JP3525724B2 - Electronic component and its mounting method - Google Patents
Electronic component and its mounting methodInfo
- Publication number
- JP3525724B2 JP3525724B2 JP3449198A JP3449198A JP3525724B2 JP 3525724 B2 JP3525724 B2 JP 3525724B2 JP 3449198 A JP3449198 A JP 3449198A JP 3449198 A JP3449198 A JP 3449198A JP 3525724 B2 JP3525724 B2 JP 3525724B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead
- electronic component
- leads
- board insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品とその実
装方法に関するものであり、特に電子部品のリードの形
状に係わるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a mounting method thereof, and more particularly to the shape of a lead of the electronic component.
【０００２】[0002]
【従来の技術】電子部品の外部リードをプリント回路基
板のリード貫通孔に挿入して電子部品を保持し、リフロ
ーはんだ付けして固定する電子部品の実装方法において
は、従来、例えば、実公平７−２０９２３号公報の第６
図に開示されているような、リードを交互に逆向きに振
分けて折曲げ成形した電子部品が使用される。2. Description of the Related Art An electronic component mounting method in which an external lead of an electronic component is inserted into a lead through hole of a printed circuit board to hold the electronic component and fixed by reflow soldering has hitherto been known. No. 6 of -20923 Publication
An electronic component as disclosed in the figure is used in which leads are alternately distributed in opposite directions and then bent and formed.
【０００３】すなわち、そのようにリード成形された電
子部品で、電力用トランジスタの例を斜視図にて図３に
示す。That is, FIG. 3 is a perspective view showing an example of a power transistor in the electronic component thus lead-molded.
【０００４】図３において、１は樹脂封止部、２、３、
４はエミッタ、ベース、コレクタ用の３本の外部リード
であって、その外部リードにはそれぞれ第１折曲げ部２
ａ、３ａ、４ａと第２折曲げ部２ｂ、３ｂ、４ｂを経
て、回路基板のリード孔挿入に係わる回路基板挿入部２
ｃ、３ｃ、４ｃが形成されている。In FIG. 3, 1 is a resin sealing portion, 2, 3,
Reference numeral 4 designates three external leads for the emitter, the base and the collector. The external leads each have a first bent portion 2 respectively.
a, 3a, 4a and the second bent portions 2b, 3b, 4b, and the circuit board insertion portion 2 relating to insertion of the lead holes of the circuit board.
c, 3c, 4c are formed.
【０００５】ここで、３本のリード２、３、４のうち中
央のリード３の基板挿入部３ｃと、両端のリード２、４
の基板挿入部２ｃ、４ｃとは、前後に振分けて折曲げ成
形されており、また各基板挿入部２ｃ、３ｃ、４ｃは、
電子部品を基板に垂直に取り付ける為、すべて電子部品
の縦方向と同じ方向に形成されている。すなわち、中央
のリード３の基板挿入部３ｃと、両端のリード２、４の
基板挿入部２ｃ、４ｃとは平行になっている。Here, of the three leads 2, 3, 4, the substrate insertion portion 3c of the central lead 3 and the leads 2, 4 at both ends.
The board insertion parts 2c, 4c are formed by bending forward and backward, and the board insertion parts 2c, 3c, 4c are
Since the electronic components are mounted vertically on the substrate, they are all formed in the same direction as the vertical direction of the electronic components. That is, the board insertion portion 3c of the lead 3 at the center and the board insertion portions 2c and 4c of the leads 2 and 4 at both ends are parallel to each other.
【０００６】なお、基板挿入部２ｃ、３ｃ、４ｃの各先
端寸法や先端間隔寸法は、回路基板のリード孔にスムー
ズに挿入できるように、回路基板のリード孔寸法や、孔
位置寸法に対応させて形成されている。The tip dimensions and tip spacing of the board insertion portions 2c, 3c, 4c are made to correspond to the lead hole dimensions and hole position dimensions of the circuit board so that they can be smoothly inserted into the lead holes of the circuit board. Is formed.
【０００７】このような電子部品の回路基板への実装に
当たっては、まず電子部品のリードの基板挿入部２ｃ、
３ｃ、４ｃを回路基板のリード孔に挿入し、次に電子部
品をフローはんだ付け工程に送り、ここで回路基板の裏
面に出た外部リードを溶融はんだの表面に接触させては
んだを付着させ、配線パターンにはんだ付けして固定す
る方法がとられている。In mounting such an electronic component on the circuit board, first, the board insertion portion 2c of the lead of the electronic component,
3c and 4c are inserted into the lead holes of the circuit board, then the electronic parts are sent to the flow soldering process, where the external leads on the back surface of the circuit board are brought into contact with the surface of the molten solder to attach the solder, A method of soldering and fixing to a wiring pattern is adopted.
【０００８】[0008]
【発明が解決しようとする課題】以上のようにリード成
形された電子部品とその実装方法においては、リードを
回路基板のリード孔に挿入して、回路基板裏面のリード
を配線パターンにはんだ付けして固定するまでの間の工
程中で、振動などにより電子部品が、図４の側面図で示
したように、傾きを生じ、ときには転倒や脱落も発生す
るという問題があった。In the lead-molded electronic component and the mounting method thereof as described above, the lead is inserted into the lead hole of the circuit board, and the lead on the back surface of the circuit board is soldered to the wiring pattern. There is a problem in that, during the process up to fixing the electronic component, the electronic component is inclined due to vibration or the like as shown in the side view of FIG. 4, and sometimes falls or falls.
【０００９】回路基板に傾斜した状態ではんだ付け接着
されたものは、「挿入不良」による致命不良品として扱
われ大きなロスとなるので、電子部品メーカー側には実
装工程を持つセットメーカ側から、電子部品上での改善
策を強く要望されていた。A product which is soldered and adhered to a circuit board in a tilted state is treated as a fatal defective product due to "insertion defect", which causes a large loss. There has been a strong demand for improvement measures on electronic parts.
【００１０】この問題は、電子部品の断面角状リードの
基板挿入部２ｃ、３ｃ、４ｃの断面サイズが大きい箇所
でも０．８mm×０．４mmであるのに対し、回路基板５の
リード孔５ａ、５ｂの内径は１．０mmと、電子部品のリ
ードの基板挿入部２ｃ、３ｃ、４ｃの周りサイズが回路
基板５のリード孔５ａ、５ｂの内径に比べて小さいこと
が、挿入のしやすさに反して災いし、工程移動中に電子
部品がガタつくことからきている。This problem is 0.8 mm.times.0.4 mm even at a large cross-sectional size of the board insertion portions 2c, 3c, 4c of the rectangular lead of the electronic component, whereas the lead hole 5a of the circuit board 5 is used. The inner diameter of 5b is 1.0 mm, and the size around the board insertion portions 2c, 3c, 4c of the leads of the electronic component is smaller than the inner diameters of the lead holes 5a, 5b of the circuit board 5, which facilitates insertion. Contrary to this, disasters have occurred and electronic parts rattle during process movement.
【００１１】そこで、本発明は、リードを回路基板の孔
に挿入し、回路基板裏面のリードを配線パターンにはん
だ付け固定するまでの実装工程で、傾き、転倒、脱落な
どの異常を生ぜず、自立保持できる電子部品およびその
実装方法を提案することを目的とするものである。Therefore, according to the present invention, in the mounting process of inserting the leads into the holes of the circuit board and fixing the leads on the back surface of the circuit board to the wiring pattern by soldering, no abnormalities such as tilting, overturning or falling are caused. It is an object of the present invention to propose an electronic component that can be held independently and a mounting method thereof.
【００１２】[0012]
【課題を解決するための手段】これらの課題を解決する
ために本発明は、樹脂封止部と、樹脂封止部から導出し
た３本のリードとからなり、前記３本のリードが交互に
逆向きに振分けて折曲げ成形された電子部品において、
３本のリードのうち両端のリードの回路基板挿入部は電
子部品の縦方向と同じく、垂直方向に形成されており、
３本のリードのうち中央のリードの回路基板挿入部の成
形方向が、両端のリードの回路基板挿入部の成形方向に
対して、外側に若干傾斜させて成形されて成る電子部品
である。In order to solve these problems, the present invention comprises a resin encapsulation portion and three leads led out from the resin encapsulation portion, and the three leads are alternately arranged. In electronic parts that are bent and formed by sorting in the opposite direction,
Of the three leads, the circuit board insertion parts of the leads on both ends are electrically
Like the vertical direction of the child part, it is formed in the vertical direction,
This is an electronic component in which the molding direction of the circuit board insertion portion of the center lead of the three leads is slightly inclined outward with respect to the molding direction of the circuit board insertion portions of the leads at both ends.
【００１３】また、上述のような電子部品のリードの各
回路基板挿入部を回路基板のリード孔に挿入した時に、
中央のリードの回路基板挿入部と両端のリードの回路基
板挿入部との間に発生するバネ性により、回路基板のリ
ード孔間を挟持し、リードが回路基板裏面ではんだ付け
固定されるまで、両端のリードの回路基板挿入部を垂直
にして電子部品を回路基板に自立的に保持して実装する
電子部品の実装方法である。Further, when each circuit board insertion portion of the lead of the electronic component as described above is inserted into the lead hole of the circuit board,
By the spring property generated between the circuit board insertion part of the center lead and the circuit board insertion parts of both ends of the lead, the lead holes of the circuit board are sandwiched, and the leads are soldered and fixed on the back surface of the circuit board. Vertically insert the circuit board insertion part of the leads on both ends
In to a mounting method of the electronic component to be implemented autonomously hold the electronic component on a circuit board.
【００１４】[0014]
【発明の実施の形態】請求項１に記載の発明は、３本の
リードのうち中央のリードの回路基板挿入部の成形方向
が、両端のリードの回路基板挿入部の成形方向に対し
て、外側に若干傾斜させて成形されているため、電子部
品のリードの各回路基板挿入部を回路基板のリード孔に
挿入した時に、中央のリードの回路基板挿入部と両端の
リードの回路基板挿入部との間にバネ性を発生させるこ
とができるので、電子部品を回路基板に挟持することが
できて、少々の振動などを受けても電子部品が倒れずに
固定される。The invention according to claim 1 is such that the molding direction of the circuit board insertion portion of the center lead of the three leads is set to the molding direction of the circuit board insertion portion of the leads at both ends. Since it is molded with a slight inclination to the outside, when each circuit board insertion part of the lead of the electronic component is inserted into the lead hole of the circuit board, the circuit board insertion part of the center lead and the circuit board insertion part of both ends of the lead are inserted. Since a spring property can be generated between the electronic component and the electronic component, the electronic component can be sandwiched between the circuit boards, and the electronic component is fixed without falling even if it receives a slight vibration.
【００１５】請求項２に記載の発明は、以上のような構
成から成る電子部品のリードの各回路基板挿入部を、回
路基板のリード孔に挿入した時に、中央のリードの回路
基板挿入部と両端のリードの回路基板挿入部との間に発
生するバネ性により、回路基板のリード孔間を挟持した
状態ではんだ付けするため、これによって工程移動中に
振動を受けても、電子部品が傾いたり、転倒するなどの
事故を防止することができ、電子部品を回路基板に安定
にはんだ付け固定できるのである。According to a second aspect of the present invention, when each circuit board insertion portion of the lead of the electronic component having the above-described structure is inserted into the lead hole of the circuit board, the circuit board insertion portion of the central lead is formed. Due to the spring property generated between the leads on both ends and the circuit board insertion part, soldering is performed while the lead holes of the circuit board are sandwiched, so that the electronic components will tilt even if they are subject to vibration during process movement. It is possible to prevent accidents such as falling or falling, and it is possible to stably solder and fix the electronic components to the circuit board.
【００１６】（実施の形態１）以下本発明の実施の形態
について、図１ないし図２とともに詳しく説明する。(Embodiment 1) Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.
【００１７】図１は、本発明の電子部品の実施の形態を
示すもので、電力用トランジスタの斜視図であって、サ
イズは縦２５mm、横１０mm、厚さ５mm程度のものであ
る。FIG. 1 shows an embodiment of an electronic component of the present invention, which is a perspective view of a power transistor, and has a size of 25 mm in length, 10 mm in width, and 5 mm in thickness.
【００１８】図１において、１は樹脂封止部、２、３、
４はエミッタ、ベース、コレクタ用の３本の外部リード
であって、そのリードはそれぞれ第１折曲げ部２ａ、３
ａ、４ａと第２折曲げ部２ｂ、３ｄ、４ｂを経て、回路
基板のリード孔挿入に係わる回路基板挿入部２ｃ、３
ｅ、４ｃが形成されている。In FIG. 1, 1 is a resin sealing portion, 2, 3,
Reference numeral 4 denotes three external leads for the emitter, the base and the collector, and the leads are the first bent portions 2a and 3 respectively.
a, 4a and the second bent portions 2b, 3d, 4b, and circuit board insertion portions 2c, 3 for insertion of lead holes in the circuit board.
e, 4c are formed.
【００１９】ここで、３本のリード２、３、４のうち中
央のリード３の基板挿入部３ｅと、両端のリード線２、
４の基板挿入部２ｃ、４ｃとは、前後に振分けて折曲げ
成形されている。また、両端のリードの各基板挿入部２
ｃ、４ｃの成形方向は、電子部品を基板にまっすぐに取
り付ける為、電子部品の縦方向と同じく、垂直方向に形
成されている。一方、中央のリードの基板挿入部３ｅの
成形方向は、両端のリードの回路基板挿入部２ｃ、４ｃ
の成形方向に対して、外側に若干傾斜させて形成されて
いる。この傾斜の形成に当たっては、リードの基板挿入
部３ｅの先端の寸法は回路基板のリード孔位置寸法に合
わせる必要があり、第２折曲げ部３ｄの位置が従来の位
置より第１折曲げ部３ａの位置側に寄せることで実現で
きる。Here, the board insertion portion 3e of the center lead 3 among the three leads 2, 3 and 4, and the lead wires 2 at both ends,
The board insertion portions 2c and 4c of No. 4 are divided into front and rear parts and bent. In addition, each board insertion portion 2 of the leads at both ends
The molding directions of c and 4c are the same as the vertical direction of the electronic component because the electronic component is mounted straight on the substrate. On the other hand, the molding direction of the board insertion portion 3e of the central lead is that the circuit board insertion portions 2c and 4c of the leads at both ends are formed.
It is formed with a slight inclination to the outside with respect to the molding direction. In forming this inclination, the size of the tip of the board insertion portion 3e of the lead needs to be matched with the position size of the lead hole of the circuit board, and the position of the second bent portion 3d is larger than that of the conventional position. It can be realized by moving it to the position side of.
【００２０】この実施の形態では、第１折曲げ部３ａの
位置と第２折曲げ部３ｄの位置の間隔は、２．３mmであ
り、傾斜のない従来のものに比べて１．１mmほど第１折
曲げ部３ａの位置側に寄せて作られており、このためリ
ードの基板挿入部３ｅは外側に約１５度の傾斜になって
いる。In this embodiment, the distance between the position of the first bent portion 3a and the position of the second bent portion 3d is 2.3 mm, which is 1.1 mm larger than that of the conventional one without inclination. It is made close to the position of the one bent portion 3a, and therefore the lead substrate insertion portion 3e is inclined outward by about 15 degrees.
【００２１】図２は、リードの回路基板挿入部２ｃ、３
ｅ、４ｃを、回路基板５のリード孔５ａ、５ｂに挿入し
た時に、中央のリード３の回路基板挿入部３ｅと両端の
リード２、４の回路基板挿入部２ｃ、４ｃとの間に発生
するバネ性により、回路基板５のリード孔５ａ、５ｂ間
を挟持した状態を示す側面図である。FIG. 2 shows lead circuit board insertion portions 2c, 3
When e and 4c are inserted into the lead holes 5a and 5b of the circuit board 5, they are generated between the circuit board insertion portion 3e of the center lead 3 and the circuit board insertion portions 2c and 4c of the leads 2 and 4 at both ends. FIG. 6 is a side view showing a state in which the lead holes 5a and 5b of the circuit board 5 are sandwiched by the spring property.
【００２２】この挟持した状態を、リードが回路基板裏
面ではんだ付けされるまで、電子部品を回路基板５に保
持し続けることによって、組立工程中の移動の際に振動
を与えても、装着した電子部品が傾いたり、転倒、脱落
する等の不都合が無くなる。This sandwiched state is attached even if vibration is applied during movement during the assembly process by continuously holding the electronic components on the circuit board 5 until the leads are soldered on the back surface of the circuit board. Inconveniences such as tilting, falling, and falling of electronic components are eliminated.
【００２３】なお、リードの材質としては、鉄、鉄ニッ
ケル合金、銅、銅合金等の金属を使用する。As the material of the lead, a metal such as iron, iron-nickel alloy, copper or copper alloy is used.
【００２４】本実施の形態では、３本のリードのうち中
央のリードの回路基板挿入部の成形方向が、両端のリー
ドの回路基板挿入部の成形方向に対して、外側に若干傾
斜させて成形されて成る電子部品の例を示したが、３本
のリードのうち両側のリードの回路基板挿入部の成形方
向が、中央のリードの回路基板挿入部の成形方向に対し
て、外側に若干傾斜させて成形されて成る電子部品の場
合でもよい。In this embodiment, the molding direction of the circuit board insertion portion of the center lead of the three leads is slightly inclined outward with respect to the molding direction of the circuit board insertion portions of the leads at both ends. Although the example of the electronic component is shown, the molding direction of the circuit board insertion part of the leads on both sides of the three leads is slightly inclined outward with respect to the molding direction of the circuit board insertion part of the central lead. It may be an electronic component formed by molding.
【００２５】すなわち、前後に振り分け成形された複数
の外部リード線のうち、いずれか片側少なくとも１本の
リードが傾斜成形されてあれば、すべて本発明の効果を
得ることができる。That is, the effect of the present invention can be obtained if at least one lead is slant-molded on one side of the plurality of external lead wires distributed front and back.
【００２６】[0026]
【発明の効果】以上のように本発明は、３本のリードの
うち中央のリードの回路基板挿入部の成形方向が、両端
のリードの回路基板挿入部の成形方向に対して、外側に
若干傾斜させて成形されて成る電子部品であるから、電
子部品のリードの各回路基板挿入部を回路基板のリード
孔に挿入した時に、中央のリードの回路基板挿入部と両
端のリードの回路基板挿入部との間にバネ性を発生させ
ることができ、また、発生するバネ性により、回路基板
のリード孔間を挟持し、リードが回路基板裏面ではんだ
付けされるまで、電子部品を回路基板に自立的に保持し
て、電子部品を回路基板に実装する方法であるから、セ
ットメーカ等の実装工程で移動中に振動を受けても、電
子部品に傾き、転倒、脱落などの異常を発生させること
がなく、電子部品の自立安定性が確保され、多量生産上
極めて有利な効果が得られるものである。As described above, according to the present invention, the molding direction of the circuit board insertion portion of the central lead of the three leads is slightly outward with respect to the molding direction of the circuit board insertion portions of the leads at both ends. Since the electronic component is formed by inclining, when each circuit board insertion part of the lead of the electronic component is inserted into the lead hole of the circuit board, the circuit board insertion part of the center lead and the circuit board insertion of the leads at both ends are inserted. It is possible to generate a spring property between the electronic component and the circuit board until the lead holes of the circuit board are sandwiched by the generated spring property and the leads are soldered on the back surface of the circuit board. Since it is a method of mounting the electronic components on the circuit board by holding them independently, even if vibration is received during movement in the mounting process of a set maker, etc., the electronic components will be tilted, fallen, or come off Without electronic components Self stability is ensured, in which very favorable effect on mass production can be obtained.
【図１】本発明の一実施の形態による電子部品の斜視図FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention.
【図２】本発明の一実施の形態による電子部品の回路基
板保持方法を示す側面図FIG. 2 is a side view showing a method for holding a circuit board of an electronic component according to an embodiment of the present invention.
【図３】従来の形態による電子部品の斜視図FIG. 3 is a perspective view of an electronic component according to a conventional form.
【図４】従来の電子部品の回路基板保持での傾斜不良状
態を示す側面図FIG. 4 is a side view showing a state where the conventional electronic component is not properly tilted when holding a circuit board.
１ 樹脂封止部 ２ 一方のリード ２ｃ 一方のリードの回路基板挿入部 ３ 中央のリード ３ｅ 中央のリードの回路基板挿入部 ４ 他方のリード ４ｃ 他方のリードの回路基板挿入部 ５ 回路基板 1 Resin sealing part 2 One lead 2c Circuit board insertion part of one lead 3 Center lead 3e Circuit board insertion part of center lead 4 other lead 4c Circuit board insertion part of the other lead 5 circuit board
Claims (2)
た３本のリードとからなり、前記３本のリードが交互に
逆向きに振分けて折曲げ成形された電子部品において、
前記３本のリードのうち両端のリードの回路基板挿入部
は前記電子部品の縦方向と同じ方向であり、前記３本の
リードのうち中央のリードの回路基板挿入部の成形方向
が、前記両端のリードの回路基板挿入部の成形方向に対
して、外側に若干傾斜させて成形されて成ることを特徴
とする電子部品。1. An electronic component comprising a resin encapsulation part and three leads led out from the resin encapsulation part, wherein the three leads are alternately distributed in opposite directions and bend-formed.
Circuit board insertion part of leads at both ends of the three leads
Is the same direction as the longitudinal direction of the electronic component, shaping the direction of the circuit board insertion portion of the central lead of the three leads, with respect to the molding direction of the circuit board insertion portion of the ends of the leads, the outer An electronic component characterized by being formed with a slight inclination to.
路基板挿入部を、回路基板のリード孔に挿入した時に、
中央のリードの回路基板挿入部と両端のリードの回路基
板挿入部との間に発生するバネ性により、回路基板のリ
ード孔間を挟持し、リードが回路基板裏面ではんだ付け
固定されるまで、電子部品を回路基板に自立的に保持し
て、電子部品を回路基板に対して垂直になるよう実装す
ることを特徴とする電子部品の実装方法。2. When each circuit board insertion portion of the lead of the electronic component according to claim 1 is inserted into a lead hole of the circuit board,
By the spring property generated between the circuit board insertion part of the center lead and the circuit board insertion parts of both ends of the lead, the lead holes of the circuit board are sandwiched, and the leads are soldered and fixed on the back surface of the circuit board. and autonomously hold the electronic component on a circuit board, mounting method of the electronic component, characterized by mounting so as to be vertically against the electronic components on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3449198A JP3525724B2 (en) | 1998-02-17 | 1998-02-17 | Electronic component and its mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3449198A JP3525724B2 (en) | 1998-02-17 | 1998-02-17 | Electronic component and its mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11233701A JPH11233701A (en) | 1999-08-27 |
| JP3525724B2 true JP3525724B2 (en) | 2004-05-10 |
Family
ID=12415725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3449198A Expired - Fee Related JP3525724B2 (en) | 1998-02-17 | 1998-02-17 | Electronic component and its mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3525724B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015012053A (en) * | 2013-06-27 | 2015-01-19 | アズビル株式会社 | Assembling and manufacturing method of electronic component |
-
1998
- 1998-02-17 JP JP3449198A patent/JP3525724B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11233701A (en) | 1999-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20030114029A1 (en) | Contact for ball grid array connector | |
| US5728601A (en) | Process for manufacturing a single in-line package for surface mounting | |
| JP3525724B2 (en) | Electronic component and its mounting method | |
| JP3751472B2 (en) | Double-sided pattern sheet metal parts and printed wiring board | |
| JP3130784B2 (en) | Terminal structure of electronic components | |
| CN1038807C (en) | Printing wiring board | |
| JP5811884B2 (en) | PCB terminal fittings | |
| JP3933852B2 (en) | Shield device | |
| JP4007851B2 (en) | Electronic circuit unit | |
| JP2003187890A (en) | Electrical connection terminal | |
| GB2342509A (en) | Surface mount reed switch having transverse feet formed from leads | |
| JP2655118B2 (en) | Semiconductor device | |
| JP3941593B2 (en) | Bracket mounting structure for printed wiring boards | |
| JPH07307545A (en) | Surface-mount electronic component mounting board and clip lead frame | |
| JP2004349413A (en) | Surface mounting clamp | |
| US6224398B1 (en) | IC card connector and IC card connector mounting structure | |
| WO2009090717A1 (en) | Circuit board and method for mounting electronic component on printed board | |
| JP2570581B2 (en) | Vertical surface mount semiconductor package | |
| JPH0563133A (en) | Resin sealing type semiconductor device | |
| JP2570602B2 (en) | Surface mount type semiconductor device | |
| JPH01201946A (en) | Semiconductor device | |
| JPH02285602A (en) | Electronic part | |
| JPS63291494A (en) | Surface mounting printed wiring board | |
| JPH01319274A (en) | Terminal for electronic parts | |
| JP2004227907A (en) | Connector for integrated circuit and assembly of connector and circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20031211 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040127 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040209 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080227 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 5 Free format text: PAYMENT UNTIL: 20090227 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20100227 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100227 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110227 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20120227 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20130227 |
|
| LAPS | Cancellation because of no payment of annual fees |