JP3533158B2 - Surface mount capacitors - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount capacitor, and more particularly to a surface mount capacitor for an automated manufacturing process of surface mount technology (SMT).

[0002]

2. Description of the Related Art Conventionally, this type of device is as follows.

Regarding a conventional surface mount capacitor, Taiwan Patent Publication No. 26630 of December 3, 1995 shown in FIG.
The structure disclosed in No. 0 “Surface Mount Type Chip Capacitor” is mainly composed of a casing 10, a capacitance member 20, an insulating rubber 30, and a holder 40. The casing 10 is made of a metal material, and its outer surface is covered with a thin insulating film. The capacitance member 20 includes a conductor 21, an insulating layer 22, and two lead wires 2.
3, the capacitance member 20 is provided inside the casing 10, and then the electrolytic solution is injected, and the capacitance member 20 is sealed inside the casing 10 by the insulating rubber. On the outer surface of the casing 10, the casing 10 is depressed into the insulating rubber 30 by a roller pressing method at a portion corresponding to the insulating rubber 30, and an annular groove 11 is formed.
It is possible to prevent the escape from the inside. The holder 40 is provided in the opening of the casing 10, and the lead wire 23 of the capacitance member 20 is configured to penetrate the insulating rubber 30 and then be bent and attached to the outer surface of the holder 40.

Further, the structure of another conventional surface mount capacitor shown in FIGS. 2 and 3 mainly comprises a casing 50, a capacitance member 60, a mold resin 70 and a cap 80. The casing 50 includes a side surface 51, a first end surface 52 and a second end surface 53, and the second end surface 53 is provided with an opening 54. First, the capacitance member 60
Is provided inside the casing 50, and then the stop member 55 stops the capacitance member 60. Mold resin 7
0 is filled up to the first end surface 52 of the casing 50. The two lead wires 61 of the capacitance member 60 are fixed to the stopper 55.
And the molding resin 70 are pierced and protruded to the outside, and are bent along the first end surface 52 of the casing 50.
Attached to 1. After injecting the electrolytic solution through the opening 54 of the casing 50, the cap 80 is again covered and tightly adhered, or the material around the opening 54 is heat-welded and sealed with a high temperature mold. It is configured.

[0005]

In the structure of the conventional capacitor shown in FIG. 1, the casing 10 is made of a metal material, and in order to prevent the conductor 21 of the capacitance member 20 from coming into contact with the casing 10 to cause a short circuit, The length of the insulating layer 22 must be larger than that of the conductor 21, and only then can the conductor 21 be prevented from coming into contact with the casing 10 and short-circuiting. Further, in order to fix the lead wire 23, it is necessary to add a holder 40 to the capacitor in addition to the capacitor. Since the length of the capacitor is increased in this way, the volume cannot be efficiently reduced. In addition to this, if the thin insulating film on the outer surface of the casing 10 is cut, the electric energy stored in the capacitance member 20 cannot be conducted to the outside and stored. Therefore, in the manufacturing process of the capacitor. This leads to a high defect rate. Further, the electrolytic solution inside the casing 10 utilizes the close contact between the annular groove 11 of the casing 10 and the insulating rubber 30 to seal the electrolytic solution inside the casing 10. Since it has the ability to adhere only to the contact portion with the insulating rubber 30, if there is a slight defect due to roller pressing, or if elastic fatigue of the insulating rubber 30 occurs,
There is a problem that not only liquid leakage occurs in the capacitor but also the defective rate of the product is further increased in the manufacturing process.

In the structure of the conventional capacitor shown in FIGS. 2 and 3, when the molding resin is injected, the molding resin 70 is solidified by the surface tension, and then a concave curved surface is formed on the first end surface 52 of the casing 50. The two lead wires 61 have to be attached to the first end surface 52 after being bent, but the first end surface 52 is not a flat surface, so the portion where the two lead wires 61 are attached to the first end surface 52 Cannot maintain the level, which is why surface mounting technology (SM
T) cannot be incorporated into the manufacturing process. In addition, the opening 54 of the casing 50 is sealed by a cap 80 or a welding method using heat, and then the second end surface 53 of the casing 50.
Since a bulged surface is formed on the surface, it cannot be applied to the suction mechanism of the surface mounting technology. Therefore, in such a capacitor, since only the lead wire 61 attached to the side surface 51 of the casing 50 cannot be used, the suction mechanism of the surface mounting technology can only suck the flat surface portion of the side surface 51 of the casing 50. There is a problem that the range in which such a capacitor can be used is limited.

The present invention has been made in view of the above problems. A first object of the present invention is to simplify parts in manufacturing and to reduce volume by using a simpler structure and insulating material. It is intended to provide a surface mount capacitor capable of keeping the height of the capacitor low by reducing

A second object of the present invention is to make it possible to inject the electrolytic solution into the casing accurately and quickly by forming the opening of the casing to be relatively large in mass production due to a simpler structure. The present invention is intended to provide a surface mount capacitor which can be relatively safe and quick in assembling and can suppress a defective rate of a product in a manufacturing process to a low level.

A third object of the present invention is to provide a casing having a perfectly flat surface so that the suction can be accomplished by the conventional suction mechanism of surface mount technology,
An object of the present invention is to provide a surface mount capacitor applicable to manufacturing processes of different surface mount technologies.

[0010]

In order to achieve the above object, a surface mount capacitor according to the present invention is as follows.

That is, the surface mount capacitor of the present invention comprises a casing, an inner plate, a capacitance member and an outer plate. The casing includes a wall surface and an end surface, and the wall surface and the end surface form a storage chamber and an opening. An annular collar is projected in the accommodation chamber, two through holes are formed in the end surface, and a notch hole is formed in the wall surface. Two through holes are formed in the inner plate. Two leads are erected on the capacitance member, and the outer plate can seal the opening of the casing. In assembling the capacitor, the inner plate and the capacitance member are installed inside the housing chamber of the casing, and two lead wires are projected to the end face through the through hole of the inner plate and the through hole of the casing. Mold resin is injected into the accommodation chamber through the notch hole to fill the space between the inner plate and the end face, and then the electrolyte solution is injected from the opening inside the accommodation chamber, and then the outer plate seals the opening of the casing. Then, after conducting electricity to the two lead wires to store electricity in the capacitance member, the two lead wires are bent again and attached to the end surface of the casing.

The surface mount capacitor of the present invention can also be constructed as follows. 1. The outer plate is equipped with multiple rupture prevention wires, so the pressure generated by the unexpected explosion of the capacitor can be released. 2. The outer plate seals the casing opening by ultrasonic welding. 3. A first recessed groove for accommodating the two bent lead wires is formed in the through hole formed in the end surface of the casing. 4. Provide fixed ends on the two lead wires. 5. A second groove is formed on one wall surface in the casing, and a fixing groove is formed on the second groove. 6. The two lead wires can be bent and then housed in the second concave groove, and the fixed ends of the two lead wires are configured to sink into the fixing groove for fixing.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

[0014]

[First Embodiment] FIG. 4 is an exploded perspective view of a surface mount capacitor according to a first embodiment of the present invention. The surface mount capacitor includes a casing 100, an inner plate 200, and two lead wires 3.
The capacitance member 300 including 10 and the outer plate 400.

The casing 100 has a wall surface 110 and an end surface 12.
0, which is surrounded by the wall surface 110 and the end surface 120 to form the accommodation chamber 130 and the opening 140. Two first concave grooves 121 are provided in the end surface 120, and the two first concave grooves 1 are provided.
A through hole 122 for penetrating two lead wires 310 of the capacitance member 300 is formed in each of 21. Casing 100 is preferably made of a plastic material, but can be made of other insulating materials. The wall surface 110 is provided with a cutout hole 111 which is continuous with the accommodation chamber 130, and the accommodation chamber 130 is provided with an annular flange 131 in a protruding manner. The annular collar 131 is the inner plate 200.
Used to abut and position the outer plate 40
The zero is formed so that it can just cover the opening 140 of the casing.

When assembling the capacitor, see FIGS.
As shown in FIG. 1, first, the inner plate 200 and the capacitance member 300 are respectively placed in the housing chamber 130 of the casing 100.
To be placed inside. The two lead wires 310 of the capacitance member 300 project to the end surface 120 of the casing 100 through the two through holes 210 of the inner plate 200. In addition, in order to facilitate bending of the two lead wires 310 at a right angle, the bent surface is further flattened by flatly compressing the two lead wires 310 as necessary.

Then, the mold resin 500 is injected into the accommodation chamber 130 through the notch hole 111 so that the molding resin 500 is filled in the accommodation chamber 130 and is interposed between the inner plate 200 and the end surface 120. At the same time, the capacitance member 300 has the casing 1
It is fixed inside 00. Then, it is better to inject the electrolytic solution into the housing chamber 130 through the opening 140 of the casing 100, then cover the opening 140 with the outer plate 400 to bring them into close contact, and further combine them by ultrasonic welding or heat welding. It is suitable.

The outer plate 400 is provided with a plurality of rupture prevention lines 410. As a result, the pressure generated by the unexpected explosion of the capacitor can be released to the outside. Then, the capacitor, which has completed the sealing work, is electrically conductive by the two lead wires 310 and stored in the capacitance member 300. Also, the tests can be performed simultaneously if necessary. After that, the two lead wires 310 are bent so that they can be accommodated in the first concave groove 121 of the end face 120. In the embodiment of the present invention, the surface mounting technology (S
MT) device, using the outer plate 400 of the condenser
Can be sucked and held, and the two lead wires 310 of the end surface 120 of the capacitor can be attached to a device that requires it.

[0019]

[Second Embodiment] FIGS. 7, 8, 9, and 10 show a second embodiment of the surface mount capacitor of the present invention. The difference between the second embodiment and the first embodiment is that the two lead wires 310 of the capacitance member 300 are each formed by bending one fixed end 311. Two second concave grooves 112 are provided on one wall surface 100 of the casing 100, and a fixed groove 113 is provided on the second concave groove 112. Fixed groove 1
The width of 13 is smaller than the diameter of the fixed end 311. After the two lead wires 310 protrude through the through hole 122 of the casing 100, the two lead wires 310 are bent and placed inside the second groove 112 formed in the wall surface 110 of the casing 100. Then, the fixed end 311 of the lead wire 310 is fixed by sinking it into the fixing groove 113. In this embodiment, a surface mount technology (SMT) device is used to suck and hold a portion of the other wall surface 110 corresponding to the capacitor lead wire 310, and two capacitor lead wires 310 are required. Can be attached to the device.

[0020]

According to the surface mount capacitor of the present invention,
With a simpler structure and insulating material, the number of parts can be reduced and the volume can be reduced in manufacturing, so that there is an advantage that the height of the capacitor can be kept low.

According to the surface mount capacitor of the present invention, the opening of the casing is formed to be relatively large in mass production due to the simpler structure, so that the electrolytic solution can be injected into the casing accurately and quickly. Since this is possible and the assembly is relatively safe and quick, there is an advantage that the defective rate of the product can be kept low in the manufacturing process.

According to the surface mount capacitor of the present invention, since the casing having the completely flat surface is provided, it is possible to provide suction by the suction mechanism of the surface mount technology, and to manufacture different surface mount technology. There is an advantage that it can be applied to the process.

The present invention may be embodied in other ways without departing from its spirit and essential characteristics. Therefore, the preferred embodiments described herein are illustrative and not intended to be limiting.

[Brief description of drawings]

FIG. 1 is a sectional view of a conventional capacitor.

FIG. 2 is a perspective view of a conventional capacitor.

3 is a cross-sectional view of the conventional capacitor of FIG.

FIG. 4 is an exploded perspective view of the surface mount capacitor according to the first embodiment of the present invention.

FIG. 5 is a perspective view of a surface mount capacitor according to a first embodiment of the present invention.

6 is a cross-sectional view taken along line 6-6 of FIG.

FIG. 7 is a perspective view of a surface mount capacitor according to a second embodiment of the present invention before bending a lead wire.

FIG. 8 is a plan view of a surface mount capacitor according to a second embodiment of the present invention before bending a lead wire.

9 is a cross-sectional view taken along the line 9-9 of FIG.

FIG. 10 is a perspective view after bending a lead wire according to a second embodiment of the surface mount capacitor of the present invention.

[Explanation of symbols]

10 Casing 10 Annular Groove 20 Capacitance Member 21 Conductor 22 Insulating Layer 23 Lead Wire 30 Insulating Rubber 40 Holder 50 Casing 51 Side Surface 52 First End Face 53 Second End Face 54 Opening 55 Stopping Piece 60 Capacitance Member 61 Lead Wire 70 Mold Resin 80 Cap 100 Casing 110 Wall surface 111 Notch hole 112 Second concave groove 113 Fixed groove 120 End surface 121 First concave groove 122 Through hole 130 Storage chamber 131 Annular flange 140 Opening 200 Inner plate 210 Through hole 300 Capacitance member 310 Lead wire 311 Fixed end 400 Outer plate 410 Burst prevention wire 500 Mold resin

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H01G 9/12 H01G 9/04 310

Claims (7)

(57) [Claims] 1. A casing (100), an inner plate (2)
00), a capacitance member (300), and an outer plate (400), the casing (100) includes a wall surface (110) and an end surface (120), and the wall surface (110) and the end surface (120) form a casing. A storage chamber (130) and an opening (140) are formed,
An annular flange (131) is projected in the accommodation chamber (130), two through holes (122) are bored in the end face (120), and a cutout hole (111) is formed in the wall surface (110).
And two through holes (210) are formed in the inner plate (200), and the capacitance member (30
0) two lead wires (310) are erected, and the outer plate (400) has an opening (14) of the casing (100).
0) can be sealed, and the capacitor is assembled by installing the inner plate (200) and the capacitance member (300) inside the housing chamber (130) of the casing (100), and by connecting the two lead wires (310). The inner plate (200)
Through the through hole (210) of the casing and the through hole (122) of the casing (100) to the end surface (120), and the mold resin (500) is injected into the accommodation chamber (130) through the notch hole (111) to form the inner plate. After filling the space between (200) and the end face (120) and then injecting the electrolytic solution through the opening (140) inside the accommodation chamber (130),
The outer plate (400) seals the opening (140) of the casing (100), and the two lead wires (31
0) to the capacitance member (30
0) and then the two lead wires (31
0) is bent and the end surface (12) of the casing (100) is bent.
0) A surface mount capacitor, which is characterized in that it is formed by adhering to (0). 2. The outer plate (400) is provided with a plurality of rupture prevention lines (410), by which the pressure generated by the unexpected explosion of the capacitor can be released. Item 1. The surface mount capacitor according to Item 1. 3. The surface mount capacitor of claim 1, wherein the outer plate (400) is configured to seal the opening (140) of the casing (100) by ultrasonic welding. 4. The end surface (120) of the casing (100).
A through hole (122) is drilled in the
2) Two lead wires (31
The surface mount capacitor according to claim 1, wherein a first groove (121) for accommodating 0) is provided. 5. The surface mount capacitor according to claim 1, wherein the two lead wires (310) are provided with fixed ends (311). 6. A casing (100) is provided with a second groove (112) on one wall surface (110) thereof and a fixing groove (113) on the second groove (112). The surface mount capacitor according to claim 1, wherein 7. The two lead wires (310) can be bent and accommodated in the second groove (112), and the fixed ends (311) of the two lead wires (310) are fixed groove (11).
7. The surface mount capacitor according to claim 5, wherein the surface mount capacitor is configured so as to be submerged and fixed in the inside of 3).