JP3537485B2 - Optical package - Google Patents
Optical packageInfo
- Publication number
- JP3537485B2 JP3537485B2 JP07683594A JP7683594A JP3537485B2 JP 3537485 B2 JP3537485 B2 JP 3537485B2 JP 07683594 A JP07683594 A JP 07683594A JP 7683594 A JP7683594 A JP 7683594A JP 3537485 B2 JP3537485 B2 JP 3537485B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- light
- integrated circuit
- light receiving
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、光ファイバ、レーザダ
イオード(LD)、発光ダイオード(LED)、フォト
ダイオード(PD)、そして光集積回路(OEIC)な
どより構成される発光素子と受光素子間で光信号の空間
伝搬を行う光パッケージに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device and a light receiving device comprising an optical fiber, a laser diode (LD), a light emitting diode (LED), a photodiode (PD), and an optical integrated circuit (OEIC). The present invention relates to an optical package for spatially propagating an optical signal in the optical package.
【0002】[0002]
【従来の技術】従来より、例えば光ファイバと光集積回
路との光学的結合を行う際には、図3の斜視概略図に示
すように、光集積回路を実装する実装体11と実装体1
1を覆う蓋体12よりなり、実装体11には光ファイバ
を設置するためのV溝13、光集積回路に接続されるリ
ードピン15を有する光パッケージ(実開昭61ー17
6512号公報参照)、あるいは図4の斜視概略図に示
すように、実装体11の底面に光ファイバ17を挿入し
て固定させるための孔14を設け、発光部や受光部とな
る面が実装体11の底面側となるように光集積回路16
を設置させてなる光パッケージ(実開昭61ー1446
58号公報参照)が用いられていた。2. Description of the Related Art Conventionally, for example, when optical coupling between an optical fiber and an optical integrated circuit is performed, as shown in a schematic perspective view of FIG.
An optical package having a V-shaped groove 13 for installing an optical fiber and a lead pin 15 connected to an optical integrated circuit (see Japanese Utility Model Application Laid-Open No. 61-17 / 1986).
No. 6512), or as shown in the schematic perspective view of FIG. 4, a hole 14 for inserting and fixing an optical fiber 17 is provided on the bottom surface of the mounting body 11 so that a surface serving as a light emitting unit and a light receiving unit is mounted. The optical integrated circuit 16 is located on the bottom side of the body 11.
Optical package (Jpn.
No. 58).
【0003】[0003]
【発明が解決しようとする課題】ところが、従来の光パ
ッケージの構成は、ICチップ実装用の実装体11に光
ファイバ設置用のV溝13や孔14を設けたものであ
り、複数の光ファイバ17を設置する際の面積的な限
界、あるいは目的結合受光素子以外への余剰光による影
響などにより、複数の光集積回路16と光ファイバ17
とのそれぞれの結合を高精度に行うことができず、また
光パッケージを小型の状態で実現可能な構造とすること
ができないという問題があった。However, the structure of a conventional optical package is such that a mounting body 11 for mounting an IC chip is provided with a V-groove 13 and a hole 14 for installing an optical fiber. Due to the area limitation when installing the optical fiber 17 or the influence of surplus light on the light other than the target coupled light receiving element, the plurality of optical integrated circuits 16 and the optical fiber
However, there has been a problem that the optical package cannot be coupled with high precision, and the optical package cannot have a structure that can be realized in a small size.
【0004】[0004]
【課題を解決するための手段】本発明は、上記問題点に
鑑みてなされたものであり、対向する内面に発光素子と
受光素子とがそれぞれ配設され、発光素子から受光素子
へ光信号を空間伝搬するように構成された光パッケージ
において、前記発光素子と受光素子とが、一方が傾斜し
て対向する内面にそれぞれ配設されるとともに、発光素
子から出射された光信号の光路を受光素子方向へ変換す
るホログラム等の光路変換素子が両素子間に具備された
光パッケージである。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a light emitting element and a light receiving element are provided on opposing inner surfaces, respectively, and an optical signal is transmitted from the light emitting element to the light receiving element. In an optical package configured to propagate in space, the light-emitting element and the light-receiving element are disposed on inner surfaces, one of which is opposed to the other, and the light path of an optical signal emitted from the light-emitting element is changed to a light-receiving element. This is an optical package in which an optical path conversion element such as a hologram for changing the direction is provided between the two elements.
【0005】[0005]
【実施例】以下本発明の実施例を図面を用いて説明す
る。図1の断面概略図は、5角形のハウス型である光パ
ッケージ1を示し、この光パッケージ1のある面を光集
積回路を設置するための光集積回路設置面2、光ファイ
バを設置するための光ファイバ設置面3とするが、本実
施例では光集積回路設置面2をA面とした場合に、他の
面を光集積回路設置面2の時計回りからB面、C面、D
面、E面とした場合に、光ファイバ設置面3はC面、D
面とする。そして、光パッケージ1は、光集積回路設置
面2に外部との電気信号伝搬を行うためのボンディング
ワイヤー4とリードピン5が接続されている複数の光集
積回路6を設置し、光ファイバ設置面3に複数の光ファ
イバ7を設置し、ホログラム8をB面とC面の角部分か
らD面とE面の角部分まで延設させた状態で設置させて
なる。なお、本実施例では光集積回路6を受光素子、光
ファイバ7を発光素子として用いる。また、ホログラム
8は、目的とする複数の光ファイバ7と光集積回路6の
発光部または受光部との各々の結合が低損失となる光路
を形成させるための回折格子をあらかじめ形成させてい
るものを使用する。Embodiments of the present invention will be described below with reference to the drawings. The schematic cross-sectional view of FIG. 1 shows an optical package 1 which is a pentagonal house type, and a certain surface of the optical package 1 is used as an optical integrated circuit installation surface 2 for installing an optical integrated circuit, and for installing an optical fiber. In this embodiment, when the optical integrated circuit installation surface 2 is the A surface, the other surfaces are the B surface, the C surface, and the D surface from the clockwise direction of the optical integrated circuit installation surface 2 in this embodiment.
Surface, the optical fiber installation surface 3 is C surface, D surface
Face. In the optical package 1, a plurality of optical integrated circuits 6 to which bonding wires 4 and lead pins 5 for transmitting electric signals to the outside are connected are installed on the optical integrated circuit installation surface 2, and an optical fiber installation surface 3 is provided. A plurality of optical fibers 7 are installed, and the hologram 8 is installed in a state where the hologram 8 extends from the corners of the planes B and C to the corners of the planes D and E. In this embodiment, the optical integrated circuit 6 is used as a light receiving element, and the optical fiber 7 is used as a light emitting element. The hologram 8 has a diffraction grating for forming an optical path in which the coupling between each of the target optical fibers 7 and the light emitting portion or the light receiving portion of the optical integrated circuit 6 has a low loss. Use
【0006】このように、5角形のハウス型である光パ
ッケージ1を使用し、かつ光ファイバ7と光集積回路6
との光信号伝搬中にホログラム8を介在させることによ
り、複数の光ファイバ7と光集積回路6の受光部との光
信号伝搬を行う場合でも、ホログラム8での微妙な光路
変換作用によりそれぞれの光学的結合を低損失・高精度
なものとすることができる。また、光ファイバ設置面3
が光集積回路設置面2に対して斜面となるように形成さ
れるために、光パッケージ1の小型化を維持した状態
で、光ファバ設置面3を十分に確保でき、また光がホロ
グラム8通過後に光路変更がない0次光などの目的とす
る光集積回路の受光部以外に到達してしまう余剰光は、
集光せずに拡がった状態となるために光信号としては微
弱なものであり、かつ受光素子に対して斜めに入射する
ために目的結合受光素子以外に全く影響のない光とな
る。さらに、発光素子である光ファイバ7がホログラム
8に対して斜めである場合には、0次光が斜めに進むた
めに、ホログラム8と目的結合受光素子以外の受光素子
間の0次光の進行距離を十分に持たせることができ、余
剰光の影響をさらに低減でき、より小型な光パッケージ
1とすることができる。なお、本実施例では、5角形の
ハウス型である光パッケージ1についてのみ説明した
が、光ファイバ設置面3が光集積回路設置面2に対して
傾斜し、かつ光集積回路6の発光部または受光部と光フ
ァイバ7間で光信号を空間伝搬する部分にホログラム8
を介在できるような構造であればどのような形状であっ
てもよく、例えば図2の断面概略図に示すように、3角
形のテント型である光パッケージ1で、2面を光集積回
路設置面2、1面をホログラム8で形成して、外部から
光ファイバアレイ9を設置してもよい。また、設置する
ホログラム8は、光ファイバ7と光集積回路6との間の
光路間に設置できるものであればよく、大きさ・形状・
厚さ・設置方法などは任意である。そして、本実施例で
は、発光素子として光ファイバ7、受光素子として光集
積回路6を用いたが、逆または光ファイバ、レーザダイ
オード、発光ダイオード、フォトダイオード、光集積回
路などの素子間の光信号伝搬であればどのようなものに
も使用できる。さらに、光ファイバ設置面3に光ファイ
バ7を設置する際には、光ファイバ設置面3に孔を設
け、その孔に光ファイバ3を挿入して固定する、あるい
は少なくとも光ファイバ設置面3の光ファイバとの接続
となる部分に光の通過が可能な材料で形成するなどの方
法により設置すればよい。As described above, the pentagonal house type optical package 1 is used, and the optical fiber 7 and the optical integrated circuit 6 are used.
By interposing the hologram 8 during the propagation of the optical signal between the hologram 8 and the light receiving portion of the optical integrated circuit 6, even when the optical signal is propagated between the plurality of optical fibers 7 and the light receiving section of the optical integrated circuit 6, the hologram 8 has a subtle optical path conversion action. Optical coupling can be made with low loss and high precision. Also, the optical fiber installation surface 3
Is formed so as to be inclined with respect to the optical integrated circuit installation surface 2, so that the optical fiber installation surface 3 can be sufficiently secured while maintaining the miniaturization of the optical package 1, and light can pass through the hologram 8. Surplus light that reaches other than the light receiving portion of the target optical integrated circuit, such as the zero-order light that does not change the optical path later,
Since the light signal is spread without being condensed, the signal is weak as an optical signal, and since the light signal is obliquely incident on the light receiving element, the light has no influence except on the target coupled light receiving element. Further, when the optical fiber 7, which is a light emitting element, is oblique to the hologram 8, the 0th-order light travels obliquely, so that the 0th-order light travels between the hologram 8 and light receiving elements other than the target coupled light receiving element. A sufficient distance can be provided, the influence of surplus light can be further reduced, and a smaller optical package 1 can be obtained. In this embodiment, only the pentagonal house type optical package 1 has been described. However, the optical fiber installation surface 3 is inclined with respect to the optical integrated circuit installation surface 2 and the light emitting portion of the optical integrated circuit 6 or A hologram 8 is provided at a portion where an optical signal is spatially propagated between the light receiving portion and the optical fiber 7.
Any shape may be used as long as the optical package 1 can be interposed. For example, as shown in a schematic sectional view of FIG. The surfaces 2 and 1 may be formed by the hologram 8, and the optical fiber array 9 may be installed from the outside. The hologram 8 to be installed may be any one that can be installed between the optical paths between the optical fiber 7 and the optical integrated circuit 6.
The thickness and the installation method are arbitrary. In this embodiment, the optical fiber 7 is used as the light emitting element and the optical integrated circuit 6 is used as the light receiving element. However, the optical signal between the elements such as the reverse or optical fiber, laser diode, light emitting diode, photodiode, and optical integrated circuit is used. It can be used for any propagation. Further, when installing the optical fiber 7 on the optical fiber installation surface 3, a hole is provided in the optical fiber installation surface 3 and the optical fiber 3 is inserted and fixed in the hole, or at least the optical fiber on the optical fiber installation surface 3 The portion to be connected to the fiber may be provided by a method of forming the material through which light can pass.
【0007】また、本実施例ではホログラム8を用いた
が、他の光路変換素子を用いてもよい。なお、光路変換
素子とは、発光素子から出射された光信号の光路を目的
とする受光素子方向へ変換する素子であり、回折光学素
子または屈折型光学素子等が挙げられる。回折光学素子
は、ホログラム、グレーティング、フォトリフラクティ
ブ結晶、フレネルレンズに代表されるように、光の回折
現象を利用した光学素子であり、光の照射により基板上
に光の干渉縞を形成、あるいは基板上に凹凸を形成させ
てなる回折格子により光を回折させて光路を変換させる
素子である。また、屈折型光学素子は、レンズ、光学プ
リズムに代表されるように、光束の変換を行うために光
の屈折現象を利用した素子であり、光の入射面の形状あ
るいは入射面への入射角度に応じた屈折を得ることによ
り光を屈折させて光路を変換させる素子である。Although the hologram 8 is used in this embodiment, another optical path changing element may be used. The optical path conversion element is an element that converts an optical path of an optical signal emitted from a light emitting element toward a target light receiving element, and includes a diffractive optical element or a refraction optical element. Diffractive optical elements are optical elements that utilize the phenomenon of light diffraction, as represented by holograms, gratings, photorefractive crystals, and Fresnel lenses. This is an element that converts light path by diffracting light by a diffraction grating having irregularities formed thereon. A refraction-type optical element is an element that uses the phenomenon of refraction of light to convert a light flux, as represented by a lens or an optical prism, and has a shape of an incident surface of light or an incident angle to the incident surface. Is an element that converts light path by refracting light by obtaining refraction according to the following.
【0008】[0008]
【発明の効果】以上説明したように、本発明の光パッケ
ージによれば、発光素子と受光素子とが、一方が傾斜し
て対向する内面にそれぞれ配設されるとともに、発光素
子から出射された光信号の光路を受光素子方向へ変換す
るホログラム等の光路変換素子が両素子間に具備される
ことにより、小型の状態で受光素子または発光素子設置
面を十分に確保でき、複数の発光素子と受光素子間の各
々の光学的結合を低損失・高精度にでき、かつ目的結合
受光素子以外に到達する余剰光による影響を押さえるこ
とができる光パッケージを提供できる。As described above, according to the optical package of the present invention, the light emitting element and the light receiving element are disposed on the inner surfaces, one of which is opposed to the other, and the light is emitted from the light emitting element. By providing an optical path conversion element such as a hologram for converting the optical path of the optical signal in the direction of the light receiving element between the two elements, it is possible to sufficiently secure the light receiving element or light emitting element mounting surface in a small state, and to use a plurality of light emitting elements. It is possible to provide an optical package that can make each optical coupling between the light receiving elements with low loss and high precision, and suppress the influence of excess light arriving at other than the target coupled light receiving element.
【図1】本発明の光パッケージを示す断面概略図であ
る。FIG. 1 is a schematic sectional view showing an optical package of the present invention.
【図2】本発明の光パッケージを示す断面概略図であ
る。FIG. 2 is a schematic sectional view showing an optical package of the present invention.
【図3】従来の光パッケージを示す斜視概略図である。FIG. 3 is a schematic perspective view showing a conventional optical package.
【図4】従来の光パッケージを示す斜視概略図である。FIG. 4 is a schematic perspective view showing a conventional optical package.
1 :光パッケージ 8 :ホ
ログラム
2 :光集積回路設置面 9 :光
ファイバアレイ
3 :光ファイバ設置面 11:実
装体
4 :ボンディングワイヤー 12:蓋
体
5、15:リードピン 13:V
溝
6、16:光集積回路 14:孔
7、17:光ファイバ1: Optical package 8: Hologram 2: Optical integrated circuit installation surface 9: Optical fiber array 3: Optical fiber installation surface 11: Mounting body 4: Bonding wire 12: Lid 5, 15: Lead pin 13: V
Grooves 6, 16: Optical integrated circuit 14: Hole 7, 17: Optical fiber
Claims (1)
れぞれ配設され、前記発光素子から前記受光素子へ光信
号を空間伝搬するように構成された光パッケージにおい
て、前記発光素子と受光素子とが、一方が傾斜して対向
する内面にそれぞれ配設されるとともに、前記発光素子
から出射された光信号の光路を前記受光素子方向へ変換
するホログラム等の光路変換素子が両素子間に具備され
たことを特徴とする光パッケージ。1. An optical package having a light emitting element and a light receiving element disposed on opposing inner surfaces and configured to spatially propagate an optical signal from the light emitting element to the light receiving element. And a light path converting element such as a hologram for converting an optical path of an optical signal emitted from the light emitting element in the direction of the light receiving element is provided between the two elements. An optical package, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07683594A JP3537485B2 (en) | 1993-09-14 | 1994-04-15 | Optical package |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22900393 | 1993-09-14 | ||
JP5-229003 | 1993-09-14 | ||
JP07683594A JP3537485B2 (en) | 1993-09-14 | 1994-04-15 | Optical package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07135303A JPH07135303A (en) | 1995-05-23 |
JP3537485B2 true JP3537485B2 (en) | 2004-06-14 |
Family
ID=26417951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07683594A Expired - Fee Related JP3537485B2 (en) | 1993-09-14 | 1994-04-15 | Optical package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3537485B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100982309B1 (en) * | 2003-11-26 | 2010-09-17 | 삼성모바일디스플레이주식회사 | Light emitting diode having wide emitting angle |
JP2006234920A (en) * | 2005-02-22 | 2006-09-07 | Nippon Sheet Glass Co Ltd | Optical module |
-
1994
- 1994-04-15 JP JP07683594A patent/JP3537485B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07135303A (en) | 1995-05-23 |
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