JP3515503B2 - Method of manufacturing a floating member for electrically connecting two movable parts of a micromechanism with respect to each other - Google Patents

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates generally to the field of micromechanics, and in particular to the field of microactuators, and more particularly (but not exclusively) to read / write units of hard disk read / write units.
The present invention relates to a micro actuator used for fine positioning of a writing head. More specifically, the invention relates to a read / write head fixed to the rotor of a microactuator and a stationary part of the microactuator for electrically connecting two parts of the micromechanism which are movable relative to each other. The present invention relates to a method of manufacturing a floating member, for electrically connecting a floating member.

[0002]

2. Description of the Related Art The read / write unit of a known hard disk comprises a support body (called an "E block") which is rotated by an electric motor. The support body has a plurality of arms, each arm comprising a suspension member formed by a cantilevered plate. The free end of the plate comprises a read / write transducer (head or "slider") that faces the surface of the hard disk via a coupling ("gimbal"). The slider can be connected to the gimbal through a microactuator manufactured by microfabrication of a semiconductor wafer.

These read / write units are
After the initial positioning by the motor acting on the support body, the fine positioning is enabled by the operation of the microactuator on the slider, which enables an increase in the track density on the hard disk.

However, fixing the slider to the rotor of the microactuator, and connecting the electrical terminals of the slider (at least four, two for reading and two for writing) without disturbing the movement of the slider. There are problems with making electrical connections.

[0005]

In view of the above-mentioned prior art, it is an object of the present invention to provide a method of manufacturing a floating member for electrically connecting between two parts of a micromechanism which are movable relative to each other. Is to provide.

[0006]

According to the invention, the object is to provide two movable micromechanics with respect to each other.
Suspended member that electrically connects two parts (suspended
and a step of forming a sacrificial material layer, a step of forming an electrical connection member on the sacrificial material layer, and a step of removing the sacrificial material layer below the electrical connection member. , The sacrificial material layer should not enter the cavity of the underlying layer.
Attached to the surface of the micromechanism in a dry state .
Thin film Der having at least one adhesive surface that
The thin film immobilizes the micromechanism
It is achieved by a method characterized in that it also acts as a structure .

[0007]

The features and advantages of the invention will become more apparent from the following detailed description of its practical embodiments. Aspects are only illustrated by the examples in the accompanying drawings, which do not limit the invention in any way.

Shown in FIG. 1 are details of the tip of a suspension plate 1 for a hard disk read / write transducer (head or "slider") 2. The suspension plate 1 is supported in a known manner by each arm (not shown) of an "E" shaped support member ("E block"), which support member is an electric motor ("voice coil motor") (also (Not shown)
To rotate by. The slider 2 has a coupling 3
It is fixed to the suspension plate 1 via (called “gimbal”). The coupling 3 is generally formed by a suspension plate, for example, a small rectangular plate 3a cut from the suspension plate at three and half sides. The portion 3b connected to the suspension plate 1 allows the small plate 3a to bend under the action of the weight of the slider 2. Slider 2 and coupling 3
The rotary microactuator 4 arranged between and is also shown schematically. Micro actuator 4
Is operated by an electronic control unit to enable fine positioning of the slider on the track of the hard disk and to correct the positioning error caused by the voice coil motor.

The microactuator 4 is, for example, of the type described in the applicant's European patent application EP0913921, ie it is made, for example, from polysilicon in a semiconductor chip by the method described in this European patent application.

FIG. 2 is a schematic plan view showing the microactuator 4. The outer stator 5 and the inner rotor 6 are visible. The stator 5 is fixedly connected to the small plate 3a of the gimbal 3 together with other constituent members included in the semiconductor chip on which the microactuator 4 is formed. The rotor 6 is capacitively coupled to the stator, and is fixed to the slider 2 by a method described later in detail.

The rotor 6 comprises a substantially annular suspended mass 7 and a plurality of movable arms 8 which are also floating and spread radially outward from the floating mass 7. Each of the movable arms 8 has a plurality of movable electrodes 9 extending on both sides of the movable arm 8 substantially perpendicular to the movable arms 8.
Equipped with.

The floating body portion 7 has four annular slots 10 extending radially from the inner boundary of the floating body portion 7.
Within the slot 10, four resilient suspensions known as springs and fixing members 11 extend to elastically and electrically secure the floating body part 7 concentric with the floating body part 7 but fixed thereto. It is connected to 12. The pillar 12, the spring 11, the floating body part 7, the movable arm 8 and the movable electrode 9 are made of epitaxial polysilicon appropriately doped so as to be highly conductive. By the pillar 12, the movable electrode 9 of the rotor 6
Are polarized through embedded conductive regions (not visible in FIG. 2).

The stator 5 comprises a plurality of first fixed arms 1
3 and a plurality of second fixed arms 14. Each first fixed arm 13 extends radially from each first fixed region 15 on the left side of each movable arm 8. Fixed area 15
Are arranged around the rotor 6 and are electrically connected to each other by an embedded or surface connection (not shown) to apply a first voltage polarity to the first fixed arm 13. There is. The second fixed arm 14 extends in the radial direction from the one annular second fixed region 17 defining the outside of the microactuator 2 on the right side of each movable arm 8.

The first and second fixed arms 13 and 14 each include a plurality of fixed electrodes 16, and the fixed electrodes 16 extend toward each movable arm 8 in a direction substantially perpendicular to each fixed arm 13 and 14. ing. In particular, the fixed electrode 16 has a comb structure with the movable electrode 9 and forms a plurality of capacitors arranged in parallel with each other by a known method. First and second fixed arms 13 and 14, fixed electrode 1
6, as well as regions 15 and 17, are also made of doped epitaxial polysilicon.

An appropriate potential difference is applied to the fixed electrodes 13 and 14
When applied between the movable electrodes 8, the movable electrodes 8 are moved to the arms 13 having a smaller potential difference due to capacitive coupling.
Subjected to a lateral force that tends to move the electrode 8 away from 14 and towards the other arm 14, 13 with the larger potential difference.
As a result, the rotation of the floating body portion 7 occurs and the spring 1
Elastic deformation of 1 occurs.

FIG. 3 is a perspective view schematically showing a silicon wafer 30 which has undergone the known process steps necessary to form a plurality of microactuators of the type described above and to incorporate each control integrated circuit. Each microactuator, along with each integrated circuit, is cut
It is formed on each portion 31 of the wafer that becomes the "die".

After the microactuator and each integrated circuit have been electrically tested and tested for reliability, FIG.
As shown in (A) -4 (C), a thin sticky film (“sticky foil”) 32, eg R
The photosensitive resin, which forms part of DuPont's product line known as ISTON ^R , is dried on the front surface of the wafer 30 without the need for treatment with liquid phase substances.
spread. This thin film is wound around a supply roll 20 and is spread between the supply roll 20 and the collecting roll 20B and has an adhesive surface 21. Semiconductor wafer 30
Is placed on the vertically movable support surface 103 (FIG. 4A). As shown in FIG. 4B, when the support surface 103 rises, the front surface of the semiconductor wafer 30 comes into contact with the adhesive surface 21 of the thin film 32. The operation is preferably carried out at a temperature of 110 to 120 ° C., and the film 32 is heated by the high temperature air flow 22 to obtain the film 3
2 is adhered to the front surface of the wafer 30 by the pressure roller 33. Next, as shown in FIG.
The film 32 is cut along the periphery of the wafer by the cutting blade 34, and the portion of the film 32 adhered to the front surface of the wafer 30 is cut off. Thin film 32
Does not follow the topography of the front side of the wafer, ie it does not enter the cavity of the layer below it.

The back surface of the wafer 30 is lapped to reduce the thickness of the substrate of the wafer 30 to a thickness of, for example, about 100 μm. By doing so, the microactuator can be inserted between the slider 2 and the gimbal 3.

Next, an adhesive film (adhesive foil) 35 (FIG. 5), which is adhesive on both sides, is spread on the back side of the wafer also in the dry state. The adhesive layer of the film placed in contact with the backside of the wafer is photo-labile. The double-sided tacky film may be, for example, a film of a material commonly used during the cutting of wafers into dies. The method of applying the double-sided adhesive film is substantially similar to the method described for applying the thin film 32.

Next, a base 36 for subsequent processing of the wafer 30 is attached to the exposed surface of the double-sided adhesive foil 35. The base 36 is preferably a piece of transparent material such as glass (FIG. 5). The thickness of base 36 is such as to allow standard processing of a sandwich composed of wafer 30, double-sided adhesive foil 35, and base 36. A suitable base, for example, has a thickness of about 500
It is composed of one glass of μm.

Optionally, oxygen plasma etching (shown schematically as 23 in FIG. 5) may be performed to reduce the thickness of the adhesive foil 32 on the front side of the wafer 30, from about 15 μm to about 5-8 μm. Oxygen plasma etching may be performed with the wafer 30 in a conventional "stripper".

The cross-sectional view of FIG. 6 schematically shows a cross-section of the diametrical plane VI-VI of the microactuator of FIG. There is a buried N ⁺ region 24 formed in the p-type silicon layer 25 that contacts the polysilicon pillar 12 and polarizes the rotor 6. The buried N ⁺ regions 24 are formed before the epitaxial growth of the polysilicon forming the microactuator.
⁺ Formed by doping. The drive circuit of the microactuator 4 is integrated in the p-type layer 25 around the microactuator 4, which is indicated schematically by 26. It is important to note that the adhesive foil 32 covers the rotor 6 and immobilizes the rotor 6 without entering the cavity of the structure.

The formation of the mask ("hard mask") on the adhesive foil 32 is made of a material which has a high selectivity for the next etching defining the final shape, for example RIE etching in O ₂ plasma. This is done by depositing (“sputtering”) layer 360. The deposition is cold, i.e., at any temperature low enough to be compatible with the tacky foil 32 in any case. This layer 360 may be, for example, silicon dioxide or aluminum with a thickness of about 2 μm (FIG. 6).

Next, a standard photosensitive resin layer 37 is applied to layer 36.
0, for example by the usual "spin coating" process (FIG. 7).

The photosensitive resin layer 37 is selectively exposed using a conventional mask, and then the exposed layer 37 is developed and selectively removed by a standard process to electrically connect the slider. A window 38 serving as a region for fixing the floating conductor,
A window 380 above the rotor in which a region for fixing the fixing plate (“cap layer”) of the slider is formed is opened (FIG. 8). During development of the photosensitive resin 37, cavities of the rotor (between the movable electrodes 9, between these and the fixed electrode 16,
And there is no liquid penetration into the cavity between the movable arm 8 and the fixed arms 13, 14, since at this stage the rotor 6 is completely covered and protected by the adhesive foil 32. It is important to note that

Next, the silicon dioxide or aluminum layer 3
60 are selectively etched, preferably by the RIE technique, to form the window 3 previously formed in the photosensitive resin layer 37.
It is removed in the area of 8,380 (FIG. 9). As a result of this etching, the hard mask remains on the adhesive foil 32,
It is constituted by the part of the layer 360 that has not been removed for protection by the photosensitive resin layer 37.

Next, the photosensitive resin 37 is completely removed, and the adhesive foil 32 which is not protected by the hard mask 360 is selectively etched to form windows 39, 390 in the foil 32 as shown in FIG. To form. Preferably, the etching of the adhesive foil 32 is an oxygen plasma etching, ending the etching when it reaches the surface of the wafer 30.

The reason for using a hard mask to selectively remove the adhesive foil 32 is that conventional photolithographic techniques, that is, techniques that utilize the photosensitive properties of the adhesive foil, define sufficiently small geometries. Because it is impossible. Clearly, however, in applications where it is not necessary to define a significantly smaller geometry, the adhesive foil 32
The photosensitivity property of is available and there is no need to use a hard mask.

The silicon dioxide or aluminum hard mask 360 is completely removed by a subsequent etch, preferably a RIE technique (FIG. 11).

FIG. 12 shows an enlarged detail A of FIG. 11 in which one of the windows 39 formed in the adhesive foil 32 can be seen.

After a quick annealing ("flash annealing") heat treatment to reflow the adhesive foil 32, an insulating dielectric layer 40, preferably silicon dioxide,
Alumina (Al ₂ O ₃ ) or other suitable material is deposited. The dielectric layer 40 is deposited at low temperature, preferably with a thickness of about 3-4 μm and a deposition angle of about 60 ° -70 °, symmetrical with respect to a normal to the surface of the wafer 30. As a result, the dielectric layer 40 covers the window 39 and occludes the top of the cavity of the microactuator 4 (eg, the cavity between the movable electrodes 9), but the dielectric layer 40 does not enter the cavity but only remains on the surface. Becomes This is important. This is because if the layer 40 were to penetrate deeply, it would be practically impossible to remove the encroached material and the rotor would be blocked.

Next, a layer 41 of a conductive material such as aluminum or gold, or a multilayer comprising an aluminum layer (eg about 2 μm thick) and a gold layer (eg about 500 Å thick) is deposited. The conductive layer 41 is deposited by sputtering at low temperature, preferably below 90 ° C (Figure 14). Thus, the dielectric layer 40 of 3 to 4 μm
And a conductive layer 41 of about 2 μm is formed on the adhesive foil 32. Due to the presence of the dielectric layer 40, this multilayer is well adhered to the rotor and has high mechanical strength.

Instead, before depositing the conductive material layer 41, a floating electric conductor for electrically connecting the slider, for example, is formed in an area where a floating connecting member which does not require so much rigidity is to be formed. In the areas that will be formed, the dielectric layer 40 may be selectively removed from the surface of the adhesive foil 32 by conventional photolithography and etching processes (FIG. 15). However, preferably, the dielectric layer 4 is applied to the remainder of the rotor, which will form the fixed plate (“cap layer”) for the slider.
Leave 1

Next, a layer of standard photosensitive resin is deposited,
Next, it exposes through a mask. Next, the photosensitive resin is developed. Note that the rotor is well protected by the tacky foil 32 and by the layers 40 and 41 so that the photosensitive resin development process does not pose any risk of penetration of the developing solution. Also, since the adhesive foil 32 is covered by the dielectric layer 40 and the conductive layer 41, there is no risk of the foil 32 being etched.

After developing the photosensitive resin, the conductive material layer 4 is formed.
1 is selectively removed (FIG. 16) and, as also shown in FIG. 17, a pad 42A fixed to the rotor for soldering the electrical terminals of the slider and an electrical wire is soldered from the pad 42A. A floating electric conductor 43 reaching the fixing pad 42B and a cap layer 44 on which the slider is arranged and fixed are defined. The conductive layer 41 is etched by first etching back to remove the gold layer and then RIE.
Etching to remove the aluminum layer is included.
The dielectric layer 40 is also selectively removed. Aluminum RIE
The etching is stopped with the adhesive foil 32.

Next, the photosensitive resin layer used for defining the conductive layer 41 is removed by etching, for example, in oxygen plasma.

All the steps described so far are performed on the entire wafer 30 before it is cut into individual dies.

At this point, the wafer 30 is diced into individual dies using the glass base 36 still attached to the back surface of the wafer 30. Glass base 36
Are preferably not cut so that they can be reused.

Next, the glass base 36 is irradiated with ultraviolet rays, and the glass base 36 is removed due to the photo-lability of the adhesive layer of the film 35 in contact with the wafer 30. During these operations, the rotors of a number of microactuators also receive both mechanically sufficient protection and sufficient protection against moisture penetration during die division due to the presence of the adhesive foil 32.

Next, as shown in FIG. 18, each slider 2 for each die is placed on the microactuator 4.

The slider 2 is adhered to the cap layer 44 according to standard methods using a UV curable adhesive layer 45. Implementation of this step may be manual or automatic. Next, the terminal 100 of the slider is soldered to the pad 42A of the floating conductor 43 fixed to the rotor by the "ball bonding" technique. Next, the electrical wire is soldered to the pad 42B.

Next, the die on which the slider 2 has already been mounted is adhered to the gimbal 3a in FIG. 1 by adhering it with an adhesive which is also curable by ultraviolet rays. Finally, the electrical wires that connect the electrical paths on the suspension plate to the die pads are soldered.

As an alternative to the method described above, a die with microactuators is adhered to the gimbal 3a before mounting the slider 2. The slider is attached to the cap layer 44.
It is only glued to. Next, the electrical terminals 100 of the slider are soldered to the pads 42A on the rotor and the electrical wires are soldered to the pads of the die.

As an alternative to the two techniques described above, the slider 2 may be mounted on each microactuator by adhering the slider 2 to each cap layer 44 before dividing the wafer 30 into individual dies. Next, the electrical terminal 100 of the slider is soldered to the pad 42A on the rotor. The wafer is then divided into individual dies and the unit is placed on the gimbal. Next, an electrical wire for connecting to an electrical path on the suspension plate is soldered to the die pad.

As soon as the slider has been placed on the die with the microactuator and on each gimbal, the adhesive foil 32 is removed to free the rotor of the microactuator. For this purpose, the gimbal may be dipped in the solution for several minutes using a NaOH solution having a concentration of about 1.5% by weight. The assembly is then rinsed with water, then rinsed with water with alcohol and finally dried in a vacuum at a temperature of about 120 ° C.

Alternatively, the adhesive foil 32 may be removed by etching in oxygen plasma. This method has the advantage of reducing the damage caused by "stiction" effects that can occur during the drying stage of the technique described above.

Thus, the structure shown in FIG. 19 is obtained. The cap layer 44 floats above the rotor and is fixed to the rotor at 101 points. A conductor 43 floats between the rotor and the stationary part of the microactuator and is fixed to the rotor in the region of pad 42A and to the stationary part in the region of pad 42B.

The floating conductor 43 allows the slider to be electrically connected without disturbing its movement, because the conductor 43 is flexible.

FIG. 20 is an isometric view showing the assembled structure.

The method according to the present invention has the following salient features. That is, the adhesive foil is used as a sacrificial material to form a floating electrical connection member. Also, a process of depositing a tacky foil in the dry state on a microactuator that has already been made, thus depositing a liquid phase of the photopolymer that would result in the photopolymer entering the microactuator or more generally the micromechanism cavity. Can be attached without using.

A further advantage is that the sticky foil can be removed by etching in an oxygen plasma, reducing the potential for damage to microactuators and micromechanisms due to a phenomenon commonly known as "stiction". Is.

Another advantage of the method described above is that mounting the unit consisting of the microactuator and slider on the gimbal is well compatible with conventional assembly, soldering, and testing techniques. . That is, hard disk manufacturers do not have to modify their commonly used technology to adapt it to the presence of microactuators.

Obviously, variations and / or additions may be used in the embodiments described and illustrated above.

[Brief description of drawings]

FIG. 1 is an exploded view showing details of a read / write unit of a hard disk that operates in a micron order.

2 is a schematic plan view showing a microactuator for the unit of FIG.

FIG. 3 is a perspective view showing a semiconductor wafer on which a plurality of microactuators are formed.

FIG. 4 shows a read / write transducer in FIG.
FIG. 5 shows successive steps of a method according to the invention for electrically and mechanically connecting to a microactuator of the type shown in FIG.

FIG. 5 shows a read / write transducer in FIG.
FIG. 5 shows successive steps of a method according to the invention for electrically and mechanically connecting to a microactuator of the type shown in FIG.

FIG. 6 shows a read / write transducer in FIG.
FIG. 5 shows successive steps of a method according to the invention for electrically and mechanically connecting to a microactuator of the type shown in FIG.

FIG. 7 shows a read / write transducer in FIG.
FIG. 5 shows successive steps of a method according to the invention for electrically and mechanically connecting to a microactuator of the type shown in FIG.

FIG. 8 shows a read / write transducer in FIG.
FIG. 5 shows successive steps of a method according to the invention for electrically and mechanically connecting to a microactuator of the type shown in FIG.

FIG. 9 shows a read / write transducer in FIG.
FIG. 5 shows successive steps of a method according to the invention for electrically and mechanically connecting to a microactuator of the type shown in FIG.

10 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

11 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

12 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

13 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

14 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

15 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

16 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

FIG. 17 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

18 shows successive steps of a method according to the invention for electrically and mechanically connecting a read / write transducer to a microactuator of the type shown in FIG.

FIG. 19 is a cross-sectional view showing an example of a read / write transducer arranged on each microactuator.

FIG. 20 is an isometric view showing an example of a read / write transducer and each microactuator arranged on each suspension member.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Suspension plate 2 ... Slider 3 ... Gimbal 4 ... Rotary microactuator 5 ... Stator 6 ... Rotor 7 ... Floating body part 8 ... Movable arm 9 ... Movable electrode 10 ... Annular slot 11 ... Spring 12 ... Pillar 13 ... First fixed arm 14 ... 2nd fixed arm 15 ... 1st fixed region 16 ... Fixed electrode 17 ... 2nd fixed region 20 ... Supply roll 20B ... Collection roll 21 ... Adhesive surface 103 ... Support surface 22 ... Airflow 23 ... Oxygen plasma etching 24 ... N ⁺ Region 25 ... P-type silicon layer 26 ... Drive circuit 360 ... Hard mask material layer 30 ... Silicon wafer 31 ... Die part 32 ... Adhesive foil 33 ... Pressure roller 34 ... Cutting blade 35 ... Double-sided adhesive film 36 ... Base 37 ... Photosensitive resin 38, 39, 380, 390 ... Window 40 ... Insulating dielectric layer 41 ... Conductive layers 42a, 42b ... Pad 43 ... Floating electrical conductor 44 ... Cap layer 45 ... Adhesive layer 100 ... Slider terminals

─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Benedetto Vigna Italy, 85100 Potenza, Via Anzio, 20 (72) Inventor Ubaldo Mastromatteo Italy, 20010 Cornaredo, Via Brera, 18 / See (56) Reference JP-A-7-167885 (JP, A) JP-A-8-140368 (JP, A) JP-A-7-92687 (JP, A) JP-A-6-151998 (JP, A) JP 11-207962 (JP, A) JP 10-86392 (JP, A) US Pat. No. 5454158 (US, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B81C 1/00 -5/00 B81B 1/00-7/00 G11B 21/10 G03F 7/00

Claims (13)

(57) [Claims] 1. A method of manufacturing a floating member for electrically connecting between two parts of a micromechanism movable relative to each other, the method comprising: forming a sacrificial material layer; The step of forming a connecting member and the step of removing the sacrificial material layer below the electrical connecting member, wherein the sacrificial material layer does not enter the hollow portion of the underlying layer and remains dry on the surface of the micromechanism in at least <br/> adhering a thin film having one adhesive surface, the thin
The film has a structure that immobilizes the micromechanism.
A method characterized by working even . 2. A thin film, The method of claim 1, wherein the attaching to the front surface of a plurality of semiconductor wafers micromechanical is formed. 3. The method according to claim 1, wherein the thin film is a film of a photosensitive resin. 4. A thin film according to, which is a type known commercially by the name of RISTON ^R
Item 3. The method according to Item 3 . 5. After the formation of the electrical connection member, according to claim 1 to 4 The method of any one of claims, characterized in that the removal of a thin film by oxygen plasma etching. 6. The thin film is immersed in a NaOH solution and removed after the electrical connection member is formed.
The method according to any one of claims 1 to 4 . 7. The micromechanism is an electrostatic microactuator of the type used for fine positioning of read / write transducers in a hard disk read / write unit.
The method according to claim 1 . 8. A step of selectively removing the thin film after depositing the thin film to open a region for fixing the electrical connection member to the fixed portion and the movable portion of the microactuator, and reading out. / At least one for fixing the plate connecting the writing transducer to the moving part of the microactuator
And selectively removing the two regions, forming a "hard mask" having an opening at a portion of the fixing region on a thin film.
8. The method of claim 7, comprising selectively etching the thin film. 9. Forming a "hard mask" comprises depositing a silicon dioxide or aluminum layer on a thin film at low temperature, the selective removal of the silicon dioxide or aluminum layer being performed by photolithographic techniques. The method according to claim 8 . 10. The method of claim 9 including the step of, after defining the electrical connection members, dividing the semiconductor wafer by cutting into individual dies each containing each microactuator. 11. The method of claim 10, wherein each read / write transducer is mounted on a respective die. 12. The step of gluing each read / write transducer onto each microactuator after defining the electrical connection member, and soldering the terminals of the transducer to the electrical connection member of each microactuator. , claims a semiconductor wafer which transducer is placed divided by cutting, characterized in that it comprises a step of a plurality of individual dies
9. The method described in 9 . 13. The method according to claim 11 , further comprising the step of removing the thin film.