JP3534605B2 - Substrate plating equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate for a semiconductor wafer or a liquid crystal display device (hereinafter simply referred to as a substrate).
The present invention relates to a substrate plating apparatus for performing a plating process on a substrate, and more particularly to a technique for performing an electrolytic plating process by supplying power while an electrolytic solution such as copper sulfate is supplied to a processing surface of a substrate.

[0002]

2. Description of the Related Art As a conventional substrate plating apparatus of this type,
For example, a structure as shown in FIG. 7 may be mentioned. In the following description, an apparatus for plating copper for wiring using copper sulfate as an electrolytic solution will be described as an example.

The substrate W is held in the opening 101 of the processing bath 100 storing the electrolytic solution LQ with the processing surface Ws thereof facing downward (so-called face down). The opening 101 has a processing surface W of the substrate W held downward.
An upper electrode 103 for supplying power to s is provided.
A circulation path 107 is connected to the upper part and the lower part of the processing tank 100 via a circulation pump 105. Processing tank 100
A jet nozzle 109 for jetting the electrolytic solution LQ overflowing from the upper portion and flowing through the circulation path 107 toward the processing surface Ws of the substrate W is disposed at the bottom of the. Further, a lower electrode 111 is provided at the bottom of the processing bath 100,
The upper electrode 103 becomes the cathode by the power supply unit 113,
Power is supplied so that the lower electrode 111 serves as an anode.

In the apparatus configured as described above, the circulation pump 105 is operated while the power supply unit 113 is supplying power to the upper / lower electrodes 103 and 111, and the electrolytic solution LQ is jetted from the jet nozzle 109 to generate the substrate. Treated surface W
The electrolytic solution LQ is supplied to s. The electrolytic solution L supplied to the processing surface Ws of the substrate W from the bottom to the top of the processing bath 100.
Q is discharged from the upper part and supplied again into the processing tank 100 via the circulation path 107. In this process, a copper plating layer is formed on the processing surface Ws of the substrate W which is in contact with the electrolytic solution LQ.

[0005]

The elements (for example, MPU and memory) formed on the substrate W have been increasing in density year by year due to the increase in operating speed and the increase in multifunctionality. A deep groove (trench structure) is often formed in Ws. Such grooves will have a width of 0.
It is thought that the aspect ratio of about 2 μm and the depth of about 1 μm will be about “5”.

When the substrate W in which such a groove having a high aspect ratio is formed is plated by the above-described apparatus, the air in the groove is extremely large because the substrate W is held face down. It is hard to come off. Also, the gas (oxygen) generated by electrolysis is extremely difficult to escape. Therefore, as shown in FIG. 8A, the inside of the groove T is closed by the bubbles, and the electrolytic solution LQ is filled with the groove T.
Will not be fully supplied inside. As a result, FIG.
As shown in (b), there is a problem in that the plating layer PL cannot be formed inside the trench T and a void V (hereinafter referred to as a void) is generated. When such a void V occurs, for example, it is not possible to obtain a sufficient cross-sectional area for the current flowing through the wiring, or it is not possible to obtain ohmic contact in the contact hole.

Further, the processing surface Ws of the substrate W and the lower electrode 11
As shown in FIG. 9, the distance from 1 is the shortest between the lower electrode 111 and the processing surface Ws located directly above it, and the other distances are longer than that (the path indicated by the arrow in the figure). Therefore, the current density is large from the lower electrode 111 to the processing surface Ws located right above, and the current density is smaller than the others, and the current density in the processing surface Ws is biased. As a result, there is also a problem that the plated layer cannot be formed uniformly over the entire treated surface Ws.

The reason why the plated layer becomes non-uniform within the treated surface Ws is that the flow of the electrolytic solution LQ jetted by the jet nozzle 109 is non-uniform in addition to the above current density. Has become.

The present invention has been made in view of the above circumstances, and it is possible to prevent generation of voids by improving the gas release and to make the current density in the treated surface uniform. An object of the present invention is to provide a substrate plating apparatus capable of improving the uniformity of a plating layer.

[0010]

The present invention has the following constitution in order to achieve such an object. That is, the invention according to claim 1 is a substrate plating apparatus that performs a plating process on a substrate, holds the processing surface of the substrate upward, and electrically connects to the processing surface of the substrate. wherein the substrate holding means, wherein disposed close to face the treated surface of the substrate held by the substrate holding means, a plate-like member constituting the electrodes, the processing surface of the substrate held by the substrate holding means and which a supply means for supplying to satisfy the electrolytic solution between the plate-like member, in a state in which the supply means is fed between said plate-like member to the electrolyte and the processing surface of the substrate, from the plate-like member Power feeding means for feeding power so that a current flows toward the substrate holding means, the substrate holding means and the plate-like portion
Drive means for rotating and driving at least one of the materials .

The invention described in claim 2 is the same as claim 1.
In the substrate plating apparatus described in the paragraph 1, the plate-shaped member has a supply port for supplying an electrolytic solution between the processing surface of the substrate and the plate-shaped member in a substantially central portion. .

The invention described in claim 3 is the same as claim 1
Alternatively, in the substrate plating apparatus described in Item 2 , the driving unit is configured to rotationally drive only the substrate holding unit.

The invention according to claim 4 is the same as claim 1.
Alternatively, in the substrate plating apparatus described in the paragraph 2 , the driving means is configured to rotationally drive only the plate-shaped member.

The invention described in claim 5 is the same as claim 1.
Alternatively, in the substrate plating apparatus described in Item 2, the driving unit is configured to rotationally drive the substrate holding unit and the plate-shaped member.

The invention described in claim 6 is the same as claim 1.
The substrate plating apparatus according to claim 5 , further comprising ultrasonic vibration applying means for applying ultrasonic vibration to the electrolytic solution supplied between the processing surface of the substrate and the plate-shaped member. It is characterized by that.

[0016] The invention of claim 7, claim 6
In the substrate plating apparatus described in the paragraph 1, the ultrasonic vibration applying means is arranged in the supply means, and is configured to apply ultrasonic vibration to the flowing electrolytic solution. .

The invention according to claim 8 is the same as claim 6
In the substrate plating apparatus according to the above item 3, the ultrasonic vibration applying means is configured to apply ultrasonic vibration to the plate-shaped member.

The invention described in claim 9 is the same as claim 1.
9. The substrate plating apparatus according to claim 8 , wherein the supply unit is also connected to a cleaning liquid supply source so as to communicate with the processing surface of the substrate held by the substrate holding unit and the plate-shaped member. It is characterized in that the cleaning liquid and the electrolytic solution are selectively supplied between them.

The invention according to claim 10 is the following:
In the substrate plating apparatus according to 3 or 5, there are provided a collecting member arranged around the substrate holding means, for collecting the electrolytic solution scattered with the rotation of the substrate, and an electrolytic solution collected by the collecting member. It further comprises a circulation path for sending to the supply means again.

Further, the invention according to claim 11, claim
10. The substrate plating apparatus according to 10 , wherein concentration measuring means for measuring a concentration of an electrolytic solution flowing in the circulation path, an electrolytic solution storage tank arranged in the circulation path for storing an electrolytic solution, and the concentration measurement It further comprises control means for controlling replenishment of the electrolytic solution so that the concentration becomes constant based on the measurement result of the means.

The invention according to claim 12 is the following:
In the substrate plating apparatus described in 11 , the replenishment of the electrolytic solution performed based on the result of the concentration measuring means is configured to be performed to the electrolytic solution storage tank.

The invention according to claim 13 is the following:
11. In the substrate plating apparatus according to 11 , the replenishment of the electrolytic solution based on the result of the concentration measuring means is performed to the circulation path and is performed at a position downstream of the electrolytic solution storage tank. It is characterized by being done.

[0023]

The operation of the invention described in claim 1 is as follows. Held substrate by a substrate holding means, that is to a position opposed to the treated surface plate member disposed near the supply as the electrolytic solution is filled from the supply means between the treated surface and the plate-like member of the substrate To be done. Power is supplied to the plate member and the substrate holding means by the power supply means. Since the substrate is held with the treatment surface facing upwards, even when the treatment surface has a groove, bubbles in the groove are easily released and the gas generated by electrolysis naturally rises upward. It becomes difficult to stay on not only the groove but also the processing surface. Also,
Since the plate-like member, which is arranged close to the processing surface and has the same size as the substrate, serves as an electrode, the distance from the electrode to the processing surface can be made substantially uniform in the surface. further,
At least one of the substrate holding means and the plate-shaped member
The current density in the processing plane can be
Even if there are variations, it is possible to reduce the effect.
The centrifugal force from the center side to the peripheral side.
As a result, the electrolytic solution can be made to flow smoothly.

Further, according to the second aspect of the invention, since the electrolytic solution is supplied from the supply port at the substantially central portion of the plate-shaped member, the electrolytic solution can be smoothly flowed from the center toward the peripheral portion. You can

Further, according to the invention described in claim 3 , even if only the substrate holding means is rotationally driven by the driving means, it is possible to suppress the adverse effect due to the variation of the current density in the processing surface, and to centrifugal force. With this, the electrolytic solution can smoothly flow from the center side to the peripheral side.

Further, according to the invention described in claim 4 , even if only the plate-like member is rotationally driven by the driving means, it is possible to suppress the adverse effect due to the dispersion of the current density in the processing surface, and to centrifugal force. With this, the electrolytic solution can smoothly flow from the center side to the peripheral side.

According to the fifth aspect of the present invention, when the driving means rotates the substrate holding means and the plate-like member together, the electrolytic solution smoothly flows from the center side to the peripheral side by the centrifugal force. be able to. In addition, both rotations include the same direction or the opposite direction.

Further, according to the invention described in claim 6 , the bubbles adhered to the processing surface of the substrate and the gas generated by the electrolysis by the ultrasonic vibration applied to the electrolytic solution are easily separated from the processing surface. be able to.

As a method of applying the ultrasonic vibration, ultrasonic vibration applying means may be attached to the supplying means and ultrasonic vibration may be applied to the circulating electrolyte solution.
7 ), ultrasonic vibration may be applied to the plate member (claim 8 ).

According to the invention described in claim 9 , after the electrolytic solution is supplied from the supplying means to perform the plating treatment, the cleaning liquid can be supplied from the supplying means to perform the cleaning treatment. After that, indispensable processing can be continuously performed without transporting the substrate.

According to the invention described in claim 10 ,
The utilization efficiency of the electrolytic solution can be improved by collecting the scattered electrolytic solution by the collecting member and sending it again to the supply means via the circulation path.

According to the invention described in claim 11 ,
If the electrolytic solution is supplied from the electrolytic solution storage tank to the circulation path and the plating process is performed on many substrates while circulating the electrolytic solution, the concentration of the electrolytic solution decreases, and it takes time to obtain the same plating thickness. However, if the plating process is performed for the same time, there arises a problem that the plating thickness becomes thin. Therefore, the control means controls so as to replenish the electrolytic solution so that the concentration of the electrolytic solution becomes constant based on the measurement result of the concentration measuring means, so that the concentration fluctuation can be suppressed and the above inconvenience can be avoided. You can

The replenishment of the electrolytic solution as described above may be carried out in the electrolytic solution storage tank (claim 12 ), or may be carried out in the circulation path and at a position downstream of the electrolytic solution storage tank. Good (Claim 13 ). In particular, when replenishing on the downstream side of the electrolytic solution storage tank, it is possible to quickly restore the original when the concentration fluctuation occurs.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 is a block diagram showing a schematic configuration of a substrate plating apparatus according to the present embodiment. The substrate holding mechanism 1 is formed of a conductive material, and a substrate W such as a semiconductor wafer to be plated is in a state in which a processing surface Ws to be plated is directed upward (so-called face-up). It will be held in. The base member 3 is a member having a diameter slightly larger than that of the substrate W, and a plurality of supporting portions 5 for contacting and supporting the peripheral portion of the substrate W are formed on the peripheral portion of the upper surface thereof. The inside of the upper portion of each support portion 5 is formed in conformity with the shape of the peripheral portion of the substrate W. The substrate holding mechanism 1 corresponds to the substrate holding means in the present invention.

A connecting portion 7 is formed on the base member 3 so as to project downward from the center of the lower surface of the base member 3. A rotary shaft 11 of an electric motor 9 is fitted into this portion and is interlocked with the electric motor 9. There is. Power is supplied to the connecting portion 7 from a power supply brush 13 sliding on the outer peripheral surface.
The upper part and the lower part of the rotating shaft 11 are electrically insulated by the insulating part 11 a, and the rotating shaft 11 is configured so that the power feeding from the power feeding brush 13 does not affect the electric motor 9.

Above the substrate holding mechanism 1, a base member 3 is provided.
A plate-like member 15 formed of a conductive material (for example, copper, platinum, titanium, or an alloy thereof when the electrolytic solution is a copper sulfate plating solution) is arranged substantially in the same size as and in parallel therewith. It is set up. The pressing portion 1 having the same shape as the supporting portion 5 of the substrate holding mechanism 1 is provided around the lower surface of the plate member 15.
A plurality of 7 are arranged. However, the pressing portion 17 is composed of an insulating upper portion 17a and a conductive lower portion 17b, and the inside of the lower portion 17b is formed in conformity with the shape of the peripheral portion of the substrate W. In addition, the lower surface of the plate member 15,
Distance d between the processing surface Ws of the substrate W supported by the supporting portion 5
Is better to be set narrower so as to be close to each other for the reason that it is possible to process with a small amount of electrolytic solution and that the liquid tightness of the electrolytic solution is easy to maintain, but its specific value is, for example,
It is about 0.5 to 5 mm.

The connecting portion 19 formed so as to project upward from the central portion of the upper surface of the plate member 15 is interlockingly connected to the rotary shaft 25 of the electric motor 23 via the insulating portion 21. Plate-shaped member 1
A supply port 15a is formed in the central portion of the lower surface of No. 5, and an electrolytic solution (for example, copper sulfate plating solution) is supplied through a vibration unit 27 attached to a rotary shaft 25 penetrating above the electric motor 23. Are supplied to the substrate W held by the substrate holding mechanism 1. The vibrating unit 27 has a built-in ultrasonic vibrator 27a, and vibrates the ultrasonic vibrator 27a by an ultrasonic vibration power supply 29 that supplies a high frequency to apply ultrasonic vibration to the electrolytic solution. In addition, the plate-shaped member 1
Power is supplied to 5 from the connecting portion 19 via a power supply brush 31. The vibrating section 27 corresponds to the ultrasonic vibration applying means of the present invention.

The power supply brushes 13 and 31 described above are connected to the power supply unit 33, respectively, and
Is connected to the negative electrode side, and the power feeding brush 31 is connected to the positive electrode side. Therefore, the processing surface Ws of the substrate W is
3, the connecting part 7, the base member 3, the supporting part 5, and the lower part 17b of the pressing part 17 serve as a cathode, and the plate-shaped member 15 facing the processing surface Ws is connected to the power feeding brush 31. It becomes an anode via the part 19. The power supply brush 13,
31 and the power supply unit 33 correspond to the power feeding means of the present invention.

A supply port 15a is provided around the substrate holding mechanism 1.
A splash guard 35, which serves as a recovery member for receiving and recovering the electrolytic solution supplied from the above and scattered around by the centrifugal force, is provided. The splash guard 35 is configured to move up and down with respect to the substrate holding mechanism 1.

Electrolyte storage tank 3 for storing electrolyte
Reference numeral 7 denotes a circulation pump 39 for sending out the electrolytic solution, a filter 41 for removing particles and the like in the electrolytic solution, a concentration sensor 43 (concentration measuring means) for detecting the concentration of the electrolytic solution, and a replenisher for concentration adjustment. A circulation path 49 communicates with a supply path 27b (supply means) of the vibration unit 27 via a mixing valve 45 for injecting and an opening / closing operation valve 47. The electrolytic solution is supplied from the electrolytic solution storage tank 37 to the supply path 27b by opening the open / close operation valve 47 and operating the circulation pump 39, and ultrasonic vibration is applied by the vibrating unit 27 to the processing surface Ws. It is being supplied. Further, the splash guard 35 and the electrolytic solution storage tank 37 are in communication with each other via the opening / closing operation valve 51, and collect the scattered electrolytic solution. Further, the splash guard 35 is also in communication with the drain via the opening / closing operation valve 53. These open / close operation valves 51, 5
The liquid received in the splash guard 35 is collected or discarded by the opening / closing operation of 3. The opening / closing operation of these opening / closing operation valves 51, 53 is controlled by the control unit 55 described later.

The density signal detected by the density sensor 43 is
It is given to the control unit 55. The control unit 55 controls the replenishment unit 57 so that the concentration of the electrolytic solution flowing through the circulation path 49 is kept constant. The replenishing unit 57 includes a replenishing liquid supply source 59 that stores a replenishing liquid (for example, copper sulfate in the case of a copper sulfate plating liquid), a pump 61 that sends out the replenishing liquid under the control of the control unit 55, and a replenishing liquid And a filter 63 for removing particles and the like. The replenisher flowing through the filter 63 is injected into the electrolyte flowing through the circulation path 49 by the mixing valve 45. In this way, the replenisher is directly replenished to the circulation path 49 based on the concentration signal of the concentration sensor 43, so that the concentration of the electrolyte supplied to the substrate W can be made substantially constant. In addition, as a method for sending out the electrolytic solution, without using the pump 61,
A method of pressurizing and supplying the inside of the replenisher supply source 59 may be adopted.

An open / close operation valve 65 is attached to a circulation path 49 between the supply path 27b and the open / close operation valve 47.
A cleaning liquid supply source 67 for supplying a cleaning liquid (for example, pure water) is connected to the opening / closing operation valve 65 so as to communicate therewith.
Therefore, the electrolytic solution or the cleaning liquid can be selectively supplied by opening / closing the opening / closing operation valves 47, 65.

The control section 55 includes electric motors 9 and 23 corresponding to driving means, an ultrasonic vibration power source 29, a power source unit 33, opening / closing operation valves 47, 51, 53 and 65, a circulation pump 39, Pump 61 and splash guard 35
The lifting mechanism (not shown) and the moving mechanism (not shown) for the plate-shaped member 15 are integrally controlled.

Next, the operation of the substrate plating apparatus configured as described above will be described with reference to FIGS. For convenience of explanation, it is assumed that the opening / closing operation valves 47, 51, 53, 65 are closed in the initial state.

First, the control unit 55 controls the moving mechanism (not shown) of the plate-shaped member 15 to move the plate-shaped member 15 to the side of the substrate holding mechanism 1 and above the substrate holding mechanism 1. A substrate transfer arm (not shown) is allowed to enter (FIG. 2A).

Next, the controller 55 controls a substrate transfer arm (not shown) to place the substrate W on the support 5 so that the processing surface Ws of the substrate W faces upward (FIG. 2 (b)). .

After the substrate transfer arm (not shown) is retracted,
By controlling the moving mechanism (not shown) of the plate-shaped member 15, the plate-shaped member 15 is moved to directly above the substrate holding mechanism 1, and the plate-shaped member 1 is moved.
The pressing member 17 of 5 moves down the plate member 15 so as to press the peripheral portion of the substrate W (FIG. 2C). Then, the splash guard 35 is raised to surround the substrate holding mechanism 1.

First, the opening / closing operation valves 53 and 65 are opened, and the cleaning liquid (for example, pure water) is supplied from the supply port 15a to perform the pre-cleaning process. At this time, ultrasonic vibration may be applied. After performing the pre-cleaning process for a certain period of time, the opening / closing operation valves 53 and 65 are closed.

Next, the opening / closing operation valves 47 and 51 are opened and the circulation pump 39 is operated to make the electrolyte solution storage tank 3
The electrolytic solution LQ of No. 7 is sent to the circulation path 49. Further, the ultrasonic vibration power source 29 is turned on to apply ultrasonic vibration to the electrolytic solution LQ supplied to the supply path 27b, and the electrolytic solution LQ to which ultrasonic vibration is applied is supplied from the supply port 15a to the processing surface of the substrate W. Supply to Ws. Since the substrate W is held face up so that the processing surface Ws faces upward, the processing surface Ws
Even if a groove is formed in the bubble, the bubble spontaneously separates, and even if the bubble adheres to the part of the structure that is more difficult to separate, ultrasonic vibration is applied to such a bubble. It is possible to easily separate from the processing surface Ws and completely cover the entire surface of the processing surface Ws with the electrolytic solution LQ. The electrolytic solution LQ supplied to the processing surface Ws has a distance d between the processing surface Ws and the plate member 15.
While leaking to the surroundings through the space between the plurality of pressing portions 17. Further, the leaked electrolytic solution LQ is received by the splash guard 35, is recovered in the electrolytic solution storage tank 37, and is supplied again via the circulation path 49, so that the utilization efficiency can be improved. The electrolytic solution L
A member serving as a resistance may be arranged between the pressing members 17 in order to reduce the speed at which Q leaks out and increase the liquid tightness of the interval d.

When the distance d between the processing surface Ws and the plate member 15 is completely filled with the electrolytic solution LQ, the controller 55
Means that the electric motors 9 and 23 have the same rotation speed (for example,
It is driven at a low speed of about several tens of rpm) and the power supply unit 33 is turned on (FIG. 2 (d)). As a result, the treated surface Ws becomes a cathode, the plate member 15 becomes an anode, and the electrolytic solution LQ that fills the space d is electrolyzed.
When the electrolytic solution LQ is a copper sulfate plating solution, the treated surface Ws
Copper is deposited on and plated. In this process, the gas generated by the electrolysis spontaneously separates upward, and it is possible to make it difficult for the bubbles to remain not only in the groove but also in the processing surface Ws. Therefore, the gas is satisfactorily released and the generation of the void V as shown in FIG. 8B can be prevented. Further, since the electrolytic solution LQ supplied from the supply port 15a at the interval d flows from the central portion to the peripheral portion due to the centrifugal force, the electrolytic solution LQ can smoothly flow from the central portion to the peripheral portion. Therefore, it is possible to prevent unevenness of the plating layer due to uneven flow of the electrolytic solution LQ.

Further, since the plate-like member 15 having a size substantially the same as that of the processing surface Ws is used as an electrode, which is disposed close to the processing surface Ws, the distance (interval d) from the electrode to the processing surface Ws is within the surface. Can be made almost uniform at. Therefore, the current density can be made substantially uniform over the entire treated surface Ws, and the uniformity of the plated layer can be improved.

Further, since the replenishing liquid is injected from the replenishing liquid supply source 59 into the circulation path 49 based on the concentration signal of the concentration sensor 43 to adjust the concentration of the electrolytic solution LQ, the concentration of the electrolytic solution LQ can be made constant. Stable treatment is possible over a long period of time. In addition, the replenishment location is the electrolytic solution storage tank 37.
Since it is on the downstream side, it can be quickly returned to its original state when a concentration change occurs, and more stable processing is possible.

After the state in which the electrolytic solution LQ is supplied and the power is supplied as described above is maintained for a certain time (for example, 5 or 6 minutes), the cleaning process is started. Specifically, the ultrasonic vibration power source 2
9 and the power supply unit 33 are turned off, and the circulation pump 39
And the on-off operation valves 47, 51 are closed. And
The opening / closing operation valves 53 and 65 are opened, and the cleaning liquid (for example, pure water) is supplied from the supply port 15a to perform the post-cleaning process. At this time, ultrasonic vibration may be applied.
After performing a cleaning process after a certain period of time, open / close operation valves 53, 65
Is closed and the electric motor 9 is rotated at a high speed to drain and dry the substrate W. The plating process on the substrate W is completed by the series of processes described above.

Incidentally, it is also possible to separate and collect in the drain according to the kind of the processing liquid such as the cleaning liquid and the electrolytic liquid.

<Second Embodiment> FIG. 3 is a block diagram showing the schematic arrangement of the apparatus of this embodiment. The same components as those of the above-described first embodiment device are designated by the same reference numerals, and detailed description thereof will be omitted.

The substrate holding mechanism 1 has a cylindrical support pin 71 attached to the peripheral portion of the upper surface of the base member 3. Each support pin 71 has an eccentric vertical axis P of rotation.
It is configured to be rotatable around, and a recess 71a for locking the peripheral edge of the substrate W is formed on the outer peripheral portion away from the axis P. In addition, the support pin 71 has a concave portion 71.
Only the ceiling surface of a is electrically connected to the power feeding brush 13, and only the processing surface Ws of the substrate W can be energized.

The plate-shaped member 15 is formed so that its diameter is slightly smaller than the diameter of the substrate W for the reason described below.
The connecting portion 19 is fixed in position. Plate member 15
The vibrating portion 27 is attached to the upper surface of the above, but an ultrasonic transducer 27a is attached via an insulator 27b for the purpose of power feeding. The positive electrode side of the power supply unit 33 is directly connected to the upper surface of the plate member 15.

Further, in the replenishing portion 57 for adjusting the concentration of the electrolytic solution, the replenishing portion of the replenishing solution is not the circulation path 49 but the electrolytic solution storage tank 37.

Next, the operation of the apparatus of the second embodiment will be described with reference to FIGS.

The control unit 55 controls a moving mechanism (not shown) for the plate-shaped member 15 to move the plate-shaped member 15 to the substrate holding mechanism 1.
A state in which the substrate W can be received by moving the support pins 71 around the axis P so that the substrate transfer arm (not shown) can enter and the recess 71a faces the side. (FIG. 4 (a)).

Next, the control unit 55 controls a substrate transfer arm (not shown) so that the substrate transfer arm is advanced with the processing surface Ws of the substrate W being supported so as to face upward, and the substrate W is moved.
The peripheral edge and the concave portion 71a are lowered to the same height.
Then, the support pin 71 is rotated about the axis P to rotate the substrate W.
The peripheral part of the substrate is locked at a plurality of points and the substrate transfer arm is retracted (FIG. 4 (b)).

By controlling the moving mechanism (not shown) of the plate-shaped member 15, the plate-shaped member 15 is moved to directly above the substrate holding mechanism 1, and the lower surface of the plate-shaped member 15 and the processing surface Ws descend close to each other. . Specifically, the plate-shaped member 15 is moved down so as to have a constant distance (interval d) (FIG. 4 (c)). Then, the splash guard 35 is raised to surround the substrate holding mechanism 1.

First, the opening / closing operation valves 53 and 65 are opened, and the cleaning liquid (for example, pure water) is supplied from the supply port 15a to perform the pre-cleaning process. At this time, ultrasonic vibration may be applied. After performing the pre-cleaning process for a certain period of time, the opening / closing operation valves 53 and 65 are closed.

Next, the electrolytic solution LQ is sent to the circulation path 49, the ultrasonic vibration power source 29 is turned on, and the plate member 1 is turned on.
5, ultrasonic vibration is applied to the electrolytic solution LQ supplied between the processing surface Ws and the lower surface of the plate member 15. Since the substrate W is held face-up so that the treatment surface Ws faces upward, the bubbles naturally disengage and the effect of ultrasonic vibration is also combined to completely cover the entire surface of the treatment surface Ws with the electrolytic solution LQ. You can Treatment surface Ws
The electrolytic solution LQ supplied to the battery passes between the plurality of support pins 71 and flows out to the surroundings. Also, the electrolytic solution LQ that has flowed out
Are received and collected by the splash guard 25. In addition, in order to reduce the leak rate of the electrolytic solution LQ and increase the liquid tightness of the interval d, a member serving as a resistance may be arranged between the support pins 71.

At the time when the distance d between the processing surface Ws and the plate member 15 is completely filled with the electrolytic solution LQ, the control unit 55.
Rotates the electric motor 9 at a low speed and turns on the power supply unit 33 (FIG. 4 (d)). As a result, the treated surface Ws becomes a cathode and the plate member 15 becomes an anode, and the treated surface Ws is plated. In this process, the gas generated by the electrolysis spontaneously departs upward, and it is possible to make it difficult for the bubbles to stay not only in the groove but also in the processing surface Ws, which is similar to the above-described embodiment. However, since only the substrate holding mechanism 1 needs to be rotated, the configuration can be simpler than that of the first embodiment device described above. In addition, by rotating the plate member 15 in this manner, it is possible to suppress the influence of the unevenness in the current density between the processing surface Ws and the processing surface Ws. The operations such as the cleaning process thereafter are the same as those in the above embodiment.

By the way, when the diameter of the plate member 15 is larger than the diameter of the substrate W, the plating layer PL is thickly formed on the peripheral side of the processing surface Ws of the substrate W as shown in FIG. 5A. "End effect" is likely to occur. In terms of power supply, this is because the electric current flows in the path between the center side of the processing surface Ws and the facing surface of the plate-shaped member 15 and the peripheral side of the processing surface Ws and the plate-shaped member 15.
The current density on the side of the peripheral portion is increased because the current easily flows to the path facing the opposite surface. Therefore, by making the diameter of the plate member 15 slightly smaller than the diameter of the substrate W as in this embodiment, it is possible to balance the current densities of the central portion and the peripheral portion of the processing surface Ws. The "edge effect" can be suppressed and the plating layer PL can be formed with good uniformity (FIG. 5B). Further, as shown by a dotted line in FIG. 5B, the same effect can be obtained even if the distance between the peripheral surface of the plate member 15 and the processing surface Ws is longer than that of the central portion.

In the above description of the first and second embodiments, ultrasonic vibration is applied during the plating process. However, in the case where the plating layer is difficult to adhere to the treated surface, Gives ultrasonic vibration until just before power is supplied,
Ultrasonic vibration may not be applied after power is supplied to start electrolysis. Further, in order to efficiently separate the gas generated by the electrolysis, the feeding and the application of ultrasonic vibration may be alternately repeated.

<Modification> In the apparatus of the first embodiment described above, the plate member 15 and the substrate holding mechanism 1 are rotated simultaneously, and in the apparatus of the second embodiment, only the substrate holding mechanism 1 is rotated. But,
You may comprise as shown in FIG.

That is, the plate-like member 15 having a diameter slightly smaller than the diameter of the substrate W is rotatably attached by the electric motor 23 (driving means), and the plate-like member 15 is rotatably constituted without rotating the substrate holding mechanism 1. The electrolytic solution LQ is supplied to the processing surface Ws while rotating only the member 15 at a low speed. With this configuration, even if only the upper plate-shaped member 15 is rotated and the plating process is performed, the same effects as those of the above-described apparatus can be obtained.

It should be noted that the electric motor 9 and the electric motor 23 may be rotated in opposite directions, and the plate member 15 and the substrate holding mechanism 1 may be rotated in opposite directions.

Although each of the above-described devices is configured to supply the electrolytic solution from the supply port 15a formed in the central portion of the plate member 15, the supply port 15a is formed at a position displaced from the center. Alternatively, a plurality of supply ports 15a may be formed. Further, a supply means separate from the plate member 15 may be provided to supply the electrolytic solution to the processing surface Ws.

[0073]

As is apparent from the above description, according to the invention as set forth in claim 1, since the processing surface of the substrate is held upward, bubbles are easily released and are generated by electrolysis. The generated gas naturally escapes upward, and it is possible to make it difficult for bubbles to remain not only in the groove but also on the processing surface. Therefore, the gas can be satisfactorily released and the generation of voids can be prevented. Further, since the plate-like member arranged facing the processing surface is used as an electrode and the distance from the electrode to the processing surface is substantially uniform within the surface, it is possible to make the current density substantially uniform over the entire processing surface. it can. Therefore, the uniformity of the plated layer can be improved. In addition, there are variations in the current density in the processing plane.
Even if there is, the effect can be reduced
In addition, the electrolytic solution is moved from the center side to the peripheral side by centrifugal force.
Can be made to flow smoothly, so that the plating layer is even
The sex can be further improved.

According to the second aspect of the invention, since the electrolytic solution is supplied from the supply port provided at the substantially central portion of the plate-shaped member, the electrolytic solution can smoothly flow from the center toward the peripheral portion. Therefore, the uniformity of the plated layer can be further improved.

Further, according to the third aspect of the invention, even if only the substrate holding means is rotationally driven, it is possible to suppress the adverse effect due to the variation of the current density, and the electrolytic solution is moved from the rotation center to the peripheral portion. It can flow smoothly toward the surface, and the uniformity of the plating layer can be further improved. Further, since it is not necessary to rotate the plate member, the structure can be simplified.

Further, according to the invention described in claim 4 , even if only the plate-like member is rotationally driven, it is possible to suppress the adverse effect due to the dispersion of the current density, and the centrifugal force is applied from the center side to the peripheral side. The electrolytic solution can be made to flow smoothly toward it. Further, since it is not necessary to rotate the substrate holding means together with the plate-shaped member, it is possible to easily control the rotation driving.

According to the invention described in claim 5 , the substrate holding means and the plate-like member are both driven to rotate, so that the electrolytic solution can smoothly flow from the rotation center toward the peripheral portion by the centrifugal force. it can. Therefore, the uniformity of the plated layer can be further improved.

Further, according to the invention described in claim 6 , the bubbles attached to the processing surface of the substrate and the gas generated by the electrolysis by the ultrasonic vibration applied to the electrolytic solution are easily separated from the processing surface. be able to.

In order to apply such ultrasonic vibration, ultrasonic vibration applying means may be attached to the supplying means and ultrasonic vibration may be applied to the flowing electrolytic solution as in the invention of claim 7. Of course, ultrasonic vibration may be applied to the plate-like member as in the eighth aspect of the invention.

According to the ninth aspect of the present invention, the cleaning liquid can be supplied from the supply means so that the cleaning process can be performed, so that the essential process is performed on the substrate after the plating process. It can be performed continuously without carrying, and the plating treatment can be performed efficiently.

According to the invention described in claim 10 ,
The use efficiency of the electrolytic solution can be improved, and the cost of the plating process can be reduced.

According to the invention described in claim 11 ,
Since the control means replenishes the electrolytic solution so that the concentration of the electrolytic solution becomes constant based on the measurement result of the concentration measuring means, it is possible to suppress fluctuations in the concentration, resulting in inconveniences such as fluctuation of processing time and fluctuation of plating thickness. It can be avoided. Therefore,
A stable plating process can be performed for a long period of time.

The replenishment of the electrolytic solution as described above is carried out according to claim 12.
The invention may be carried out in the electrolytic solution storage tank as in the invention described in claim 13 , and in the circulation path as in the invention described in claim 13 ,
Further, it may be performed at a position downstream of the electrolytic solution storage tank. Particularly, in the case of the invention of claim 14 in which the electrolyte solution storage tank is replenished on the downstream side, when the concentration fluctuation occurs, it can be quickly returned to the original state, and thus more stable treatment is possible.

[Brief description of drawings]

FIG. 1 is a block diagram showing a schematic configuration of a substrate plating apparatus according to a first embodiment.

FIG. 2 is a diagram for explaining the operation.

FIG. 3 is a block diagram showing a schematic configuration of a substrate plating apparatus according to a second embodiment.

FIG. 4 is a diagram for explaining the operation.

FIG. 5 is a diagram for explaining an end effect.

FIG. 6 is a diagram showing a schematic configuration of a modified example.

FIG. 7 is a diagram showing a schematic configuration of a substrate plating apparatus according to a conventional example.

FIG. 8 is an explanatory diagram of a problem caused by the conventional device.

FIG. 9 is an explanatory diagram of a problem caused by the conventional device.

[Explanation of symbols] W ... Substrate Ws ... Treatment surface LQ ... Electrolyte PL ... Plating layer 1 ... Substrate holding mechanism 3 ... Base member 9,23 ... Electric motor 13, 31 ... Power supply brush 15 ... Plate-shaped member 15a ... Supply port 27 ... Excitation section 27a ... Ultrasonic transducer 27b ... Supply port 33 ... Power supply unit 35 ... Splash Guard 37 ... Electrolyte storage tank 43 ... Concentration sensor 49 ... Circulation 55 ... Control unit

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryuji Kitamon, 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto, Kyoto Prefecture Dainippon Screen Mfg. Co., Ltd. at the Rakusai office (72) Inventor Akira Izumi Sansu, Yasu-cho, Yasu-gun, Shiga Prefecture Upper character Kuchino Kawahara 2426-1 Dainippon Screen Mfg. Co., Ltd. at Yasu Plant (56) References JP 55-85692 (JP, A) JP 52-65665 (JP, A) JP 11- 145099 (JP, A) JP 10-226896 (JP, A) JP 8-283993 (JP, A) JP 6-280098 (JP, A) JP 2-263996 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C25D 7/12 H01L 21/288

Claims (13)

(57) [Claims] 1. A substrate plating device for performing a plating process on a substrate, comprising: a substrate holding means for holding the processing surface of the substrate upward and electrically connecting to the processing surface of the substrate. between the facing treated surface of the substrate held by the substrate holding means are arranged close, the plate-like member constituting the electrodes, the plate-like member and the treatment surface of the substrate held by the substrate holding means a supply means for supplying to satisfy two electrolytic liquid, in a state in which the supply means is fed between said plate-like member to the electrolyte and the processing surface of the substrate, toward from the plate-like member to the substrate holding means At least one of the board holding means and the plate-like member
A substrate plating apparatus comprising: a driving unit that rotationally drives one side . 2. The substrate plating apparatus according to claim 1, wherein the plate-shaped member has a supply port for supplying an electrolytic solution between a processing surface of the substrate and the plate-shaped member at a substantially central portion. A substrate plating apparatus characterized in that 3. The substrate plating apparatus according to claim 1 , wherein the driving unit is configured to rotate and drive only the substrate holding unit. 4. The substrate plating apparatus according to claim 1 , wherein the driving unit is configured to rotate and drive only the plate-shaped member. 5. The substrate plating apparatus according to claim 1 , wherein the driving unit is configured to rotationally drive the substrate holding unit and the plate-shaped member. 6. The substrate plating apparatus according to any one of claims 1 to 5 , wherein ultrasonic vibration is applied to the electrolytic solution supplied between the processing surface of the substrate and the plate-shaped member. A substrate plating apparatus further comprising ultrasonic vibration applying means. 7. The substrate plating apparatus according to claim 6 , wherein the ultrasonic vibration applying means is provided in the supply means.
A substrate plating apparatus configured to apply ultrasonic vibration to a flowing electrolytic solution. 8. The substrate plating apparatus according to claim 6 , wherein the ultrasonic vibration applying unit is configured to apply ultrasonic vibration to the plate-shaped member. 9. The substrate plating apparatus according to any one of claims 1 to 8 , wherein the supply means is also connected to a cleaning liquid supply source so as to communicate therewith, and the substrate held by the substrate holding means is processed. A substrate plating apparatus configured to selectively supply a cleaning solution and an electrolytic solution between a surface and the plate-shaped member. 10. The substrate plating apparatus according to claim 3 , wherein the collecting member is arranged around the substrate holding means, and collects the electrolytic solution scattered as the substrate rotates, and the collecting member. A substrate plating apparatus, further comprising: a circulation path for sending the electrolytic solution recovered by the method to the supply means again. 11. The substrate plating apparatus according to claim 10 , wherein concentration measuring means for measuring a concentration of an electrolytic solution flowing through the circulation path, and an electrolytic solution disposed in the circulation path for storing the electrolytic solution. The substrate plating apparatus further comprising: a storage tank; and a control unit that controls replenishment of the electrolytic solution so that the concentration becomes constant based on the measurement result of the concentration measuring unit. 12. The substrate plating apparatus according to claim 11 , wherein the replenishment of the electrolytic solution based on the result of the concentration measuring unit is configured to be performed on the electrolytic solution storage tank. Substrate plating equipment to be. 13. The substrate plating apparatus according to claim 11 , wherein the replenishment of the electrolytic solution based on the result of the concentration measuring unit is performed on the circulation path, and is on the downstream side of the electrolytic solution storage tank. A substrate plating apparatus, which is configured to be performed in position.