JP3519972B2 - Semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to the structure of a master slice type basic cell.

[0002]

2. Description of the Related Art Conventionally, in order to quickly respond to a request from a customer, a master slice method in which an LSI design to a diffusion process are uniformly processed and only subsequent circuit wiring is performed for each product type Is well known. This master slice method has advantages such as shortening the development period and reducing the development cost, which are suitable for the production of a large amount of small quantities.

This master slice type semiconductor integrated circuit device is realized by connecting a plurality of basic cells arranged in a matrix or in one direction in accordance with the specifications of the finished product.

For example, as shown in FIG. 4, the structure of a general basic cell 100 mounted on a master slice type semiconductor integrated circuit device as disclosed in Japanese Patent Laid-Open No. 5-63046 is a P-type MOS transistor. Gate electrode 1
01 and 102, a P-type impurity diffusion region 103 serving as a drain terminal or a source terminal of a P-type MOS transistor, gate electrodes 104 and 105 of an N-type MOS transistor, and an N-type impurity diffusion serving as a drain terminal or a source terminal of an N-type MOS transistor. Region 106 and two power supply wirings 10
It is composed of 7, 108.

[0005]

In the conventional example, a P-type MOS transistor and an N-type MOS are provided on the basic cell 100.
Since only the transistors are present, the degree of freedom in connecting the transistors in the basic cells or between the basic cells is limited, and as a result, (1) the area of the frequently used flip-flop circuit or selector is increased. (2) There is a problem that the wiring efficiency of the entire circuit is reduced.

The present invention relates to a semiconductor device and is intended to solve such a problem.

[0007]

According to another aspect of the present invention, there is provided a semiconductor device in which at least one transistor and at least one wiring line are provided on a cell substrate, and contact portions are formed at both ends of the wiring line. The length L of the portion of the wiring line excluding the contact portion is equal to that of other wirings.
The gist of the book is that it is set to the minimum value that allows only books to intersect.

Further, in the semiconductor device of the second invention, a plurality of transistors and at least one wiring line are provided on the cell substrate, contact portions are formed at both ends of the wiring line, and the wiring line intersects with the wiring line. Each space between other wiring and both contact portions of the wiring line,
The gist is that it is set to the minimum value that can be processed.

Further, in the semiconductor device of the third invention, a plurality of cell substrates having at least one transistor and at least one wiring line are arranged, and transistors between the cell substrates or within the same cell substrate are selectively selected. A predetermined circuit is formed by connecting the wiring lines, and contact portions are formed at both ends of the wiring line, and another wiring line intersects with the wiring line and each of the wiring line contact portions. The gist is that the space is set to the minimum value that can be processed.

That is, by using the wiring line at the time of connection, it is not necessary to separately connect using a metal wiring, and the degree of freedom is increased in the wiring region.

Further, the wiring line is often formed of polysilicon or polycide like the gate line of the transistor on the cell substrate, and has a higher wiring resistance than metal wiring, so that the length thereof is made as short as possible. Is desirable. Therefore, in the first aspect of the invention, the length L of the portion of the wiring line excluding the contact portion is set to the minimum value that allows only one other wiring to cross the portion, In the third invention, the space between each of the other wirings intersecting with the wiring line and both contact portions of the wiring line is set to the minimum value that can be processed. As a result, the wiring line length is minimized by substantially limiting the number of other wiring lines that can be crossed to one while ensuring the degree of freedom of connection to cross other wiring lines on the wiring line. The increase in wiring resistance is prevented only in the above.

In this case, the minimum value that can be processed is
It is desirable to be the limit value of the lithography and etching process.

Further, it is desirable that each space is equal in width to the other wiring.

Further, it is preferable that the cell substrate has a first transistor and a second transistor, and the wiring line is located in a space between the first and second transistors. By doing so, the area on the cell substrate is effectively used.

It is desirable that the sizes and directions of the first and second transistors be different.

By thus making the sizes and directions of the plurality of transistors different, it is possible to freely select a transistor having a size according to the size of the circuit and to increase the degree of freedom in the wiring direction.

[0017]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows the structure of a basic cell 1 in the embodiment. This basic cell 1 occupies a rectangular cell substrate 2, a first device region 3 which occupies an area of about an upper third of the cell substrate 2, and an area of a lower left quarter of the cell substrate 2. A second device region 4 and a third device region 5 occupying about one-third lower right area of the cell substrate 2,
The wiring line 6 is provided in the space between the first device region 3 and the third device region 5. The wiring line 6 is made of, for example, tungsten polycide.

A first P-type transistor group 7 and a first N-type transistor group 8 are provided in the first device region 3.

The first P-type transistor group 7 is composed of first and second polysilicon members which extend in parallel to each other in the left-right direction in the drawing.
The gate electrodes 9 and 10 and the first, second and third P-type source / drain regions 11, 12 and 13 are provided. First, second and third P-type source / drain regions 11, 12, 13
Are vertically separated from each other by the left side region portions of the first and second gate electrodes 9 and 10.

The first N-type transistor group 8 includes the first
And the second gate electrodes 9 and 10, and the first, second and third N electrodes.
Type source / drain regions 14, 15 and 16.
First, second and third N-type source / drain regions 14, 1
Reference numerals 5 and 16 are vertically separated from each other by the right side region portions of the first and second gate electrodes 9 and 10.

That is, 2 of the first P-type transistor group 7
2 of the P-type transistors and the first N-type transistor group 8
The individual N-type transistors share the first gate electrode 9 or the second gate electrode 10 in a one-to-one relationship.

Further, in order to effectively use the void portion of the first device region 3, the contact portion can be formed by expanding appropriate portions of the central portion and the end portions of the first and second gate electrodes 9 and 10. The wide portions 17, 18 and 19 are formed.

A second P-type transistor group 20 and a second N-type transistor group 21 are provided in the second device region 4.

The second P-type transistor group 20 is made of polysilicon and extends in the vertical direction in the figure in parallel with each other.
And fifth gate electrodes 22, 23, 24, and fourth, fifth,
Sixth and seventh P-type source / drain regions 25, 26, 2
7, 28 and. The fourth, fifth, sixth, and seventh P-type source / drain regions 25, 26, 27, 28 have third to
The fifth gate electrodes 22 to 24 are separated from each other in the left-right direction by the upper region portions.

The second N-type transistor group 21 includes the third to fifth gate electrodes 22 to 24, and the fourth, fifth, sixth and seventh N-type source / drain regions 29, 30, 31, 3.
2 and. 4th, 5th, 6th and 7th N type sources
The drain regions 29, 30, 31, 32 are laterally separated from each other by the lower region portions of the third to fifth gate electrodes 22 to 24.

That is, the three P-type transistors of the second P-type transistor group 20 and the second N-type transistor group 21.
The three N-type transistors share the third gate electrode 22, the fourth gate electrode 23, or the fifth gate electrode 24 in a one-to-one relationship.

Further, in order to effectively use the void portion of the second device region 4, the contact portion can be formed by expanding appropriate portions of the central portion and the end portions of the third to fifth gate electrodes 22 to 24. Wide portions 33 to 38 are formed.

The third device region 5 is provided with sixth, seventh and eighth gate electrodes 39, 40 and 41 made of polysilicon. The sixth gate electrode 39 has 45 degrees or 90 degrees at a plurality of locations.
It extends while bending in the direction of degree. Seventh gate electrode 40
Are also provided so as to extend at a plurality of positions while being bent in a direction of 45 degrees or 90 degrees and form a bottleneck with the sixth gate electrode 39. The eighth gate electrode 41 extends vertically from the end of the seventh gate electrode 40 along the right end of the cell substrate 2.

The sixth and seventh gate electrodes 39, 40 have regions (tilt regions) 39c inclined in the direction of 45 degrees with respect to the vertical axis on the way from the one ends 39a, 40a to the other ends 39b, 40b. , 40c, and this inclined region 39
By providing c and 40c, the sixth and seventh gate electrodes 3
Each one end 39a, 40a of 9, 40 and each other end 3
9b and 40b are arranged so as to be located on a straight line in the vertical direction (on the vertical axis).

Further, the third device area 5 includes the eighth and ninth areas.
And 10th P-type source / drain regions 42, 43, 44
And the eighth, ninth and tenth N-type source / drain regions 4
5, 46, 47, eleventh and twelfth P-type source / drain regions 48, 49, and eleventh and twelfth N-type source / drain regions.
And drain regions 50 and 51.

The eighth, ninth and tenth P-type source / drain regions 42, 43 and 44 are arranged in the left-right direction in the figure by the other end 39b of the sixth gate electrode 39 and the one end 40a of the seventh gate electrode 40. Is separated into.

The eighth, ninth and tenth N-type source / drain regions 45, 46 and 47 are arranged in the left-right direction of the figure by one end 39a of the sixth gate electrode 39 and the other end 40b of the seventh gate electrode 40. Is separated into.

The eleventh and twelfth P-type source / drain regions 48, 49 are separated by one end 41a of the eighth gate electrode 41. 11th and 12th N-type sources
The drain regions 50 and 51 are separated by the other end portion 41b of the eighth gate electrode 41.

The other end 39 of the sixth gate electrode 39
b, one end 40a of the seventh gate electrode 40, and the eighth, ninth and tenth P-type source / drain regions 42, 43, 4
4, the one end portion 41a of the eighth gate electrode 41, and the eleventh and twelfth P-type source / drain regions 48 and 49 form a third P-type transistor group 52.

Further, one end portion 39a of the sixth gate electrode 39
And the other end 40b of the seventh gate electrode 40, and the eighth and ninth
And tenth N-type source / drain regions 45, 46, 47
And the other end 41b of the eighth gate electrode 41 and the eleventh and twelfth N-type source / drain regions 50 and 51 form a third N-type transistor group 53.

Further, in order to effectively use the void portion of the third device region 5, the contact portion can be formed by expanding appropriate portions of the central portion and the end portions of the sixth to eighth gate electrodes 39 to 41. Wide portions 54, 55, 56 are formed.

In the basic cell 1 of this embodiment, the fourth to seventh P-type source / drain regions 25 to
Width W2 of 28 (that is, the gate width of the second P-type transistor group 20) and width W2 of the eighth to twelfth P-type source / drain regions 42 to 44, 48, 49 (that is, the gate width of the third P-type transistor group 52). Is equal to.

The width W1 of the first to third P-type source / drain regions 11 to 13 (that is, the gate width of the first P-type transistor group 7), the fourth to seventh P-type source / drain regions 25 to 28, and the fourth P-type source / drain regions 25 to 28. Ratio of the width of the 8th to 12th P-type source / drain regions 42 to 44, 48, 49 to the width W2 (W1: W
2) is set to be 7: 4.

The width W4 of the fourth to seventh N-type source / drain regions 29 to 32 (that is, the gate width of the second N-type transistor group 21) and the eighth to twelfth N-type source / drain regions 45 to 47, 50. , 51 is equal to the width W4 (that is, the gate width of the third N-type transistor group 53).

The width W3 of the first to third N-type source / drain regions 14 to 16 (that is, the gate width of the first N-type transistor group 8), the fourth to seventh N-type source / drain regions 29 to 32, and the fourth N-type source / drain regions 29 to 32. Ratio of the width of the 8th to 12th N-type source / drain regions 45 to 47, 50, 51 to the width W4 (W3:
W4) is set to be 3: 2.

Further, in the basic cell 1 of this embodiment, the ratio of the gate width W1 of the first P-type transistor group 7 to the gate width W3 of the first N-type transistor group 8 is
The gate width W2 of the second P-type transistor group 20 (third P-type transistor group 52) and the gate width W4 of the second N-type transistor group 21 (third N-type transistor group 53) are set to be 4: 3. Is set to be 5: 4.

That is, in this embodiment, the first P-type transistor group 7 on the cell substrate 1 and the second and third P-type transistor groups 7 are formed.
The type transistor groups 20 and 52 are made different in size, and the first N-type transistor group 8 and the second and third N-type transistor groups 21 and 53 are made different in size.

The wiring line 6 is provided so as to extend in the left-right direction (horizontal direction) at this position by utilizing the space 57 between the first device region 3 and the third device region 5. Wide portions 6a, 6a capable of forming contact portions are formed at both ends of the wiring line 6 by effectively utilizing the void portion 57. The wide portions 6a, 6a correspond to the contact portion in the present invention.

In the configuration described above, the basic cell 1
Are arranged in a matrix on the semiconductor substrate. At this time, the basic cells 1 adjacent to each other are arranged in a mirror.

FIG. 2 uses the basic cell 1 shown in FIG.
Delayed Flip Flop (D)
(FF circuit) is a substantial circuit diagram, the metal wiring portion is shown by a thick solid line for the sake of clarity in order to make the drawing easy to understand. However, in reality, as shown by the metal wiring 75 in FIG. It has a width (0.56 μm in this embodiment). FIG. 3 is a logic circuit diagram of the DFF circuit of FIG.

In FIG. 3, the DFF circuit 58 comprises two stages of latch circuits 59 and 60 and a clock signal inverting circuit 61. The latch circuit 59 includes an inverter 62 and a NAN.
It comprises a D circuit 63 and a transfer gate 64. The latch circuit 60 includes an inverter 65, a NAND circuit 66, and a transfer gate 67. The latch circuit 60 at the final stage outputs the signal Q and its inverted signal QN.

The transfer gates 68 and 69 open and close between the input terminal D and the latch circuit 59 and between the latch circuit 59 and the latch circuit 60, respectively. The transfer gates 64, 67, 68, 69 are opened / closed by the clock signal CK and the output CKN of the clock signal inverting circuit 61. The clock signal inverting circuit 61 is composed of an inverter 70 and outputs an inverted signal CKN of the clock signal CK.

In FIG. 2, the basic cell 1 is arranged in a mirror on the left and right, and the wiring connecting each transistor is formed in the first layer of the metal wiring layer. The mark ■ in the figure indicates the contact portion.

When the DFF circuit 58 is constructed, a large size transistor of the first device region 3 is selected for the inverter 62 and the NAND circuit 66 which require a large driving capacity, and the driving capacity which is smaller than those circuits is sufficient.
Small-sized transistors in the second device region 4 and the third device region 5 are selected for the AND circuit 63, the inverter 65, the transfer gates 64, 67 to 69, and the clock circuit 61, and the transistors are connected to each other.

A GND wiring 72 (hereinafter referred to as a horizontal wiring 72) is formed at the lower end of the cell substrate 2 so as to extend in the left-right direction in the drawing.
Is provided, and VDD wiring 73 (hereinafter referred to as vertical wiring 7) is provided at a side end portion of the cell substrate 2 so as to extend in the vertical direction in the drawing.
3) is provided. The horizontal wiring 72 is provided in the first layer of the metal wiring layer, and the vertical wiring 73 is provided in the second layer of the metal wiring layer. Further, a vertical wiring 74 is provided as a second layer of the metal wiring layer on the side end portion of the right basic cell 1 so as to extend in the vertical direction in the figure, and the vertical wiring 74 is connected to the GND wiring 72 of one layer. To be done. The horizontal wiring 72 and the vertical wirings 73 and 74 are connected to each transistor.

As can be seen from FIG. 2, the wide portion 6a on one end side of the wiring line 6 in the left basic cell 1 is
The wide portion 6a on the other end side is connected to the wide portion 38 of the fifth gate electrode 24, and is connected to the wide portion 19 of the first gate electrode 9 of the right basic cell 1. That is, the wiring line 6
Is effectively utilized as a part of the wiring for making the fifth gate electrode 24 of the left basic cell 1 and the first gate electrode 9 of the right basic cell 1 have the same potential.

In the left basic cell 1, the wide portion 19 of the first gate electrode 9 in the first device region 3 and the third device among the wirings formed in the first layer of the metal wiring layer. The metal wiring 75 connecting to the ninth P-type source / drain region 43 in the region 5 is, with respect to the wiring line 6, an effective wiring region of this wiring line 6 (a portion excluding the wide portion 6a).
2 intersect with each other at a right angle (in FIG. 2, the width of the metal wiring 75 is formed to be thick as it is, only in the intersecting portion).

Further, in the right basic cell 1, the wide portion 18 of the second gate electrode 10 in the first device region 3 and the third device among the wirings formed in the first layer of the metal wiring layer. The metal wiring 75 connecting to the ninth P-type source / drain region 43 in the region 5 intersects the wiring line 6 at a right angle above the effective wiring region of the wiring line 6 (in FIG. 2, it intersects). The width of the metal wiring 75 is formed to be thick just as it is). The metal wiring 75
Corresponds to the "other wiring" in the present invention.

The width of the metal wiring 75 is set to 0.56 μm, and the space between the metal wiring 75 and the wide portions 6a on the left and right of the wiring line 6 (the space portion 6).
b, 6b) is 0.56 μm which is the same size as the width of the metal wiring 75 due to the limitation of lithography and etching technology.
Is the limit value in processing. Therefore, in the present embodiment, the length L of the portion of the wiring line 6 excluding the wide portion 6a is set to be three times the width of the metal wiring 75 intersecting the wide portion 6a, so that the length of the wiring line 6 becomes 1 metal wiring 75 on it
The length is set so that only the books can intersect, and is set to be as short as possible. That is, the length L of the portion of the wiring line 6 excluding the wide portion 6a includes the width of the metal wiring 75 and the widths of the space portions 6b and 6b to be formed on both sides of the metal wiring 75, and the width of the space portions 6b and 6b. Is set to the limit value of the lithography and etching technology. The space portions 6b, 6b correspond to the "space" in the present invention.

The basic cell 1 in this embodiment has the following features.

(A) The wiring line 6 which is effectively used as a part of the wiring is made as short as possible in order to reduce the wiring resistance, but at the minimum necessary to intersect only one metal wiring 75. Has secured the length of. That is,
The wiring line 6 of the present embodiment can achieve both freedom of wiring and reduction of power consumption.

(B) In the third device area 5, the sixth
The P-type transistor having the other end portion 39b of the gate electrode 39 as a gate electrode and the N-type transistor having the other end portion 40b of the seventh gate electrode 40 as a gate electrode are located on a straight line in the vertical direction without any deviation. Furthermore, the N-type transistor having one end 39a of the sixth gate electrode 39 as a gate electrode and the P-type transistor having one end 40a of the seventh gate electrode 40 as a gate electrode are substantially deviated from each other on a vertical line. The sixth and seventh gate electrodes 39, 40 are provided with inclined regions 39c, 40c so as not to be located.

Therefore, when a transfer gate is formed by using this portion, as shown in FIG. 2, the source / drain regions of the P-type transistor and the source / drain regions of the N-type transistor are connected in a substantially vertical direction. Therefore, the length of the metal wiring required for this connection is extremely short (the shortest if it can be connected in the vertical direction), which contributes to the reduction of power consumption and the circuit area of the transfer gate itself can be reduced. This can contribute to the area saving of the semiconductor integrated circuit.

In particular, since the metal wiring is formed on these gate electrodes and transistors unlike the respective gate electrodes on the basic cell 1, it is formed on the underlying surface having some irregularities. Therefore, in consideration of the depth of focus during the exposure process, the width dimension must be set to a large value (in the present embodiment, the width of the gate electrode (gate length in the transistor) is 0.38 μm. The width is 0.56 μm as described above).

Therefore, under the condition that the circuit area is limited, it is not possible to connect a plurality of metal wirings in an oblique direction.
It is difficult to work because the metal wirings of each other overlap each other, which is a difficult task. On the other hand, in the present embodiment, as described above, since the wiring can be made in a substantially vertical direction, such a problem does not occur.

(C) In the above-described embodiment, the metal wiring for connecting the eighth P-type source / drain region 42 and the eighth N-type source / drain region 45 and the ninth P-type source. The drain region 43 and the ninth
Although an example is shown in which the metal wirings connecting the N-type source / drain regions 46 intersect each other in the vertical direction, for example, like the metal wiring 76 shown by a thick line in FIG. Depending on the type (decoding gate, high drive cell, etc.), the metal wiring 76 may be the inclined regions 39c and 4c.
In some cases, the upper part near 0c may intersect horizontally.

Further, if the metal wiring is arranged in a layer higher than each metal wiring, the inclined region 39 has a higher probability.
Horizontally intersect above c and 40c.

In this case, for example, this inclined region 39c,
If 40c is not inclined and extends in the horizontal direction, the metal wiring 7 located in the horizontal direction above the vicinity of this
When 6 overlaps with this horizontally extending portion, the capacitance generated between the two becomes large, and there is a danger that problems such as signal delay may occur.

On the other hand, in the present embodiment, the inclined region 3
Metal wiring 76 located horizontally above 9c and 40c
However, the overlapping area of the inclined regions 39c and 40c is almost constant no matter which position they intersect. Therefore,
The metal wiring 76 can be connected without worrying about a problem such as a signal delay caused by a large increase in the overlapping area.

In FIG. 2, the metal wiring 76 is shown only in the overlapping portion with the inclined regions 39c and 40c in order to make the drawing easy to see. However, in reality, as shown by the dotted line in FIG. It extends in the horizontal direction so as to completely intersect the regions 39c and 40c.

(D) First device area 3 and second and third areas
Since the sizes of the transistors in the device regions 4 and 5 are different from each other, it is possible to freely select a transistor having a size corresponding to the driving capability of each logic circuit such as an inverter and a NAND circuit.

(E) The arrangement direction of the transistor groups 7 and 8 in the first device region 3 and the arrangement direction of the transistor groups 20 and 21 in the second device region 4 are made different (especially, the arrangement direction is 90 degrees). Have been set differently). Therefore, it is not necessary to change the wiring layer when connecting the transistors so as not to extend over the transistor region, the wiring efficiency can be improved, and the wiring length can be shortened.

(F) Since the wiring line 6 is provided for each cell substrate 1, the vacant area in the cell is effectively utilized and the degree of freedom of the connection position is increased.

(G) The position where each wiring is provided is divided into two layers with an insulating film interposed, and the wiring connecting each transistor and the horizontal wiring 72 are located in the first layer, and the vertical wirings 73 and 74 are located in the second layer. Is configured as follows. As a result, the wiring that connects each transistor (for example, the wiring that connects the basic cells) is
Even when the vertical wirings 73 and 74 are crossed, they can pass under the vertical wirings 72, which increases the degree of freedom of wiring.

The above embodiment may be modified as follows, and in that case, the same operation and effect can be obtained.

(1) In the above embodiments, an example in which the basic cell 1 is used to form the DFF circuit has been shown, but the present invention is not limited to this, and the basic cell 1 described in the above embodiments may be replaced by 1 or By arranging multiple units, in addition to DFF,
For example, inverter, buffer, NAND circuit, NOR
Circuit, AND circuit, OR circuit, AND-NOR circuit, O
R-NAND circuit, exclusive OR circuit (Exclusive-OR circuit), exclusive NOR circuit (Exclusive-NOR circuit), multiplexer, adder (Adder), half adder (Half-Adde)
r), a decoder, a latch circuit, and the like can be realized.

(2) A plurality of wiring lines 6 are formed in the same cell substrate 2.

(3) A circuit is constructed by arranging cell substrates having different numbers of wiring lines 6.

(4) The angle θ of the inclined portions 39c and 40c is
It is set arbitrarily within the range of 0 <θ <90.

[0076]

As described above in detail, in the semiconductor device of the present invention, the number of other wirings that can be crossed is substantially secured while ensuring the degree of freedom of connection enough to cross other wirings on the wiring line. By limiting the number to one, the length of the wiring line is limited to the minimum and an increase in wiring resistance is prevented. Therefore, it is possible to realize a high speed circuit and low power consumption while ensuring the degree of freedom of design, the ease of wiring, and the wiring efficiency in a good state when integrated into a basic cell using this. .

[Brief description of drawings]

FIG. 1 is a plan view showing a structure of a basic cell according to an embodiment of the present invention.

FIG. 2 is a physical circuit diagram when a DFF circuit is configured using the basic cell shown in FIG.

FIG. 3 is a logic circuit diagram of the DFF circuit of FIG.

FIG. 4 is a plan view showing a structure of a basic cell in a conventional example.

[Explanation of symbols]

1 basic cell 2 cell substrate 6 wiring lines 7, 20, 52 First, second, third P-type transistor group 8, 21, 53 First, second, third N-type transistor group 9, 10, 22-24, 39-41 Gate electrode 57 Void 75 Metal wiring

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-10-135431 (JP, A) JP-A-5-102322 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/82 H01L 21/822 H01L 21/8238 H01L 27/04 H01L 27/118 H01L 27/092

Claims (7)

(57) [Claims] 1. At least one transistor and at least one wiring line are provided on a cell substrate, contact portions are formed at both ends of the wiring line, and a length of a portion of the wiring line excluding the contact portion is formed. A semiconductor device, wherein L is set to a minimum value capable of intersecting only one other wiring. 2. A plurality of transistors and at least one wiring line are provided on a cell substrate, contact portions are formed at both ends of the wiring line, and another wiring intersecting the wiring line and the wiring line are formed. A semiconductor device, wherein each space between the contact portion and the contact portion is set to a minimum value that can be processed. 3. A predetermined circuit is formed by arranging a plurality of cell substrates each having at least one transistor and at least one wiring line, and selectively connecting transistors between each cell substrate or within the same cell substrate. The contact portions are formed at both ends of the wiring line, and the space between each of the wiring lines and the other wiring intersecting the wiring line is set to a minimum value that can be processed. A semiconductor device characterized by being set. 4. The semiconductor device according to claim 2, wherein the minimum processable value is a limit value of lithography and etching processes. 5. The semiconductor device according to claim 2, wherein each space and the width of the other wiring are substantially equal to each other. 6. The cell substrate has a first transistor and a second transistor, and the wiring line is located in a void portion between the first and second transistors. Item 4. The semiconductor device according to any one of items 1 to 3. 7. The semiconductor device according to claim 6, wherein the sizes and directions of the first and second transistors are different.