JP3522927B2 - Adhesive film for flat type wire harness processing and holding - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat type wire harness processing and holding adhesive film used for processing, holding and transporting when manufacturing a flat type wire harness used for wiring automobiles, game machines and the like.

[0002]

2. Description of the Related Art For example, wire harnesses in which covered conductors are bound are mainly used for electric wiring of automobiles, game machines and the like.

However, since the wiring work of the wire harness is complicated, it is difficult to automate it. In addition, as automobiles, game machines and the like are becoming more electronic and functional, wire harnesses are being incorporated in large quantities. Therefore, a lot of manpower is required for manufacturing and assembling the wire harness, which is a major obstacle to cost reduction.

In order to solve this problem, in recent years, a flat type wire harness in which a thin plate-shaped conductor is sandwiched by an insulator and punched by a press to finish a harness of a required shape is disclosed in Japanese Patent Laid-Open No. Hei.
-144336, JP-A-5-28922, JP-A-6-76659, and JP-A-6-34993.
No. 43, Japanese Patent Application Laid-Open No. 7-21853, etc.

There has been proposed an adhesive film which is used for assembling materials, carrying, holding during punching, positioning, etc. when manufacturing this flat type wire harness and which can be easily peeled off after use.

[0006]

However, the conventional pressure-sensitive adhesive film does not satisfy the following required characteristics.

That is, in order to properly convey the material in the assembly process of the flat type wire harness, it is necessary to sufficiently adhere to the rolled copper which is the conductor. Furthermore, the film itself must not be punched because the product is conveyed even after the punching process is completed. Moreover, it must be able to be easily peeled from the product after use.

An object of the present invention is to provide an adhesive film which satisfies the above conditions and enables continuous production of a flat type wire harness.

[0009]

In order to achieve the above object, the present invention provides an acrylic adhesive containing 1 to 25% by weight of acrylonitrile as an adhesive and having an elastic modulus of 100.
The present invention relates to an adhesive film obtained by applying a resin film of up to 500 kgf / mm ² .

According to the present invention, rolled copper, which is a conductor for a flat type wire harness, is appropriately held and conveyed during the assembling process, and is stably held so that the workpiece can be completely punched during punching. As a result, the flat wire harness can be automatically assembled.

The pressure-sensitive adhesive film of the present invention is one in which a specific pressure-sensitive adhesive is applied to one surface of a specific substrate film and dried to form a pressure-sensitive adhesive layer.

The base film used for the pressure-sensitive adhesive film of the present invention may be a single layer or a multilayer, but the elastic modulus of the film itself is 100 to 500 kgf / mm ² .

Examples of these materials include polyethylene terephthalate film, polybutylene terephthalate film, polypropylene film, stretched polypropylene film, hard vinyl chloride film, polybutadiene film and the like, but preferably polyethylene terephthalate film, polybutylene terephthalate film, polypropylene. Films and stretched polypropylene films are used. If the elastic modulus is less than 100 kgf / mm ² , the punched material escapes during punching, resulting in incomplete punching. Further, if the elastic modulus exceeds 500 kgf / mm ² , the life of the punching die will be significantly shortened.

The elastic modulus of the base film in the present invention is a value measured according to the method specified in ASTM D-790.

The thickness of the base film is appropriately determined depending on the material, shape and processing method of the flat type wire harness, but in order to allow a punching error during punching, a thickness of 75 to 300 μm is preferably used. .

Further, in order to improve the anchoring property between the base film and the pressure-sensitive adhesive, the surface to which the pressure-sensitive adhesive is applied can be subjected to a surface treatment such as corona discharge treatment or plasma treatment, if necessary.

The pressure-sensitive adhesive used in the pressure-sensitive adhesive layer of the present invention is
The main chain is a copolymer of acrylonitrile and butyl acrylate and / or ethyl acrylate and / or 2-ethylhexyl acrylate and / or methyl methacrylate, and hydroxymethyl methacrylate and / or hydroxyethyl acrylate and / or acrylamide and / or functional group components. Alternatively, an acrylic pressure-sensitive adhesive obtained by copolymerizing acrylic acid and / or methacrylic acid, which is an acrylic pressure-sensitive adhesive containing 1 to 25% by weight of acrylonitrile and has a dynamic viscoelasticity G ′ of 150,000 to 1260000 is used. preferable.

The pressure-sensitive adhesive is synthesized from the polymerization step, or a commercially available product is purchased. The dynamic viscoelasticity G ′ is controlled by adjusting the molecular weight distribution of the pressure-sensitive adhesive according to the type of functional group component, the copolymerization ratio, and the addition amount of the crosslinking agent.

Adhesives other than acrylic adhesives cannot obtain an appropriate adhesive force to rolled copper which is a conductor forming a flat type wire harness. Even with an acrylic pressure-sensitive adhesive, if the amount of acrylonitrile is less than 1% by weight, a sufficient adhesive force to a metal cannot be obtained and the conductor cannot be properly conveyed. If the amount of acrylonitrile exceeds 25% by weight, the tackiness at room temperature becomes insufficient and no substantial function can be obtained. Further, when the dynamic viscoelasticity G'is less than 150,000, the adhesive is transferred at the time of peeling after use and the dynamic viscoelasticity G '
When it exceeds 1260000, tackiness becomes insufficient,
Substantial function cannot be obtained.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the adhesive film according to the present invention will be specifically described based on << Example 1 >> to << Example 5 >>, but the present invention is not limited thereto. Absent.

Example 1 A polyethylene terephthalate film (elastic modulus: 310 kgf / mm ² ) having a thickness of 188 μm and subjected to corona discharge treatment was used as a support, and an acrylic pressure-sensitive adhesive (acrylonitrile content 16% by weight, WS manufactured by Teikoku Kagaku) was used. -023) An adhesive (G ′ = 780,000) containing 1 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane Co., Ltd.) was applied to 100 parts so that the thickness would be 10 μm. The pressure-sensitive adhesive film was adhered to a rolled copper foil, which is a typical conductor, at a pressure of 6 kgf / cm ^{2 at} a speed of 2 m / min, and peeled at 180 ° C. and peeled at a peeling speed of 200 mm / min. The punching-holding property of this pressure-sensitive adhesive film was measured using a rolled copper foil at a pressure of 6 kgf / cm ² and a speed of
It was evaluated in the punched state of the rolled copper foil when it was stuck at m / min and punched, and the transportability after punching was evaluated by the presence or absence of peeling of the rolled copper foil during punching.

Example 2 A polyethylene terephthalate film (elastic modulus: 310 kgf / mm ² ) having a thickness of 75 μm and subjected to corona discharge treatment was used as a support, and an acrylic adhesive (acrylonitrile content 5% by weight, manufactured by Teikoku Kagaku EXP) was used. -79-11) Adhesive (G '= 530,000) in which 1 part of isocyanate cross-linking agent (Coronate L made by Nippon Polyurethane) was mixed with 100 parts of thickness was 10 μm.
Was applied so that This adhesive film was evaluated in the same manner as in Example 1.

Example 3 Using a polybutylene terephthalate film (elastic modulus: 355 kgf / mm ² ) having a thickness of 75 μm and subjected to corona discharge treatment as a support, an acrylic adhesive (acrylonitrile content 16% by weight, manufactured by Teikoku Kagaku) To 100 parts of WS-023), an adhesive (G '= 780,000) containing 1 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane Co., Ltd.) was applied so as to have a thickness of 10 μm. About this adhesive film Example 1
Similar evaluation was performed.

Example 4 A corona discharge-treated polyethylene terephthalate film (elastic modulus: 355 kgf / mm ² ) having a thickness of 188 μm was used as a support, and an acrylic pressure-sensitive adhesive (acrylonitrile content 20 wt%, HTR manufactured by Teikoku Kagaku) was used. -708) Adhesive (G '= 940,000) in which 1 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane) was mixed with 100 parts of thickness was 10 μm.
Was applied so that This adhesive film was evaluated in the same manner as in Example 1.

Example 5 A polypropylene film having a thickness of 150 μm and subjected to corona discharge treatment (elastic modulus: 155)
kgf / mm ² ) as a support, acrylic adhesive (acrylonitrile content 16% by weight, Teikoku Kagaku WS-
023) An adhesive (G ′ = 780,000) containing 1 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane Co., Ltd.) was applied to 100 parts of the mixture so as to have a thickness of 10 μm. This adhesive film was evaluated in the same manner as in Example 1.

[0026]

[Table 1]

Comparative Example 1 A 190 μm thick low density polyethylene film (elastic modulus: 7) which has been subjected to corona discharge treatment.
0 kgf / mm ² ) as a support, acrylic adhesive (acrylonitrile content 16% by weight, Teikoku Kagaku WS)
-023) An adhesive (G ′ = 780,000) containing 1 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane Co., Ltd.) was applied to 100 parts so that the thickness would be 10 μm. This adhesive film was evaluated in the same manner as in Example 1.

Comparative Example 2 A polyethylene terephthalate film (elastic modulus: 310 kgf / mm ² ) having a thickness of 188 μm and subjected to corona discharge treatment was used as a support, and an acrylic pressure-sensitive adhesive (acrylonitrile content 0 wt%, HTR manufactured by Teikoku Kagaku) was used. -811) 90 parts and acrylic adhesive (acrylonitrile content 6.5% by weight, Teikoku Chemical's HTR-60
0LB) 10 parts of the adhesive (acrylonitrile content 0.65% by weight) mixed with 1 part of the isocyanate cross-linking agent (Nippon Polyurethane Coronate L) (G '= 360,000) It was applied so as to have a thickness of 10 μm. This adhesive film was evaluated in the same manner as in Example 1.

Comparative Example 3 A polyethylene terephthalate film (elastic modulus: 120 kgf / mm ² ) having a thickness of 188 μm and subjected to corona discharge treatment was used as a support, and an acrylic pressure-sensitive adhesive (acrylonitrile content 30 wt%, HTR manufactured by Teikoku Kagaku) was used. -860) Adhesive (G '= 1,160,000) in which 1 part of an isocyanate cross-linking agent (Coronate L made by Nippon Polyurethane) was mixed with 100 parts of thickness of 10
It was applied to have a thickness of μm. This adhesive film was evaluated in the same manner as in Example 1.

Comparative Example 4 A polyethylene terephthalate film (elastic modulus: 310 kgf / mm ² ) having a thickness of 50 μm and subjected to corona discharge treatment was used as a support, and an acrylic adhesive (acrylonitrile content 16% by weight, manufactured by Teikoku Kagaku WS) was used. -023) An adhesive (G ′ = 780,000) containing 1 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane Co., Ltd.) was applied to 100 parts so that the thickness would be 10 μm. About this adhesive film Example 1
Similar evaluation was performed.

Comparative Example 5 A polyethylene terephthalate film (elastic modulus: 310 kgf / mm ² ) having a thickness of 50 μm and subjected to corona discharge treatment was used as a support, and an acrylic adhesive (acrylonitrile content 16% by weight, manufactured by Teikoku Kagaku WS) was used. -023) An adhesive (G '= 120,000) in which 0.3 part of an isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane) was mixed with 100 parts of the thickness of 10 μm.
Was applied so that This adhesive film was evaluated in the same manner as in Example 1.

Comparative Example 6 A polyethylene terephthalate film (elastic modulus: 310 kgf / mm ² ) having a thickness of 50 μm and subjected to a corona discharge treatment was used as a support, and an acrylic pressure-sensitive adhesive (acrylonitrile content 16% by weight, manufactured by Teikoku Kagaku WS) was used. -023) Adhesive (G ′ = 1,360,000) having 100 parts of isocyanate cross-linking agent (Coronate L manufactured by Nippon Polyurethane Co.) mixed therein at a thickness of 10
It was applied to have a thickness of μm. This adhesive film was evaluated in the same manner as in Example 1.

[0033]

[Table 2]

[0034]

As described above, the pressure-sensitive adhesive film according to the present invention is obtained by applying an acrylic resin-based pressure-sensitive adhesive containing 1 to 25% by weight of acrylonitrile on one side of a resin film having an elastic modulus of 100 to 500 kgf / mm ^2. Therefore, it has sufficient adhesiveness to a flat type wire harness and is suitable for holding and transporting materials during assembly and punching of the flat type wire harness, and easily peels from the product after use. As a result, the automatic assembly of the flat wire harness can be efficiently performed, and the productivity can be significantly improved.

Claims (4)

(57) [Claims] 1. An elastic modulus of 100 to 500 kgf / mm ²
1 to 2 of acrylonitol on one side of the resin film
A flat type wire harness processing and holding adhesive film, characterized by being coated with an acrylic resin-based adhesive containing 5% by weight. 2. The flat type wire harness processing / holding adhesive film according to claim 1, wherein the resin film is a polyethylene terephthalate film having a thickness of 75 to 300 μm. 3. The flat-type wire harness processing / holding adhesive film according to claim 1, wherein the resin film is a polypropylene film having a thickness of 75 to 300 μm. 4. The flat-type wire harness processing and holding pressure-sensitive adhesive film according to claim 1, wherein the acrylic resin pressure-sensitive adhesive has a dynamic viscoelasticity G ′ at 20 ° C. of 150,000 to 1260,000.