JP3505160B2 - Method for manufacturing optical mounting board - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to relates primarily manufacturing method of line power sale optical package substrate signal conversion optoelectric used for optical communication.

[0002]

2. Description of the Related Art With the permeation of the Internet into ordinary households and the progress of digitalization of video media, the importance of gigabit-class high-speed communication infrastructure is increasing. An optical communication system is expected as such a high-speed communication infrastructure.

By the way, one of the barriers to introducing such a high-speed system into a subscriber system such as a general household is to balance the performance and cost of the system.

Generally, the optical communication system is superior to the wireless system in communication speed and communication quality, but is expensive, which is an obstacle to its widespread use.

Particularly in the case of laying in a general household, each household needs an optical module for photoelectric conversion, and it is indispensable to supply this at a low cost. In other words, it is extremely important to establish a technology for supplying an optical module having high speed, which is a feature of optical communication, at low cost.

A PLC platform (a mounting board provided with an optical circuit, PLC: Plan) is used as an optical module for realizing high-speed photoelectric conversion of gigabit or higher.
arLightwave Circuit has been proposed (see “Latest Data Collection 2 for Optical Communication Technology”, Optronics Co., Ltd., p59). All the disclosures of p59 in the document “Latest Data Collection 2 for Optical Communication Technology” are incorporated by reference (reference) in their entirety.

FIG. 8 is a view showing a basic structure of an optical mounting board forming a PLC platform according to a conventional technique.

The PLC section 810 is a part of the substrate 80 (see FIG. 8).
(Right side portion of the substrate 80) and a silica-based optical waveguide (upper clad 81, core 82, lower clad 83) formed on the upper part of the substrate 80 for branching and combining optical signals.

An optical element mounting portion 820, which is the other part of the substrate 80 (the central portion of the substrate 80 in FIG. 8), is provided with an optical element 84 such as a laser or a photodiode. Signal conversion of. The electrical wiring portion 83 which is the remaining portion of the substrate 80 (left side portion of the substrate 80 in FIG. 8)
0 is for connecting the optical element 84 and the drive circuit, and GHz
The above high-speed high frequency is transmitted.

The reason why silicon is used as the material of the substrate 80 is as follows.

That is, (1) it is suitable for forming an optical waveguide that requires a high temperature process, and (2) the V groove for optical fiber alignment can be easily processed because of its good workability.
(3) Since it has good thermal conductivity, it functions as a heat sink even when the laser or semiconductor IC as the optical element 84 is driven with high power, and the rise in element temperature can be suppressed.

Since silicon has an excellent heat dissipation effect as described above, the optical element 84 is directly mounted on the substrate 80 made of silicon.

On the other hand, since silicon has a relatively large dielectric loss, parasitic inductance and parasitic capacitance in the electric wiring portion 830 become a problem when using the high frequency band of the optical mounting board.

Therefore, in order to reduce the dielectric loss at high frequencies as much as possible, an electrode is formed by an electric wiring 85 such as a coplanar line in the electric wiring portion 830 as shown in FIG.
A silica-based glass 86 having a small high frequency loss is formed as a thick film and is interposed between the electric wiring 85 and the substrate 80.

In order to adjust the heights of the optical element 84 and the PLC portion, a silicon terrace 87 having a terrace-shaped cross section is provided only in this portion.

This enables transmission / reception of digital signals of several gigabits.

[0017]

However, in such a PLC platform, the manufacturing process is very complicated and the cost is high.

That is, photolithography and etching for forming the silicon terrace 87 on the silicon substrate 80 are necessary. Furthermore, it is necessary to repeat a number of steps such as photolithography, etching, thin film deposition, and high-precision polishing for forming the upper clad 81, the core 82, and the lower clad 83. The upper clad 81, the core 82, and the lower clad 83 form an optical waveguide.

An optical waveguide has a particularly high cost weight. The optical waveguide is manufactured by using a semiconductor process such as a flame deposition method, film formation by CVD, photolithography, and core patterning by etching. However, since the chip size is relatively large, cost reduction effect cannot be expected even if it is mass-produced.

Another problem is that it is not easy to connect the optical waveguide and the optical fiber.

In order to suppress the optical loss in the connection between the optical fiber and the optical waveguide, ± 1 μm in the case of single mode
The following position adjustment, assembly and fixing are required.

The following two connection methods are generally used.

First, as shown in FIG. 8, an optical waveguide (upper clad 81, core 82, lower clad 8) is formed on a silicon substrate 80.
When 3) is formed, a V groove for arranging the optical fiber is formed in the silicon portion at the end (not shown in FIG. 8) of the optical waveguide. The optical fiber and the optical waveguide are connected by arranging and fixing the optical fiber in the V groove.

However, forming the V-groove on the silicon substrate 80 requires separate steps such as photolithography and wet etching, which increases the cost burden and causes variations in etching. Therefore, there are many variations in the shape accuracy of the V-groove. As a result, there is a problem in that the amount of optical loss in the connection between the optical waveguide and the optical fiber also varies.

The other is that a substrate on which an optical waveguide is formed and a substrate on which a V groove for arranging an optical fiber is formed are prepared independently and individually, and an optical axis alignment mechanism for these optical axes is provided. There is a way to do it in the system. However, it takes several tens of seconds to several minutes to adjust each connection point, the equipment is expensive, and there are great problems in terms of mass productivity and economical efficiency.

As a method for solving the problems concerning the production of such an optical waveguide and the connection between the optical waveguide and the optical fiber, a groove for fixing to the fiber is used by using press molding which has already been put into practical use as a method for producing aspherical glass. And a method of forming a groove corresponding to the core of the optical waveguide and burying a core material such as a resin in the groove corresponding to the core to produce an optical waveguide, JP-A-7-287141 and JP-A-7-113924,
It is proposed in Japanese Patent Laid-Open No. 7-218739.

Incidentally, the document "JP-A-7-287141",
"JP-A-7-113924" and "JP-A-7-2121"
The entire disclosure of "8739" is incorporated herein by reference in its entirety.

In this method, for example, as shown in FIG. 9, a mold having concave and convex shapes corresponding to the fiber fixing portion and the optical waveguide portion is pressed against the workpiece and the inverted shape is transferred. The fiber fixing guide, and Mass production of grooves for optical waveguides with good shape reproducibility. Here, 91 is an optical fiber guide groove forming portion, and 92 is an optical waveguide pattern forming portion.

By embedding a core material such as resin in the groove for the optical waveguide, the groove can be made to function as an optical waveguide. It is possible to easily and optically connect the optical fiber and the optical waveguide with high efficiency without any special position adjustment simply by arranging them in the groove.

By using the press molding in this way, as shown in FIG. 10, the optical waveguide 101 and the optical fiber guide groove 1 are formed.
It is possible to realize the optical mounting board 103 including the optical waveguide 02, and to reduce the optical waveguide manufacturing cost and the optical fiber connection cost.

However, such an optical mounting substrate 10
When optical elements such as a laser and a photodiode are provided in 3 and a circuit for driving them, it is necessary to form them on glass, which has poorer thermal conductivity than silicon. There was a constraint that you couldn't drive.

In the case where an electric element such as a capacitor is provided on the electric wiring (85 in FIG. 8, not shown in FIG. 8) which is an electrode portion in both the optical mounting substrate 103 in FIG. 10 and the PLC platform in FIG. Requires a lead for routing and causes a loss in a high frequency band, which is an obstacle to speeding up.

As described above, at present, there is a problem in that it is impossible to supply an optical mounting board and an optical module having high speed of gigabit level, cost that can be supplied to general households, and productivity.

The present invention has been made in view of the above problems, and has an optical mounting board, an optical module, an optical transmitter-receiver, and an optical transmitter-receiver system which have a simple structure as compared with conventional ones but have an excellent heat dissipation effect. The purpose is to provide.

Further, the present invention provides an optical mounting substrate, an optical module, which can further reduce the loss in the high frequency band as compared with the prior art.
An object is to provide an optical transmitter / receiver and an optical transmitter / receiver system.

Another object of the present invention is to provide a method for manufacturing an optical mounting board, which can simplify the manufacturing process.

[0037]

[0038]

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[0041]

[0042]

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[0047]

[0048]

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[0050]

[0051]

[0052]

[0053]

[0054]

[0055]

According to a first aspect of the present invention, there is provided a forming step of forming an optical transmission part having an optical waveguide and / or an optical fiber guide part for arranging and fixing an optical fiber, and a main surface. And an embedding step of embedding a conductive member so as to penetrate the main surface and the other main surface of an arrangement portion for arranging an optical element optically connected to the optical waveguide or the optical fiber. In the forming step, all or a part of the light transmission portion, the optical fiber guide portion, and the arrangement portion are formed on the base material softened by heating ,
It is formed by transferring the inverted shape of the mold by pressing the mold from the surface side , and in the embedding step, the conductive member having a predetermined shape is preliminarily softened by heating at the same time as the forming step. In addition to the above
This is a method of manufacturing an optical mounting substrate that is embedded in the base material by directly pressing it from the one main surface side .

In addition, a second aspect of the present invention includes a step of forming an optical transmission section having an optical waveguide and / or an optical fiber guide section for arranging and fixing an optical fiber, and the optical guide on the main surface. An embedding step of embedding a heat transfer member containing a heat conductive material so as to penetrate the main surface and the other main surface of an arrangement portion for arranging an optical element optically connected to the waveguide or the optical fiber. And, in the forming step, the light transmitting portion, the optical fiber guide portion, and all or part of the arrangement portion, to the base material softened by heating, by pressing the mold from the main surface side , At the same time as the forming step, the heat transfer member having a predetermined shape is formed on the base material softened by heating at the same time as the main surface side of the other main surface side. Yo By directly pressing
It is a method of manufacturing an optical mounting substrate to be embedded in the base material.

[0057]

Further, in the third aspect of the present invention, a heat dissipation member including the heat conductive material is formed on all or part of the other main surface of the arrangement portion so that heat can be transferred to the heat transfer member. It is a manufacturing method of the above-mentioned optical mounting board of the 2nd present invention provided with a radiation member arrangement process for connecting.

Further, in a fourth aspect of the present invention, the heat transfer member is integrally formed with a heat dissipation member including the heat conductive material, and the heat transfer member is embedded at the same time in the embedding step. the heat radiating member, Ru manufacturing method der the thirteenth optical mount substrate that are formed in all or part of the other main surface of the placement portion.

[0060]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention and techniques related to the present invention will be described below with reference to the drawings .
An embodiment will be described.

Embodiment Mode 1 FIG. 1A and FIG. 1B are examples of a technique related to the present invention.
2 shows the configuration of the optical mounting board as described above.

Incidentally, FIG. 1A is a plan view of the optical mounting board of this embodiment, and FIG. 1B is a plan view of A- of FIG.
It is an A'sectional view.

The optical mounting substrate of this embodiment is made of glass, and as shown in the figure, an optical fiber guide portion 1 for arranging and fixing optical fibers and an optical waveguide 27.
(See FIG. 2 (d)) Light transmission part 2 and optical waveguide 2
7 and each part of the arrangement part 3 for arranging a laser or a photodiode 110 as an optical element optically connected to the element 7.

More specifically, as shown in FIGS. 1A and 1B, the glass substrate 17 and the glass substrate 17 will be described in detail.
The optical waveguide groove 11 formed above, an ultraviolet curable resin (not shown) having a higher refractive index than the glass substrate 17 filled in the optical waveguide groove 11, a via hole 12 having a through hole filled with a conductive paste, A fiber array V groove 13 for fixing an optical fiber, which is formed on a glass substrate 17, is provided.

Further, a laser mounting for arranging an optical element such as a laser or a photodiode 110 formed on the glass substrate 17 at a position symmetrical with the fiber array V groove 13 when viewed from the optical waveguide groove 11. The unit 18 and the photodiode mounting unit 19 and the alignment marker 14 for positioning the optical element are provided.

Further, in a part of the glass substrate 17 including the optical waveguide groove 11, a flat glass member 15 having the same refractive index as that of the glass substrate 17 is provided so as to seal the optical waveguide groove 11.
Are pasted together. Further, the back surface of the glass substrate 17 including the via hole 12 is partially hollowed to reduce the wiring length. The hollow portion (recess 11
In 1), circuit elements such as the microcapacitor 16 are arranged so as to be connected to a plurality of via holes.

Next, an example of a desirable manufacturing procedure of the optical mounting board according to the present embodiment will be described with reference to FIGS.
It shows in (d).

Here, the convex optical waveguide pattern 21 is used.
a, a convex portion 21b for forming the fiber array V groove, an upper mold 21 having a marker pattern forming portion (not shown) for positioning the optical element, the through hole 12, and a concave portion 111 on the back surface.
A lower mold 22 for molding (see FIG. 1B) is used.

That is, first, the upper mold 21 and the lower mold 22 are pressed against the upper surface and the lower surface of the glass substrate 23 which has been softened by heating (FIG. 2A), and the glass substrate 23 is Transfer the inverted shape (Fig. 2)
(B)).

Next, an ultraviolet curable resin 25 having a refractive index higher than that of the glass substrate 23 is applied to the main surface of the glass substrate 23 at least including the optical waveguide groove 24 so as to fill the optical waveguide groove 24. Apply. Before coating, use spin coating to reduce the thickness (Fig. 2).
(C)).

Finally, a flat glass member 26 having a refractive index almost equal to that of the glass substrate 23 is attached to the optical waveguide portion, and the through hole 27 is filled with a conductive paste (not shown),
A microcapacitor (not shown) is mounted (see FIG. 2).
(D)). In this way, the optical mounting board of FIG. 1 is completed.

The optical mounting substrate of this embodiment functions as a base substrate of the optical transceiver module.

That is, it is possible to connect the optical fiber and the optical waveguide simply by installing the optical fiber in the V groove 13 and fixing it with an optical adhesive or the like. Traditionally, these connections required submicron-level position accuracy,
This mounting board can significantly reduce the adjustment cost.

Further, for mounting an optical element such as a laser or a photodiode, it is possible to perform passive alignment by using the positioning marker 14 simultaneously formed by molding. At this time, the laser and the photodiode are respectively arranged on a height stage such that the heights of light emission and light reception match the optical waveguide. Such a step can be easily formed by the molding method.

The optical mounting substrate of the present invention can be manufactured without using steps such as photolithography, etching, thin film deposition, and high precision polishing. In particular, if the molding method shown in FIG. 2 is used, mass production can be performed at a very low cost. However, the manufacturing method is not limited to this. For example, only the optical waveguide groove 11 may be formed by a molding method, and the via hole 12 may be formed by another means such as machining.

Although glass is used as the substrate material in the present embodiment, it is not limited to this as long as it is optically transparent. For example, various thermoplastics such as polyolefins and glass can be molded by a molding method, which is advantageous in terms of cost.

Particularly in the case of glass, since the dielectric loss is smaller than that of silicon or the like, the high frequency loss in the transmission line connected to the laser or the photodiode can be reduced, which is very effective for a high speed communication module.

When high speed is required, a coplanar line, a microstrip line, and a slot line are desirable as the transmission line.

Further, since the optical mounting board of the present invention has the via hole 12 provided in the board thickness direction, the wiring length is shortened, and flat gain characteristics and group delay characteristics can be obtained in a wide high frequency band. As an advantage.

In particular, as the conductive material with which the through holes are filled, it is desirable to use solder, for example, a conductive paste containing silver, copper, nickel or the like as a main component, or a conductive adhesive.

Further, the wiring length is preferably 500 μm or less in view of high frequency characteristics. For that purpose, the thickness of the glass substrate itself may be set to 500 μm or less without forming the recess 111, other than the means for providing the recess 111 on the back surface to shorten the wiring length as in the present embodiment. At this time, a metal layer or the like may be formed on the back surface of the substrate.

The element connected between the via holes is not limited to a high frequency element such as a microcapacitor, but may be a high frequency element. Also, a high frequency circuit may be used.

In this embodiment, FIGS. 2A to 2D are used.
As shown in FIG. 5, the upper mold 21 having the optical waveguide pattern 21a and the convex portion 21b for forming the optical fiber array V groove and the lower mold 22 having the projection 22a for molding the via hole 12 are provided.
I went there.

In particular, if the substrate is thin and the concave portion 111 is not necessary on the back surface, the optical waveguide pattern and the projection for the via hole may be provided in the same mold.

As in this embodiment, the optical waveguide groove 11, the via hole 12, and the fiber array V groove 13 may be integrally formed by a molding method using the same substrate.
This is most desirable because it eliminates the need for position adjustment during assembly of parts.
However, not limited to this, for example, when the via hole 12 is formed by using a method other than the molding method (for example, a drilling method using a drill), the via hole may be provided on the flat glass member side, for example.

In this case, unlike the structure shown in FIG. 1A, the glass substrate has no arrangement portion, but an optical fiber guide portion and a light transmission portion. And FIG.
The right end of the flat glass member 15 shown in (b) has a shape further expanded rightward, and the expanded portion is
It serves as an arrangement part for mounting an optical element. In this case, the optical element is mounted on the back surface of the flat glass member. Therefore, as described above, it is necessary to provide the via hole in the arrangement portion of the flat glass member.

It is desirable to use the ultraviolet curable resin or the thermosetting resin used in the present embodiment as the core material. However, a thin film of a quartz material is deposited so as to fill the groove, and an extra portion other than the groove is formed. May be removed by polishing or the like.

In this embodiment, the optical waveguide groove 1 is used.
Although the example provided with Nos. 1 and 24 is shown, the effect of the present invention is not impaired at all even if this is not necessarily provided.

In FIG. 1, the fiber array V groove 13 may be provided long up to the optical element mounting portion such as a laser or a photodiode so that the optical fiber and the optical element can be directly connected.

Embodiment 2 FIG. 3 shows a configuration of an optical module as an example of a technique related to the present invention.

In FIG. 3, the optical mounting board 31 is constructed based on the optical mounting board having the same basic structure as that of the first embodiment. The optical mounting board 31 has two optical waveguides 32.
This is provided with an optical fiber 33, a laser 34 and a photodiode 35 as an optical element, and an electrode 36 of a coplanar transmission line.

The electrode 36 is formed by forming a chrome film on the underlayer in order to secure adhesion with the glass which is the material of the substrate.
A gold electrode may be provided on this by plating. Alternatively, a construction method such as printing can be used.

As described above, a high-speed optical module can be easily realized by using the optical mounting board of the present invention.

The laser or photodiode may be mounted by wire bonding, but it is preferable to use a short connection mounting method such as flip chip mounting or stud bump mounting when high speed is required.

Although the two-branched optical waveguide pattern is shown in the first embodiment, the present invention is not limited to this, and a plurality of optical waveguide patterns may be provided as in the second embodiment.

In particular, in analog communication or high-speed digital communication, the incidence of light on the laser causes noise, so it is desirable to provide an optical waveguide pattern for each of transmission and reception.

(Third Embodiment) FIGS. 4A and 4B.
Shows the structure of the optical mounting substrate of the present invention.

Incidentally, FIG. 4A is a plan view of the optical mounting board of the present embodiment, and FIG. 4B is a view of B- of FIG. 4A.
It is a B'sectional view.

The optical mounting substrate of this embodiment is made of glass. As shown in FIGS. 4 (a) and 4 (b), the glass substrate 46 and the optical waveguide groove formed on the glass substrate 46 are used. 41, the glass substrate 4 filled in the optical waveguide groove 41
6, an ultraviolet curable resin (not shown) having a higher refractive index than 6, a high thermal conductive member 42 containing a high thermal conductive material, a fiber array V groove 43 for fixing optical fibers formed on a glass substrate 46, and a laser 49. A laser mounting portion 47 and a photodiode mounting portion 48 for disposing an optical element such as a photodiode and a photodiode, and an alignment marker 44 for positioning the optical element are provided.

Further, in a part of the glass substrate 46 including the optical waveguide groove 41, the optical waveguide groove 41 is sealed.
Flat glass member 4 having the same refractive index as the glass substrate 46
5 are pasted together. Examples of the high heat conductive material include various metals such as copper and silicon.

In this embodiment, the high thermal conductivity member 5 is used.
As shown in FIGS. 4 (b) and 5 (a), 2 is integrally configured by a heat transfer member 52a and a heat dissipation member 52b.

Next, an example of a desirable manufacturing procedure of the optical mounting board according to the present embodiment will be described with reference to FIGS.
It shows in (d).

Here, the convex optical waveguide pattern 51 is used.
a, an upper die 51 provided with a convex portion 51b for forming a fiber array V groove, a marker pattern forming portion (not shown) for positioning an optical element, and a protrusion (heat High thermal conductivity member 5 provided with transfer member 52a)
2 and are used. Here, the high thermal conductivity member 52 is an example of a member including the heat transfer member and the heat dissipation member of the present invention.

That is, first, the upper mold 51 and the high thermal conductivity member 52 are pressed against the upper surface and the lower surface of the glass substrate 53 which is softened by heating (FIG. 5).
(A)) The inverted shape is transferred onto the glass substrate 53, and the high thermal conductivity member 52 is embedded in the glass substrate 53 (FIG. 5B).

At this time, if the tip 52b of the protruding portion of the high thermal conductive member 52 is buried in the glass substrate 53, the surface of the glass substrate 53 is polished to remove the protrusion of the high thermal conductive material portion. The tip 52b is exposed.

High accuracy is not required for positioning the upper and lower molds when molding the glass substrate 53, but positioning accuracy is ensured by providing a barrel mold that regulates the displacement of the upper and lower molds.

The high thermal conductivity member 52 is the glass substrate 4
It is provided in order to efficiently dissipate the heat generated from the laser 49 mounted on the unit 6.

Next, an ultraviolet curable resin 55 having a refractive index higher than that of the glass substrate 53 is applied to the main surface of the glass substrate 53 including at least the optical waveguide groove 54.

As a result, the ultraviolet curable resin 55 is embedded in the optical waveguide groove 54. At the time of application, use spin coating or the like to reduce the thickness (see FIG. 5).
(C)).

Finally, a flat glass member 56 having a refractive index almost equal to that of the glass substrate 53 is attached to the optical waveguide portion (FIG. 5 (d)). In this way, the optical mounting board of FIG. 4 is completed.

The optical mounting board functions as a base board of the optical transceiver module. That is, the optical fiber and the optical waveguide can be connected only by installing the optical fiber in the V groove 43 and fixing it with an optical adhesive or the like. Conventionally,
These connections required submicron-level position accuracy, but this mounting board can significantly reduce adjustment costs.

Further, the mounting of the optical element such as the laser or the photodiode enables the passive alignment by using the positioning marker 44 simultaneously formed by molding. The optical mounting substrate of the present invention can be manufactured without using steps such as photolithography, etching, thin film deposition, and high precision polishing.

Particularly, if the molding method shown in FIGS. 5A to 5D is used, mass production can be performed at a very low cost. However, the manufacturing method is not limited to this. For example, only the optical waveguide groove 41 is formed by a molding method, and the high thermal conductive material 42 is filled with a paste-like material by punching through holes by another means such as machining. But good.

Although glass is used as the substrate material in the present embodiment, it is not limited to this as long as it is optically transparent. For example, various thermoplastics such as polyolefins and glass can be molded by a molding method, which is advantageous in terms of cost.

The optical mounting substrate of the present invention is provided with the high thermal conductive material 42 in the thickness direction of the substrate.
By arranging immediately below the installation portion of C, it functions as a heat sink, and it is possible to prevent performance deterioration and damage of the element due to temperature rise.

In this embodiment, as shown in FIG. 2, the molding is carried out by sandwiching the glass substrate between the upper mold 21 having the optical waveguide groove and the high thermal conductive substrate 22. It may be embedded in the glass substrate by arranging and molding a high thermal conductive material. In any case, when the high thermal conductive material is formed into a protrusion and embedded by molding, it is preferable that the shape of the protrusion is such that the tip is gradually narrowed.

It is most desirable to form the optical waveguide groove 41, the high thermal conductive material 42, and the fiber array V groove 13 on the same substrate as in the present embodiment, because position adjustment is not necessary during component assembly. However, this is not the case when a construction method other than the molding construction method is used, and for example, a high heat conductive material may be provided on the flat glass member 45 side.

Although it is desirable to use the ultraviolet curable resin or the thermosetting resin used in the present embodiment as the core material, a thin film of a silica material is deposited so as to fill the optical waveguide groove 54, and the core material other than the groove is deposited. The extra portion may be removed by polishing or the like.

Further, based on the optical mounting board of the present embodiment, the optical module of the second embodiment as shown in FIG. 3 can be similarly constructed.

Needless to say, it is more effective if the via hole of the first embodiment and the high thermal conductive material portion of the present embodiment are provided on one optical mounting board at the same time, so that the via hole serves as an electric wiring and a heat radiating via hole. You may use.

Further, depending on the case, the high thermal conductive material portion may be provided not only on the entire surface of the glass substrate 46 but also on a partial surface thereof.

(Embodiment 4) FIG. 6 shows the structure of an optical mounting substrate of the present invention.

In FIG. 6, the optical mounting board 31 is constructed based on the optical mounting board having the same basic structure as that of the first embodiment.

That is, the optical mounting substrate 31 of this embodiment is
An optical waveguide groove 61, an ultraviolet curable resin (not shown) having a higher refractive index than the glass substrate 60, which is filled in the optical waveguide groove 61, and a groove 62 formed by the optical waveguide groove 61 and traversing the optical waveguide. ing.

Further, the optical mounting substrate 31 of the present embodiment is further provided with the wavelength filter 63 which is further inserted and fixed in the groove 62, and the fiber array V groove 6 for fixing the optical fiber.
4. A positioning marker 65 for positioning an optical element such as a laser or a photodiode is provided.

Furthermore, the optical mounting substrate 31 is laminated with a flat glass member (not shown) having the same refractive index as the substrate so as to seal the optical waveguide groove 61.

The wavelength filter 63 is formed by laminating a plurality of dielectric materials in a multilayer structure such as polyimide, and has a function of reflecting and transmitting light according to the wavelength and separating the light. That is, it can be used for large-capacity, high-speed wavelength multiplexing applications.

Although the wavelength filter is provided in the middle of the optical waveguide in this embodiment, the present invention is not limited to this, and an isolator, a mirror, a half mirror, an attenuation filter or the like may be used. The width of the groove is preferably several tens of microns or less.

Alternatively, the groove width may be set to several millimeters to several centimeters, an optical waveguide may be provided on a substrate such as LiNbO 3 by ion exchange or the like, and an external modulator provided with electrodes may be incorporated.

As described above, the optical mounting substrate of the present invention has the conventional P
Similar to the LC module, various optical elements can be added to the optical waveguide portion.

Although the present embodiment has been described as being constituted by the optical mounting board based on the optical mounting board of the first embodiment, it is constituted by the optical mounting board according to the third embodiment. May be

(Fifth Embodiment) FIG. 7 is a configuration diagram showing an optical transceiver module manufactured based on the optical mounting board according to the first embodiment as an example of the technique related to the present invention.

That is, as shown in FIG. 7, the optical transceiver module of this embodiment has an optical mounting board 71 having an optical waveguide groove 72, an optical fiber 73, an optical element such as a laser 74, and a photodiode 75. A front end such as a laser driver 76 and a preamplifier 77 is mounted. The electrodes are coplanar lines.

According to the optical transmitter-receiver module of the present embodiment, by using the optical mounting substrate of the present invention as a base, a highly heat-conductive material embedded in the laser driver and the preamplifier also provides a sufficient heat dissipation effect. can get.

Such an optical transceiver module has a logical LS
By adding I and an interface, a very low cost optical transceiver can be constructed.

Furthermore, if the optical transmitter / receiver is connected by an optical signal transmission line such as an optical fiber, an optical transmitter / receiver system can be easily constructed.

For example, it is effective for an access network connecting a LAN or a base station with a subscriber terminal. Since the optical mounting substrate of the present invention is excellent in high speed and heat dissipation effect, it can be used in an optical module equipped with a high power element required for a base station.

Although the present embodiment has been described as being constituted by the optical mounting board based on the optical mounting board of the first embodiment, it is constituted by the optical mounting board according to the third embodiment. May be

The light transmitting portion of the present invention corresponds to the optical waveguide groove, the flat glass member, the glass substrate and the ultraviolet curable resin of each of the embodiments.

Regarding the optical mounting substrate and the like of the present invention, in the above embodiment, as an example of using the via hole for electrical connection with a high frequency circuit or a high frequency element, an optical fiber guide portion (fiber array V groove) is used. And the light transmission part (groove for optical waveguide) and the disposition part (laser mounting part, photodiode mounting part) are integrally molded (FIG. 1 (b), FIG. 2 (a) -FIG. 2 (d)). But,
Not limited to this, for example, each of these parts may be formed in a separate process, or may be manufactured without using a molding die. In short, any configuration may be used as long as the optical element and the high frequency element or the high frequency circuit are connected through the conductive member embedded in the through hole (via hole), and what kind of manufacturing is performed. It does not matter whether it is manufactured by the method.

Even in this case, it is possible to provide an optical mounting substrate, an optical module, an optical transmitter / receiver, and an optical transmitter / receiver system, which are excellent in high frequency characteristics and can be speeded up as compared with the conventional case.

Further, with respect to the method of embedding a conductive member such as an optical mounting substrate of the present invention, the through-holes are formed in advance in the above embodiments, and the case of embedding in the through-holes has been mainly described (FIG. 2 (a) etc.). However, the present invention is not limited to this, and for example, similar to the case described with reference to FIG. 5A for the heat-conducting member, the glass substrate is not preliminarily provided with a through hole, and the columnar conductive member is pressed to force the force. Alternatively, a method of embedding in a glass substrate may be adopted.

Regarding the method for embedding a heat conductive member such as an optical mounting substrate of the present invention, in the above-described embodiment, the glass substrate side is not preformed with through holes, and the columnar heat conductive member is not formed. The method of forcibly embedding in the glass substrate by pressing was explained (FIG. 5 (a) etc.). However, the method is not limited to this. For example, as in the case of the conductive member described with reference to FIG. 2A, a method may be used in which a through hole is formed in the glass substrate in advance and a heat conductive member is embedded in the through hole.

Further, in the above embodiment, the case where the heat conductive member is integrally constituted by the heat transfer member 52a and the heat radiation member 52b has been described (FIG. 5).
(A)). However, not limited to this, for example, the heat transfer member 52a and the heat dissipation member 52b shown in FIG. 5A may be separated at the manufacturing stage. That is, in this case, the heat transfer member is first embedded in the glass substrate 53, and then the heat dissipation member is arranged on the back surface of the glass substrate so as to be in contact with the end surface of the heat transfer member. If the heat transfer member and the heat dissipation member are integrally configured, there is a risk that the heat transfer member may break due to lateral stress applied to the heat transfer member at the time of pressing, but if the configuration is separated as described above, Because such a problem does not occur,
The yield in the manufacturing process is improved.

In the above embodiment, the optical mounting board is
The case where the optical fiber guide portion, the light transmission portion, and the arrangement portion are included has been described (FIG. 1A and the like). However, the present invention is not limited to this, and for example, as shown in FIG. 11A and FIG.

That is, in this case, as shown in the figure, the optical fiber (not shown) is directly connected to the photodiode 110 without passing through the optical waveguide. In addition, FIG.
The same components as those described in FIG. 1B are designated by the same reference numerals. Note that FIG. 11A is a plan view of the optical mounting board of the present modification, and FIG. 11B is AA ′ of FIG. 11A.
FIG.

Further, in the above embodiment, the case where each part of the optical mounting board is integrally molded in the same step has been mainly described (FIGS. 2A to 2D, etc.). However, the manufacturing method is not limited to this, and may be, for example, formed in separate steps, or formed as separate parts by a method other than molding and finally joined to integrate the parts. May be.

Further, in the above embodiment, the optical mounting substrate of the present invention is described as a substrate in which a conductive member or a heat conductive member is embedded. However, the present invention is not limited to this, and, for example, a substrate having a through hole but not yet filled with a conductive member or a heat conductive member is also an example of the optical mounting substrate of the present invention.

As described above, one example of the present invention is, for example, a substrate provided with an optical waveguide groove, a member having a refractive index equivalent to that of the substrate and attached to the optical waveguide groove, and the optical waveguide groove It is characterized in that it is made of a material having a higher refractive index than that of the filled substrate, and a conductive material different from that of the substrate or the member is partially embedded in the substrate or the member.

With such a structure, the optical waveguide can be easily manufactured, the cost can be reduced, and the mass production can be performed. Further, by embedding a conductive material in the thickness direction of the substrate, the wiring length can be shortened, loss with respect to high frequency and phase delay can be reduced, and the degree of integration of the circuit portion can be increased and the size can be reduced.

In particular, a high-frequency electronic circuit can be incorporated by providing a high-frequency transmission line such as a coplanar line using a material having a low dielectric loss such as glass for the substrate and the member.

Further, according to another example of the present invention, a substrate having an optical waveguide groove, a member having the same refractive index as that of the substrate and bonded to the optical waveguide groove, and the optical waveguide groove are filled. It is characterized in that it is made of a material having a higher refractive index than the substrate, and that a material having a higher thermal conductivity than the substrate or the member is partially embedded in the substrate or the member.

With such a structure, the optical waveguide can be easily manufactured, the cost can be reduced, and the mass production can be performed.

Further, the heat radiation effect can be easily improved by mounting a heat generating element such as a laser, a semiconductor IC, or a modulation element in the portion where the high thermal conductive material is embedded in the thickness direction of the substrate.

Another example of the present invention is to incorporate optical parts such as an optical filter, an external modulator and an isolator between the optical waveguide parts.

That is, by embedding various optical elements, multifunctional optical signal processing becomes possible.

Another example of the present invention is an optical module, characterized in that the optical mounting board is provided with an optical fiber and a light receiving element or a light emitting element.

Another example of the present invention is characterized in that the optical module is provided with an electric signal processing circuit as an optical transmitting and receiving device.

Another example of the present invention is an optical transmission / reception system characterized by comprising an optical signal transmission line and the optical transmission / reception device at both ends of the signal transmission line.

Another example of the present invention is a method of manufacturing an optical mounting substrate, comprising the steps of forming an optical waveguide groove and a through hole in the substrate by pressing a mold against a substrate that has been heated and softened to apply pressure. The method further comprises a step of filling the through hole with a conductive material or a high thermal conductive material. By using the molding method with a mold,
The optical waveguide groove and the via hole can be collectively formed.

Another example of the present invention is a method of manufacturing an optical mounting substrate, in which a conductive material or a high thermal conductive material is placed between a substrate softened by heating and a mold, and the mold is pressed. The method is characterized by including a step of embedding the conductive material or the high thermal conductive material in the substrate by applying pressure. By using a molding method, a different material is easily embedded in the substrate.

As described above, according to the present invention, it is possible to provide an optical mounting substrate, an optical module, an optical transmitter / receiver device, and an optical transmitter / receiver system which are excellent in high-frequency characteristics and can be speeded up as compared with conventional ones.

Further, according to the present invention, the optical mounting board can be manufactured at a lower cost than the conventional one. Also, for example,
If the optical fiber fixing guide groove and the positioning marker for the optical element are also molded, the cost can be further reduced.

[0164]

As described above, according to the present invention,
It is possible to provide an optical mounting substrate, an optical module, an optical transmitter / receiver device, and an optical transmitter / receiver system which have a simple structure as compared with conventional ones but have an excellent heat dissipation effect.

Further, according to the present invention, it is possible to provide an optical mounting substrate, an optical module, an optical transmitter / receiver and an optical transmitter / receiver system capable of further reducing the loss in the high frequency band as compared with the prior art.

Further, according to the present invention, it is possible to provide a method of manufacturing an optical mounting board which can simplify the manufacturing process.

[Brief description of drawings]

FIG. 1A is related to the present invention in the first embodiment .
FIG. 3 is a plan view showing the configuration of an optical mounting board as an example of the technology described above. (B): of the technology related to the present invention in the first embodiment
AA 'sectional drawing which shows the structure of the optical mounting board as an example .

2A to 2D are perspective views showing a manufacturing procedure of the optical mounting board according to the first embodiment.

FIG. 3 shows a technique related to the present invention in the second embodiment.
The block diagram of the optical mounting board as an example .

FIG. 4A is a plan view showing the configuration of the optical mounting board of the present invention in the third embodiment. (B): A BB 'sectional view showing the configuration of the optical mounting board of the present invention in the third embodiment.

5A to 5D are perspective views showing a manufacturing procedure of the optical mounting board according to the third embodiment.

FIG. 6 is a configuration diagram of an optical mounting board of the present invention in a fourth embodiment.

FIG. 7 shows a technique related to the present invention in the fifth embodiment.
The block diagram of the optical module as an example .

FIG. 8 is a sectional configuration diagram of a conventional PLC platform.

FIG. 9 is a configuration diagram showing a conventional example of a molding die that simultaneously molds an optical fiber fixing groove and an optical waveguide groove.

FIG. 10 is a configuration diagram of a conventional optical mounting board having an optical fiber fixing groove and an optical waveguide groove at the same time.

FIG. 11 is a configuration diagram of an optical mounting board as a modified example of the present embodiment including an optical fiber fixing groove and an arrangement portion for mounting an optical element.

[Explanation of symbols]

11, 24, 41, 54, 61, 72, 101 Optical waveguide groove 12 Via hole 13, 43, 64, 102 Fiber array V groove 14, 44, 65 Alignment marker 15, 26, 45, 56 Flat glass member 16 micro Capacitor 17,46 Glass substrate 18,47,67 Laser mounting part 19,48,68 Photodiode mounting part 21,51 Upper mold 22 Lower mold 23,53 Glass substrate 25,55 UV curable resin 31,71,103 Optical mounting substrate 32 optical waveguide 33, 73 optical fiber 34, 74, 49 laser 35, 75, 110 photodiode 36 electrode 42, 410 high thermal conductive material 52 high thermal conductive member 62 groove 63 wavelength filter 66 conductive material (via hole) 76 laser driver 77 Preamplifier 81 Upper clad 82 Core 83 Lower clad 84 Optical Element 85 Electric wiring 86 Quartz glass 87 Silicon terrace 91 Optical fiber guide groove forming portion 92 Optical waveguide pattern forming portion

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H01S 5/022 H01L 31/02 B (72) Inventor Hisashi Adachi 1006 Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. ( 72) Inventor Shimada Mikidai 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP 10-253856 (JP, A) JP 11-218651 (JP, A) Special Kaihei 7-218739 (JP, A) JP 11-52159 (JP, A) JP 2000-164992 (JP, A) JP 2000-216307 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 6/42

Claims (4)

(57) [Claims] 1. A light transmission section having an optical waveguide and / or
A forming step for forming an optical fiber guide portion for arranging and fixing an optical fiber; and a main portion of the arranging portion for arranging an optical element optically connected to the optical waveguide or the optical fiber on a main surface. And an embedding step of embedding a conductive member so as to penetrate the surface and the other main surface, and in the forming step, all or a part of the light transmitting section, the optical fiber guide section, and the disposing section. Is formed by transferring a reverse shape of the mold by pressing the mold from the main surface side to the base material softened by heating, and in the embedding step, at the same time as the forming step, a predetermined shape is formed. A method for manufacturing an optical mounting substrate, wherein the conductive member is embedded in the base material by directly pressing the conductive member against the base material softened by heating from the other main surface side . 2. A light transmitting section having an optical waveguide and / or
A forming step for forming an optical fiber guide portion for arranging and fixing an optical fiber; and a main portion of the arranging portion for arranging an optical element optically connected to the optical waveguide or the optical fiber on a main surface. An embedding step of embedding a heat transfer member containing a heat conductive material so as to penetrate the surface and the other main surface, wherein in the forming step, the light transfer section, the optical fiber guide section, and the arrangement. All or part of the part is formed by transferring the inverted shape of the mold by pressing the mold from the main surface side to the base material softened by heating, and in the embedding step, at the same time as the forming step. , the heat transfer member having a pre-fixed shape, the substrate was softened by heating, by pressing the directly from the other main surface side, the manufacture of optical mount substrate that embedded in the base material Law. 3. A heat dissipation member containing the heat conductive material is formed on all or part of the other main surface of the arrangement portion,
The method for manufacturing an optical mounting board according to claim 2 , further comprising a heat dissipating member disposing step of connecting to the heat transfer member in a heat transferable manner. 4. The heat transfer member is integrally formed with a heat dissipation member containing the heat conductive material, and in the embedding step, the heat transfer member is embedded at the same time as the heat dissipation member is The method for manufacturing an optical mounting board according to claim 2 , wherein the optical mounting board is formed on all or part of the other main surface of the arrangement portion.