solvent to prepare a paste.
[0046]
Then, the paste was printed as a resistance heating element 5 on the other main surface of the plate-shaped ceramic body 2 to a thickness of 20 μm by a screen printing method. Then, a concave portion 9 having a diameter of 3 mm and a depth of 2 mm was produced corresponding to each resistance heating element 5. Then, an aluminum foil having a thickness of 100 μm is placed on the bottom surface 9 a of the concave portion 9 as the thermal connection member 15, and thermocouples having wire diameters of 0.5 mm and 0.3 mm as the temperature measuring element 8 a and the lead wire 8 are arranged several millimeters from the tip. The tip was wound spirally at the position and placed on an aluminum foil, and the temperature measuring element was pressed by a fixing member 17 made of aluminum having a diameter of 2.9 mm and a thickness of 2 mm and having a groove through which the temperature measuring element passed. The fixing member 17 presses the temperature measuring element 8a and the lead wire 8 with the pressing pin 16 via the heat insulating member 20 made of zirconia ceramic having an outer diameter of 2.5 mm and a thickness of 500 μm to be thermally connected to the bottom surface 9a of the recess 9. Was. In making the thermal connection, the length of the lead wire 8 from the temperature measuring element 8a covered or sandwiched by the fixing member 17 was adjusted by the length in which the lead wire 8 was spirally wound.
[0047]
Further, the sample No. No. 7 was prepared by heating and fixing a fixing member made of silver-copper brazing at 350 ° C.
[0048]
Then, a wafer supporting member having a different length of the lead wire 8 is manufactured from the temperature measuring element 8a covered or sandwiched by the fixing member, and a power source is attached to each wafer supporting member to change the temperature from 25 ° C. to 200 ° C. for 5 minutes. Then, the time from when the temperature of the wafer W was set to 200 ° C. until the average temperature of the wafer W became constant within the range of 200 ° C. ± 0.5 ° C. was measured as the response time. The difference between the maximum value and the minimum value of the wafer temperature after 30 minutes at 200 ° C. was measured as the temperature difference of the wafer W. And the result of Table 1 was obtained.
[0049]
[Table 1]

[0050]
Sample No. Reference numeral 1 indicates that the length of the lead wire 8 from the temperature measuring element 8a sandwiched between the fixing members is too small, twice as long as the outer shape of the lead wire 8, so that the response time is as large as 64 seconds and the wafer temperature difference is also 1.5. It is found that the temperature is as high as ° C. and is out of the range of the present invention. Further, the sample No. Conversely, the length of the lead wire 8 from the temperature measuring element 8a sandwiched between the fixing members is too large, 33 times the outer shape of the temperature measuring element, so that the response time is as long as 65 seconds and the wafer temperature difference 1. It turned out to be 2 ° C., which is not preferable.
[0051]
On the other hand, the sample No. In Nos. 2 to 9, the length of the lead wire 8 from the temperature measuring element 8a sandwiched between the fixing members is larger than twice the outer shape of the temperature measuring element and 30 times or less. It can be seen that the temperature difference is as small as 1 ° C. or less and shows excellent characteristics as a wafer support member. Sample No. Sample No. 3 has a response time of 50 seconds or less and a small temperature difference of 0.9 ° C. or less. 4 to 6 and 8, it was found that the response time was 40 seconds or less and the wafer temperature difference was as small as 0.8 ° C. or less, which was more preferable.
[0052]
Therefore, the length of the lead wire 8 from the temperature measuring element 8a covered or sandwiched by the fixing member provided in the concave portion of the plate-shaped ceramic body is larger than twice the wire diameter A of the temperature measuring element and 30 times or less. And excellent characteristics.
(Example 2)
A wafer support member was manufactured in the same process as in Example 1, and the position and depth of the concave portion were changed, and a thermocouple having a diameter (A) of 0.5 mm was inserted into the concave portion as the temperature measuring element 8a or the lead wire 8 as shown in FIG. The temperature measuring element 8a and the lead wire 8 were fixed so as to have the structure shown in FIG. Then, the distance L1 from the temperature measuring element 8 in the concave portion to the resistance heating element 5 and the distance L2 from the point P where the distance between the temperature measurement element 8a and the point on the main surface becomes the minimum distance to the resistance heating element are changed. A support member was manufactured, and the characteristics of the wafer support member were evaluated in the same manner as in Example 1.
[0053]
Further, the sample No. No. 25 produced a wafer supporting member in which the same type of ALN sheet was further laminated on the printing surface after printing the resistance heating element and the resistance heating element was embedded in ALN.
[0054]
Table 2 shows the characteristics of these wafer support members.
[0055]
[Table 2]

[0056]
Sample No. (L2-7 × A) <L1 <(L2-A) is satisfied. It was found that the samples Nos. 22 to 24 had a short response time of 35 seconds or less, and also had a small wafer temperature difference of 0.7 ° C. or less, which was preferable.
[0057]
On the other hand, the sample No. In No. 21, L1 <(L2-A) was not satisfied, the response time was as large as 59 seconds, and the wafer temperature difference was as large as 0.9 ° C.
[0058]
Further, the sample No. In No. 25, L1> (L2-7 × A) was not satisfied, the response time was as large as 58 seconds, and the wafer temperature difference was as large as 0.9 ° C.
[0059]
Then, the paste was printed on the other main surface of the plate-shaped ceramic body 2 in the shape of the resistance heating element 5 to a thickness of 20 μm by a screen printing method. Then, the concave portion 9 was formed with a diameter of 3 mm and a different depth corresponding to each individual resistance heating element 5. Then, an aluminum foil having a thickness of 100 μm is placed on the bottom surface 9a of the concave portion 9 as the thermal connection member 15, and thermocouples having wire diameters of 0.5 mm and 0.3 mm as the temperature measuring element 8a and the lead wire 3 mm from the tip are provided. It was bent at a right angle at the position, its tip was placed on an aluminum foil, and the temperature measuring element was pressed by a metal fixing member 17 having a diameter of 2.9 mm and a thickness of 2 mm and having a groove through which the temperature measuring element passed. The fixing member 17 is thermally connected to the bottom surface 9a of the recess 9 by pressing the temperature measuring element 8a and the lead wire 8 with the pressing pin 16 via the heat insulating member 20 made of zirconia ceramic having an outer diameter of 2.5 mm and a thickness of 500 μm. I let it. Then, a power supply is attached to each wafer supporting member, and the temperature of the wafer W is increased from 25 ° C. to 200 ° C. for 5 minutes, and the temperature of the wafer W is set to 200 ° C., and then the average temperature of the wafer W is set to 200 ° C. ± 0. The time until the temperature became constant in the range of 5 ° C. was measured as the response time. The difference between the maximum value and the minimum value of the wafer temperature after 30 minutes at 200 ° C. was measured as the temperature difference of the wafer W. And the result of Table 3 was obtained.
[0060]
[Table 3]

[0061]
Sample No. having a thermal conductivity of 100 W / (m · K) or more of the fixing member and a thermal conductivity of 60% or more and 300% or less of the thermal conductivity of the plate-shaped ceramic body. 33, 34, 36, and 37 had excellent response times of 28 seconds or less. Further, the temperature difference of the wafer was preferably 0.7 ° C. or less.
[0062]
On the other hand, in the sample Nos. In which the thermal conductivity of the fixing member was 341% or 502% of the thermal conductivity of the plate-shaped ceramic. In Nos. 31 and 32, the temperature difference between the wafers was as large as 0.9 ° C., respectively.
[0063]
Further, the sample No. In the case where the thermal conductivity of the fixing member was not 57% or more than 60% or more of the thermal conductivity of the plate-shaped ceramic body as in 35, the response time was slightly large at 35 seconds.
[0064]
Therefore, based on the above results, a temperature measuring element is provided in the concave portion, and a fixing member having a thermal conductivity of 60% or more and 300% or less with respect to the thermal conductivity of the plate-shaped ceramic body is used. Is fixed, the response time is further reduced, and a wafer supporting member having a small temperature difference of the wafer can be obtained.
(Example 4)
A plate-like ceramic body 2 was prepared in the same manner as in Example 1, and various kinds of metals and glass components or metal oxides were mixed as a paste to be a resistance heating element 5 to form a paste, followed by screen printing to prepare a wafer support member. did.
[0065]
Then, a fixing member for fixing the temperature measuring element to the concave portion of the plate-shaped ceramic body of the wafer support member was made of a metal having a different hardness or an Ag-Ni-based alloy, and was attached to the plate-shaped ceramic body having the same shape.
[0066]
A power supply was attached to each of the manufactured wafer supporting members, and the temperature of the wafer W was raised from 25 ° C. to 200 ° C. for 5 minutes, the temperature of the wafer W was set to 200 ° C., and then the average temperature of the wafer W was 200 ° C. ± 0. The time until the temperature became constant in the range of 5 ° C. was measured as the response time. The difference between the maximum value and the minimum value of the wafer temperature after 30 minutes at 200 ° C. was measured as the temperature difference of the wafer W.
[0067]
Sample No. Reference numeral 44 shows that after inserting the temperature measuring element into the concave portion, the brazing material was placed thereon, and the brazing material was locally heated by a laser beam to press-fit the brazing material into the concave portion.
[0068]
Table 4 shows the results.
[0069]
[Table 4]

[0070]
Sample No. 5 in which the Vickers hardness of the fixing member is 50 or less. It was found that the samples 41 to 44 exhibited the most excellent characteristics with a response time of 19 seconds or less and a wafer temperature difference of 0.5 ° C. or less.
[0071]
Further, the sample No. having a Vickers hardness of 30 or less of the fixing member. From 41 to 42, it was found that the response time was 16 seconds or less and the temperature difference between the wafers was 0.4 ° C. or less, exhibiting further excellent characteristics.
[0072]
Therefore, it was found that it is important to fix the fixing member for fixing the temperature measuring element with a material having a Vickers hardness of 50 or less in producing an excellent wafer supporting member.
[0073]
【The invention's effect】
As described above, according to the wafer support member of the present invention, one of the main surfaces of the plate-shaped ceramic body is used as the mounting surface on which the wafer is placed, and the other main surface or the inside of the plate-shaped ceramic body has resistance heating. A body having a concave portion on the other main surface of the plate-shaped ceramic body, a temperature measuring element including a temperature measuring element and a lead wire is inserted into the concave portion, and held by a fixing member. The length of the lead wire from the temperature measuring element of the temperature measuring element until the lead wire is exposed from the fixing member is set to more than twice and 30 times or less the wire diameter of the above-mentioned lead wire, so that the surface temperature of the wafer can be accurately measured. The temperature of the wafer can be rapidly increased at a rate of 35 ° C./min or more because the measurement can be performed quickly and with good followability.
[0074]
Further, the wire diameter of the lead wire of the temperature measuring element is A, the shortest distance from the temperature measuring element to the resistance heating element is L1, a perpendicular line extending vertically from the temperature measuring element to one main surface of the plate-shaped ceramic body, When the shortest distance from the intersection with one main surface of the plate-shaped ceramic body to the resistance heating element is L2, by satisfying the following relationship, the wafer temperature response time is short and excellent, and the wafer The in-plane temperature difference can be 0.7 ° C. or less.
[0075]
(L2-7 × A) <L1 <(L2-A)
Further, the thermal conductivity of the fixing member is set to be not less than 60% and not more than 300% of the thermal conductivity of the plate-shaped ceramic body. It is as short as 30 seconds or less and excellent, and the in-plane temperature difference of the wafer can be reduced to 0.4 to 0.7 ° C. or less.
[0076]
In addition, the temperature measuring element of the temperature measuring body is arranged in parallel with the bottom surface of the concave portion, so that the surface temperature of the wafer can be measured more accurately and with good followability.
[Brief description of the drawings]
FIG. 1 is a sectional view showing an example of a wafer support member according to the present invention.
FIG. 2 is a schematic view showing a shape of a resistance heating element of the present invention.
FIG. 3 is a schematic view showing the shape of another resistance heating element of the present invention.
FIG. 4 is a schematic view showing the shape of still another resistance heating element according to the present invention.
FIG. 5 is a schematic view showing a mounting portion to which the temperature measuring element of the present invention is attached.
FIG. 6 is a schematic view showing a mounting portion to which another temperature measuring element of the present invention is attached.
FIG. 7 is a schematic view showing a mounting portion to which another temperature measuring element of the present invention is attached.
FIG. 8 is an exploded view showing a conventional wafer support member.
FIG. 9 is a schematic view of a resistance heating element of a conventional wafer support member.
10 (a) and 10 (b) are schematic diagrams showing a conventional temperature measuring element mounting portion.
[Explanation of symbols]
1 ... Wafer support member
2 ... plate-shaped ceramic body
3. One main surface
4 ... Support pin
5 Resistance heating element
6 ... Power supply unit
8 Lead wire
8a ・・・ Temperature measuring element
9 ... recess
9a ... bottom
11 ... Power supply terminal
12 ... Wafer push-up pin
15 Thermal connection member
P: intersection of a perpendicular drawn from the temperature measuring element to one main surface of the plate-shaped ceramic body and one main surface of the plate-shaped ceramic body
16 ・・・ Pressing pin
17 ... fixing member
18 ・・・ Spring spring
19 ・・・ Bottomed cylindrical body
20 ... heat insulating member
22 ・・・ Plate-shaped ceramic body
23 ... recess
25 ... resistance heating element
27 Conductive terminal
31 ・・・ Casing
31a: bottom of casing
33 ・・・ Stainless steel plate
34 ・・・ Opening
35 ・・・ Pin insertion hole
36 ··· Hole for taking out lead wire
40 ... plate-like body
41 ... recess
57 ... hole
150 ・・・ Temperature measuring element
151 ... Protection tube
W: semiconductor wafer

Claims

One main surface side of the plate-shaped ceramic body is a mounting surface on which a wafer is mounted, and the other main surface of or in the inside of the other main surface of the plate-shaped ceramic body, and the other main surface of the plate-shaped ceramic body is provided. A wafer support member having a concave portion, into which a temperature measuring element composed of a temperature measuring element and a lead wire is inserted and held by a fixing member, wherein the temperature measurement of the temperature measuring element is performed. the length of the lead wire from the device to the lead wire is exposed from the fixing member, not more than 30 times greater than twice the wire diameter of the lead wire, the thermal conductivity of the thermal conductivity of the fixing member is the ceramic plate A wafer supporting member , wherein the fixing member is made of a metal having a Vickers hardness of 50 or less, with the ratio being 60% or more and 300% or less .

The wire diameter of the lead wire of the temperature measuring element is A, the shortest distance from the temperature measuring element to the resistance heating element is L1, a perpendicular line extending vertically from the temperature measuring element to one main surface of the plate-like ceramic body, and a plate-like shape. The wafer support member according to claim 1, wherein the following relationship is satisfied when the shortest distance from the intersection with the one main surface of the ceramic body to the resistance heating element is L2.
(L2-7 × A) <L1 <(L2-A)

3. The wafer support member according to claim 1, wherein a temperature measuring element of the temperature measuring body is disposed in parallel with a bottom surface of the concave portion.