JP3562294B2 - Sensor - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a pressure sensor, an acceleration sensor, a speed sensor, an impact sensor, and other similar sensors.
[0002]
[Prior art]
Among conventional sensors, for example, a pressure sensor called a semiconductor pressure sensor will be described with reference to FIGS. 21 is an external perspective view of the pressure sensor with the cap removed, FIG. 22 is a side sectional view of the pressure sensor, and FIG. 23 is a plan view of the pressure sensor with the cap removed. Referring to these figures, a plastic package 100 is formed in a shallow box shape having an open top with a bottom portion 102 having a flat rectangular shape and a side portion 104 rising from each of its four peripheral edges. A pressure-introducing portion 108 having a pressure-introducing hole 106 is integrally provided at the center of the outer surface 102, a sensor chip 110 is mounted at the center on the inner surface of the bottom 102, and a cap 112 is covered on each of the side portions 104. A plurality of lead frames 114, one ends of which are fixed to the bottom 102 in the package 100, are provided outside the package 100 via the opposite side portions 104 at opposite ends thereof.
[0003]
In such a pressure sensor, the other end of the lead frame 114 is soldered and fixed on a wiring pattern of a substrate on which a pressure detection processing circuit (not shown) is mounted.
[0004]
The sensor chip 110 detects a pressure received from a gas or a fluid introduced into the pressure introducing hole 106, outputs a detection signal to the electrode pad 116 on the chip 110, and has one end fixed to the electrode pad 116. The wire 118, the lead frame 114 to which the other end of the wire 118 is connected, and a wiring pattern on the substrate to which the other end of the lead frame 114 is soldered are input to the circuit, and the pressure detection processing is performed. .
[0005]
The pressure sensor has the other end of the lead frame 114 bent outward, but there is also a pressure sensor having a structure in which the other end of the lead frame 114 is bent inward as shown in FIGS.
[0006]
[Problems to be solved by the invention]
Each semiconductor pressure sensor has a large shape several times or more than the sensor chip. This is, in the case of the above structure,
(1) that a lead frame is used;
(2) Since the sensor chip and the lead frame are separately mounted at different positions, first, a large-area wire is connected to the lead frame in order to connect the sensor chip and the lead frame via a wire. The need for bonding pads,
(3) Since the capillary tube for wire bonding requires a space for the bonding operation in the package, it is necessary to increase the package size.
(4) The package has the thickness of the package itself,
(5) The other end of the lead frame needs to protrude out of the package in order to solder and mount the lead frame on the board;
Etc.
[0007]
As a specific numerical example of the shape and size of this type of conventional pressure sensor, the package size is 11.9 mm (width) × 13.7 mm (length), and the sensor chip size is 2.5 mm (width) × 2. 5 mm (vertical), the distance between the other ends of both the lead frames in the lateral direction of the package is 22.0 mm, and the mounting area of the pressure sensor in a plane is 22.0 mm (horizontal) × 13.7 mm (vertical) = 301.4 mm. ² It has become.
[0008]
Therefore, an object of the present invention is to solve the problem that the size of a sensor, such as the above-described pressure sensor, which hinders the size reduction can be significantly reduced compared to the related art.
[0009]
[Means for Solving the Problems]
In the sensor according to the present invention, the electrical characteristics change in response to the application of the physical quantity, and the sensor chip includes a sensor chip capable of extracting the change in the electrical properties. It has an electrode pad for extracting a change in electrical characteristics, and the electrode pad is provided so as to be connectable to a corresponding electrode on the substrate while the sensor is mounted on the substrate. Has solved the problem.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention will be described by applying the embodiment to a pressure sensor. However, the present invention is not limited to this. For other types of sensors, for example, an acceleration sensor, a speed sensor, an impact sensor, and other sensors. Can be similarly applied.
[0011]
(Embodiment 1)
The pressure sensor according to the first embodiment will be described with reference to FIGS. 1 is a sectional view of the pressure sensor as viewed from the front, FIG. 2 is an exploded view of the pressure sensor shown in FIG. 1, and FIG. 3 is a perspective view of the pressure sensor shown in FIG. FIG. 4 is an exploded perspective view of the pressure sensor shown in FIG. 1 as viewed from a position obliquely downward from the front. 5 and 6 will be described in the middle of the description with reference to FIGS. Further, the positional relations such as the upper side and the lower side described in the first embodiment are relative, and are merely mere relations for facilitating understanding with reference to the drawings.
[0012]
With reference to these drawings, a pressure sensor 1 according to the first embodiment basically includes a sensor chip 2, a cap 4 positioned above the sensor chip 2, and a cap 4 positioned below the sensor chip 2. And an interposer substrate 6 on which the sensor chip 2 is mounted. Note that the substrate in the first embodiment includes not only the interposer substrate 6 but also a mother substrate 8 described later. If the substrate on which the sensor chip 2 is mounted is the mother substrate 8, the interposer substrate 6 is located at an intermediate position. It may be considered a substrate. As is well known, the interposer substrate 6 is a substrate for bonding to the lower surface of the chip, and solder or solder balls are attached to the lower surface of the substrate and mounted on the mother substrate in the same manner as other surface mount components. It is a substrate for making it possible.
[0013]
Hereinafter, each component of the pressure sensor 1 will be described in detail.
[0014]
The sensor chip 2 includes a movable electrode 10 made of a semiconductor material such as silicon and formed so as to be displaceable by applying a pressure, and a fixed electrode 12 made of glass or the like and opposed to the movable electrode 10. The movable electrode 10 includes a thin and flat pressure-sensitive portion 14 that is displaced in response to pressure application, and a thick peripheral portion 16 that supports the periphery so as to allow displacement of the pressure-sensitive portion 14. ing.
[0015]
The sensor chip 2 is configured such that the pressure-sensitive portion 14 of the movable electrode 10 is displaced by a pressure to change the relative distance from the fixed electrode 12 so as to change the electric characteristics, and thus the electric capacity between the electrodes 10 and 12 (this capacity is the pressure-sensitive portion The opposing surfaces of the fixed electrode 12 and the fixed electrode 12, the distance between the opposing surfaces, and the permittivity between the opposing surfaces change), thereby outputting an electric signal corresponding to the pressure. .
[0016]
A peripheral portion 16 on the right side of the movable electrode 10 in the figure extends to the right side in the figure from the right end of the fixed electrode 6, and a pair of electrode pads 20 a and 20 b (one side) opposing a lower surface of the extended portion 18 at a predetermined interval. Are connected to the movable electrode, and the other electrode pad is connected to the fixed electrode.).
[0017]
In addition, a step 22 corresponding to the thickness of the fixed electrode 6 is formed between the right extension portion 18 of the peripheral portion 16 of the movable electrode 10 and the right end surface of the fixed electrode 6.
[0018]
The cap 4 has a cap surface 24 made of resin and having the same plane area as the movable electrode 10 on the inner side, and has a locking claw 26 extending downward at a peripheral portion of the cap surface 24. When the cap 4 is put on the upper surface of the movable electrode 10, the cap 4 can be locked to the movable electrode 10 by the locking claw 26. In addition, the positioning of the cap 4 can be easily performed by the locking claw 26, and it is also preferable to improve the airtightness of the inside.
[0019]
The cap 4 is bonded with a silicone adhesive or a resin adhesive at a position where the cap 4 is in contact with the movable electrode 10 in the locked state, so that the movable electrode 10 can be hermetically held by the cap 4. The cap 4 also has a pressure introducing portion 28 extending vertically upward from the center of the upper surface. Therefore, when the cap 4 is mounted over the movable electrode 10 and pressure is applied from the pressure introducing portion 28 to the pressure-sensitive portion 14 of the movable electrode 10 by the gas or the like, the pressure-sensitive portion 14 is fixed accordingly. It can be displaced with respect to the electrode 12.
[0020]
It should be noted that a thin film made of a conductive material is formed on the corresponding surfaces of the movable electrode 10 and the fixed electrode 12 to form an electrode (not shown) for extracting electric capacitance between the electrodes 10 and 12.
[0021]
The interposer substrate 6 has a flat portion 30 on which the fixed electrode 12 can be placed by partially removing the upper surface corresponding to the shape of the fixed electrode 12, and the step 22 on the right side of the flat portion 30. And a standing portion 32 standing up corresponding to the height. In addition, this deletion configuration can overcome the problem peculiar to the pressure sensor that the electrode portion is not on the uppermost surface or the lowermost surface of the chip.
[0022]
On the back surface of the flat portion 30 of the interposer substrate 6, a pair of electrode patterns 34a, 34b is formed at a predetermined distance in the same direction as the electrode pads 20a, 20b on the lower surface of the extension portion 18. A pair of electrode pads 36a, 36b is formed on the upright portion 32 of the interposer substrate 6 in the same direction as the electrode pads 20a, 20b also on the lower surface of the extension portion 18 on the upper surface thereof, and a conductive material is provided on the inner periphery of each. A pair of through holes 38a, 38b in which the portions are formed penetrate the electrode pads 36a, 36b, and penetrate the electrode patterns 34a, 34b on the lower surface of the flat portion 30.
[0023]
Thus, each of the electrode pads 36a and 36b on the upper surface of the standing portion 32 and each of the electrode patterns 34a and 34b on the lower surface of the flat portion 30 are electrically connected through the through holes 38a and 38b. With this through-hole configuration, the connection can be made at a low cost.
[0024]
The bonding between the upper surface of the flat portion 30 and the side surface of the standing portion 32 of the interposer substrate 6 and the lower surface and the side surface of the fixed electrode 12 of the sensor chip 2 is performed by using a resin, a silicone adhesive, a conductive adhesive, an anisotropic conductive material. An adhesive, an anisotropic conductive film, other adhesives, and an adhesive film are used.
[0025]
In this case, the conductive or anisotropic conductive adhesive does not affect the extraction of the capacitance corresponding to the distance between the movable electrode 10 and the fixed electrode 12 from the electrode pads 20a and 20b on the lower surface of the movable electrode 10 of the sensor chip 2. So that it can be used.
[0026]
The connection between each of the electrode pads 20a and 20b of the movable electrode 10 of the sensor chip 2 and each of the electrode pads 36a and 36b of the standing portion 32 of the interposer substrate 6 is made of a conductive or anisotropic conductive adhesive or a different material. One side conductive film is used. Since the anisotropic conductive adhesive or the anisotropic conductive film changes conductivity only when pressure is applied, the thickness of the electrode pads 20a and 20b of the movable electrode 10 of the sensor chip 2 is increased or the thickness of the electrode pads 20a is increased. , 20b are formed in a projection shape, the electrode pads 36a, 36b on the upper surface of the standing portion 32 of the interposer substrate 6 are made thicker, or the electrode pad 36a, 36b mounting position on the upper surface of the standing portion 32 is projected. Depending on the shape, pressure is applied to the anisotropic conductive adhesive or the anisotropic conductive film.
[0027]
Each of the pair of electrode patterns 34a and 34b on the lower surface of the flat portion 30 of the interposer substrate 6 is used to electrically connect to the mother substrate 8 on which the pressure sensor 1 is mounted, and to connect the pressure sensor 1 itself to the mother substrate 8. It has the effect of fixing.
[0028]
The pressure sensor 1 according to the first embodiment having the above-described configuration is mounted on a mother board 8. A pair of substrate patterns 40a and 40b made of a conductive material such as copper are formed on the mother substrate 8. When the pressure sensor is mounted, the electrode patterns 34a and 34b on the lower surface of the interposer substrate 8 are replaced with the substrate pattern 40a. , 40b are mounted and fixed to the motherboard 8 by soldering.
[0029]
In this case, in order to stably fix the pressure sensor 1 to the mother board 8, the board patterns 40a and 40b are formed on both side ends of the mother board 8 as shown in FIG. 5, for example, or as shown in FIG. Preferably, it is formed on the entire surface of the mother substrate 8.
[0030]
The connection between the pressure sensor 1 and the mother board 8 is performed by soldering the electrode patterns 34a, 34b on the lower surface of the flat portion 30 of the interposer board 6 and the board patterns 40a, 40b on the upper surface of the mother board 8.
[0031]
The mounting area of the pressure sensor 1 according to the first embodiment will be described. The dimensions of the cap 4 are 2.7 mm (horizontal) × 2.7 mm (vertical), and the dimensions of the fixed electrode 12 are 2.5 mm (horizontal) × 2. 5 mm (vertical), so the mounting area in the planar direction is 2.7 mm (horizontal) × 2.7 mm (vertical) = 7.29 mm ² It becomes. This is 301.4 mm of the conventional pressure sensor. ² The mounting area is about 1/40 of that of the above, and the size is very reduced.
[0032]
As described above, according to the first embodiment, the sensor chip 2 is configured by the movable electrode 10 formed so as to be displaceable by applying pressure and the fixed electrode 12 arranged opposite to the movable electrode 10. The sensor chip 2 is mounted on a mother substrate 8 via an interposer substrate 6, and the movable electrode 10 and the fixed electrode 12 are individually individually connected to the respective electrodes on the mother substrate 8 via the interposer substrate 6. The connection eliminates the need for a conventional package and lead frame, and thus eliminates the need for wire bonding between the sensor chip and the lead frame, and thus eliminates the need for space for bonding work such as a capillary tube. All of the factors that have hindered downsizing of the pressure sensor have been eliminated, and the downsizing of the pressure sensor has been greatly promoted. It has become what can bet.
[0033]
(Embodiment 2)
Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. The second embodiment differs from the first embodiment in that the surface is mounted on a normal substrate, and is processed and mounted on the substrate.
[0034]
In the pressure sensor 1 b according to the second embodiment, the mother substrate 8 is thicker than the fixed electrodes 12 of the sensor chip 2. The mother substrate 8 is seated in a slightly larger area than the fixed electrode 12 of the sensor chip 2 to form the concave portion 42, and a pair of electrode patterns 40a and 40b are formed on the upper surface of the mother substrate 8 around the concave portion 42. Form. The fixed electrode 12 of the sensor chip 2 is bonded and fixed to the concave portion 42 with an adhesive 44, and the electrode pads 20 a and 20 b on the lower surface of the extended portion 18 of the movable electrode 10 of the sensor chip 2 are connected to the electrode pattern 40 a on the upper surface of the mother substrate 8. , 40b with an adhesive such as a conductive adhesive, an anisotropic conductive adhesive, or an anisotropic conductive film.
[0035]
As described above, in the second embodiment, similarly to the first embodiment, the conventional package and the lead frame are not required, and therefore, it is necessary to wire-bond the sensor chip and the lead frame. All of the factors that hindered the miniaturization of the pressure sensor were eliminated, such as eliminating the need for space for bonding work such as a capillary tube.This has made it possible to significantly reduce the size of the pressure sensor. .
[0036]
(Embodiment 3)
Embodiment 3 of the present invention will be described with reference to FIG. The third embodiment differs from the first embodiment in that the surface is mounted on a normal substrate, and the substrate is processed and mounted.
[0037]
In the pressure sensor 1 b according to the third embodiment, the thickness of the mother substrate 8 is smaller than that of the fixed electrode 12 of the sensor chip 2. A through hole 46 is formed in the mother substrate 8 in an area slightly larger than the fixed electrode 12 of the sensor chip 2. A support substrate 48 is fixed to the lower surface around the through hole 46 of the mother substrate 8 with an adhesive 50. Then, the lower surface of the fixed electrode 12 of the sensor chip 2 is fixed to the upper surface of the support substrate 48.
[0038]
Other configurations are the same as those of the second embodiment.
[0039]
As described above, also in the third embodiment, similarly to the first embodiment, the conventional package and the lead frame are not required, and therefore, it is necessary to wire-bond the sensor chip and the lead frame. All of the factors that hindered the miniaturization of the pressure sensor were eliminated, such as eliminating the need for space for bonding work such as a capillary tube.This has made it possible to significantly reduce the size of the pressure sensor. .
[0040]
(Embodiment 4)
Embodiment 4 of the present invention will be described with reference to FIGS. The fourth embodiment differs from the first embodiment in that the surface is mounted on a normal substrate, and is processed and mounted on the substrate.
[0041]
In the pressure sensor 1c according to the fourth embodiment, a through hole 46 having a slightly larger area than the fixed electrode 12 of the sensor chip 2 is formed in the mother substrate 8.
[0042]
The cap 4 of the pressure sensor 1 c has a locking portion 52 in which the end of the cap 4 is locked on the mother substrate 8 when the fixed electrode 12 is inserted into the through hole 46 of the mother substrate 8. The pressure sensor 1c is bonded and fixed on the mother substrate 8 by bonding the lower surface 54 of the 52 to the mother substrate 8 with an adhesive made of resin or silicon.
[0043]
Other configurations are the same as those of the second embodiment.
[0044]
In the above-described configuration, even if a stress is applied by the pressure introduced into the cap 4, the stress applied to the sensor chip 2 is reduced, so that the reliability is improved.
[0045]
The mounting area of the pressure sensor according to the fourth embodiment will be described. The dimensions of the cap 4 are 2.9 mm (horizontal) × 2.9 mm (vertical), and the dimensions of the fixed electrode 12 are 2.5 mm (horizontal) × 2.5 mm. (Vertical), and the mounting area is 2.9 mm (horizontal) x 2.9 mm (vertical) = 8.4 mm ² It becomes. This is 301.4 mm of the conventional pressure sensor. ² The mounting area is reduced to about 1/36 of that of, and the size is extremely reduced.
[0046]
As described above, in the fourth embodiment, similarly to the first embodiment, the conventional package and the lead frame are not required, and therefore, it is necessary to wire-bond the sensor chip and the lead frame. Eliminates all the factors that have hindered miniaturization of pressure sensors, such as eliminating the need for space for bonding work such as capillary tubes, and greatly reducing the size of the pressure sensor. Was.
[0047]
(Other embodiments)
In each of the first to fourth embodiments, the pressure introducing portion 38 of the cap 4 extends vertically upward from the upper surface of the cap 4, but as shown in FIG. 16, the pressure introducing portion 38 extends along the upper surface. The portion 38 may be provided to further reduce the size.
[0048]
In each of the above-described embodiments, the extending portion 18 of the movable electrode 10 is simply extended horizontally to the right of the fixed electrode 12 in the drawing, but as shown in FIG. The interposer substrate 6 is provided by extending downward, forming the electrode pads 20a, 20b on the lower extension end surfaces, and connecting the lower extension ends to the electrode patterns 40a, 40b on the mother substrate 8. In addition, since it is not necessary to form a concave portion or a through hole in the mother substrate 8, it is possible to simplify the manufacturing and contribute to a reduction in cost.
[0049]
In each of the above-described embodiments, the extension 18 of the movable electrode 10 extends horizontally to the right of the fixed electrode 12, and the electrode pads 20 a and 20 b formed on the extension 18 are connected to the mother substrate 8. In order to connect to the electrode patterns 40a and 40b, an interposer substrate 6 is provided, and a recess or a through hole is formed in the mother substrate 8, but a projection 58 is formed on the mother substrate 8 as shown in FIG. If the electrode patterns 40a, 40b are formed on the protrusions 56, and the electrode pads 20a, 20b on the lower surface of the extension portion 18 of the movable electrode 10 are connected to the electrode patterns 40a, 40b of the protrusions 58, There is no need to provide the poser substrate 6 or to form recesses or through-holes in the mother substrate 8, which simplifies manufacturing and contributes to cost reduction. It can be.
[0050]
In each of the above-described embodiments, the extension 18 of the movable electrode 10 extends horizontally to the right of the fixed electrode 12, and the extension 18 has the electrode pads 20 a and 20 b formed thereon. However, the electrode pads 20a and 20b may be formed on the fixed electrode 12 as shown in FIG. In this case, the movable electrode 10 can be shortened in the horizontal direction by the length of the extended portion 18, which can contribute to downsizing.
[0051]
In each of the above-described embodiments, the detection of the pressure is detected by the change in the electric capacitance between the movable electrode 10 and the fixed electrode 12, but as shown in FIG. May be omitted, the movable electrode 10 may be fixed on the mother substrate 8, and the piezoresistive element 60 may be provided on the pressure-sensitive portion 14 of the movable electrode 10. The operation of the sensor chip in this case is such that when the pressure-sensitive portion 14 of the movable electrode 10 is deformed as a deformable portion in response to the applied pressure, the sensor chip is distorted by the deformation of the pressure-sensitive portion 14, resulting in an electrical characteristic. For example, a piezoresistive element 60 whose electric resistance changes, such as a piezoresistive element whose resistance value corresponds to the pressure change, that is, a change in electric characteristics, can constitute a pressure sensor. In the drawings, the element 60 is shown as being attached to the pressure-sensitive portion 14 for understanding, but the pressure-sensitive portion itself has a specific position on the n-type silicon semiconductor crystal such as a semiconductor diffusion resistor. May be constituted by a p-type resistance wire strain gauge of the Wheatstone bridge type by diffusing and penetrating boron. In addition to this element, any piezoelectric element or the like may be used as long as its electrical characteristics change due to deformation.
[0052]
In the case where such a device or a movable electrode having a pressure-sensitive portion configuration is used, an electrode pad similar to the electrode pads 20a and 20b of the above-described embodiments is formed on the lower surface of the peripheral portion 16 of the movable electrode 10, and If this is directly connected to the electrode patterns 40a and 40b of the mother substrate 8, the same implementation as the above-described embodiment can be performed.
[0053]
In the above-described embodiment, the applied physical quantity is pressure because the pressure sensor is used. However, the present invention is not limited to this, and may be a physical quantity corresponding to the form of the sensor. .
[0054]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
[0056]
The present invention 1 According to the sensor of the above, a sensor chip and an interposer substrate are provided, and the sensor chip is disposed opposite to the fixed electrode, and is displaceable by applying a physical quantity, A movable electrode having an electrode pad on an extended portion extending laterally from the fixed electrode, wherein the interposer substrate rises toward a flat surface on which the fixed electrode is placed and an extended portion of the movable electrode. And a through hole for individually connecting the electrode pad of the extension of the movable electrode to each of the electrodes on the motherboard. Invention first sensor In Since the lead frame is not used, it is not necessary to project the other end of the lead frame out of the package in order to mount the lead frame on the board by soldering as in the related art. Therefore, in the first sensor of the present invention, it is possible to significantly reduce the size of the sensor according to the first embodiment of the present invention by removing all of the factors that hinder the conventional reduction in size.
[0057]
In addition, the mother substrate has a bottomed groove capable of accommodating the whole or a part of the fixed electrode, and the sensor chip is configured such that, when the fixed electrode is housed in the bottomed groove, the extension portion In the case where each of the upper electrode pads is connected to the corresponding electrode on the substrate, the size of the sensor in the height direction can be further reduced by the depth of the bottomed groove.
[0058]
The mother substrate has a through hole through which the fixed electrode can pass, and the mother substrate is provided with a support substrate so as to face the through hole. In a case where each electrode pad on the extension portion is connected to a corresponding electrode on the mother substrate while being supported on the support substrate in the through hole, the thickness of the sensor corresponds to the thickness of the mother substrate. The size in the height direction can be further reduced.
[0059]
In the case where the sensor chip is fixed on the substrate with the cap and each electrode pad on the extension portion is connected to a corresponding electrode on the substrate, the sensor chip is Installation is simplified.
[0060]
In the case where the fixed electrodes are provided with the respective electrode pads so as to be individually connected to the respective electrodes on the substrate, the same operation as in the case where the electrode pads are provided on the movable electrode side is performed. In addition to the effect, the fixed electrode is closer to the mother substrate than the movable electrode, so that the configuration of the movable electrode is simplified and the connection to the substrate is facilitated.
[Brief description of the drawings]
FIG. 1 is a side sectional view of a pressure sensor according to a first embodiment of the present invention.
FIG. 2 is an exploded view of the pressure sensor of FIG.
FIG. 3 is an exploded view of the pressure sensor of FIG. 1 as viewed from an obliquely upper position.
FIG. 4 is an exploded view of the pressure sensor of FIG. 1 as viewed from an obliquely lower position.
FIG. 5 is a bottom view showing a modification of the interposer substrate of FIG. 1;
FIG. 6 is a bottom view showing another modified example of the interposer substrate of FIG. 1;
FIG. 7 is a side sectional view of a pressure sensor according to a second embodiment of the present invention.
FIG. 8 is an exploded view of the pressure sensor of FIG. 7;
9 is an exploded view of the pressure sensor of FIG. 7 as viewed from an obliquely upper position.
FIG. 10 is an exploded view of the pressure sensor of FIG. 7 viewed from a diagonally lower position.
FIG. 11 is a side sectional view of a pressure sensor according to Embodiment 3 of the present invention.
FIG. 12 is a side sectional view of a pressure sensor according to Embodiment 4 of the present invention.
FIG. 13 is an exploded view of the pressure sensor of FIG.
14 is an exploded view of the pressure sensor of FIG. 12 as viewed from an obliquely upper position.
FIG. 15 is an exploded view of the pressure sensor of FIG. 12 viewed from a diagonally lower position.
FIG. 16 is a perspective view showing a modification of the cap.
FIG. 17 is a side sectional view of a main part of a pressure sensor according to another embodiment of the present invention.
FIG. 18 is a side sectional view of a main part of a pressure sensor according to still another embodiment of the present invention.
FIG. 19 is a side sectional view of a main part of a pressure sensor according to still another embodiment of the present invention.
FIG. 20 is a side sectional view of a main part of a pressure sensor according to still another embodiment of the present invention.
FIG. 21 is an external perspective view of a conventional pressure sensor with a cap removed.
22 is a side cross-sectional view of the pressure sensor of FIG. 21 (side cross-sectional view along the line AA of FIG. 23 with a cap attached).
FIG. 23 is a plan view of the pressure sensor of FIG. 21 with a cap removed.
FIG. 24 is a side cross-sectional view of another conventional pressure sensor (a side cross-sectional view along line BB in FIG. 25 with a cap attached).
FIG. 25 is a plan view of the pressure sensor of FIG. 24 with a cap removed.
[Explanation of symbols]
1 Pressure sensor
2 Sensor chip
4 caps
6 Interposer board
8 Mother board
10 Movable electrode of sensor chip
12 Sensor chip fixed electrode
14 Pressure-sensitive part of movable electrode

Claims (5)

It has a sensor chip and an interposer substrate,
The sensor chip includes a fixed electrode, and a movable electrode which is disposed on the fixed electrode to face each other, is displaceable by application of a physical quantity, and has an electrode pad on an extended portion extending laterally from the fixed electrode. ,
The interposer substrate has a flat surface on which the fixed electrode is placed, and a standing portion raised toward an extension of the movable electrode, and the standing portion has an extension of the movable electrode. A sensor having a through hole for individually connecting a part of said electrode pad to each electrode on a mother substrate . The sensor according to claim 1,
The mother substrate has a bottomed groove capable of accommodating the whole or a part of the fixed electrode, and the sensor chip is provided on the extended portion in a state where the fixed electrode is accommodated in the bottomed groove. A sensor, wherein each electrode pad is connected to a corresponding electrode on the mother substrate . The sensor according to claim 1 ,
The mother substrate has a through hole through which the fixed electrode can pass, and a support substrate is attached to the mother substrate so as to face the through hole,
The sensor chip is characterized in that each electrode pad on the extension is connected to a corresponding electrode on the mother substrate in a state where the fixed electrode is supported on a support substrate in the through hole. Sensor. The sensor according to claim 1 ,
The sensor, wherein each electrode pad on the extension portion is connected to a corresponding electrode on the mother substrate while the sensor chip is fixed on the mother substrate with the cap . The sensor according to any one of claims 1 to 4 ,
The sensor according to claim 1, wherein each of the electrode pads is provided such that the fixed electrode is individually connected to each of the electrodes on the mother substrate .

Images