JP3519923B2 - Package board inspection equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package board inspection apparatus suitable for electrical inspection of a package board on which a semiconductor chip is mounted.

[0002]

2. Description of the Related Art In recent years, semiconductor bare chip mounting packages such as LSI packages have become smaller, thinner, and have more pins due to surface mounting accompanying higher density of chips.
Fine pitch is progressing. Therefore, as a package substrate for mounting bare chips or flip chips on the surface, multilayer plastic substrates having a thickness of 1 mm or less are becoming mainstream from conventional ceramic substrates.

Further, in the open / short inspection of the package substrate, when lands (electrodes) are formed on both front and back surfaces of the package substrate, an inspection probe is contacted from both front and back surfaces of the package substrate to perform an electrical inspection ( Open / short inspection). The pattern layout of the land on the package chip bare chip or flip chip mounting side is naturally dense, and the pattern layout on the surface on the opposite side (motherboard mounting side) is usually rough.

FIG. 7 is a schematic side sectional view of a BGA (ball grid array) as an example of a semiconductor bare chip mounting package. In the figure, an LSI 12 as a semiconductor chip is mounted on the upper surface of the package substrate 1, and L
A resin layer for sealing SI 12 is formed on the upper surface of the package substrate 1, and solder balls 13 as leads for attaching to a mother board etc. are arranged on the lower surface of the package substrate 1. Therefore, the layout area (corresponding to the LSI 12) of the land on the LSI 12 mounting side of the package substrate 1 is relatively small, and the layout area of the land (corresponding to the solder ball 12) on the motherboard mounting side is relatively large. Incidentally, the number of lands is usually larger on the LSI 12 mounting side than on the motherboard mounting side.

[0005]

The inspection needles arranged in the probe unit of the inspection device are brought into contact with the respective lands provided on the front and back surfaces of the package substrate 1 as described above to conduct the electric conduction inspection. The spring biasing force that biases the inspection needle in the protruding direction to ensure a stable contact pressure is
Usually, the number of pins on the chip side is larger than that on the motherboard mounting side, and since the land arrangement area on the LSI12 mounting side is relatively small as described above, the LSI12 mounting side has a concentrated load and the motherboard mounting side has a distributed load.

FIG. 8 is a schematic view of the inspection apparatus. In the figure, the package substrate 1 is supported at its peripheral edge by a substrate pressing chuck 2. Package board 1
In the figure, the upper surface is the chip mounting side, the lower surface is the motherboard mounting side, and the upper surface side probe unit 3 provided with a plurality of inspection needles for contacting the chip mounting side land is above the package substrate 1. A lower surface side probe unit 11 provided with a plurality of inspection needles to be brought into contact with the motherboard mounting side land is provided below the package substrate 1. Then, the probe units 3 and 11 are driven by a cylinder or the like not shown so as to sandwich the package substrate 1 from above and below, and each inspection needle is elastically abutted to each corresponding land.

However, due to the difference in the layout area of each land as described above, the load distribution is uneven on the front and back sides of each probe package substrate 1, especially when the package substrate 1 is formed of a plastic material as described above. Is affected by the concentrated load on the chip mounting side. Therefore, as shown in FIG. 8, the package substrate 1 is warped so as to be concave upward, and the inspection needle sufficiently contacts the land on the peripheral edge side of the package substrate 1 on the motherboard mounting side. If the contact failure occurs, the electrical inspection cannot be performed.

[0008]

SUMMARY OF THE INVENTION In order to solve the above problems and to reliably perform an electrical inspection on a package substrate made of a material which is easily elastically deformed, a semiconductor chip is provided in the present invention. A first probe unit having a plurality of test needles arranged in parallel corresponding to the land on the chip mounting surface side of the package board on which the package is mounted, and a land on the side opposite to the chip mounting surface of the package board. A package having a second probe unit corresponding to which a plurality of inspection needles are arranged in parallel, and performing electrical inspection of the package substrate by sandwiching the package substrate by the probe units. A substrate inspection apparatus, which receives a back surface side of a portion of the package substrate on which the chip is mounted, which is pressed by the first probe unit. Warping prevention plate for preventing the warping of the package substrate, the said second probe Uni
Mounting the semiconductor chip on the package substrate
The size was set to the size corresponding to the part corresponding to the back side of the part . In addition, the second probe unit
Part of the plurality of inspection needles in the portion provided with the warp prevention plate
Is provided, and a part of the inspection needle penetrates the warp prevention plate.
It is preferable that the warp prevention plate is
Is integrally formed during processing of the second probe unit
Or the warp prevention plate is attached to the second probe unit.
It is preferable that they are stacked on top of each other. Alternatively, in the first probe unit, the first probe unit
The inspection needle arranged in the
An elastic pressing means is provided for elastically pressing the vicinity of the peripheral edge of the package substrate on the chip mounting surface side when the land on the mounting surface side is pressed .

By doing so, both probe units are driven so as to approach each other so as to sandwich the package substrate, and the inspection needles of both probe units are brought into contact with the respective lands on both the front and back surfaces of the package substrate. When conducting the electrical inspection of 1., the package substrate warps due to the concentrated load on the portion of the package substrate on which the chip is mounted, which is pushed by the first probe unit. Since the warp prevention plate is provided to receive the warp, the maximum load on the chip mounting portion can be suppressed, and the occurrence of warp can be suppressed. Also, by elastically pressing the vicinity of the peripheral edge of the package substrate on the chip mounting surface side by the elastic pressing means provided on the first probe unit side, it is possible to similarly prevent the warp.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail based on specific examples shown in the accompanying drawings.

FIG. 1 is a diagram showing an outline of a package board inspection apparatus to which the present invention is applied. The same parts as those shown in FIG. 8 of the conventional example are designated by the same reference numerals. The detailed description is omitted. Note that FIG. 1 shows a state before the electrical inspection of the package substrate 1, and in the illustrated example, each inspection needle of the upper surface side probe unit 3 is in contact with the chip mounting side land of the package substrate 1.
After that, each inspection needle of the lower surface side probe unit 4 is brought into contact with the motherboard mounting side land of the package substrate 1.
Note that each of these states can be achieved by moving the probe units 3 and 4 up and down by a driving device (not shown).

FIG. 2 shows a first specific example of the lower surface side probe unit 4 according to the present invention. In this example, a rectangular island portion 4a as a warp prevention plate is formed in a portion corresponding to the back surface side of the chip (LSI 12) mounting portion of the package substrate 1. The island portion 4a may be formed by cutting at the same time when the lower surface side probe unit 4 is formed, and has a height lower than the height of the inspection needle 5 in the protruding direction. That is, the land on the motherboard mounting side of the package substrate 1 applied to this first specific example is
In which are uniformly arranged over the entire surface.

When the lower surface side probe unit 4 thus formed is used for inspection by the inspection apparatus shown in FIG. 1, the pressing force by the concentrated load of the upper surface side probe unit 3 to the chip mounting side of the package substrate 1 is It can be received by the island portion 4a, and it is possible to prevent an excessive concentrated load from being applied to the chip mounting portion. As a result, it is possible to prevent the large warp shown in the conventional example from occurring in the package substrate 1, and the warp is alleviated, so that the contact state of the peripheral portion with the land can be secured. The contact resistance between the inspection needle 5 and the land is stable, and the reliability of the electrical inspection (open / short inspection) is improved.

FIG. 3 shows a second specific example of the lower surface side probe unit 6 according to the present invention. In this example, instead of integrally forming the island portion 4a, a separate warp prevention plate 7 is formed, and the warp prevention plate 7 is screwed and attached to the upper surface of the lower surface side probe unit 6 in the drawing. . The lower surface side probe unit 6 of the second specific example can be applied to the package board 1 in which the motherboard mounting side land is not arranged in the central portion. The effect is similar to that of the first specific example.

FIG. 4 shows a third specific example according to the present invention, and FIG. 4 shows an upper surface side probe unit 8. In this example, the inspection needles 5 corresponding to the chip mounting side lands are arranged so as to be densely packed in a narrow area of the central portion of the upper surface side probe unit 8, but the upper surface side probe unit 8 is surrounded by a peripheral portion. A plurality of pushers 9 as a pressing means are arranged along the peripheral edge.

The pusher 9 is, as shown in FIG.
A compression coil spring 10 having a headed pin shape, the head portion 9a of which is coaxially reciprocally supported in a support hole 8a formed in the upper surface side probe unit 8 and which is received in the support hole 8a. Thereby, a part of the columnar leg is elastically urged in the protruding direction of the inspection needle 5.

When the upper surface side probe unit 8 thus constructed is used, the lower surface side probe unit 11 similar to the conventional example shown in FIG. 6 can be used. The lower surface side probe unit 11 includes the first and second
Although the warpage prevention plate shown in the specific example is not provided, when the package substrate 1 is pressed by the upper surface side probe unit 8, the pusher 9 provided at the peripheral portion thereof elastically urges the peripheral portion of the package substrate 1. As a result, it is possible to suppress an increase in warpage due to a concentrated load. The effect in this case is also the same as that of the first specific example.

[0018]

As described above, according to the present invention, the package substrate warps due to the concentrated load on the chip mounting portion of the package substrate pressed by the first probe unit. Since it is received by the warp prevention plate provided on the probe unit, or by elastically pressing the vicinity of the periphery of the chip mounting surface side of the package substrate by the elastic pressing means provided on the first probe unit side, Since the warpage generated on the package substrate can be alleviated, the contact state between the inspection needle and the land is stabilized, and the reliability of the electrical inspection is improved. Further, there is also an effect of suitably preventing disconnection of a circuit inside the package substrate due to warpage.

[Brief description of drawings]

FIG. 1 is a diagram showing an outline of a package board inspection apparatus to which the present invention is applied.

FIG. 2 is a first bottom side probe unit according to the present invention.
FIG.

FIG. 3 is a second bottom side probe unit according to the present invention.
FIG.

FIG. 4 is a perspective view of an upper surface side probe unit showing a third specific example according to the present invention.

FIG. 5 is an enlarged sectional view showing a pusher of a third specific example.

FIG. 6 is a perspective view of a lower surface side probe unit applied to a third specific example.

FIG. 7 is a side sectional view showing an example of a semiconductor chip mounting package.

FIG. 8 is an enlarged view of a main part showing an outline of a conventional inspection device.

[Explanation of symbols]

1 Package board 2 Substrate holding chuck 3 Top side probe unit 4 Lower surface side probe unit, 4a Island part 5 inspection needles 6 Bottom side probe unit 7 Warp prevention plate 8 Upper surface side probe unit, 8a Support hole 9 pusher, 9a head 10 Compression coil spring 11 Bottom side probe unit 12 LSI 13 solder balls

Continuation of the front page (56) References JP-A-9-211073 (JP, A) JP-A-9-61485 (JP, A) Jikken-hei 5-2866 (JP, Y2) (58) Fields investigated (Int .Cl. ⁷ , DB name) G01R 31/28-31/3193 G01R 1/06-1/073 G01R 31/02

Claims (5)

(57) [Claims] 1. A first probe unit having a plurality of inspection needles arranged in parallel corresponding to a land on the chip mounting surface side of a package substrate on which a semiconductor chip is mounted, and the chip mounting surface of the package substrate. Has a second probe unit in which a plurality of inspection needles are arranged in parallel corresponding to lands on opposite sides, and the package substrate is sandwiched between the probe units to electrically connect the package substrate with electricity. A package board inspection device configured to perform an inspection, for preventing warpage of the package board by receiving a back surface side of a portion of the package board on which the chip is mounted, which is pressed by the first probe unit. Attach the warp prevention plate to the second probe unit.
Backside of the mounting part of the semiconductor chip on the package substrate
An apparatus for inspecting a package substrate, which is provided in a portion corresponding to the side and in a corresponding size . 2. A first probe unit having a plurality of inspection needles arranged in parallel corresponding to a land on the chip mounting surface side of a package substrate on which a semiconductor chip is mounted, and the chip mounting surface of the package substrate. Has a second probe unit in which a plurality of inspection needles are arranged in parallel corresponding to lands on opposite sides, and the package substrate is sandwiched between the probe units to electrically connect to the package substrate. A package board inspection device configured to perform an inspection, for preventing warpage of the package board by receiving a back surface side of a portion of the package board on which the chip is mounted, which is pressed by the first probe unit. A warp prevention plate is provided on the second probe unit, and the warp prevention plate of the second probe unit is provided. A part of the plurality of inspection needles is disposed in the open portion, and a part of the inspection needle is provided so as to penetrate the warp prevention plate. 3. A first probe unit having a plurality of test needles arranged in parallel corresponding to a land on the chip mounting surface side of a package substrate on which a semiconductor chip is mounted, and the chip mounting surface of the package substrate. Has a second probe unit in which a plurality of inspection needles are arranged in parallel corresponding to lands on opposite sides, and the package substrate is sandwiched between the probe units to electrically connect the package substrate with electricity. A package board inspection device configured to perform an inspection, for preventing warpage of the package board by receiving a back surface side of a portion of the package board on which the chip is mounted, which is pressed by the first probe unit. A warp prevention plate is provided on the second probe unit, and the warp prevention plate is provided on the second probe unit. Package substrate inspection apparatus characterized by being integrally formed during factory. 4. A first probe unit having a plurality of inspection needles arranged in parallel corresponding to a land on the chip mounting surface side of a package substrate on which a semiconductor chip is mounted, and the chip mounting surface of the package substrate. Has a second probe unit in which a plurality of inspection needles are arranged in parallel corresponding to lands on opposite sides, and the package substrate is sandwiched between the probe units to electrically connect the package substrate with electricity. A package board inspection device configured to perform an inspection, for preventing warpage of the package board by receiving a back surface side of a portion of the package board on which the chip is mounted, which is pressed by the first probe unit. A warp prevention plate is provided on the second probe unit, and the warp prevention plate is provided on the second probe unit. Package substrate inspection device, characterized in that provided in the layer. 5. A first probe unit having a plurality of inspection needles arranged in parallel corresponding to a land on the chip mounting surface side of a package substrate on which a semiconductor chip is mounted, and the chip mounting surface of the package substrate. Has a second probe unit in which a plurality of inspection needles are arranged in parallel corresponding to lands on opposite sides, and the package substrate is sandwiched between the probe units to electrically connect the package substrate with electricity. A package substrate inspection device configured to perform inspection, wherein a land on the chip mounting surface side of the package substrate is pressed against the first probe unit by the inspection needle arranged in the first probe unit. In this case, an elastic pressing means for elastically pressing the vicinity of the peripheral edge of the package substrate on the chip mounting surface side is provided. Substrate inspection device.