JP3516719B2 - Method for manufacturing single-sided resin molded product and resin molding apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a single-sided resin molded product and a resin molding apparatus.

[0002]

2. Description of the Related Art B is for a resin mold type semiconductor device.
There is a product such as a GA package in which only one surface of a substrate is resin-molded. FIG. 9 shows a conventional example of a molding die used when manufacturing such a single-sided resin molded product. In the figure, 10a and 10b are lead frames which are molded products, 12a and 12b are upper cavity inserts, and 14a and 14b are lower cavity inserts.
In this molding die, the cavity concave portions 16a and 16b are provided only in the upper cavity inserts 12a and 12b for single-sided resin molding. 18 is a pot, 20 is a lower center insert, and 22 is an upper center insert.

FIG. 10 shows a state in which the lead frames 10a and 10b are resin-molded using the above molding die. 24 is a resin package part, 26 is a molded product, 28
Is a molded product runner. The molded product runner 28 is connected to the resin package portion 24 via the gate 30. In the molding die, as shown in FIG. 9, the upper cavity inserts 12a, 12b are provided with die gates 32 communicating with the cavity recesses 16a, 16b, and the resin is pumped from the pot 18 into the cavity recesses 16a, 16b. Molded. In the above example, the cavity recess is provided in the upper mold, but conversely, the cavity recess may be provided in the lower mold.

[0004]

As described above, in the manufacture of a resin mold type semiconductor device, a molded product such as a lead frame is clamped with a mold die and resin-molded. Only one molded product is clamped by the lower mold. In the transfer molding machine, there are cases where a plurality of lead frames are resin-molded at a time, such as two-piece picking and four-piece picking. However, even when a single-sided resin molded product is manufactured, the conventional resin molding apparatus uses an upper mold and a lower mold. Between them, the molded products were clamped one by one and resin-molded.

It is an object of the present invention to provide a resin molding apparatus capable of efficiently manufacturing a single-sided resin molding product such as a BGA package in manufacturing a resin molding type semiconductor device.

[0006]

The present invention has the following constitution in order to achieve the above object. That is, in a method for manufacturing a single-sided resin-molded product obtained by resin-molding only one surface of a molded product, a press device for performing resin molding by stacking two molded products with the resin mold surface facing outward. The two mold products are supplied to the upper mold and the lower mold, each of which is provided with a cavity recess for resin molding, and the two mold products are clamped. It is characterized by resin molding.

Further, in a resin molding apparatus for producing a single-sided resin molded product in which only one surface of a molded product is resin-molded, an upper die and a lower mold of a mold die for clamping and resin-molding the molded product. Each of them is provided with a cavity recess for resin-molding a molded product to be supplied to the press device by stacking two sheets with the resin mold surface on the outside, and a resin path for communicating with the cavity recess and filling with resin is provided in the upper mold. It is characterized in that it is provided in each of the lower mold. Further, a plurality of pots for supplying resin to the cavity recesses are provided, the pots are connected to the cavity recesses by the resin passages, and the resin passages communicating with the respective pots are connected to the upper cavity recesses for each pot. It is characterized in that only one of the cavity recesses of the lower mold is contacted. Further, the resin paths communicating with the pots are alternately arranged such that those communicating with the cavity recesses of the upper mold and those communicating with the cavity recesses of the lower mold are alternately arranged. In addition, a plurality of pots for supplying resin to the cavity concave portion are provided, and cavity concave portions for resin-molding a molded product are provided at both side positions sandwiching the pot, and resin paths connecting the pot and the cavity concave portion are respectively provided. One of the pots is connected to the cavity recess of the upper mold and the other is connected to the cavity recess of the lower mold. Further, the volume of the mold cull provided in the pot is changed according to the number of cavity recesses communicating with the pot to adjust the amount of resin to be pressure-fed to the cavity recess.

[0008]

In the resin molding apparatus according to the present invention, the molded products are set in the molding die in a state where the resin molding surface is on the outside and two sheets are superposed on each other. Clamp the molded product and resin mold it. The upper mold and the lower mold are each provided with a cavity recess for resin-molding the molded product. The molded product is clamped by the upper mold and the lower mold, and the cavity is filled with resin from the resin path to mold the molded product with the resin. Mold. The molded products set by stacking two sheets are resin-molded on the upper mold side and the lower mold side, one surface each, to obtain a single-sided resin molded product.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a sectional view showing an embodiment of a resin molding apparatus for a single-sided resin molded product according to the present invention. The figure shows a state in which the molded product is clamped by the upper and lower molds. Also in the case of this embodiment, similarly to the conventional example shown in FIG.
2b and the lower cavity inserts 14a, 14b clamp the molded product and resin mold it. The molding die is of a multi-pot type, and the articles to be molded are arranged on both sides of the pot 18. These upper cavity inserts 12a and 12b, lower cavity insert 14
The arrangement of each part such as the lower center insert 20, the upper center insert 22 and the like in addition to a and 14b is the same as in the conventional example.

The features of the molding die of the embodiment are that the lead frames 10A and 11A, and the lead frames 10B and 11B.
It is a point that two pieces of each are combined and resin-molded. That is, the lead frames 10A and 11A and the lead frames 10B and 11B are superposed with the resin mold surfaces facing outward, and clamped by the upper cavity inserts 12a and 12b and the lower cavity inserts 14a and 14b to perform resin molding.

The upper cavity inserts 12a and 12b and the lower cavity inserts 14a and 14b are provided with cavity recesses 16A and 1A for resin-molding the superposed lead frames 10A and 11A, 10B and 11B, respectively.
6B, 17A and 17B are provided. Then, the upper cavity inserts 12a and 12b and the lower cavity insert 1
4a, 14b in each of the cavity recesses 16A, 16B,
Upper die runners 36a, 36b and lower die runners 38a, 38b leading to 17A, 17B are provided.

FIG. 2 shows a lead frame 10 which is a molded product.
The state which set A, 10B, 11A, and 11B in the molding die is seen from the upper surface direction. Planar arrangement of the cavity recesses 16A, 16B, 17A, 17B with respect to the lead frames 10A, 10B, 11A, 11B, and upper die runners 36a, 36b and lower die for connecting these cavity recesses 16A, 16B, 17A, 17B and the pot 18 The plan layout of the runners 38a and 38b is shown. The lead frames 11A and 11B are located below the lead frames 10A and 10B, and the cavity recess 17
A and 17B are also on the lower side facing the cavity recesses 16A and 16B, respectively.

The upper die runners 36a, 36b communicate with the cavity recesses 16A, 16B on the upper die side, and the lower die runner 3
8a and 38b are cavity recesses 17A and 17B on the lower mold side.
However, when arranging the upper die runners 36a, 36b and the lower die runners 38a, 38b, only one of the upper die or the lower die runner is in contact with one pot 18. Since the lead frames 10A, 10B, 11A, and 11B of the embodiment have four resin mold portions, the cavity recess 1 provided in the upper mold and the lower mold
Positions of 6A, 16B, 17A, 17B and pot 18
In consideration of the arrangement position of No. 5, five pots 18 are arranged, and upper pot runners 36a and 36b and lower die runners 38a and 38b are alternately provided in each pot 18.

From the pot 18 to the cavity recesses 16 on both sides
Upper die runners 36a, 36 extending toward A, 16B
b branches into two gates 40 on the leadframes 10A, 10B and connects the gates 40 to the corners of two adjacent cavity recesses 16A, 16B.
In this way, the two pots 18 and the lead frame 10A,
All four cavity recesses 16A, 16B on 10B communicate via upper die runners 36a, 36b.

On the other hand, for the lower mold side, the lower mold runner 38
the pot 18 and the cavity recess 17 by a and 38b.
Lower mold runner 38 extending from the central pot 18 due to the arrangement of the pot 18, although it is in contact with A and 17B.
Two cavity recesses 17 on both sides for a and 38b
Two pots 18 in the end position, in contact with A and 17B
For a and 18b, cavity recesses 17A, 1 on both sides
Contact each of the 7Bs.

Since each of the pots 18a and 18b has one cavity recess 17A and 17B which communicates with the pots 18a and 18b, a smaller amount of resin may be filled than the other pots 18. In the resin molding device, the amount of resin filled is determined by the amount of resin in the resin tablet to be charged. However, it is complicated for an automatic device to add different types of resin tablets in order to adjust the amount of filled resin. Therefore,
As shown in FIG. 2, with respect to the pots 18a and 18b, the volume of the mold cull portion is designed to be larger than that of the other pots 18 so that when the same resin tablet is put in, the effective resin amount supplied to the cavity recess side becomes smaller. To It is possible to adjust the amount of resin to be filled by changing the pot diameter instead of changing the volume of the mold cull, but in this case, the apparatus becomes complicated because different types of pots are incorporated.

In the embodiment, the upper die runners 36a, 36b and the lower die runners 38a, 38b are arranged so as not to overlap each other in a planar arrangement because the lead frames 10A, 10B, 11A, 11B are respectively formed in the degate step after resin molding. This is so that the cured resin of the runner portion and the gate portion attached to the can be easily removed. Degates are stacked lead frames 10A, 10B, 11A, 11B
This is because it is necessary to separate the upper mold side and the lower mold side separately from each other, so that it is necessary to facilitate this separation operation.

The upper runner 3 is used for resin molding.
There is a case where the molten resin leaks from a portion where 6a, 36b and the lower die runners 38a, 38b intersect the side edges of the lead frames 10A, 10B, 11A, 11B. As a method for solving this problem, for example, as shown in FIG.
A method in which the resin stopper 42 is installed further outside the outermost runner on the lead frames 10A, 10B, 11A, and 11B can be applied.

The resin stopper 42 is composed of the upper cavity inserts 12a and 12b and the lower cavity inserts 14a and 1a.
4b is attached to each of the lead frames 10
The size of the top is set so as to prevent the resin from flowing out by making the space between the side edges of A, 10B, 11A, and 11B as small as possible. In this way, the lead frames 10A, 10B, 1
If resin stoppers 42 are arranged on both ends of 1A, 11B, at least lead frames 10A, 10B, 11
It is possible to prevent the resin from flowing out onto the mold outside A and 11B. Then, after the resin molding, if a side burr is generated, only that portion may be removed.

In the molding die of the embodiment, two lead frames 10A, 10B, 11A and 11B are superposed on each other and resin-molded. Therefore, at the time of resin molding, the superposing positions of the lead frames 10A, 10B, 11A and 11B are superposed. Must be set accurately. Therefore, in the embodiment, the guide pins 46 are provided on the lower cavity inserts 14a and 14b so as to intersect upward with the clamp surface,
A guide pin 46 is fitted into the guide hole 44 provided in the lead frames 10A, 10B, 11A and 11B so that the upper and lower lead frames 10A, 11A, 10B and 11B are aligned with each other. In addition, the lead frame 10
When setting A, 10B, 11A, 11B in the mold,
Usually, a set recess for setting the lead frames is provided on both the upper mold and the lower mold, but a set recess for setting two lead frames may be provided on the lower mold side.

Since the molding die of the present embodiment is constructed as described above, resin molding can be performed on two lead frames, one on the top and one on the bottom, by one resin molding operation. It is possible to double the number of molded products to be resin-molded by the operation. After resin molding, lead frames 10A, 10B, 11A, 11B
Is carried out of the molding die, unnecessary resin in the cull part, runner part and gate part is removed, and stored in a magazine. FIG. 3 shows a resin-molded product thus resin-molded. It is obtained as a single-sided resin-molded product in which the resin-molded portion 52 is provided on one surface of the substrate 50 of the lead frame.

FIGS. 4 and 5 show another embodiment of the resin molding apparatus for a single-sided resin molded product. This embodiment also shows an example in which the lead frame is resin-molded on one side.
Similar to the above-described embodiment, two lead frames 10A, 10B, 11A, and 11B are superposed on each other, and cavity recesses 16A, 16B, 17A, and 17B are provided in both the upper mold and the lower mold for resin molding. In addition, the pot 18 and the cavity recesses 16A, 16B, 17 via the upper die runners 36a, 36b and the lower die runners 38a, 38b.
Although it is common to connect A and 17B, in the present embodiment, the upper die runners 36a and 36b and the lower die runner 38a,
The arrangement method of 38b is different from that of the above embodiment.

FIG. 4 shows lead frames 10A, 10B, 1
1A, 11B, pot 18, and upper runner 36a,
36b and the lower die runners 38a and 38b are shown in plan view. The cavity recesses 16A, 16B and the like arranged on the lead frames 10A, 10B, 11A, 11B are also arranged in fours, as in the above embodiment. In this embodiment, eight pots 18 are prepared, and each pot 18 contacts the cavity recesses 16A and 16B on both sides. The same applies to the lower mold side. In addition, the upper die runners 36a, 36
b and the lower mold runners 38a and 38b were alternately arranged for each pot.

In the case of the present embodiment, every pot 18 has 2
Since the cavity recesses are connected to each other, each pot 18
The amount of resin to be filled is equal. Therefore, it is not necessary to change the volume of the cull in order to adjust the amount of the filled resin as in the above embodiment. However, in the case of this embodiment, the number of pots arranged is large. Also in the case of the resin molding apparatus of this embodiment, the lead frames 10A,
Since 0B, 11A, and 11B are overlapped and resin-molded, efficient resin molding can be performed and a suitable one-sided resin molded product can be obtained.

FIG. 6 shows still another embodiment of the resin molding device. In this embodiment as well, as in the above embodiment, two lead frames are superposed on each other, and cavity recesses are provided in both the upper mold and the lower mold for resin molding. Also, the pot 18
The arrangement is the same as in the above embodiment, but one pot 18
One of the resin passages for connecting the cavity recesses 16A, 16B, 17A, 17B to the cavity recesses on the upper mold side and the other for communicating with the cavity recesses on the lower mold side.

Therefore, when resin molding is performed by the resin molding apparatus of this embodiment, the lead frames 10A, 1A,
0B, 11A, and 11B are carried out in a state where two sheets are stacked. FIG. 7 shows the lead frame 10A after resin molding,
The state where 10B, 11A and 11B are taken out is shown. The lead frames 10A, 10B, 11A and 11B are made of resin cured in the mold cull portion and resin 36 cured in the upper die runners 36a and 36b and the lower die runners 38a and 38b.
Since they are taken out in a state of being connected by c and 38c, the runner break pins 54 and 56 for the upper die and the lower die
Poke the cured resin with and degate.

FIG. 8 shows an example of the structure of an automatic device for stacking two lead frames and molding them with resin. In the figure, A indicates the planar arrangement of each part in the overall configuration of the resin molding apparatus. In the figure, arrows indicate the flow of products in this resin molding device. The lead frames housed and set in the supply magazine 60 are supplied to the turntable 62, are turned side by side by 180 degrees and are placed side by side, and are transferred to the press device 64 and resin-molded. After resin molding, it is carried out to the degate sections 66a and 66b, degated, and stored in the storage magazines 68a and 68b. In this way, one resin molding operation is completed.

The above-mentioned resin molding operation is basically the same as the conventional method in which the lead frames are supplied one by one and resin-molded, but in the case of the present invention, two lead frames are used.
Since they are resin-molded by stacking them one by one, they have a configuration different from some conventional methods. First, in the supply magazine 60 for supplying a lead frame, two lead frames of the workpiece are stored with the resin mold surface facing outward and stacked two by two. The lower diagram of FIG. 8 shows a state in which the lead frames 10A and 11A are stacked and stored in the supply magazine 60. The lead frame is stored in a shelf shape with the chip outside.

Supply magazine 60 to turntable 62
When supplying the lead frame to the, the two pieces are set as one set and are projected by the pusher and supplied. Turntable 6
In 2, the direction is rearranged with the two lead frames that have been overlapped as one set. The lead frames rearranged on the turntable 62 are transferred to the press device 64. In the case of the embodiment, two sets are paired and four sets (8
Transfer one sheet at a time and set it in the mold. In the molding die, the two lead frames that overlap each other are clamped and resin-molded by the method described above.

After the resin molding is completed, the mold is opened, and the upper lead frame of the first overlapping is carried out from the pressing device 64 and transferred to the upper mold gate 66a for degate. Then, the lower lead frame remaining in the molding die is carried out and degateed by the lower die gate 66b. In the upper die gate portion 66a and the lower die gate portion 66b, one lead frame is gated in the same manner as in the conventional case.

In FIG. 8, 70a and 70b are storage magazines 68.
The table after the degate product is once placed before the molded products are stored in a and 68b, 70a is the upper mold table, and 70b is the lower mold table. The molded product after degating is handled by the pick-up mechanism 66.
a and 66b are transferred onto these tables 70a and 70b, and are stored in the upper and lower mold storage magazines 68a and 68b from the tables 70a and 70b by pushers. The lower side of FIG. 8 shows a state in which the storage magazines 68a and 68b are viewed from the front direction. The upper die lead frame is stored in a shelf shape with the chip facing upward, and the lower die lead frame is mounted with the chip facing downward.

In this way, it is possible to construct an automatic resin molding apparatus in which two lead frames are superposed on each other and resin-molded to obtain a single-sided resin-molded product. In this resin molding device, it is possible to effectively improve the production efficiency of a single-sided resin molded product by stacking two lead frames and resin-molding them. Although the above example shows the case where the superposed lead frames are carried out and degate separately on the upper side and the lower side, the case where the lead frames are carried out and degate while the lead frames are superposed as in the embodiment shown in FIG. It is not necessary to provide separate gate parts for the upper mold and the lower mold, and the device can be made compact accordingly. Further, even when the lead frames can be carried out separately on the upper side and the lower side and can be gated, it is also possible to carry them out in a state in which two sheets are stacked. In this case, as in the case shown in FIG. 7, the break pins for the upper mold and the lower mold are used for degate.

In the above embodiment, the case where the lead frame is used as the molded product has been described, but the same applies to other products such as BGA packages in which one side of the substrate is resin-molded in addition to the lead frame. be able to. In a BGA package, a semiconductor chip is mounted on one surface of a substrate, and only one surface is resin-molded to obtain a product. In this case as well, two substrates are stacked with the resin-molded surface facing outward, and the molding metal is used. A single-sided resin-molded product can be obtained in the same manner by clamping the two substrates with a mold and resin-molding them. Since the solder mask coating layer is provided on the substrate surface of the BGA package, the substrates can be resin-molded without causing resin leakage or the like by stacking and clamping the substrates.

[0034]

According to the method for producing a single-sided resin molded product and the resin molding apparatus according to the present invention, as described above, the two molded products are supplied to the pressing apparatus and resin-molded. The manufacturing efficiency of products can be effectively improved. Also, by separating the resin passages leading to the cavity recess of the upper mold and the cavity recess of the lower mold for each pot, it is possible to easily take out and degate the products after they are resin-molded by overlapping. Play.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an embodiment of a resin molding device.

FIG. 2 is an explanatory view showing the arrangement of pots, cavity recesses, and runners in an embodiment of a resin molding device.

FIG. 3 is a side view of a single-sided resin molded product.

FIG. 4 is an explanatory view showing the arrangement of pots, cavity recesses, and runners in another embodiment of the resin molding apparatus.

FIG. 5 is a cross-sectional view of another embodiment of the resin molding apparatus for a single-sided resin molded product.

FIG. 6 is an explanatory view showing the arrangement of pots, cavity recesses, and runners in still another embodiment of the resin molding apparatus.

FIG. 7 is a side view of the state after resin molding.

FIG. 8 is an explanatory diagram showing an overall configuration of a resin molding device.

FIG. 9 is an explanatory diagram showing a conventional example of a resin molding device.

FIG. 10 is an explanatory diagram showing a state of resin molding by a conventional device.

[Explanation of symbols]

10A, 10B, 11A, 11B Lead frame 12a, 12b Upper cavity insert 14a, 14b Lower cavity insert 16A, 16B, 17A, 17B Cavity recess 18, 18a, 18b pots 20 Lower center insert 22 Upper center insert 36a, 36b Upper runner 38a, 38b Lower runner 40 gates 42 resin stopper 44 Guide hole 46 guide pin 50 substrates 52 Resin mold part 60 supply magazine 62 turntable 64 Press machine 66a, 66b Degate section 68a, 68b storage magazine 70a, 70b table

Claims (6)

(57) [Claims] 1. A method for producing a single-sided resin-molded product obtained by resin-molding only one surface of a molded product, wherein two molded products are superposed on each other with the resin mold surface facing outward. The mold is supplied to a press machine, and the two mold products are clamped by a molding die having upper and lower mold cavities for resin molding, and the cavities are filled with resin to mold the respective molds. A method for producing a single-sided resin-molded product, which comprises molding the molded product with a resin. 2. A resin molding apparatus for producing a single-sided resin molded product in which only one surface of a molded product is resin-molded, comprising: an upper mold and a lower mold of a mold for clamping and resin-molding the molded product. Each of them is provided with a cavity recess for resin-molding a molded product to be supplied to the press device by stacking two sheets with the resin mold surface on the outside, and a resin path for communicating with the cavity recess and filling with resin is provided in the upper mold. A resin molding device for a single-sided resin molded product, characterized by being provided in each of the lower mold and the lower mold. 3. A plurality of pots for supplying resin to the cavity recesses are provided, the pots and the cavity recesses are connected by the resin passages, and the resin passages communicating with the respective pots are provided in the upper mold for each pot. 3. The resin molding apparatus according to claim 2, wherein only one of the cavity concave portion and the lower mold cavity concave portion is connected. 4. The resin passage according to claim 3, wherein resin passages communicating with the pot are alternately arranged so as to communicate with the cavity recess of the upper mold and those communicate with the cavity recess of the lower mold. Molding equipment. 5. A plurality of pots for supplying a resin to the cavity recess are provided, and cavity recesses for resin-molding a molded product are provided on both sides of the pot, and a resin path for connecting the pot and the cavity recess. 3. The resin molding apparatus according to claim 2, wherein one of the pots is connected to the cavity recess of the upper mold and the other is connected to the cavity recess of the lower mold. 6. The amount of resin to be pressure-fed to the cavity concave portion is adjusted by changing the volume of a mold cull provided in the pot according to the number of cavity concave portions communicating with the pot. Alternatively, the resin molding device according to the item 5.