JP3512207B2 - Heating equipment - Google Patents

Heating equipment

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Publication number
JP3512207B2
JP3512207B2 JP01779393A JP1779393A JP3512207B2 JP 3512207 B2 JP3512207 B2 JP 3512207B2 JP 01779393 A JP01779393 A JP 01779393A JP 1779393 A JP1779393 A JP 1779393A JP 3512207 B2 JP3512207 B2 JP 3512207B2
Authority
JP
Japan
Prior art keywords
oxygen concentration
valve
heating
opening amount
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP01779393A
Other languages
Japanese (ja)
Other versions
JPH06226439A (en
Inventor
征志郎 梁池
仁 中平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP01779393A priority Critical patent/JP3512207B2/en
Publication of JPH06226439A publication Critical patent/JPH06226439A/en
Application granted granted Critical
Publication of JP3512207B2 publication Critical patent/JP3512207B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電子機器などに用いられ
るプリント回路基板（以下、基板と略す）を製造する工
程の半田付け工程で使用される加熱装置に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating device used in a soldering step of manufacturing a printed circuit board (hereinafter abbreviated as a board) used for electronic equipment and the like.

【０００２】[0002]

【従来の技術】基板の半田付け工程はほぼ大気中の加熱
または溶融半田槽にて行なわれてきたが、近年は環境汚
染の低減やより高品質の半田付けの要求が高まり、窒素
などの不活性ガスを使用して低酸素濃度雰囲気を作り出
してこの雰囲気での半田付けが急激に増加してきてい
る。2. Description of the Related Art Substrate soldering processes have been carried out in a heating or melting solder bath in the atmosphere, but in recent years, there has been an increasing demand for reduction of environmental pollution and higher quality soldering. An active gas is used to create a low oxygen concentration atmosphere, and soldering in this atmosphere is rapidly increasing.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、従来の
低酸素濃度の雰囲気による加熱装置では、半田付けされ
る基板の大きさや、加熱装置への基板の投入間隔の違い
により、各ゾーンの酸素濃度が大きく異なっている。半
田付け品質を確保する上では、供給されるガスの濃度変
動や経時変化やメンテナンスなどによる装置状態の変化
といった外乱に影響されることなく、一定の酸素濃度の
雰囲気で半田付けすることが不可欠であって、従来では
一定の酸素濃度の雰囲気を確保のため窒素ガスの供給を
過剰に供給している。そのため、窒素ガスの大量消費と
言う問題が発生してきた。However, in the conventional heating device using an atmosphere of low oxygen concentration, the oxygen concentration in each zone may be different due to the size of the substrate to be soldered and the difference in the interval of charging the substrate to the heating device. It's very different. In order to secure the soldering quality, it is essential to solder in an atmosphere with a constant oxygen concentration without being affected by disturbances such as fluctuations in the concentration of the supplied gas, changes over time, and changes in the device state due to maintenance. Therefore, conventionally, the nitrogen gas is excessively supplied in order to secure an atmosphere having a constant oxygen concentration. Therefore, the problem of large consumption of nitrogen gas has occurred.

【０００４】本発明は外乱が発生しても加熱雰囲気を規
定の酸素濃度に維持することができ、しかも不活性ガス
の消費量を低く抑えることができる加熱装置を提供する
ことを目的とする。It is an object of the present invention to provide a heating device capable of maintaining a heating atmosphere at a prescribed oxygen concentration even when a disturbance occurs and suppressing the consumption of an inert gas to a low level.

【０００５】[0005]

【課題を解決するための手段】請求項１記載の加熱装置
は、加熱雰囲気に不活性ガスを供給して加熱雰囲気を低
酸素濃度にする加熱装置において、加熱雰囲気の酸素濃
度を検出する酸素濃度検出手段と、加熱雰囲気へ供給さ
れる不活性ガス量をバルブの開放量によって調節するガ
ス供給制御部と、前記酸素濃度検出手段の検出値が規定
値に近づくように前記バルブの開放量を制御する演算部
と、を設けた加熱装置であって、基板が加熱雰囲気に投
入される前に、前記演算部は、先ず、前記バルブの開放
量を全開にして前記酸素濃度検出手段の検出値が前記規
定値以下に達するまで、もしくは前記規定値を下回るま
で不活性ガスを加熱雰囲気に供給した後、前記バルブの
開放量を半分程度にし、所定時間経過後、前記酸素濃度
検出手段の検出値が前記規定値以下もしくは前記規定値
を下回っているか否かを判定し、前記規定値以下もしく
は前記規定値を下回っていれば前記バルブの開放量をさ
らに半分程度にし、前記規定値を越えていれば、もしく
は前記規定値以上であれば前記バルブの開放量を前々回
の開放量に前回の開放量を加えたものを半分にした量と
する制御を所定回数繰り返し、前記バルブの開放量を最
適な開放量にすることを特徴とする。A heating device according to claim 1, wherein an inert gas is supplied to the heating atmosphere to reduce the oxygen concentration in the heating atmosphere, the oxygen concentration for detecting the oxygen concentration in the heating atmosphere. gas to adjust the detecting means, by the opening amount of the valve of the inert gas amount supplied to the heating atmosphere
A scan supply control unit, a heating device detection value is provided, and a computation unit for controlling the opening amount of the valve so as to approach the predetermined value the oxygen concentration detection means, projecting the substrate within the heating atmosphere
Before being turned on, the arithmetic unit first opens the valve.
With the amount fully open, the value detected by the oxygen concentration detection means is
Until it falls below the specified value or falls below the specified value.
After supplying the inert gas to the heating atmosphere with
Release the amount to about half, and after the lapse of a predetermined time, the oxygen concentration
The detection value of the detection means is less than the specified value or the specified value
Is below the specified value.
Is the opening amount of the valve if it is below the specified value.
If it exceeds the specified value, it will be
Is the opening value of the valve two times before if the specified value or more
The amount obtained by adding the previous amount released to the amount released by
Control is repeated a predetermined number of times to maximize the valve opening amount.
The feature is that the opening amount is appropriate .

【０００６】請求項２記載の加熱装置は、請求項１記載
の加熱装置であって、温度分布を得るために加熱雰囲気
を複数の加熱ゾーンに分割し、各加熱ゾーンごとに前記
酸素濃度検出手段と前記バルブを具備させ、前記演算部
が各加熱ゾーンごとに前記バルブの開放量を制御するこ
とを特徴とする。また、請求項３記載の加熱装置は、請
求項１もしくは２のいずれかに記載の加熱装置であっ
て、基板が加熱雰囲気に投入される前に前記バルブの開
放量を前記最適な開放量にし、基板が加熱雰囲気に投入
されると、前記酸素濃度検出手段により加熱雰囲気の酸
素濃度を検出しその検出値を基に前記演算手段により前
記バルブの開放量を調整することを特徴とする。 A heating device according to a second aspect is the heating device according to the first aspect.
A heating device, the heating atmosphere to obtain a temperature distribution is divided into a plurality of heating zones, wherein each heating zone
The operation unit is provided with an oxygen concentration detecting means and the valve.
Control the opening of the valve for each heating zone.
And are characterized . The heating device according to claim 3 is a contractor.
The heating device according to either claim 1 or 2.
Open the valve before the substrate is placed in a heated atmosphere.
The release amount is set to the optimum opening amount and the substrate is put into a heating atmosphere.
Then, the oxygen in the heating atmosphere is detected by the oxygen concentration detecting means.
The elementary concentration is detected, and based on the detected value,
The feature is that the opening amount of the valve is adjusted.

【０００７】[0007]

【作用】請求項１の構成によると、酸素濃度検出手段の
検出値が規定値に近づくように調節手段を演算部が制御
して加熱雰囲気への不活性ガスの供給量を調節する。According to the structure of the first aspect, the arithmetic unit controls the adjusting means so that the detected value of the oxygen concentration detecting means approaches the specified value, and the supply amount of the inert gas to the heating atmosphere is adjusted.

【０００８】請求項２の構成によると、酸素濃度検出手
段の検出値が規定値に近づくように各加熱ゾーンごとの
調節手段を演算部が制御して、各加熱ゾーンへの不活性
ガスの供給量を調節する。According to the structure of claim 2, the arithmetic unit controls the adjusting means for each heating zone so that the detection value of the oxygen concentration detecting means approaches the specified value, and the inert gas is supplied to each heating zone. Adjust the amount.

【０００９】[0009]

【実施例】以下、本発明を図１〜図３に基づいて説明す
る。図１は本発明の加熱装置の一実施例のリフロー装置
を示し、基板１はコンベア２によって連続して装置に投
入される。不活性ガスとしての窒素ガスＮ2 は、調節装
置としての第１のバルブ３と第２のバルブ４ａ〜４ｄを
介して第１〜第４のゾーンＰＨ１，ＰＨ２，ＲＦ１，Ｒ
Ｆ２に供給されている。第１〜第４のゾーンＰＨ１〜Ｒ
Ｆ２に供給された窒素ガスＮ2 はそれぞれヒータ５によ
って加熱されて熱風ガスとなり、この熱風ガスの循環に
よって基板１の上の半田が溶融して基板１に電子部品を
半田付けする。第１〜第４のゾーンＰＨ１〜ＲＦ２の酸
素濃度は、酸素濃度検出器６により検出されて刻々と演
算部７へ通知される。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to FIGS. FIG. 1 shows a reflow apparatus as an embodiment of the heating apparatus of the present invention, in which a substrate 1 is continuously loaded into the apparatus by a conveyor 2. Nitrogen gas N 2 as an inert gas is passed through the first valve 3 and the second valves 4a to 4d as a control device to the first to fourth zones PH1, PH2, RF1, R.
It is supplied to F2. First to fourth zones PH1 to R
The nitrogen gas N 2 supplied to F2 is heated by the heater 5 to become hot air gas, and the circulation of this hot air gas melts the solder on the substrate 1 to solder the electronic components to the substrate 1. The oxygen concentrations in the first to fourth zones PH1 to RF2 are detected by the oxygen concentration detector 6 and notified to the calculation unit 7 every second.

【００１０】演算部７は図３に示すフローチャートのよ
うに構成されている。供給されるガス流量をＱとし、酸
素濃度をＣＣＬそれぞれの加熱ゾーンＰＨ１〜ＲＦ２の
ガス流量、酸素濃度検出値、酸素濃度設定値を下記の表
のように規定する。The arithmetic unit 7 is constructed as shown in the flow chart of FIG. The supplied gas flow rate is Q, and the oxygen concentration is defined as the gas flow rate, the oxygen concentration detection value, and the oxygen concentration set value of the heating zones PH1 to RF2 of each CCL as shown in the following table.

【００１１】[0011]

【表１】 [Table 1]

【００１２】先ず、本装置が安定した状態になるまで基
板１を投入せずに、各ゾーンの温度や酸素濃度が設定さ
れた状態になるまで空運転を行う。第１のバルブ３を開
放（通常は１００％）し、窒素ガスＮ2 を各ゾーンに供
給する。最初は各ゾーンとも Ｃ＞＞Ｃｏ （Ｃａ＞＞Ｃａｏ） である。わかり易くするために第１ゾーンＰＨ１につい
て説明する。First, the substrate 1 is not charged until the apparatus is in a stable state, and the idle operation is performed until the temperature and oxygen concentration in each zone are set. The first valve 3 is opened (usually 100%), and nitrogen gas N 2 is supplied to each zone. Initially, C >> Co (Ca >> Cao) in each zone. The first zone PH1 will be described for clarity.

【００１３】図２に示すように、＃１で第２のバルブ４
ａを開き（通常は全開＝１００％）にて窒素ガスＮ2 を
第１ゾーンＰＨ１に供給し、第１ゾーンＰＨ１の酸素濃
度が Ｃａ≦Ｃａｏ に達したことを＃２で検出するまで窒素ガスＮ2 を充填
する。その後、＃３では第２のバルブ４ａを絞って Ｑａ1 ＝Ｑａmax ／２ （５０％） にして＃４でＴ時間の経過を観測し、＃５では Ｃａ≦Ｃａｏ かどうかを判定する。＃５で“ Ｃａ≦Ｃａｏ ”であ
れば＃６を実行して第２のバルブ４ａをさらに絞って Ｑａ2 ≦Ｑａ1 ／２ （２５％） にする。＃５で“ Ｃａ＞Ｃａｏ ”であれば＃７を実
行して第２のバルブ４ａを開き、最適に供給ガス量“
Ｑａ0 ＞Ｑａ（Ｃａ0 ） ”を求める。他のゾーンＰＨ
２，ＲＦ１，ＲＦ２についても同様に求める。すなわ
ち、下記のような関係になる。As shown in FIG. 2, the second valve 4 is connected to # 1.
Nitrogen gas N 2 is supplied to the first zone PH1 by opening a (normally fully open = 100%), and nitrogen gas is detected until it is detected in # 2 that the oxygen concentration in the first zone PH1 reaches Ca ≦ Cao. Fill with N 2 . After that, in # 3, the second valve 4a is throttled to set Qa 1 = Qa max / 2 (50%) and the lapse of T time is observed in # 4. In # 5, it is determined whether Ca ≦ Cao. # To "Ca ≦ Cao" running # 6 if the second valve 4a further squeezed by Qa 2 ≦ Qa 1/2 ( 25%) at 5. If "Ca>Cao" in # 5, # 7 is executed to open the second valve 4a, and the optimum supply gas amount "
Qa 0 > Qa (Ca 0 ) ″ is determined. Other zone PH
2, RF1 and RF2 are similarly obtained. That is, the relationship is as follows.

【００１４】 Ｑａ（ｔn+1 ）＝ｆａ（ｔn+1 ）・Ｑａ（ｔn ） このようにして、各ゾーンの第２のバルブ４ａ〜４ｄが
格別に最適なガス流量に制御されてから、基板１が投入
されて生産が開始される。基板１が投入されると、基板
１と共に外気が装置内に入り込んで各ゾーンの酸素濃度
が高くなる場合がある。最初の第１ゾーンＰＨ１は直ち
に酸素濃度の比較を行い第２のバルブ４ａを制御する。
第２ゾーンＰＨ２については、第１ゾーンＰＨ１の酸素
濃度が高くなって第２ゾーンＰＨ２も同様に酸素濃度が
高くなると考えられ、前もって第２のバルブ４ｂを多め
に開いて酸素濃度の上昇を防ぐ。Qa (t n + 1 ) = fa (t n + 1 ) Qa (t n ) In this way, the second valves 4a to 4d in each zone are controlled to a particularly optimum gas flow rate. Then, the substrate 1 is put in and production is started. When the substrate 1 is introduced, outside air may enter the device together with the substrate 1 and the oxygen concentration in each zone may increase. In the first first zone PH1, the oxygen concentration is immediately compared and the second valve 4a is controlled.
Regarding the second zone PH2, it is considered that the oxygen concentration in the first zone PH1 becomes high and the oxygen concentration in the second zone PH2 becomes high as well, and the second valve 4b is opened in advance to prevent the increase in oxygen concentration. ..

【００１５】Ｑｂ（ｔn+1 ）＝（ｆａ（ｔn ）−１＋ｆ
ｂ（ｔn ））・Ｑｂ（ｔn ） 第３，第４ゾーンＲＦ１，ＲＦ２についても同様に前も
って第２のバルブ４ｃ，４ｄを多めに開いて酸素濃度の
上昇を防ぐ。以上の制御を各ゾーンＰＨ１，ＰＨ２，Ｒ
Ｆ２，ＲＦ２について表したものが図３に示すフローチ
ャート図である。Qb (t n + 1 ) = (fa (t n ) -1 + f
b (t n )) · Qb (t n ) Similarly, for the third and fourth zones RF1 and RF2, too, the second valves 4c and 4d are opened in advance to prevent the oxygen concentration from rising. The above control is applied to each zone PH1, PH2, R
FIG. 3 is a flow chart showing F2 and RF2.

【００１６】したがって、基板１のサイズなどの変化が
発生しても早く追従し、最適な条件を装置内で求めて窒
素ガスの供給量を制御して各加熱ゾーンＰＨ１〜ＲＦ２
ごとの酸素濃度を設定値のＣａｏに維持できる。Therefore, even if a change in the size of the substrate 1 occurs, it quickly follows up, the optimum conditions are obtained in the apparatus, and the supply amount of nitrogen gas is controlled to control each heating zone PH1 to RF2.
The oxygen concentration for each can be maintained at the set value of Cao.

【００１７】[0017]

【発明の効果】本発明によれば、酸素濃度検出手段の検
出値が規定値に近づくようにバルブの開放量を演算部が
制御して加熱雰囲気への不活性ガスの供給量を最適値に
調節することができ、不活性ガスの消費量を低く抑える
ことができる。 According to the present invention, the arithmetic unit controls the opening amount of the valve so that the detection value of the oxygen concentration detecting means approaches the specified value, and the supply amount of the inert gas to the heating atmosphere is optimized. It can be adjusted and the consumption of inert gas can be kept low.

【００１８】また、各加熱ゾーンへの不活性ガスの供給
量を調節して各加熱ゾーンごとの酸素濃度を最適値に調
節することができる。また、基板の生産開始後において
も、酸素濃度を最適値に維持することができる。 Further, adjustment to the optimum value of oxygen concentration for each heating zone by adjusting the supply amount of the inert gas into the heating zone
Can be saved. In addition, after the start of production of the board
Also, the oxygen concentration can be maintained at the optimum value.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の加熱装置の一実施例の構成図。FIG. 1 is a configuration diagram of an embodiment of a heating device of the present invention.

【図２】同実施例の演算部を説明するフローチャート
図。FIG. 2 is a flow chart illustrating a calculation unit of the embodiment.

【図３】同実施例の演算部のフローチャート図。FIG. 3 is a flowchart of a calculation unit of the same embodiment.

【符号の説明】[Explanation of symbols]

１ 基板 ３ 第１のバルブ ４ａ〜４ｄ 第２のバルブ ６ 酸素濃度検出器 ７ 演算部 ８ ガス供給制御部 1 substrate 3 first valve 4a-4d Second valve 6 Oxygen concentration detector 7 operation part 8 Gas supply controller

フロントページの続き (56)参考文献 特開 平３−101296（ＪＰ，Ａ) 特開 平４−200893（ＪＰ，Ａ) 特開 平４−356349（ＪＰ，Ａ) 特開 平４−13475（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 1/008 B23K 31/02 H05K 3/34 Continuation of front page (56) Reference JP-A-3-101296 (JP, A) JP-A-4-200893 (JP, A) JP-A-4-356349 (JP, A) JP-A-4-13475 (JP , A) (58) Fields investigated (Int.Cl. 7 , DB name) B23K 1/008 B23K 31/02 H05K 3/34

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】加熱雰囲気に不活性ガスを供給して加熱雰
囲気を低酸素濃度にする加熱装置において、加熱雰囲気
の酸素濃度を検出する酸素濃度検出手段と、加熱雰囲気
へ供給される不活性ガス量をバルブの開放量によって調
節するガス供給制御部と、前記酸素濃度検出手段の検出
値が規定値に近づくように前記バルブの開放量を制御す
る演算部と、を設けた加熱装置であって、基板が加熱雰
囲気に投入される前に、前記演算部は、 先ず、前記バルブの開放量を全開にして前記酸素濃度検
出手段の検出値が前記規定値以下に達するまで、もしく
は前記規定値を下回るまで不活性ガスを加熱雰囲気に供
給した後、前記バルブの開放量を半分程度にし、 所定時間経過後、前記酸素濃度検出手段の検出値が前記
規定値以下もしくは前記規定値を下回っているか否かを
判定し、前記規定値以下もしくは前記規定値を下回って
いれば前記バルブの開放量をさらに半分程度にし、前記
規定値を越えていれば、もしくは前記規定値以上であれ
ば前記バルブの開放量を前々回の開放量に前回の開放量
を加えたものを半分にした量とする制御を所定回数繰り
返し、前記バルブの開放量を最適な開放量にすることを
特徴とする 加熱装置。1. A heating device for supplying an inert gas to a heating atmosphere to make the heating atmosphere have a low oxygen concentration, an oxygen concentration detecting means for detecting an oxygen concentration of the heating atmosphere, and an inert gas supplied to the heating atmosphere. a gas supply control unit which adjust <br/> by the opening amount of the valve the amount, the detection value of the oxygen concentration detecting means is provided and arithmetic unit for controlling the opening amount of the valve so as to approach the predetermined value, the A heating device , in which the substrate is in a heating atmosphere.
Before being put into the atmosphere , the calculation unit first fully opens the valve to fully open the oxygen concentration sensor.
Until the detection value of the output means reaches the specified value or less,
Is heated to a temperature below the specified value.
After the supply, the opening amount of the valve is reduced to about half, and after a lapse of a predetermined time, the detected value of the oxygen concentration detecting means is
Whether it is below the specified value or below the specified value
Judged, below the specified value or below the specified value
If so, further reduce the valve opening amount by about half,
If it exceeds the specified value, or is above the specified value
For example, the opening amount of the valve is changed to the opening amount two times before and the previous opening amount.
Repeated a predetermined number of times to halve the amount obtained by adding
Return the valve to the optimum opening amount.
Characteristic heating device. 【請求項２】請求項１記載の加熱装置であって、温度分
布を得るために加熱雰囲気を複数の加熱ゾーンに分割
し、各加熱ゾーンごとに前記酸素濃度検出手段と前記バ
ルブを具備させ、前記演算部が各加熱ゾーンごとに前記
バルブの開放量を制御することを特徴とする加熱装置。2. The heating device according to claim 1 , wherein the heating atmosphere is divided into a plurality of heating zones in order to obtain a temperature distribution, and the oxygen concentration detecting means and the bar are provided for each heating zone.
A heating element, and the computing unit is provided with
A heating device characterized by controlling the opening amount of a valve . 【請求項３】請求項１もしくは２のいずれかに記載の加
熱装置であって、基板が加熱雰囲気に投入される前に前
記バルブの開放量を前記最適な開放量にし、基板が加熱
雰囲気に投入されると、前記酸素濃度検出手段により加
熱雰囲気の酸素濃度を検出しその検出値を基に前記演算
手段により前記バルブの開放量を調整することを特徴と
する加熱装置。 3. The additive according to claim 1 or 2.
A thermal device, before the substrate is put into a heating atmosphere.
Set the valve opening amount to the optimum opening amount described above and heat the substrate.
When it is put into the atmosphere, it is added by the oxygen concentration detection means.
Detect the oxygen concentration in the hot atmosphere and perform the above calculation based on the detected value
The opening amount of the valve is adjusted by means.
Heating device.
JP01779393A 1993-02-05 1993-02-05 Heating equipment Expired - Fee Related JP3512207B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP01779393A JP3512207B2 (en) 1993-02-05 1993-02-05 Heating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01779393A JP3512207B2 (en) 1993-02-05 1993-02-05 Heating equipment

Publications (2)

Publication Number Publication Date
JPH06226439A JPH06226439A (en) 1994-08-16
JP3512207B2 true JP3512207B2 (en) 2004-03-29

Family

ID=11953596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP01779393A Expired - Fee Related JP3512207B2 (en) 1993-02-05 1993-02-05 Heating equipment

Country Status (1)

Country Link
JP (1) JP3512207B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2757650B1 (en) * 1996-12-20 1999-01-15 Air Liquide METHOD FOR SUPPLYING GAS TO A SPEAKER AND METHOD FOR REGULATING THE CONTENT OF A GIVEN ELEMENT IN THE ATMOSPHERE OF SUCH A SPEAKER
US8180114B2 (en) 2006-07-13 2012-05-15 Northrop Grumman Systems Corporation Gesture recognition interface system with vertical display
KR20180081899A (en) * 2017-01-09 2018-07-18 (주)워프비전 Roll to roll reflow apparatus and method and SMT process using this method

Also Published As

Publication number Publication date
JPH06226439A (en) 1994-08-16

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