JP3544853B2 - Print paste printing apparatus and printing method - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a printing paste printing apparatus and a printing method for printing and applying a printing paste, for example, cream solder, on a circuit board surface as a printing object.
[0002]
[Prior art]
Conventionally, when soldering electronic components such as chip components onto a printed circuit board in the manufacture of electronic circuit boards, cream solder is mainly used, and the cream solder is printed and applied in a desired pattern. A printing machine is used.
As an example of a squeegee head mounted on the conventional cream solder printing machine 100, a squeegee head having a configuration as shown in FIG. 14 is exemplified. Normally, in the printing operation, the squeegee head 102 moves alternately from left to right and from right to left in FIG. 14 for each printed circuit board 5. At this time, in the rightward printing from left to right, rightward printing is performed. The directional squeegee 101a is used, and the leftward squeegee 101b is used in the opposite leftward printing.
The printing operation of the cream solder on the printed circuit board 5 by the conventional cream solder printing machine 100 will be described with reference to FIGS. 14 and 15, reference numeral 3 denotes a mask on which an opening 4 having a desired pattern is formed, 5 denotes a printed board, 6 denotes a land on which the cream solder 7 is printed, and 8 denotes a solder resist. The desired pattern of the mask 3 refers to a pattern in which the openings 4 are formed corresponding to the lands 6 on the printed circuit board 5.
[0003]
First, when performing the rightward printing, the printed circuit board 5 is positioned on the mask 3 so that the openings 4 and the lands 6 coincide with each other, and then the leftward printing squeegee 101b is raised and the rightward printing is performed. The squeegee 101a for directional printing is lowered to bring the squeegee tip 103 into contact with the surface 3a of the mask 3 at an appropriate printing pressure. In this state, the cream solder 7 previously provided on the surface 3a of the mask 3 is filled in the opening 4 of the mask 3 by linearly moving the rightward printing squeegee 101a along the right direction. After the rightward printing squeegee 101a moves to the right end of the mask 3, the printing operation is completed by separating the printed circuit board 5 from the mask 3. In the case of performing the leftward printing, similarly to the rightward printing described above, after the printed circuit board 5 is positioned on the mask 3 and superimposed, then the rightward printing squeegee 101a is raised in the opposite direction. Then, the leftward printing squeegee 101b is lowered to bring the squeegee tip 103 into contact. The subsequent operation is the same as the above-described rightward printing. In this way, by repeating these operations alternately for each printed circuit board 5, the cream solder 7 is continuously printed and applied onto the lands 6 of each printed circuit board 5 via the mask 3.
[0004]
On the other hand, the cream solder 7 is a paste-like substance obtained by mixing a solder powder with a high-viscosity flux. Therefore, the types of the cream solder 7 are innumerable depending on the type of the flux and the type of the solder powder, or the combination of the mixing ratio thereof, and the flow characteristics thereof are various. The flow characteristics of the cream solder 7 are generally represented by viscosity, but are often qualitatively expressed. When the viscosity is low, it is called a soft cream solder, and when the viscosity is high, Called hard cream solder. For example, in the case of the cream solder 7 having a low viscosity, since the fluidity is good, the cream solder 7, in particular, the flux is filled in the minute gap between the back surface of the mask 3 and the printed board 5 when filling the opening 4. The flux and the cream solder 7 are liable to bleed out as a result of printing on the printed circuit board 5, that is, the so-called printing bleeding or printing defects such as bridges are easily generated. On the other hand, in the case of the cream solder 7 having a high viscosity, since the fluidity is poor, it is difficult to fill the cream solder 7 into the opening 4, and printing failure such as unfilling or blurred print is likely to occur.
As described above, since the printing quality is greatly affected by the flow characteristics, that is, the viscosity, of the cream solder 7, in the conventional cream solder printing process, the inspection result report of the cream solder 7 attached by the maker when the cream solder 7 is purchased. At present, the viscosity of the cream solder 7 is controlled by referring to the described viscosity or measuring the viscosity of the cream solder 7 with a viscometer before printing.
[0005]
[Problems to be solved by the invention]
However, a cream solder printing apparatus in an actual circuit board production process performs continuous printing for a long time from the viewpoint of productivity. Therefore, the cream solder 7 on the surface 3a of the mask 3 is constantly stressed because squeezing is repeatedly performed in the left and right printing directions. In addition, since the amount of the cream solder 7 on the front surface 3a is gradually reduced by the continuous printing, a new cream solder 7 is supplied every predetermined time. In addition, during continuous printing for a long time, the ambient temperature around the cream solder printing apparatus also changes.
Due to such conditions, the viscosity of the cream solder 7 on the surface 3a changes each time, and also changes with the aging of the cream solder 7 itself. Therefore, in the conventional viscosity management using the viscosity value based on the inspection report at the time of purchase, the value measured by a viscometer before printing, and the like, the cream solder 7 on the surface 3a of the mask 3 during the printing process is not used. However, there is a problem that printing failure occurs due to a change in the viscosity of the cream solder 7 during continuous printing.
The present invention has been made to solve such a problem, and provides a printing paste printing apparatus and a printing method that can prevent the occurrence of printing failure due to a change in viscosity of a printing paste such as cream solder. The purpose is to:
[0006]
[Means for Solving the Problems]
In a printing paste printing apparatus according to a first aspect of the present invention, a squeegee moves in a printing direction on a surface of a printing mask in which an opening is formed, so that a printing paste on the surface is positioned on a back surface of the printing mask. A printing paste printing apparatus for printing and applying the circuit board surface through the opening portion to be applied,
At the time of printing, the tip is arranged in a non-contact state with a gap from the surface, moves in the same direction as the squeegee, and detects the pressure generated in the print paste by the movement, and the print paste by the squeegee is detected. A pressure detecting member having a pressure detector for determining the viscosity during printing of,
Based on the viscosity of the printing paste obtained based on the pressure measured by the pressure detector, at least the moving speed of the squeegee, the angle between the squeegee and the surface, the pressing force of the squeegee, and the temperature of the printing paste. A control device for controlling any one of:
It is characterized by having.
[0007]
A printing paste printing method according to a second aspect of the present invention includes the step of squeezing the surface of a printing mask to print the printing paste on the surface through an opening formed in the printing mask. A print paste printing method of printing and applying on a circuit board surface located on the back surface of
A pressure detector provided on a pressure detecting member whose tip is disposed in a non-contact state with a gap between the surface and the pressure detector detects a pressure generated in the printing paste applied by the squeezing. It is characterized in that the viscosity of the printing paste during printing is measured.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
A printing paste printing apparatus and a printing method according to an embodiment of the present invention will be described below with reference to the drawings. The printing method is executed by the print paste printing apparatus. In each of the drawings, components that perform the same or similar functions have the same reference characters allotted, and description thereof will not be repeated. In the present specification, cream solder, which is a paste solder obtained by mixing powder solder with a high-viscosity flux, is taken as an example of the printing paste. Therefore, in the present embodiment, a cream solder printing device is taken as an example of the print paste printing device, and a cream solder printing method is taken as an example of the print paste printing method.
[0009]
The cream solder printing apparatus 1001 has substantially the same configuration as the conventional cream solder printing apparatus, and as shown in FIG. 11, a board loading apparatus 55 for loading a board 5 on which printing is performed into the cream solder printing apparatus 1001, and a loading apparatus 55. A stage unit 60 having a device for correcting the X, Y, and θ positions of the substrate 5, a plate separation device for separating the plate between the mask 3 and the substrate 5 after printing, a substrate support device 61 for supporting the substrate 5, A board position correcting recognition camera 62 for obtaining information for alignment between the mask 3 and the board 5, a squeegee head 10, a driving device 76 for driving the squeegee head 10, and operation control of the cream solder printing apparatus 1001 And a control device 81 for performing the control. In addition, among the above-described components, the remaining components other than the squeegee head 10 and the control device 81 having the characteristic structure in the present embodiment are the same as those of the conventional cream solder printing apparatus. The following mainly describes the squeegee head 10 and the control device 81. The cream solder printing apparatus 1001 is of a type in which a squeegee moves in both the left and right printing directions described above.
[0010]
FIG. 1 schematically shows the periphery of a squeegee head 10 in a cream solder printing apparatus 1001 according to the present embodiment. The squeegee head 10 has a rightward printing squeegee 14a used in rightward printing and a leftward printing squeegee 14b used in leftward printing, similarly to the conventional squeegee head shown in FIG. A pressure detecting member 30 having a pressure detector 35 for measuring a pressure for determining the viscosity of the cream solder 7 during printing of the cream solder 7 is provided.
First, the printing squeegees 14a and 14b will be described.
Each of the printing squeegees 14a and 14b that fills the opening 4 of the mask 3 with the cream solder 7 during printing is a printing squeegee attached to the base plate 17 of the squeegee head 10 constituting the cream solder printing apparatus 51, respectively. The upper and lower driving devices 15 and 16 are attached to the distal ends of the output shafts 13a and 13b, respectively, and can be moved up and down between the standby position 18 and the squeezing position 19 by the vertical driving devices 15 and 16. The base plate 17 is moved in the left and right printing directions by a driving device 76 whose operation is controlled by a control device 81. FIG. 1 shows a state in which rightward printing is being performed, and thus a state in which the rightward printing squeegee 14a has been lowered to the squeezing position 19 and the leftward printing squeegee 14b has been raised to the standby position 18. ing. When the rightward printing squeegee 14a or the leftward printing squeegee 14b is located at the squeezing position 19, an appropriate pressure is applied to the front surface 3a of the mask 3 at the tips 20a and 20b of each squeegee. In such a state, the mask 3 is brought into contact with the surface 3a of the mask 3 to perform the filling operation of the cream solder 7 into the opening 4 of the mask 3.
Further, each of the driving device 76 and the vertical driving devices 15 and 16 is connected to a control device 81 that controls the operation of the cream solder printing device 51.
[0011]
The pressure detecting member 30 is attached to a tip of an output shaft 32 of a driving device 31 for the pressure detecting member attached to the base plate 17. As shown in detail in FIG. 2, the pressure detecting member 30 has a pressure detecting slope having a surface facing the surface 3 a of the mask 3, which is inclined upward from the front end 33 of the pressure detecting member 30 in the printing direction. In the present embodiment, the pressure detector 35 is attached to the tip 33 so that the pressure detection surface 35a of the pressure detector 35 is flush with the pressure detection slope 34 in this embodiment. It is buried. In the present embodiment, one such pressure detector 35 is provided substantially at the center in the width W direction of the pressure detection member 30 as shown in FIG. The arrangement position and number of the pressure detecting members 30 in the width W direction are not limited to those described above.
As shown in FIG. 3, such a pressure detecting member 30 has a non-opening area 91 outside the area of the substrate 5 on which the cream solder 7 is printed, that is, on the mask 3 where the opening 4 is not formed. And the width W is long enough to squeeze a part of the non-opening area 91. The cream solder 7 exists even in the non-opening portion 91.
Further, the pressure detector 35 is connected to the control device 81. The control device 81 outputs the cream solder 7 during printing based on the pressure information (“p” described below) of the cream solder 7 supplied from the pressure detector 35. Is determined.
[0012]
The driving device 31 is connected to the control device 81 and has a dimension h2 between the surface 3a of the mask 3 and the tip 33 of the pressure detecting member 30 as shown in FIG. The pressure detecting member 30 is arranged so as to form the gap H2 formed by the pressure. During the pressure measurement, the dimension h2 of the gap H2 does not change. When the pressure detecting member 30 is arranged with the gap H2 as described above, the intersection line portion 37 between the printing direction side surface 36 of the pressure detecting member 30 and the pressure detecting slope 34, and the surface 3a The dimension of the gap H1 is h1. The distance between the gap H1 and the gap H2 is L.
[0013]
The reason why the pressure of the cream solder 7 during printing can be detected by the pressure detecting member 30 will be described. In the state shown in FIG. 1, when the pressure detecting member 30 is moved rightward as indicated by an arrow, the cream solder 7 moves from the above-described gap H1 to the pressure detecting slope 34 of the pressure detecting member 30. It flows in and flows out of the gap H2. This phenomenon can be explained by considering the flow of material into the narrow wedge-shaped gap. That is, a model as shown in FIG. 5 is considered. This model is a generally well-known model used in the description of fluid lubrication in bearings and the like, but this model is similar to the form from the gap H2 to the gap H1 of the pressure detecting member 30. In FIG. 5, the size of the gap between the wall body 301 and the reference surface 302 on the fluid inlet side is represented by h.₁, The size of the gap on the exit side is h₂Where L is the distance between the inlet gap and the outlet gap, h is the size of the gap between the wall 301 and the reference surface 302 at a distance x from the inlet gap, v is the moving speed of the wall 301, and η is the viscosity of the fluid. It is well known that the pressure p generated at the position of the distance x by the flow of the fluid is expressed by the following equation.
p = (6ηvL / (h₁ ²-H₂ ²)) ・ ((H₁-H) (hh₂) / H²)… (1)
Here, the conditions other than the viscosity η of the cream solder 7 and the printing speed v in the above equation (1) are the dimensions h1 of the gap H1, the dimension h2 of the gap H2, and the interval L between the gap H1 and the gap H2. When the pressure detecting member 30 is arranged so as to be kept constant, the above equation (1) is transformed into the equation (2).
p = A₁ηv (However, A₁Is a constant)
(A₁= (6L / (h₁ ²-H₂ ²)) ・ ((H₁-H) (hh₂) / H²)… (2)
Therefore, the viscosity η of the cream solder 7 can be represented by the pressure p and the printing speed v generated in the cream solder 7 by the pressure detecting member 30 as shown in the following equation (3).
η = A₂(P / v) (However, A₂Is a constant, A₂= 1 / A₁…… (3)
[0014]
As described above, the viscosity of the cream solder 7 during printing can be measured by detecting the pressure of the cream solder 7 by the pressure detector 35. The reason why the pressure detecting member 30 is disposed corresponding to the non-opening portion 91 will be described. If the pressure detecting member 30 is arranged in a region where the opening 4 is formed, the cream solder 7 may fill the opening 4 due to the pressure generated by the pressure detecting member 30. In this case, Is filled twice by the pressure detecting member 30 and the printing squeegee 14a, and the filling state differs between the opening 4 through which the pressure detecting member 30 has passed and the opening 4 not passing through. Because.
In the area of the circuit board 5, that is, in the area where the opening 4 is formed, the dimension h2 of the gap H2 at the tip 33, which is a position near the arrangement of the pressure detector 35, changes depending on the presence or absence of the opening 4. Therefore, in the region where the opening 4 is formed, the pressure of the cream solder 7 detected by the pressure detector 35 fluctuates, and the required viscosity of the cream solder 7 changes.
For these reasons, the pressure detecting member 30 is arranged corresponding to the non-opening portion 91.
[0015]
The installation position of the pressure detecting member 30 is not limited to the position shown in FIG. 3, and as shown in FIG. 6, for example, it is disposed adjacent to the printing squeegee 14a in the longitudinal direction of the printing squeegee 14a. For example, even if the pressure detecting member 30 is directly attached to the longitudinal end of the printing squeegee 14a as in the cream solder printing apparatus 1002 shown in FIG. 7 or FIG. 8 which is a side view of FIG. Good. In such a cream solder printing apparatus 1002, for example, when the printing squeegee 14a performs filling and scraping, that is, when the tip 20a contacts the surface 3a of the mask 3, the tip 33 of the pressure detection member 30 and the surface The pressure detecting member 30 is attached to the printing squeegee 14a such that the gap dimension with respect to 3a is h2. Further, since the pressure detecting member 30 is directly attached to the printing squeegee 14a in this manner, the cream solder printing apparatus 1002 does not include the driving device 31 for driving the pressure detecting member 30.
[0016]
As described above, since the pressure detecting slope 34 is inclined upward in the printing direction, during printing, the cream solder 7 is gradually compressed along the pressure detecting slope 34 and then discharged from the gap H2. Is done. Therefore, the pressure of the cream solder 7 passing through the pressure detecting member 30 becomes the largest in the vicinity of the tip, as shown by a graph 92 in FIG. 12, and the pressure change due to the viscosity of the cream solder 7 is the largest. It becomes. Therefore, the disposition position of the pressure detector 35 is preferably in the vicinity of the tip 33 as in the present embodiment, but is not limited to the tip 33 portion. However, as shown in the graph 92, when the distance from the tip 33 to the distance of 1/4 to 1/3 of the length of the pressure detecting slope 34 is reduced, the pressure of the cream solder 7 is rapidly decreased. Is preferably in a range from the tip 33 to a position apart from the above-mentioned distance of 1/4 to 1/3.
[0017]
FIG. 1 shows the state of the pressure detecting member 30 in rightward printing, but when performing leftward printing in the cream solder printing apparatus 1001, the pressure detecting member 30 is in the state shown in FIG. That is, since the pressure detecting slope 34 needs to be inclined upward in the printing direction as described above, the pressure detecting member 30 is arranged to be rotated by 180 degrees about the output shaft 32 by the driving device 31. .
Further, as a type in which the rotation operation of the pressure detecting member 30 is omitted, a cream solder printing apparatus 1003 shown in FIG. 10 can be configured. The cream solder printing apparatus 1003 has a pressure detection member 40 having a cross section of a ship bottom instead of the above-described pressure detection member 30, and moves the pressure detection member 40 up and down instead of the above-described driving device 31. It has a driving device 41. As shown in FIG. 13, the pressure detection member 40 has a structure in which the pressure detection members 30 shown in FIG. 2 are symmetrically arranged. A pressure detector 35-1 is provided on the pressure detecting slope 42 being compressed, and a pressure detector 44 is provided near the tip 43 on the pressure detecting slope 44 where the cream solder 7 is compressed during the above-described leftward printing. 35-2 is installed. Further, the driving device 41 arranges the pressure detecting member 40 such that the front end 43 forms a gap H2 having the dimension h2 with respect to the surface 3a of the mask 3 as in the case of the pressure detecting member 30. By providing such a pressure detecting member 40, the pressure of the cream solder 7 is detected by the pressure detector 35-1 during the rightward printing, and the pressure detector 35-2 during the leftward printing. The pressure of the cream solder 7 is detected. The detected pressure is sent to the control device 81 from the pressure detector 35-1 during the rightward printing and from the pressure detector 35-2 during the leftward printing.
[0018]
The operation of the cream solder printing apparatus 1001 configured as described above will be described below. The operation of loading the substrate 5, the operation of aligning the mask 3 with the substrate 5, and the operation of printing with the printing squeegees 14a and 14b are the same as those of the conventional cream solder printing apparatus. The description is omitted, and here, the operation related to the pressure detecting member 30 will be mainly described. The operation of the cream solder printing apparatus 1001 is controlled by the control device 81.
The case where the rightward printing is performed by the printing squeegee 14a will be described as an example. The drive device 31 is operated under the control of the control device 81, and the pressure detection member 30 is arranged so that the tip 33 of the pressure detection member 30 forms a gap H2 having a dimension h2 with respect to the surface 3a of the mask 3. . Further, since rightward printing is performed, the pressure detecting slope 34 of the pressure detecting member 30 is arranged by the driving device 31 so as to be inclined upward to the right. In such a state, the squeegee head 10 is moved rightward at a predetermined speed by the driving device 76 for driving the squeegee head 10. Therefore, the pressure detecting member 30 also moves rightward as the printing squeegee 14a moves rightward. Therefore, of the cream solder 7 placed on the surface 3 a of the mask 3, the cream solder 7 corresponding to the substrate 5 is filled into the opening 4 of the mask 3 by the printing squeegee 14 a. Also, of the cream solder 7 placed on the surface 3 a of the mask 3, the cream solder 7 existing in the non-opening area 91 flows from the gap H 1 of the pressure detecting member 30 to the gap H 2 side and the gap H 2 Pass through. At this time, the cream solder 7 sandwiched between the pressure detection slope 34 of the pressure detection member 30 and the surface 3a of the mask 3 is detected by a pressure detector 35 installed near the tip 33 of the pressure detection member 30. Is detected by the pressure detector 35, and the pressure information is sent to the control device 81 in real time.
[0019]
The control device 81 obtains the viscosity of the cream solder 7 during printing based on the pressure information by substituting the pressure information supplied in the present embodiment into the equation (3). Based on the obtained viscosity, when the viscosity of the cream solder 7 is lower than a predetermined viscosity suitable for printing, the control device 81 increases the operating speed of the driving device 76 and decreases the moving speed of the squeegee head 10, for example. Cream solder for increasing the speed, increasing the angle α between the printing squeegee 14a and the surface 3a, and driving the vertical drive unit 15 to lower the force with which the printing squeegee 14a presses the surface 3a, that is, the printing pressure. At least one operation of lowering the temperature of 7 is performed to change the printing conditions such as the printing speed and the filling angle of the squeegee, or to make the viscosity of the cream solder 7 suitable for the printing. As a specific method for lowering the temperature of the cream solder 7, for example, lowering the ambient temperature of the cream solder printing apparatus 1001 can be considered. On the other hand, when the obtained viscosity is higher than the predetermined viscosity suitable for the printing, the control device 81 decreases the operating speed of the driving device 76 and the moving speed of the squeegee head 10, for example, At least one operation of reducing the squeegee angle α, driving the vertical driving device 15 to increase the printing pressure, and increasing the temperature of the cream solder 7 is performed to change the printing conditions, or The viscosity of 7 is adjusted to a viscosity suitable for the printing.
[0020]
The method of obtaining the viscosity of the cream solder 7 during printing based on the pressure information in the control device 81 is not limited to the method of directly substituting the measured pressure information into the above equation (3). In addition, for example, using a so-called table listing and calculating the cream solder viscosity for the pressure information in advance, using a graph showing the relationship between the pressure information and the cream solder viscosity, and various known methods Can be used.
[0021]
After the printing in the right direction is performed and the printing squeegee 14a moves to the right end in this manner, the printing squeegee 14a is arranged at the standby position 18, the printing squeegee 14b is arranged at the squeezing position 19, and By actuating 31, the pressure detecting member 30 is turned 180 degrees so that the pressure detecting slope 34 is inclined upward toward the left.
Then, while performing the printing operation in the same manner as in the above-described rightward printing, the pressure detecting member 30 detects the pressure of the cream solder 7 and the control device 81 obtains the viscosity of the cream solder 7 during printing.
[0022]
As described above, in the present embodiment, by providing the pressure detecting member 30 having the pressure detector 35, even when the viscosity of the cream solder 7 on the surface 3a of the mask 3 changes due to continuous printing for a long time, the mask can be used. By calculating the viscosity in real time by squeezing on the surface 3a of 3, the change can be captured in real time. Therefore, the printing conditions are changed in accordance with the change in the viscosity of the cream solder 7, the cream solder 7 is exchanged, and the pressure is also changed by the consumption of the cream solder 7. It can be carried out. Therefore, occurrence of printing failure can be prevented.
[0023]
The measurement of the viscosity of the cream solder 7 may be performed in real time as described above, or may be performed for each substrate 5 or for a predetermined number of printed sheets.
In the present embodiment, the pressure detecting slope 34 of the pressure detecting member 30 is a flat surface. However, the present invention is not limited to this. For example, the pressure detecting slope 34 may be a curved surface protruding toward the surface 3 a of the mask 3. Good. In short, the dimension h1 is larger in the gap between the pressure detection slope 34 and the surface 3a of the mask 3 in the printing direction than the dimension h2, that is, h₁> H₂The shape of the pressure detecting slope 34 does not matter as long as it has the following relationship. The tip 33 of the pressure detecting member 30 may be sharp as shown, or may have a plane parallel to the surface 3a over an appropriate length along the printing direction.
[0024]
Further, in this embodiment, the pressure detector 35 is provided on the pressure detecting slope 34 so as to directly detect the pressure of the cream solder 7. For example, even when the pressure detecting member 30 is replaced and the area of the pressure detecting slope 34 changes, the information and the like obtained by the previous use can be diverted as long as the pressure detector 35 itself is not changed. However, the present invention is not limited to this mode. That is, a sensor such as a load cell can be attached to a location where the pressure of the cream solder 7 can be detected, for example, a connection portion between the pressure detection member 30 and the output shaft 32 of the driving device 31. The pressure of the cream solder 7 generated on the entire surface of the use slope 34 may be detected.
[0025]
Also, the cream solder printing apparatus 1001 is of a type that moves in both the left and right printing directions, and therefore includes both the printing squeegees 14a and 14b, but the cream solder printing apparatus moves in only one of them. In that case, a printing squeegee 14a or a printing squeegee 14b corresponding to the moving direction is provided.
[0026]
【The invention's effect】
As described above in detail, according to the print paste printing apparatus of the first aspect and the print paste printing method of the second aspect of the present invention, the pressure paste member and the control device are provided, and the pressure detection member is used for skiing. Since the viscosity of the print paste is directly measured during jigging, it is possible to appropriately and appropriately change the printing conditions in accordance with the change in the viscosity of the print paste. Therefore, it is possible to prevent the occurrence of printing failure due to a change in the viscosity of the printing paste.
[Brief description of the drawings]
FIG. 1 is a diagram showing a structure of a squeegee head of a cream solder printing apparatus according to an embodiment of the present invention.
FIG. 2 is a view showing a pressure detecting member shown in FIG. 1;
FIG. 3 is a view showing an arrangement position of a pressure detecting member shown in FIG. 1;
FIG. 4 is a perspective view of the pressure detecting member shown in FIG.
FIG. 5 is a view showing a model for obtaining a filling pressure of cream solder by the pressure detecting member shown in FIG. 1;
FIG. 6 is a view showing a modification of the arrangement position of the pressure detecting member shown in FIG.
FIG. 7 is a view showing another modification of the arrangement position of the pressure detecting member shown in FIG.
8 is a side view of FIG. 7 when a pressure detecting member is arranged as shown in FIG. 7;
FIG. 9 is a diagram illustrating a state in which leftward printing is performed by the pressure detecting member illustrated in FIG. 1;
FIG. 10 is a view showing a modification of the pressure detecting member shown in FIG. 1;
FIG. 11 is a perspective view of the cream solder printing apparatus shown in FIG. 1;
FIG. 12 is a view showing a pressure distribution of cream solder obtained by the pressure detecting member shown in FIG.
FIG. 13 is a diagram showing an arrangement position and a gap size of a pressure detector in the pressure detecting member shown in FIG.
FIG. 14 is a view showing a squeegee head in a conventional cream solder printing apparatus.
15 is a diagram showing a state of the cream solder when filling the opening of the mask with the cream solder by the printing squeegee shown in FIG. 14;
[Explanation of symbols]
1 ... cream solder printing device, 3 ... printing mask, 3a ... surface,
5 ... circuit board, 7 ... cream solder,
14a, 14b ... printing squeegee,
30: Pressure detecting member, 31: Drive device, 33: Tip,
34 ... Slope for pressure detection, 35 ... Pressure detector,
81 ... Control device,
1001, 1002 ... cream solder printing apparatus.

Claims (7)

When the squeegees (14a, 14b) move in the printing direction on the front surface (3a) of the printing mask (3) in which the openings are formed, the printing paste (7) on the front surface is positioned on the back surface of the printing mask. A printing paste printing apparatus for printing and applying the circuit board surface through the opening to the
At the time of printing, the tip (33) is arranged in a non-contact state with a gap (H2) from the surface, moves in the same direction as the squeegee, and detects the pressure generated in the print paste by the movement. A pressure detection member (30) having a pressure detector (35) for determining a viscosity of the printing paste during printing by the squeegee;
Based on the viscosity of the printing paste obtained based on the pressure measured by the pressure detector, at least a moving speed of the squeegee, an angle between the squeegee and the surface, a pressing force of the squeegee, and a temperature of the printing paste. A control device (81) for controlling any one of:
A printing paste printing apparatus comprising: 2. The printing paste printing apparatus according to claim 1, wherein the pressure detecting member is arranged at a position corresponding to a non-opening area in which the opening is not formed in the printing mask. 3. The printing paste printing apparatus according to claim 1, wherein the pressure detection member is disposed in front of the squeegee in the printing direction. A surface of the pressure detection member facing the surface of the mask forms a pressure detection slope (34) that is inclined upward from the front end in the printing direction, and the pressure detector detects the pressure detection. The printing paste printing apparatus according to any one of claims 1 to 3, wherein the printing paste printing apparatus is installed on a slope for use. The printing paste printing apparatus according to claim 4, wherein the pressure detector is embedded near the tip of the slope. By squeezing the front surface (3a) of the printing mask (3), the printing paste (7) on the front surface is positioned on the back surface of the printing mask through an opening formed in the printing mask. A printing paste printing method for printing and applying on a circuit board surface,
It is applied by the above-mentioned squeezing by a pressure detector (35) provided on a pressure detection member (30) in which a tip (33) is disposed in a non-contact state with a gap (H2) from the surface. A printing method for printing a printing paste, comprising detecting a pressure generated in the printing paste and measuring a viscosity of the printing paste during printing. Based on the measured viscosity of the print paste, at least the speed of the squeegee, the angle between the squeegee performing the squeegee and the surface, the filling pressure of the print paste into the opening, and the temperature of the print paste The print paste printing method according to claim 6, wherein any one of the following is controlled.

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