JP3510866B2 - Semiconductor device test system - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device test system for measuring various characteristics such as frequency characteristics and level (power) characteristics of semiconductor devices.

[0002]

2. Description of the Related Art For example, mobile communication equipment, ITS (intelli
For semiconductor devices composed of complex devices such as amplifiers, mixers, and switches of gent transport systems), the frequency characteristics and level (power) characteristics are measured using a semiconductor device test system (hereinafter abbreviated as test system). It

FIG. 10 is a block diagram of a conventional test system. As shown in FIG. 10, in order to measure the frequency characteristic and level (power) characteristic of a semiconductor device, a processor 50 such as a personal computer, a signal generator 51, and a transmitter tester (characteristic measuring device) 52 are GP. -A test system 53 connected by an IB interface is used.

The processor 50 outputs measurement frequency and level setting information to the signal generator 51 and the transmitter tester 52 by a GP-IB command, respectively. Signal generator 51
Generates a signal at the set frequency and level and outputs it to the semiconductor device. The transmitter tester 52 measures the characteristics of the semiconductor device at the set frequency similarly to the signal generator 51, and outputs the measured level to the processing device 50 in response to the level acquisition request.

Then, the processing device 50 has a frequency (for example, 1 to 10 MHz to 3000 MHz) necessary for characteristic measurement.
The setting information of the measurement frequency and level of the signal generator 51 and the transmitter tester 52 is set by the GP-IB command for 300 times of 0 MHz step).

As a result, the frequency characteristic and level characteristic of the semiconductor device are automatically measured over a predetermined frequency range.

[0007]

By the way, in the above-mentioned conventional test system 53, since the signal from the semiconductor device is received and processed, the A / D converter and the DSP (d
igtal signal processor) is paired and built into the transmitter tester.

However, this type of test system 5
In 3, the power measurement of the fundamental wave, the second harmonic, the third harmonic, and spurious, the adjacent channel leakage power ratio called ACPR and ACLP, etc. are measured for each frequency, and there are many processing items per frequency. . Therefore, it becomes a load of signal processing in the DSP, and it has been desired to increase the processing speed.

Therefore, in the conventional test system, the DS
The processing speed was increased by increasing the clock frequency of P.

However, since the A / D conversion unit and the DSP are paired, the DSP cannot perform the next processing while the A / D conversion unit opens the gate.
There was a limit to increasing the processing speed. That is, even if only the speed of the DSP is increased, it takes time for the data to be acquired by the A / D conversion unit.
The SP speedup did not give the desired results.

Here, FIG. 11 shows the test system 53.
ACPR of PDC (Personal Digital Cellular)
The example of the time chart of the data acquisition time at the time of measuring is shown.

In the case of ACPR measurement of PDC, the main frequencies are f1: 893 MHz, f2: 925 MHz, f3:
The measurement is performed by sequentially setting to 958 MHz. But,
In the conventional test system 53, as shown in FIG.
The A / D conversion unit outputs 110 for each main frequency f1 to f3.
Data acquisition time of ms is required, and even DSP has 110 ms FFT (fast Fourier transform).
Computation time is required, and the overall processing time becomes long,
The processing speed could not be increased.

In particular, wide band W-CDMA ACPR
In the case of measurement, as shown in FIG. 7, the signal is divided into a plurality of frequency regions (bandwidth 3.84 MHz) and main frequencies (f1: 1920 MHz, f2: 1950 MHz, f) are divided.
3: 1980 MHz) for each frequency range (1) to (5)
Is measured.

Therefore, as shown in FIG. 12, when W-CDMA ACPR measurement is performed in the conventional test system, the frequency regions (1) to (5) of the frequencies f1 to f3 are measured.
In contrast, the data acquisition time of 1 ms in the A / D converter, DS
P requires an FFT calculation time of 80 ms. That is, W
In the CDMA ACPR measurement, the number of processing items is larger than that in the PDC ACPR measurement, and the entire processing time is longer, which is an obstacle to speeding up the processing.

As described above, the frequency characteristic, level (power) characteristic, etc. of the semiconductor device cannot be measured at high speed even if the speed of the DSP is simply increased as in the conventional test system 53 described above. .

Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor device test system capable of measuring the frequency characteristic and level (power) characteristic of a semiconductor device at high speed. I am trying.

[0017]

In order to achieve the above object, the invention of claim 1 sets the frequency of the local signal according to the measurement frequency of the signal from the semiconductor device DUT, and In the semiconductor device test system 1 including the transmitter tester 4 that mixes a signal from the semiconductor device to convert the signal to an intermediate frequency, and detects the converted intermediate frequency signal by the detection unit 24 to perform digital waveform processing, A signal generator 3 for generating a measurement signal having a frequency set according to a measurement condition and supplying the signal to the semiconductor device, and an A / D conversion unit for acquiring the signal detected by the detection unit and converting the signal into digital data. Thirty
And a processing unit 31 for processing the digital data converted by the A / D conversion unit in a pair, the data processing unit 25 having a plurality of sets, and one of the plurality of A / D conversion units. A / D conversion section switching means 26 which is selectively switched and connected to the detection section, and the frequency of the signal output by the signal generator is set based on measurement conditions to control the output, and the A / D conversion section A data processing unit for selectively switching control of the conversion unit switching unit, the data acquisition from the detection unit by the A / D conversion unit, and the data processing unit forming a pair with the A / D conversion unit. It is characterized by performing parallel processing with the signal processing by.

The invention of claim 2 is the semiconductor device DUT.
The frequency of the local signal is set according to the measured frequency of the signal from the device, the set local signal and the signal from the semiconductor device are mixed and converted into an intermediate frequency, and the converted intermediate frequency signal is detected. In the semiconductor device test system 1 including the transmitter tester 4 that detects the digital waveform by the unit 24 and processes the digital waveform, the signal generator that generates the measurement signal set to the frequency according to the measurement condition and supplies the signal to the semiconductor device. 3, a plurality of local signal sources 12 for generating a local signal set to a frequency according to a measurement condition and outputting it to the transmitter tester, and selectively switching to any one of the plurality of local signal sources. Local signal source switching means 13 connected to the transmitter tester
And an A / D conversion unit 30 that acquires the signal detected by the detection unit and converts it into digital data, and a processing unit 31 that processes the digital data converted by the A / D conversion unit as a pair. A data processing unit 25 having a plurality of sets, and provided between the detection unit and the plurality of A / D conversion units, and electrically connecting any one A / D conversion unit to the detection unit A
A / D converter switching means 26 and a frequency of a signal output from the signal generator and the local signal source are set based on the measurement condition to control output, and the A / D converter switching means is selectively operated. And a processing device 2 for switching control of the local signal source switching means so that the local signal source is selectively switched in order of measurement frequency, and the detection by the A / D converter is performed. It is characterized in that data acquisition from the unit and signal processing by the data processing unit paired with the A / D conversion unit are processed in parallel.

According to a third aspect of the present invention, in the semiconductor device test system according to the second aspect, the frequency of the local signal source 12 of the signal generator 3 is set by the processing device 2, and the local signal source switching means 13 is provided. Thus, the measuring signal is supplied to the semiconductor device DUT in synchronization with any one of the local signal sources being selectively switched.

[0020]

1 is a diagram showing a schematic configuration of a test system according to the present invention, FIG. 2 is a block diagram showing an internal configuration of the system, and FIG. 3 is a block showing an internal configuration of a transmitter tester of the system. It is a figure.

The test system 1 of this example includes a processing device 2,
A signal generator 3, a transmitter tester (characteristic measuring device) 4, and a local signal generation module (hereinafter abbreviated as LO module) 5 are provided.

Semiconductor device DUT as DUT
Is, for example, mobile communication equipment, ITS (intelligent trans
It consists of composite devices such as amplifiers, mixers, and switches of port systems). The semiconductor device DUT is electrically connected to the signal generator 3 and the transmitter tester 4 via a signal cable while being mounted on a test fixture (not shown).

The processing device 2 is composed of a terminal device such as a personal computer, and has a CPU 2a, a data storage means 2b for storing measurement data, and a ROM, RAM, etc. for storing control programs and the like.

The processing device 2 is a GP-IB or RS2.
A control procedure (control method) is registered in each setting table of the signal generator 3, the transmitter tester 4, and the LO module 5 with an interface such as 23C.

That is, the processor 2 sends various parameters for initial setting based on the measurement conditions to the signal generator 3, the transmitter tester 4 and the LO through the interface such as GP-IB or RS223C before the start of measurement. Module 5
Send to and set. The parameters include a frequency band for measuring characteristics, a measurement frequency step, a level at each frequency, and the like.

As shown in FIG. 2, the signal generator 3 includes a signal generating means 6 for generating and outputting a test signal (measurement signal) supplied to the semiconductor device DUT. The signal generating means 6 controls the signal to be generated and output based on the measurement condition set in the procedure storing means 7.

The procedure storing means 7 sets a plurality of frequencies and levels of the signal output from the signal generating means 6 in a predetermined frequency band for each predetermined frequency step based on the initial setting parameters sent from the processing device 2. . The setting contents are stored in the setting table 7a.

The synchronizing means 8 has a trigger interface, controls the start of measurement based on a trigger (single pulse trigger signal) from the processing device 2, and causes the signal generating means 6 to generate and output a signal. Then, the synchronization means 8 uses the trigger interface after the measurement is started, and the processing device 2
Each time a trigger is received from, the frequency and level of the signal set in the setting table 7a are sequentially read for each frequency step and output to the signal generating means 6 is repeated.

The transmitter tester 4 is a semiconductor device DUT.
The signal measuring means 9 for measuring the frequency characteristic and the level (power) characteristic of is provided. The signal measuring means 9 measures the level for each measurement frequency based on the measurement conditions set in the procedure storing means 10.

The procedure storing means 10 is based on the parameters of the initial setting sent from the processing device 2, and the signal measuring means 9
A plurality of signals to be measured in (1) are set in a predetermined frequency band for each predetermined frequency step. This setting content is the setting table 1
It is stored in 0a.

The synchronizing means 11 is provided with a trigger interface, and controls the start of measurement by the signal measuring means 9 based on the trigger (single pulse trigger signal) from the processor 2. Then, the synchronization means 11 causes the processing device 2 after the start of measurement.
Each time the trigger is received, the frequency of the signal set in the setting table 10a is sequentially read at each frequency step and output to the signal measuring means 9 is repeated.

The internal structure of the signal measuring means 9 of the transmitter tester 4 will be described with reference to the block diagram of FIG.

The transmitter tester 4 of this example changes the frequency of the local signal linearly with respect to the time axis to sweep the frequency, and mixes the frequency-swept local signal with the signal from the semiconductor device DUT. Convert to an intermediate frequency,
The converted IF signal has a function of performing band limitation, analog level detection, processing of the detected signal, and waveform display (function equivalent to a signal analyzer called a spectrum analyzer).

As shown in FIG. 3, the signal measuring means 9 comprises a frequency converter 21, a sweep controller 22, and an RBW filter 2.
3, a detection unit 24, a switching unit 25, a data processing unit 26, a display unit 27, a first switching unit 28, a second switching unit 29 is configured roughly.

The frequency converter 21 includes a local oscillator 21a,
It has a signal mixer 21b. The local oscillator 21a is
The oscillation frequency is swept over a predetermined frequency range (frequency sweep) so that the frequency of the local signal changes linearly with respect to the time axis by the sweep signal from the sweep control unit 22.
To be done.

The signal mixer 21b is a semiconductor device DU.
The signal under measurement from T and the local signal from the local oscillator 21a or the LO module 5 are mixed and converted into an intermediate frequency signal (IF signal).

The sweep control section 22 outputs a sweep signal (voltage signal) for sweeping the output frequency of the local oscillator 21a in a predetermined sweep time. That is, the sweep control unit 22
Inputs a sweep signal to the local oscillator 21a in order to sweep the oscillation frequency of the local oscillator 21a over a predetermined frequency range, and variably controls the oscillation frequency of the local oscillator 21a.

The RBW filter 23 is composed of an analog band pass filter, and the bandwidth (RBW) is variably set according to the user setting. The RBW filter 23 removes unnecessary frequency components of the intermediate frequency signal input from the frequency conversion unit 21, and passes only the intermediate frequency signal of the frequency component of the variably set bandwidth.

The detecting section 24 receives the intermediate frequency signal that has passed through the RBW filter 23 or the intermediate frequency signal from the signal mixer 21b, detects it, and outputs the detected signal to the data processing section 25.

The data processing unit 25 comprises a plurality of A / D conversion units 30 and processing units 31 forming a pair. Figure 3
In this example, the A / D conversion unit 30A and the processing units 31A, A / D
Two sets of the conversion unit 30B and the processing unit 31B form a pair to configure the data processing unit 25. Each A / D converter 3
When 0 is connected to the detection unit 24 by the switching selection of the A / D conversion unit switching unit 26, the signal detected by the detection unit 24 is converted into digital data.

Each processing section 31 is provided with a data storage section 31a and a signal processing section 31b, and is composed of, for example, a DSP. The data storage unit 31a includes a pair of A / D conversion units 30.
The digital data converted by is stored and stored. The signal processing unit 31b performs signal processing (FFT (fast Fourier Fourier transform) on the digital data stored in the data storage unit 31a.
ransform: Fast Fourier transform) calculation), and the processing result is displayed on the display unit 27.

The A / D conversion section switching means 26 includes a detection section 24.
And a plurality of A / D conversion units 30. A / D
The conversion unit switching means 26 has its contacts switched and controlled by a control signal from the processing device 2, and the detection unit 24 and any one A / A
The D converter 30 is electrically connected.

Based on the result of the signal processing unit 31b, the display unit 27 displays the spectrum waveform with the horizontal axis on the screen as the frequency axis and the vertical axis as the intensity, or displays digital waveform processed numerical data. There is.

The first switching unit 28 is provided so as to switch the contacts to the local oscillator 21a side or the LO module 5 side so that the path is selected. In addition, the second switching unit 29, the RB
The contact is switched to the W filter 23 side or the detection unit 24 side so that the path is selected. The contacts of the first switching unit 28 and the second switching unit 29 are switched and controlled by a control signal from a control unit (CPU) (not shown) of the transmitter tester 4 based on user settings.

When the signal from the semiconductor device DUT is measured at a predetermined frequency point and subjected to digital waveform processing, the contact point of the first switching unit 28 is the LO module by the control signal from the control unit (CPU) (not shown). It is switched to the 5 side, and the contact point of the second switching section 29 is switched to the detecting section 24 side.

As a result, the local signal from the LO module 5 is input to the signal mixer 21b via the first switching section 28 and mixed with the signal from the semiconductor device DUT. Then, the IF signal mixed by the signal mixer 21b is detected by the detection unit 24 without passing through the RBW filter 23. The detected signal is converted into digital data by the A / D conversion section 30 which is switched and selected by the A / D conversion section switching means 26, and the data is acquired. Then, the data acquired by the A / D conversion unit 30 is subjected to FFT calculation by the processing unit 31 forming a pair, and the display unit 27 is displayed based on the calculation result.

On the other hand, when the signal from the semiconductor device DUT is analog-detected to display the spectrum waveform, the contact point of the first switching unit 28 is locally changed by the control signal from the control unit (CPU) (not shown). The contact of the second switching unit 29 is switched to the oscillator 21a side, and the RBW filter 23
Can be switched to the side.

As a result, the local signal from the local oscillator 21a whose frequency has been swept by the sweep control unit 22 becomes the first signal.
The signal is input to the signal mixer 21b via the switching unit 28 and mixed with the signal from the semiconductor device DUT. The IF signal mixed by the signal mixer 21b is band-limited by the RBW filter 23 and then detected by the detection unit 24. The detected signal is converted into digital data by the A / D conversion section 30 which is switched and selected by the A / D conversion section switching means 26, and the data is acquired. Then, the data acquired by the A / D conversion unit 30 is subjected to signal processing by the processing unit 31 forming a pair, and the display unit 27 is displayed based on the processing result.

The LO module 5 is a local signal source (LO signal source) for inputting a local signal to the signal mixer 21b.
Have twelve. The LO signal source 12 is, as shown in FIG. 2, a signal generating means 14, a procedure storing means 15, and a synchronizing means 1.
6 is provided.

The signal generator 14 supplies a local signal to the signal mixer 21b of the frequency converter 21 of the transmitter tester 4. The signal generating means 14 controls the signal generated and output based on the measurement condition set in the procedure storing means 15.

The procedure storing means 15 is based on the initial setting parameters sent from the processing device 2 and is based on the signal generating means 1
A plurality of frequencies and levels of the signal output from 4 are set in a predetermined frequency band for each predetermined frequency step. The contents of this setting are stored in the setting table 15a.

The synchronizing means 16 has a trigger interface, controls the start of measurement based on a trigger from the processing device 2, and causes the signal generating means 14 to generate and output a signal. Then, the synchronization means 16 causes the processing device 2 after the start of measurement.
Each time a trigger (single pulse trigger signal) from is received, the frequency and level of the signal set in the setting table 15a are sequentially read for each frequency step and output to the signal generating means 14 is repeated.

FIG. 4 is a flow chart showing the measurement operation of the test system 1 configured as described above.

In the test system 1 of the present example, when the processing device 2 outputs a measurement start trigger at the start of measurement, the signal generator 3 sets the frequency and level at the start stored in the setting table 7a to the signal generating means 6. Set to. The signal generating means 6 generates and outputs a signal of this frequency and level (SP1).

The transmitter tester 4 sets the starting frequency stored in the setting table 10a in the signal measuring means 9 based on the input of the trigger output from the processing device 2.

The LO module 5 sets the starting frequency stored in the setting table 15a in the signal generating means 14 based on the input of the trigger output from the processing device 2. With the above settings, the signal measuring means 9 of the transmitter tester 4 measures the output level of the semiconductor device DUT at this frequency (SP2). Thereby, the characteristic measurement at the measurement start frequency is performed.

Next, the signal generator 3 generates a signal at the next frequency and level stored in the setting table 7a each time a trigger is input from the processing device 2. Also,
The LO module 5 sets the frequency stored in the setting table 15a in the signal generating means 14 each time a trigger is input from the processing device 2. Then, the transmitter tester 4 measures the output level of the semiconductor device at the next frequency stored in the setting table 10a each time the trigger of the processing device 2 is input.

Thereafter, by inputting a trigger from the processing device 2 to the signal generator 3, the transmitter tester 4 and the LO module 5, the characteristic measurement is automatically executed at a predetermined frequency step until the final set frequency is reached ( SP3).

Here, FIG. 5 is a time chart showing an example of the data acquisition time when the ACPR measurement of the PDC is performed by the test system of this example.

When performing the ACPR measurement of the PDC, the main frequency of the signal generator 3 and the LO module 5 is f1: 8.
93MHz, f2: 925MHz, f3: 958MHz
Are sequentially set to, and the measurement is performed for each of the main frequencies f1 to f3.

In the test system of this example, first, the A / D
The detection unit 24 and the A / D conversion unit 3 are converted by the conversion unit switching unit 26.
0A is connected, and the detection signal by the detection unit 24 when the main frequency f1 is set is 11 by the A / D conversion unit 30A.
It is converted into digital data in 0 ms and data is acquired. The data acquired by the A / D conversion unit 30A is
A processing unit (DSP) 3 which forms a pair with the A / D conversion unit 30A
The FFT operation is performed in 110 ms by 1A.

F when the main frequency f1 is set
In parallel with the signal processing of the FT operation, the detection unit 24 and the A / D conversion unit 30B are connected by the A / D conversion unit switching means 26, and the detection signal by the detection unit 24 when the main frequency f2 is set is A. The / D conversion unit 30B converts the data into digital data in 110 ms and acquires the data. The data acquired by the A / D conversion unit 30B is processed by the processing unit (DSP) 31B paired with the A / D conversion unit 30B.
FFT operation is performed in 0 ms.

F when the main frequency f2 is set
In parallel with the signal processing of the FT operation, the detection unit 24 and the A / D conversion unit 30A are connected again by the A / D conversion unit switching means 26, and the detection signal by the detection unit 24 at the time of setting the main frequency f3 is generated. The A / D converter 30A converts the data into digital data in 110 ms and acquires the data. A /
The data acquired by the D conversion unit 30A is the A / D
An FFT operation is performed in 110 ms by a processing unit (DSP) 31A that forms a pair with the conversion unit 30A.

Next, FIG. 6 is a time chart showing an example of the data acquisition time when the ACPR measurement of W-CDMA is performed by the test system of this example.

When performing W-CDMA ACPR measurement,
As shown in FIG. 7, the signal is divided into a plurality of frequency regions (bandwidth 3.84 MHz), and the main frequencies of the signal generator 3 and the LO module 5 are f1: 1920 MHz and f2:
1950 MHz and f3: 1980 MHz are sequentially set, and each frequency range (1) is set for each main frequency f1 to f3.
The measurement of (5) is performed.

In the test system of this example, first, the A / D
The detection unit 24 and the A / D conversion unit 3 are converted by the conversion unit switching unit 26.
0A is connected, the detection signal by the detection unit 24 when the main frequency f1−frequency region (1) is set is converted into digital data by the A / D conversion unit 30A in 1 ms, and data acquisition is performed. The data acquired by the A / D conversion unit 30A is subjected to FFT operation in 80 ms by the processing unit (DSP) 31A which forms a pair with the A / D conversion unit 30A.

In parallel with the signal processing of the FFT calculation when setting the main frequency f1−frequency domain (1), A
The detection unit 24 and the A / D conversion unit 30B are connected by the / D conversion unit switching means 26, and the detection signal by the detection unit 24 when the main frequency f1−frequency region (2) is set is A / D.
The conversion unit 30B converts the data into digital data in 1 ms and acquires the data. The data acquired by the A / D conversion unit 30B is subjected to FFT operation in 80 ms by the processing unit (DSP) 31B which is paired with the A / D conversion unit 30B.

Thereafter, similarly, the remaining frequency regions (3) to (5) of the main frequency f1, the frequency regions (1) to (5) of the main frequency f2, and the frequency regions (1) to (() of the main frequency f3. 5) Data acquisition and FFT calculation at the time of setting are processed in parallel.

Thus, in the test system of this example,
After the first data is acquired after setting the main frequency, the data acquisition by the A / D conversion unit 30 and the processing unit 31 are performed.
The FFT calculation by is executed in parallel.

Then, in the case of the ACPR measurement of PDC, if the time chart of FIG. 5 is executed by the test system of this example, compared with the conventional test system that executes the time chart of FIG. The processing can be doubled, and the processing speed can be increased.

Further, in the case of W-CDMA ACPR measurement, when the time chart of FIG. 6 is executed by the test system of this example, the processing speed is higher than that of the conventional test system which executes the time chart of FIG. Can be realized.

Thus, in the test system of this example,
A / D conversion unit (A / D converter) 30 and processing unit (DS
P) 31 are provided in pairs, and these are selectively switched and controlled. As a result, the data acquisition by the A / D conversion unit 30 and the signal processing (FFT operation) by the processing unit 31 can be executed in parallel, and the processing speed can be increased. As a result, the frequency characteristic and level (power) characteristic of the semiconductor device can be measured at high speed.

By the way, the test system 1 of the above-mentioned embodiment has a configuration in which only one LO module 5 outputs a local signal, but it may have a configuration in which a plurality of LO modules 5 are provided.

FIG. 8 is a diagram showing another embodiment of the test system according to the present invention, and is a schematic configuration diagram of a test system provided with a plurality of LO modules. The same components as those of the test system 1 shown in FIGS. 1 to 3 are designated by the same reference numerals, and detailed description thereof is omitted.

LO in the test system 1 shown in FIG.
The module 5 includes a plurality of local signal sources (hereinafter referred to as LO signal source 12) LO1 and LO2, and a local signal source switching unit 13. Each LO signal source 12 is
As shown in FIG. 8, the signal generating means 14 and the procedure storing means 1
5, the synchronization means 16 is provided. In addition, in FIG.
Although two signal sources 12 are shown as an example, three or more signal sources 12 may be provided.

The signal generating means 14 controls the mixer 21b of the frequency converter 21 of the transmitter tester 4 when the LO signal source 12 including the signal generating means 14 is switched and selected by the local signal source switching means 13. To supply local signals. This signal generating means 14 is a procedure storing means 15
The signal to be generated and output is controlled based on the measurement condition set to.

The procedure storage means 15 is based on the parameters of the initial setting sent from the processing device 2, and the signal generation means 1
A plurality of frequencies and levels of the signal output from 4 are set in a predetermined frequency band for each predetermined frequency step. The contents of this setting are stored in the setting table 15a.

The synchronizing means 16 is provided with a trigger interface, controls the start of measurement based on the trigger from the processing device 2, and causes the signal generating means 14 to generate and output a signal. Then, the synchronization means 16 causes the processing device 2 after the start of measurement.
Each time a trigger (single pulse trigger signal) from is received, the frequency and level of the signal set in the setting table 15a are sequentially read for each frequency step and output to the signal generating means 14 is repeated.

The local signal source switching means 13 is composed of a switch capable of high-speed switching, and has a transmitter tester 4 and a plurality of L's.
It is provided between the O signal source 12. The local signal source switching means 13 is switching-controlled by a control signal from the processing device 2 so that any one of the LO signal sources 12 is selected.

The transmitter tester 4 has the same configuration as that shown in FIG. 3, and the first switching section 28 includes the local signal source switching means 13 therein.
Are connected.

In the test system 1 of FIG. 8, when the processing device 2 outputs a measurement start trigger at the start of measurement, the signal generator 3 sets the frequency and level at the start stored in the setting table 7a to the signal generating means 6 Set to. The signal generating means 6 generates and outputs a signal of this frequency and level.

The transmitter tester 4 sets the starting frequency stored in the setting table 10a in the signal measuring means 9 based on the input of the trigger output from the processing device 2.

Each LO signal source 12 of the LO module 5 is
Based on the input of the trigger output from the processing device 2, the starting frequency stored in the setting table 15a is set in the signal generating means 14. At that time, the local signal source switching means 13 is based on the input of the control signal output from the processing device 2, and the LO signal source 12 set to the measurement start frequency.
Switch the contact so that is selected. With the above settings, the signal measuring means 9 of the transmitter tester 4 measures the output level of the semiconductor device DUT at this frequency.
Thereby, the characteristic measurement at the measurement start frequency is performed.

Next, the signal generator 3 generates a signal at the next frequency and level stored in the setting table 7a each time a trigger is input from the processing device 2. Also,
Each LO signal source 12 of the LO module 5 sets the frequency stored in the setting table 15a in the signal generating means 14 each time a trigger is input from the processing device 2. At that time, the local signal source switching means 13 switches the contacts so that the LO signal source 12 set to the next measurement frequency is selected based on the input of the control signal output from the processing device 2. Then, the transmitter tester 4 measures the output level of the semiconductor device at the next frequency stored in the setting table 10a each time the trigger of the processing device 2 is input.

After that, the final set frequency is reached by the input of a trigger from the processing device 2 to the signal generator 3, the transmitter tester 4 and the LO signal source 12, and the switching control of the local signal source switching means 13 by the processing device 2. Up to this, the characteristic measurement at the predetermined frequency step is automatically executed.

As described above, the input of the trigger from the processing device 2 to the signal generator 3, the transmitter tester 4 and the LO signal source 12 and the local signal source switching means 13 by the processing device 2 are performed.
By the switching control of (1), a series of measurements of the semiconductor device DUT are executed at high speed in synchronization with each other.

Further, at the time of measurement, the LO module 5
Each LO signal source 12 of
Since the frequency of the output signal is set in advance, the local signal source switching means 13 is switched at high speed under the control of the processing device 2, and the transmitter tester 4 can operate at high speed.

The processing of the signal detected by the detector 24 after setting the measurement frequency is executed in the same manner as in the above-mentioned test system. That is, the data acquisition by the A / D conversion unit 30 and the signal processing (FFT operation) by the processing unit 31 are executed in parallel to increase the processing speed.

Here, FIG. 9 is a time chart showing an example of the frequency switching time in the test system having a plurality of LO signal sources. In FIG. 9, the LO module 5
In this configuration, four LO signal sources 12 are provided, and the frequencies are sequentially switched to f1 to f4 for measurement.

In the example shown in FIG. 9, the signal generator 3 executes the command in response to the trigger input from the processing device 2 and the time required to stabilize the output signal is 10 times.
ms. Further, in the LO signal source 12, the time required for the command output by the trigger input from the processing device 2 to stabilize the output signal is set to 40 ms.

In the example of FIG. 9, the LO signal source (LO1) is set to the frequency f1, the LO signal source (LO2) is set to the frequency f2 after 10 ms, and the LO signal source ( LO3) is set to the frequency f3, and finally the LO signal source (LO4) is set to the frequency f4.
The frequency setting at this time is executed by a trigger input from the processing device 2. Then, 40 ms after the LO signal source (LO1) is set to the frequency f1, the signals are sequentially supplied from the signal generator to the semiconductor device at 10 ms intervals. The output of the signal from the signal generator at this time is executed by the trigger input from the processing device 2.

That is, in the example of FIG. 9, the LO signal source 12
In order to output the signal from the signal generator 3 in synchronization with the frequency setting of the
The frequency of the signal source 12 is sequentially set, and the local signal source switching means 13 is switched and controlled by the control signal from the processing device 2 to sequentially select and switch the LO signal source 12 in the order of measurement frequencies to output the local signal. There is. This allows
From the time point indicated by the arrow in FIG. 9 (the time point when the first measurement frequency is set: the time point when the measurement frequency is set in the LO signal source LO1), the signal generator and the transmitter tester can be synchronized.

Therefore, in the configuration having only one LO signal source 12, the signals are switched in 40 ms cycles, whereas the test system in FIG. 9 can switch the signals in 10 ms cycles. , LO signal source 1
The control time is 1/4 or less as compared with the configuration having only one 2, and the processing time can be shortened. The processing time can be further shortened by using the data acquisition by the A / D conversion unit 30 and the parallel processing of the FFT operation by the processing unit (DSP) 31 together.

By the way, in each of the above-described embodiments, the data processing unit 25 including a plurality of pairs of A / D conversion units 30 and processing units 31 is built in the transmitter tester 4. , The data processing unit 25 to the processing device 2
It may be configured to be built in.

[0095]

As is apparent from the above description, according to the present invention, the A / D conversion unit and the processing unit form a plurality of pairs to constitute the data processing unit, and the A / D conversion unit is selectively operated. Switching control is performed. Thereby, the data acquisition by the A / D conversion unit and the signal processing (FFT calculation) by the processing unit can be executed in parallel, and the processing speed can be increased. As a result, the frequency characteristics and level (power) of semiconductor devices
The characteristics can be measured at high speed.

Further, the frequency setting of the local signal source is sequentially performed from the processing device so that the signal is output from the signal generator in synchronization with the frequency setting of the local signal source, and the local signal source switching means is switched by the processing device. The local signal source is controlled and sequentially switched in the order of the measurement frequency to output the local signal. As a result, the frequency characteristic and level (power) characteristic of the semiconductor device can be measured at high speed.

The frequency of the signal generator is set to the local signal source, and the signal for measurement is supplied to the semiconductor device in synchronization with the selection of any one local signal source by the local signal source switching means. Therefore, the transmitter tester and the signal generator can be synchronized from the time when the first measurement frequency is set in the local signal source.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a test system according to the present invention.

FIG. 2 is a block diagram showing an internal configuration of a test system according to the present invention.

FIG. 3 is a block diagram showing an internal configuration of a transmitter tester of a test system according to the present invention.

FIG. 4 is a flowchart showing the measurement operation of the test system according to the present invention.

FIG. 5: A of PDC by the test system according to the present invention
The figure which shows an example of the time chart of the data acquisition time at the time of performing CPR measurement.

FIG. 6 shows a W-CDM according to the test system of the present invention.
The figure which shows an example of the time chart of the data acquisition time at the time of performing ACPR measurement of A.

FIG. 7 is a diagram showing divisions of a frequency domain when performing AC-PR measurement of W-CDMA.

FIG. 8 is a diagram showing another embodiment of the test system according to the present invention.

9 is a time chart showing an example of frequency switching time in the test system of FIG.

FIG. 10 is a block diagram of a conventional test system.

11 is an AC of PDC according to the test system of FIG.
The figure which shows an example of the time chart of the data acquisition time at the time of performing PR measurement.

FIG. 12 is a W-CDMA according to the test system of FIG.
Of an example of time chart of data acquisition time when ACPR measurement of

[Explanation of symbols]

1 ... Test system, 2 ... Processor, 3 ... Signal generator,
4 ... Transmitter tester, 5 ... LO module, 12 ... LO signal source, 13 ... Local signal source switching means, 24 ... Detection section,
25 ... Data processing unit, 26 ... A / D conversion unit switching means, 3
0 (30A, 30B) ... A / D converter, 31 (31A,
31B) ... Processing unit, DUT ... Semiconductor device.

Claims (3)

(57) [Claims] 1. A frequency of a local signal is set according to a measurement frequency of a signal from a semiconductor device (DUT), and the set local signal and the signal from the semiconductor device are mixed and converted into an intermediate frequency. In the semiconductor device test system (1) including the transmitter tester (4) that detects the converted intermediate frequency signal by the detection unit (24) and processes the digital waveform, the frequency is set according to the measurement condition. A signal generator (3) for generating a measurement signal and supplying it to the semiconductor device
And an A / D conversion unit (30) that acquires the signal detected by the detection unit and converts it into digital data, and a processing unit (31) that processes the digital data converted by the A / D conversion unit. A data processing section (25) having a plurality of pairs and an A / D conversion section switching means (2) for selectively switching to any one of the plurality of A / D conversion sections and connecting to the detection section.
6), and a processing device (2) for controlling the output by setting the frequency of the signal output from the signal generator based on the measurement conditions and selectively switching the A / D conversion unit switching means. A semiconductor device characterized by comprising: parallel processing of data acquisition from the detection unit by the A / D conversion unit and signal processing by the data processing unit paired with the A / D conversion unit. Test system. 2. A frequency of a local signal is set according to a measurement frequency of a signal from a semiconductor device (DUT), and the set local signal and the signal from the semiconductor device are mixed and converted into an intermediate frequency. In the semiconductor device test system (1) including the transmitter tester (4) that detects the converted intermediate frequency signal by the detection unit (24) and processes the digital waveform, the frequency is set according to the measurement condition. A signal generator (3) for generating a measurement signal and supplying it to the semiconductor device
And a plurality of local signal sources (12) for generating a local signal set to a frequency according to a measurement condition and outputting it to the transmitter tester, and selectively to any one of the plurality of local signal sources. A local signal source switching means (13) for switching and connecting to the transmitter tester, an A / D conversion unit (30) for acquiring the signal detected by the detection unit and converting it into digital data, and the A / D conversion The data processing unit (25) is provided between the detection unit and the plurality of A / D conversion units, and the data processing unit (25) includes a plurality of pairs of processing units (31) for signal processing the digital data converted by the unit. And an A / D converter switching means (26) for electrically connecting any one of the A / D converters to the detection unit, and the signal generator and the local signal source output based on the measurement condition. Set the frequency of the signal to Processing device for controlling the force, selectively switching control of the A / D conversion unit switching unit, and switching control of the local signal source switching unit so that the local signal source is selectively switched in order of measurement frequency. (2) is provided, and the data acquisition from the detection unit by the A / D conversion unit and the signal processing by the data processing unit paired with the A / D conversion unit are processed in parallel. Semiconductor device test system. 3. In the signal generator (3), the frequency of the local signal source (12) is set by the processing device (2), and one of the local signals is switched by the local signal source switching means (13). The measurement signal is synchronized with the semiconductor device (DUT) in synchronization with the selective switching of the source.
The semiconductor device test system according to claim 2, further comprising: