KR100982309B1 - Light emitting diode having wide emitting angle - Google Patents

Light emitting diode having wide emitting angle Download PDF

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KR100982309B1
KR100982309B1 KR1020030084476A KR20030084476A KR100982309B1 KR 100982309 B1 KR100982309 B1 KR 100982309B1 KR 1020030084476 A KR1020030084476 A KR 1020030084476A KR 20030084476 A KR20030084476 A KR 20030084476A KR 100982309 B1 KR100982309 B1 KR 100982309B1
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South Korea
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light emitting
emitting diode
circuit board
printed circuit
light
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KR1020030084476A
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Korean (ko)
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KR20050050830A (en
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김영준
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삼성모바일디스플레이주식회사
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Abstract

The present invention provides a light emitting diode capable of improving the uniformity of light emission while preventing hot spots.

The printed circuit board of the light emitting diode according to the present invention includes a first surface and a second surface having an inclination. The first surface and the second surface are different from each other in inclined directions perpendicular to the inclined surface and are adjacent to each other. First and second light emitting diode chips emitting light using electrical energy are mounted on the first and second surfaces, respectively. The first and second light emitting diode chips and the printed circuit board are molded by a molding part.

As described above, the light emitting diode according to the present invention is a light emitting diode in which two light emitting diode chips are mounted on both sides of the printed circuit board which are inclined in opposite directions, and thus the whole light emitting diode chip is mounted on a horizontal printed circuit board. The emission angle is much wider. Therefore, when the display panel is formed using the light emitting diodes, display uniformity can be further improved.

Light Emitting Diode, LED, Light Emitting Angle

Description

Light emitting diode having wide emitting angle

1 is a view illustrating a configuration of a light emitting diode generally used.

2 is a view schematically showing a configuration of a light emitting diode according to a first embodiment of the present invention.

3 is a view schematically showing a configuration of a light emitting diode according to a second embodiment of the present invention.

4 is a diagram illustrating an arrangement interval of the light emitting diodes 300 in which display uniformity is optimized in the light emitting diode display panel in which the light emitting diodes 300 are continuously arranged.

The present invention relates to a light emitting diode (LED), and more particularly to a light emitting diode having a wide light emitting angle.

In general, a light emitting diode is a semiconductor device that converts electrical energy into optical radiation, and a light emitting diode chip is mounted on an upper surface of a printed circuit board or lead terminal in which a thin film pattern is selectively formed according to the purpose or shape of use. After that, the chip is electrically connected to the substrate or the lead terminal, and the mold is formed by using an epoxy or the like thereon. At this time, the structure, the growth method and the material of the chip vary according to the color emitted from the light emitting diode chip.

The light emitting diode has a single bonding structure to withstand the high heat generated. Such a single bonding structure is a vertical structure in which electrodes formed of materials such as Au, Au / sn, Ti / Au, and Ni are positioned on opposite surfaces of each other, and the structure thereof is also well known.

In order to increase the light emission effect, the LED chip is fixed to a printed circuit board or the like such that an epitaxial layer grown on a substrate made of silicon carbide or the like comes into contact with the upper surface of the printed circuit board or lead terminal.

1 is a view illustrating a configuration of a light emitting diode generally used.

As shown in FIG. 1, the light emitting diode 100 includes a light emitting diode chip 120 on a printed circuit board 110 and a mold forming part 130 encapsulated with a resin such as epoxy on the light emitting diode chip 120.

Since the light emitting diode emits light from one light emitting diode chip, a hot spot may occur, thereby shortening the lifespan of the light emitting diode.

In addition, since the light emitting diode 100 emits light from one light emitting diode chip 120, the total light emitting angle a is narrow.

Therefore, when the display panel is formed by arranging a plurality of such light emitting diodes in an array form, display uniformity of the display panel becomes poor.

The technical problem to be achieved by the present invention is to provide a light emitting diode which can improve the uniformity of light emission while preventing hot spots.

Light emitting diode according to the first aspect of the present invention,

A printed circuit board having first and second surfaces adjacent to each other having different inclinations perpendicular to the inclined surface;

First and second light emitting diode chips mounted on the first and second surfaces, respectively, to emit light using electric energy; And

And a molding part for molding the first and second light emitting diode chips and the printed circuit board.

In the printed circuit board, the thickness of the center portion where the first surface and the second surface contact each other may be thicker than the thickness of the outer portion of the printed circuit board.

The light emitting angles of the first and second light emitting diode chips may be symmetrical.

The first and second light emitting diode chips may be disposed at the centers of the first and second surfaces, respectively.

Printed circuit board according to a second aspect of the present invention,

A printed circuit board in which first and second light emitting devices emitting light using electric energy are arranged and mounted at predetermined intervals.                     

The inclined direction toward the inclined surface is different from each other, and includes a first surface and a second surface on which the first and second light emitting devices are mounted, respectively,

The thickness of the outer portion is thinner than the thickness of the central portion where the first surface and the second surface contact.

The first surface and the second surface may have inclined directions opposite to each other.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention. Like parts are designated by like reference numerals throughout the specification.

First, a light emitting diode according to an embodiment of the present invention will be described in detail with reference to FIG. 1.

2 is a view schematically showing a configuration of a light emitting diode according to a first embodiment of the present invention.

As shown in FIG. 2, the light emitting diode 200 includes a printed circuit board 210, light emitting diode chips 221 and 223, and a mold molding unit 230.

The light emitting diodes 200 are formed by arranging two light emitting diode chips on the printed circuit board 210 at predetermined intervals and then sealing them by the mold molding unit 230.

The light emitting diode 200 formed as described above may be divided into two places where light is emitted by using two light emitting diode chips, thereby preventing hot spots.

In addition, since the light emitting diodes 221 and 223 emit light having the same light emitting angle a, the two light emitting angles a overlap and the light emitting diodes 200 may have a wider light emitting angle a1. .

3 is a view schematically showing a configuration of a light emitting diode according to a second embodiment of the present invention.

As shown in FIG. 3, the light emitting diode 300 includes a printed circuit board 310, light emitting diode chips 321 and 323, and a mold molding part 330.

The light emitting diodes 300 are formed by arranging two light emitting diode chips on the printed circuit board 310 at regular intervals and then sealing them by the mold molding part 330.

The light emitting diode 300 according to the second embodiment has a shape different from that of the first embodiment of the printed circuit board 310. That is, unlike the first embodiment, the surface of the printed circuit board 310 on which the light emitting diode chips 321 and 323 are mounted is formed to be inclined at a predetermined angle.

Specifically, as shown in FIG. 3, the printed circuit board surface on which the light emitting diode chip 3321 is placed and the printed circuit board surface on which the light emitting diode chip 323 is placed are respectively high in the thickness of the center portion of the printed circuit board and toward the outside of the printed circuit board. It has a slope that gradually decreases.

The LEDs 321 and 323 emitting light at the light emitting angle a are mounted on the printed circuit board surface having an oblique slope as described above, so that the entire light emitting diodes 300 are light emitting diode chips 321 and 323, respectively. The light emitting angles (a) are superimposed to have a wider light emitting angle (a2).                     

The light emitting diode 300 can prevent heat spots by dividing the spot where light is emitted by using two light emitting diode chips, and also emits light by mounting the light emitting diode chip on the surface of the printed circuit board 310 having a predetermined inclination. The angle can be much wider.

4 is a diagram illustrating an arrangement interval of the light emitting diodes 300 in which display uniformity is optimized in the light emitting diode display panel in which the light emitting diodes 300 are continuously arranged.

In Fig. 4, the lines l1 and l2 are lines indicating the light emission range of light emitted from one light emitting diode chip, and the angle a between the lines l1 and l2 is the light emission angle.

The line α is perpendicular to the horizontal line, and the line β is perpendicular to the inclined surface of the printed circuit board 310 and bisects the light emission angle a. Accordingly, the angle of intersection θ between the line α and the line β becomes the inclination angle of the printed circuit board 310.

d1 is the distance between the light emitting surface of the light emitting diode chip and the surface of the display panel, d2 is the distance between the light emitting diode chip 321 in one light emitting diode and the light emitting diode chip 323 in another light emitting diode adjacent thereto, and d3 is one. Is the distance between the light emitting diode chips in the light emitting diode.

First, the relationship between the light emitting angle and d3 that can optimize the display uniformity is examined.

The angle φ1 can be obtained from equation (1).

Figure 112003044808696-pat00001

The relationship between d3 and d1 in which the display uniformity of the light emitting diode display panel is optimized using the angle φ1 is expressed by Equation 2 below.

Figure 112003044808696-pat00002

Therefore, d3 can be obtained from equation (3).

Figure 112003044808696-pat00003

Next, the relationship between the two light emitting diode gaps d2 and the light emitting angle, which can optimize display uniformity, will be described.

Figure 112003044808696-pat00004

ego,

Figure 112003044808696-pat00005

to be.

Therefore, the distance d2 between two light emitting diodes for which display uniformity is optimal can be calculated using Equation 6 below.                     

Figure 112003044808696-pat00006

As such, the light emitting diode display device in which two light emitting diode chips are arranged at an interval of d3 calculated by Equation 3 is arranged at an interval of d2 calculated by Equation 6 has an optimal display uniformity. Can be.

Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited thereto, and various other changes and modifications are possible.

As described above, the light emitting diode according to the present invention can be divided into two places where light is emitted by using two light emitting diode chips to prevent the occurrence of hot spots and to widen the light emitting angle of the entire light emitting diode.

In addition, the light emitting diodes in which two light emitting diode chips are mounted on both sides of the printed circuit board 310 which are inclined in opposite directions to each other are wider than the case where the light emitting diodes are mounted on a horizontal printed circuit board.

Therefore, when the display panel is formed using the light emitting diode of the present invention having a wider light emitting angle, display uniformity can be improved.

Claims (6)

In the light emitting diode, A printed circuit board including first and second surfaces adjacent to each other having different inclinations perpendicular to the inclined surface; First and second light emitting diode chips mounted on the first and second surfaces, respectively, to emit light using electric energy; And A molding part for molding the first and second light emitting diode chips and the printed circuit board A light emitting diode having a wide light emitting angle comprising a. The method of claim 1, The light emitting diode of the printed circuit board, wherein the thickness of the center portion where the first surface and the second surface contact each other is thicker than the thickness of the outer portion of the printed circuit board. The method of claim 2, The light emitting angles of the first and second light emitting diode chips are symmetrical. The method of claim 2, The first and second light emitting diode chips are disposed in the center of the first surface and the second surface, respectively. In a printed circuit board in which the first and second light emitting devices that emit light using electrical energy are arranged and mounted at predetermined intervals, The inclined direction toward the inclined surface is different from each other, and includes a first surface and a second surface on which the first and second light emitting devices are mounted, respectively, The thickness of the outer portion is thinner than the thickness of the central portion where the first surface and the second surface contact. The method of claim 5, The first surface and the second surface is a printed circuit board having an inclined direction opposite to each other.
KR1020030084476A 2003-11-26 2003-11-26 Light emitting diode having wide emitting angle KR100982309B1 (en)

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CN103187406A (en) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 Package structure and package method of light emitting diode

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07135303A (en) * 1993-09-14 1995-05-23 Kyocera Corp Optical package
JP2003124512A (en) 2001-10-10 2003-04-25 Sony Corp Semiconductor light emitting element, image display device as well as illuminator and its manufacturing method
KR20060015712A (en) * 2003-03-12 2006-02-20 레드니엄 피티와이 리미티드 A lamp and a process for producing a lamp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07135303A (en) * 1993-09-14 1995-05-23 Kyocera Corp Optical package
JP2003124512A (en) 2001-10-10 2003-04-25 Sony Corp Semiconductor light emitting element, image display device as well as illuminator and its manufacturing method
KR20060015712A (en) * 2003-03-12 2006-02-20 레드니엄 피티와이 리미티드 A lamp and a process for producing a lamp

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