JP3531356B2 - Method of manufacturing inkjet head - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates also relates to the terminals provided on the substrates to a method and apparatus for thermal compression bonding to connect,
In particular, it relates to an electrostatic actuator and a method for connecting the flexible substrate to terminals of an inkjet head.

[0002]

2. Description of the Related Art As an application example of an electrostatic actuator, it has been proposed that an ink jet head uses a vibrating plate for attracting force due to static electricity.
Japanese Patent No. 9351 discloses such an inkjet head. From page 4, line 14 to page 5, line 11 of JP-A-2-289351, as stated,
This inkjet head has a nozzle, an ink flow path communicating with the nozzle, a vibration plate formed in a part of the flow path,
It has an electrode formed opposite to the diaphragm, and a forward electric pulse is applied between the diaphragm and the electrode to deform the diaphragm by electrostatic force and eject ink droplets from the nozzle. It is the one.

[0003]

[SUMMARY OF THE INVENTION Incidentally, with the diaphragm, the electrode structure and, power supply method for indicia pressurizing the semi direction of the electric pulses between the electrodes formed to face the diaphragm No. 1 , JP-A-2-289351
As shown in FIGS. 2 and 2, since the individual electrodes are opposed to the common electrode through the gap, it is attempted to wire these electrodes and form terminals for connecting to an external drive circuit. Then, a step is generated between these terminals.

On the other hand, an ink jet head using an electrostatic actuator uses silicon as a substrate to form a flow path,
An extremely small and high density inkjet head can be manufactured at low cost by applying a semiconductor process to the electrode wiring. In order to take advantage of these advantages, signals are sent to the inkjet head and power is supplied. It is also necessary to form the terminals for the external drive circuit and the terminals for the external drive circuit with high density.

As a method of connecting the terminals arranged in such a high density, two adherends are thermocompression-bonded by using an anisotropic conductive adhesive to be flexible with the terminals on the electrostatic actuator side. The method of connecting between the boards (hereinafter also referred to as FPC, Flexible Print Circuit) is effective, but as described above, since the step is formed between the terminals on the side of the electrostatic actuator, the existing device is sufficient. It was not possible to obtain good adhesive strength, conductivity between connecting terminals, and insulation performance between adjacent terminals. For example, when the desired conductivity is not obtained at the terminal portion of the inkjet head, a large resistance component is generated in this portion, and the time constant of the electrostatic actuator that is the pressure generating means is also different from the desired value. Will end up. For this reason, there is a possibility that ink droplets may not be ejected from the nozzle even if the device is driven by a preset drive pulse with respect to the design value (the original resistance component and capacitance component of the electrostatic actuator). The present invention has been made to solve such a problem, and satisfies desired characteristics for an electrostatic actuator including at least one step between adjacent terminals or a substrate terminal such as an inkjet. Thus, it is to provide a method of connecting FPC boards.

[0006]

According to the manufacturing method of the ink jet head of the present invention According to an aspect of the production of the ink jet head connecting the ink jet head and the flexible substrate having a pressure generating means for ejecting ink droplets from the nozzle In the method, the second substrate is formed with a first terminal connected to one pole of the pressure generating means on the first substrate and a second terminal connected to the other pole of the pressure generating means. Is bonded on the first substrate, the terminals of the flexible substrate having at least two terminals are positioned on the first and second terminals, respectively, and then the amount of pressurization between the terminals, And a heating amount is individually set for the first terminal and the second terminal, and the head side terminal and the flexible substrate side terminal are thermocompression bonded.

[0007] As a result, the first
And the second terminal can be simultaneously thermo-compressed to the flexible substrate, and the adhesive strength after connection, the conductivity between the terminals to be connected, and the insulation performance between adjacent terminals are determined. Since the amount of pressurization and amount of heating that are the factors that cause this is set to the optimum value for each terminal according to the area of each terminal, etc., even if there is a step between the terminals, sufficient adhesive strength and connection It is possible to obtain conductivity between terminals and insulation performance between adjacent terminals. Therefore, a large resistance component does not occur in the terminal portion of the inkjet head, and the time constant of the pressure generating means is almost the same as the designed value, and a highly reliable inkjet head can be mass-produced.

Further, as described in claim 2, a step of wiring the second substrate by using a conductor or a semiconductor and using the second substrate itself as a common electrode. Can be omitted, and a more convenient inkjet manufacturing method can be provided. The second substrate is preferably a silicon substrate because a fine flow path can be formed on the substrate with high precision by using anisotropic etching.

Further, when the second substrate is used as the common electrode as described above, the process can be further simplified by the invention described in claim 3 or 4. That is, the first substrate is used as an insulating substrate, a groove is formed in the insulating substrate, and one pole of the pressure generating means and the first electrode are formed along the groove.
Forming a wiring pattern that connects the terminals of
A first electrode of the pressure generating means and a first electrode on the first substrate;
By forming a wiring pattern connecting the terminals of the first substrate and a groove on the second substrate at a position corresponding to the wiring pattern when the first substrate is joined, It is possible to omit the step of performing insulation treatment on the bonding surface of the substrate.

Further, as described in the invention described in claim 6, by providing the notches between the terminals of the flexible substrate, stress does not remain in the flexible substrate after thermocompression bonding, so that it is sufficient. A good connection strength can be obtained. Further, in order to bond the substrate terminal on the side of the electrostatic actuator and the terminal on the side of the flexible substrate, an adhesive layer made of an anisotropic conductive adhesive is previously formed on the terminal of the flexible substrate. Is desirable.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of an ink jet head manufacturing method according to the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an ink jet head according to an embodiment of the present invention, which is a partial sectional view. 2 is an enlarged view of part A of FIG. 1, FIG. 3 is a cross-sectional side view of the inkjet head of the embodiment of FIG. 1, and FIG. 4 is an oblique view of the inkjet head of the embodiment of FIG. 1 after assembly.
FIG . 5 is a perspective view, and FIG. 5 is a sectional view taken along line AA of FIG. 3 . Although the present embodiment shows an example of an edge eject type in which ink droplets are ejected from nozzle holes provided at the end of the substrate, ink droplets are ejected from nozzle holes provided at the upper surface of the substrate. The face eject type may be used.
The inkjet head 10 of the present embodiment has a laminated structure in which three substrates 1, 2 and 3 having the structure described in detail below are stacked and joined.

The intermediate second substrate 2 is a silicon substrate, and a plurality of nozzle grooves 1 are formed on the surface of the substrate 2 in parallel with one end at equal intervals so as to form a plurality of nozzle holes 4.
1 and a recess 12 communicating with each nozzle groove 11 and forming a discharge chamber 6 having a diaphragm 5 as a bottom wall;
2 is a narrow groove 13 provided at the rear part of the second ink inlet
And a recess 14 that will form a common ink cavity 8 for supplying ink to each ejection chamber 6. The ink inlet 13a is provided behind the recess 14.
Is provided, which has a size smaller than the nozzle hole 4 and also functions as a filter for preventing dust in the ink from entering the head. In addition,
The narrow groove 13 will form the orifice 7 when the substrate 2 and the third substrate 3 are joined.

Regarding the provision of the common electrode 17 (second terminal) to the second substrate 2, it is important that the work function of the metal material of the semiconductor and the electrode is large and small. As the electrode material, titanium is used as an undercoat and platinum is used, or chromium is used as an undercoat, and gold is used, but the present invention is not limited to this embodiment, and another combination may be used depending on the characteristics of the semiconductor and the electrode material. . The vibrating plate 5 is formed by doping the second substrate 2 with boron and stopping the etching, and a thin and uniform thickness is obtained.

Further, as shown in FIG. 2, the oxide film 2 having a thickness of about 1 μm is formed on the entire surface of the second substrate 2 excluding the common electrode 17.
4 is formed, which is caused when the vibrating plate 5 comes into contact with an individual electrode 21 described later when the inkjet head is driven,
It functions as an insulating layer to prevent dielectric breakdown and short circuits.

Borosilicate glass is used for the lower first substrate 1 bonded to the lower surface of the second substrate 2, and a vibration chamber 9 is formed on the upper surface of the first substrate 1. A concave portion 15 having an elongated pillar 35 is provided near the center.
If the diaphragm 5 has a large thickness and a predetermined rigidity necessary for ink ejection can be obtained, the column 35 may not be provided. In the present embodiment, the distance between the diaphragm 5 and the individual electrode 21 arranged to face the diaphragm 5 is
That is, the spacing means is provided on the first substrate so that the length G of the gap portion 16 (see FIG. 3, hereinafter referred to as “gap length”) becomes the difference between the depth of the recess 15 and the thickness of the individual electrode 21. 1
It is composed of a vibration chamber recess 15 formed on the upper surface of the. As another example, the recess may be formed on the lower surface of the second substrate 2. Here, the depth of the recess 15 is set to 0.3 μm by etching. The pitch of the nozzle grooves 11 is 0.2 mm and the width thereof is 80 μm.

The vibrating chamber 9 is formed by bonding the first substrate 1 to the second substrate 2, and gold is added to each position corresponding to the vibrating plate 5 on the first substrate 1. 1
μm is sputtered, and a gold pattern is formed in the same shape as that of the vibrating plate 5 so as to surround the column 35 to form the individual electrode 21. The individual electrode 21 includes a lead portion 22 and a terminal portion 23.
(First terminal). These electrodes, etc.
The material of Nos. 2 and 23 may be an acidic conductive film such as ITO instead of gold.

The upper third substrate 3, which is bonded to the upper surface of the second substrate 2, uses the same borosilicate glass as the first substrate 1. By joining the third substrate 3, the nozzle hole 4, the ejection chamber 6, the orifice 7, and the ink cavity 8 are formed. Then, the convex portion 3 is provided in the ink cavity 8 so as to have strength so that the concave portion is not crushed when the second substrate 2 and the third substrate 3 are joined.
6 is provided.

Next, the first substrate 1 and the second substrate 2 are anodically bonded by applying a temperature of 270 to 400 ° C. and a voltage of 500 to 800 V, and under the same conditions, the second substrate 3 and the third substrate 3 are joined. joining the door, assembling the ink jet head as shown in FIG. The gap length G formed between the diaphragm 5 and the individual electrode 21 on the first substrate 1 after anodic bonding is the difference between the depth of the recess 15 and the thickness of the individual electrode 21 as described above,
In this embodiment, the thickness is 0.2 μm.

After assembling the ink jet head as described above, as shown in FIG. 3 or 4, wiring (F) is provided between the common electrode 17 and the terminal portions 23 of the individual electrodes 21, respectively.
A drive circuit 102 is connected by a PC (flexible printed circuit) 101.

An anisotropic conductive film is used in the present embodiment as a means for joining the wiring 101 and the electrodes 17 and 23 (the details of this point will be described later). Vibration chamber 9
Nitrogen gas is fed into and is hermetically sealed by an insulating sealant 30. In the present embodiment, sealing is performed in the vicinity of the terminal portion 23, and the volume of the actuator includes not only the vibration chamber 9 but also the volume of the groove formed by the lead portion 22.

The ink 103 is supplied from the ink tank (not shown) to the inside of the second substrate 2 via the ink supply pipe 33 and the ink supply container 32 fitted to the rear portion of the inkjet head, and the ink cavity 8, the ejection chamber 6 and the like. Meets Then, as shown in FIG. 3, the ink in the ejection chamber 6 is repeatedly charged and discharged at a predetermined timing with respect to the electrostatic actuator composed of the diaphragm 5 and the individual electrodes 21 facing the diaphragm 5, so that the diaphragm 5 becomes The ink is vibrated by the electrostatic force generated between the vibrating plate 5 and the individual electrodes, ejected as ink droplets 104 from the nozzle holes 4 of the inkjet head 10 and printed on the recording paper 105.

Next, a preferred embodiment of the terminal connecting device according to the present invention will be described with reference to FIGS.

FIG. 6 is a schematic view showing an inter-terminal connecting device according to an embodiment of the present invention, in which the terminals 23 formed on the first substrate of the ink jet head 10 described above,
This is applied to the case where the common electrode 17 formed on the second substrate 2 and the terminals 102a and 102b formed on the FPC are connected. FIG. 7 is a plan view showing the FPC bonded to the inkjet head 10 in FIG.

In the figure, 110 is an anisotropic conductive adhesive in which conductive particles such as carbon and nickel are dispersed in the adhesive, which is applied in advance to the surfaces of the terminals 102a and 102b of the FPC 101 with a predetermined thickness. Has been done.

A heater 202 is inserted inside the first heater block 201 fixed to the first pressurizing mechanism 204. The thermocouple 203 for temperature control is installed and fixed in the central portion of the heater block 201, is connected to the temperature controller 205, and controls the current value or ON / OFF of the heater 202 according to the set temperature to supply power to the heater 202.
As a result, the heater block 201 is heated to a constant set temperature.

Similarly, the heater 20 is also attached to the first heater block 206 fixed to the second pressure mechanism 209.
7, a thermocouple 208 for temperature control is installed and fixed in the central portion of the heater block 209, and is heated to a constant set temperature by the temperature controller 205. The temperatures of the first and second heat blocks and the heating time, the pressures of the first and second pressurizing mechanisms, and the pressurizing time can be set individually.

The terminal connecting device 20 configured as described above
The inkjet head 10 is set to 0, and the FPC 101 is set so that the terminal 102a overlaps the first terminal 23 and the terminal 102b overlaps the second terminal 17. At this time, the heat block 201,20 6, like the inkjet head 10 and FPC101 is easily set, in a state of being retracted to a position above the position shown in FIG. The position of the FPC with respect to each terminal of the inkjet head 10 is adjusted by using a microscope so that alignment marks (not shown) provided in advance on both sides are aligned with each other.

Positioning of the FPC with respect to each terminal of the ink jet head 10 is performed by using a microscope so that alignment marks (not shown) provided on both sides are aligned with each other.

In this embodiment, the depth G of the concave portion of the first substrate 1 on which the terminals 23 are arranged is 0.25 μm.
m, the second substrate has a thickness of 100 μm, and the terminals 17 and 23 have a thickness of 0.1 μm. Therefore, 100.25 is provided between the first terminal 23 and the second terminal 17.
There is a step of μm.

After the ink jet head 10 and the FPC 101 are set in the inter-terminal connection device 200, the temperature and pressure of the heat block 206 applied to the terminals 17, 102b side from the control panel (not shown) provided in the inter-terminal connection device. Pressurization amount of mechanism 209, pressurization time, terminals 23, 1
The temperature of the heat block 201 applied to the 02a side, the amount of pressure applied by the pressure mechanism 204, and the pressure time are set. After setting, thermocompression bonding is started by the switch etc. provided on the control panel. When heating of each heater block is started, and the temperature controller detects that the temperature of the heater block has reached the set temperature and is stable, each heater block is pushed down toward the inkjet head 10 by the pressurizing mechanism and set. Pressure is applied to the FPC 101 with a pressurizing amount.

After the set pressurizing time ends, each heat block retreats upward and the thermocompression bonding ends.

In this embodiment, the terminals 23, 10
The heating temperature on the 2a side is 270 ° C, the heating temperature on the terminals 17 and 102b side is 400 ° C, and both terminals have a pressing force of 150 g.
When f was applied and thermocompression bonding was performed for 20 seconds, good results were obtained.

The temperature setting on the terminals 17 and 102b side is set higher than that on the individual side. This is because the terminal 17 is a common electrode and the area of the terminal is large. This is because it is desirable to obtain it. On the other hand, the terminals 23 and 102a are the individual electrodes arranged in a row at a fine pitch, and if the installation temperature is increased, the insulation between the adjacent terminals may not be sufficiently taken, so the set temperature is set low. ing. For the same reason, it is desirable to set the pressurization amount of the terminals on the fine pitch side to be slightly lower even when it becomes necessary to make the pressurization amount different.

Further, when there is a step between the terminals even with a slight amount, it is desirable to provide a notch 103 between the terminals of the FPC corresponding to the step as shown in FIG.

As a result, no stress remains in the flexible substrate after thermocompression bonding, so that sufficient connection strength can be obtained.

As described above, according to the embodiment of the present invention, when the electrostatic actuator or the substrate terminal of the ink jet or the like is connected to the FPC board, the terminals adjacent to each other with the step therebetween are included. However, it is not necessary to repeatedly perform thermocompression bonding for each terminal on the same plane, and it is possible to connect these to the FPC board with a single pressure bonding operation.

Further, by having the adjusting means capable of setting the heating temperature and the pressing force of each heater block, the adhesive strength after connection, the conductivity between the terminals to be connected, and the insulating performance between the adjacent terminals are determined. The amount of pressurization and heating, which are the factors, is set to the optimum value for each terminal according to the area of each terminal or each plane, etc., so even if there is a step between the terminals, sufficient adhesive strength, It is possible to obtain conductivity between terminals to be connected and insulation performance between adjacent terminals.

The present invention is not limited to the above-mentioned embodiment, and various modifications can be made.

For example, in the above-described embodiment, the case where the invention is applied to the ink jet head using the electrostatic actuator as the pressure generating means has been described, but the present invention is not limited to this, and the bubble method and the piezo method are used. Even when various print heads such as the above are used, the same effect can be obtained as long as the terminal portion has a structure in which a step is formed.

In the above embodiment, the silicon substrate is used as the second substrate, but the present invention is not limited to this, and may be a conductor such as a metal,
It may be an insulator in which electrodes are wired. However, since the surface of the silicon substrate can be finely processed, it is optimal as a substrate for an inkjet head.

[0042]

As described above, according to the first aspect of the invention, the first substrate is formed with the first terminal connected to one pole of the pressure generating means, and the other of the pressure generating means is formed. A second substrate having a second terminal connected to a pole is bonded onto the first substrate, and terminals of a flexible substrate having at least two terminals are respectively connected to the first and second terminals. After positioning on the terminals, the amount of pressurization and the amount of heating between each terminal are set, and the head side terminal and the flexible substrate side terminal are thermocompression-bonded to each other so that they are arranged across the step. The first terminal and the second terminal can be thermocompression bonded to the flexible substrate at the same time. Further, even if a step is formed between the terminals, sufficient bonding strength is achieved. It is possible to obtain conductivity between terminals and insulation performance between adjacent terminals. therefore,
It is possible to mass-produce a highly reliable inkjet head without causing a large resistance component in the terminal portion of the inkjet head.

According to the second aspect of the invention, the second
The substrate is a conductor or a semiconductor, and the second substrate itself is a common electrode, so that the step of wiring on the second substrate can be omitted, and a simpler inkjet manufacturing method is provided. You can

Further, when the second substrate is used as the common electrode in this way, the process can be further simplified by the invention described in claim 3 or 4. That is, the first substrate is an insulator substrate, a groove is formed in the insulator substrate, and a wiring pattern connecting one pole of the pressure generating means and the first terminal is formed along the groove. Alternatively, a wiring pattern that connects one pole of the pressure generating means and the first terminal is formed on the first substrate, and matches the wiring pattern when the first substrate is joined on the second substrate. By forming the groove at the position, it is possible to omit the step of performing insulation treatment on the bonding surface between the first substrate and the second substrate.

Further, as described in the invention described in claim 6, by providing the notches between the terminals of the flexible substrate, stress does not remain in the flexible substrate after thermocompression bonding, so that it is sufficient. A good connection strength can be obtained.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an inkjet head according to an embodiment of the present invention.

FIG. 2 is an enlarged view of part A in FIG.

3 is a cross-sectional side view of the inkjet head of FIG.
It

4 is an assembly of the ink jet head of the embodiment of FIG .
It is a rear perspective view.

Figure 5 is an A-A sectional view of FIG.

FIG. 6 is a schematic view of an inter-terminal joining device according to an embodiment of the present invention.

FIG. 7 is a plan view of an FPC board according to an embodiment of the present invention.

[Explanation of symbols]

1st substrate 2 Second substrate 3rd substrate 4 nozzle holes 5 diaphragm 10 inkjet head 17 Second terminal (common electrode) 23 First terminal 101 Flexible wiring board (FPC) 102 terminals 200 terminal joining device

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-1952 (JP, A) JP-A-6-77643 (JP, A) JP-A-7-131144 (JP, A) JP-A-2- 135797 (JP, A) Actual Kaihei 4-102190 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B41J 2/16 B41J 2/045 B41J 2/055 H01L 21/603

Claims (7)

(57) [Claims] 1. A method of manufacturing an ink jet head connecting the ink jet head and the flexible substrate having a pressure generating means for ejecting ink droplets from a nozzle, one pole of said pressure generating means to the first substrate A second terminal having a second terminal connected to the other pole of the pressure generating means is bonded onto the first substrate, and at least two or more After positioning the terminals of the flexible substrate having the terminals on the first and second terminals, respectively, the amount of pressurization and the amount of heating between the terminals are set to the first terminal and the second end.
A method for manufacturing an inkjet head, characterized in that the head-side terminal and the flexible substrate-side terminal are thermocompression-bonded to each other. 2. The method of manufacturing an inkjet head according to claim 1, wherein the second substrate is a conductor or a semiconductor. 3. The method of manufacturing an inkjet head according to claim 1, wherein the second substrate is silicon.
The method of manufacturing an inkjet head, wherein the second terminal is a metal film formed on a silicon substrate. 4. The method of manufacturing an ink jet head according to claim 2, wherein the first substrate is an insulating substrate, a groove is formed in the insulating substrate, and the groove is formed along the groove. A method for manufacturing an ink jet head, comprising forming a wiring pattern connecting one pole of the pressure generating means and the first terminal. 5. The method of manufacturing an inkjet head according to claim 2, wherein a wiring pattern connecting one pole of the pressure generating means and a first terminal is formed on the first substrate, and the second pattern is formed. A method of manufacturing an inkjet head, wherein a groove is formed on the substrate at a position corresponding to the wiring pattern when the first substrate is joined. 6. The method of manufacturing an inkjet head according to claim 1, wherein a cut is provided between terminals of the flexible substrate. 7. The method of manufacturing an inkjet head according to claim 1, wherein an adhesive layer made of an anisotropic conductive adhesive is formed on the terminals of the flexible substrate. Inkjet head manufacturing method.