JP3493775B2 - Bulk cassette - Google Patents

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a novel bulk cassette. More specifically, it is intended to provide a bulk cassette for supplying a chip component to a component mounting machine, and to provide a novel bulk cassette capable of reliably supplying the chip component to a supply position.

[0002]

2. Description of the Related Art Chip parts (electronic parts) on a printed circuit board
There is known a high-speed chip component mounting machine for mounting. This will be briefly described with reference to FIGS. 14 to 19.

Reference numeral a is a high-speed chip component mounter, which is a component supply device b for supplying chip components in a bulked state, that is, in an unloaded state, to a printed circuit board at a central portion thereof.
Is equipped with. c is a moving base of the component supply device b, and a large number of bulk cassettes d, d,
Are arranged in the moving direction of the moving base c (see FIGS. 14 and 15).

Reference numeral e denotes a bulk case, and a large number of chip parts f, f, ... Are stored in the bulk case e. The bulk case e has a thin box shape, and an opening g is formed in the front end surface thereof, and the opening g is opened and closed by a shutter h (see FIG. 17).

The bulk case e is engaged with the guide portion i of the bulk cassette d so that the bulk cassette d
, And the shutter h is slid to open the opening g. In this way, the bulk case e is set in the bulk cassette d (FIG. 16).
reference).

From the bulk case e to the chip component f
When the feed lever j of the bulk cassette d is pressed downward by a pressing portion (not shown) to take out the product, positive pressure air is supplied from the positive pressure air supply port k and the positive pressure air is supplied from the component transfer nozzle 1 into the chute m. (Indicated by an arrow in FIG. 18) is supplied, whereby the chip component f is supplied to the component supply portion n near the front end portion via the chute m (see FIG. 18).

The cross-sectional shape of the chip part f is slightly smaller than the cross-sectional shape of the chute m. Therefore, the positive pressure air supplied into the chute m pushes the chip part f from the rear side thereof to move the chip part f forward. It is moved and supplied to the component supply part n near the front end.

Then, the chip component f supplied to the component supply section n is taken out by the suction nozzle o and mounted on the printed circuit board.

The positive pressure air carrying the chip component f is sucked from the gap between the outlet part of the chute m in the component supply section n and the chip component f shot by the component supply section n or the suction nozzle o of the chip component f. After being taken out by, it is discharged to the outside from the component supply part n.

[0010]

By the way, in such a bulk cassette d, it is ideal that one chip part f passes through the chute m by one operation of the feed lever j. Actually, a plurality of chip parts f, f, ... May enter the chute m (see FIG. 19).

In this case, the leading chip component f is located in the component supply section n, but the subsequent chip components f, f ,.
.. remain in the chute m, and these chip components f, f, ... Block the release of the positive pressure air that has carried them to the component supply part n side, and the positive pressure air is in the chute m. Will remain.

When the positive pressure air remains in the chute m, the positive pressure air is placed at the end of the chip part f.
, The leading chip component f (the chip component f positioned in the component supply section n) is pressed through the respective chip components f, f, ... There was a problem that it jumped out of the component supply unit n or got on the peripheral portion of the component supply unit n (Fig. 1).
9).

[0013]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the bulk cassette of the present invention is a component of a component conveying path .
Covering the cover the supply side, a portion between the site and the component supply unit which air for conveying from the air <br/> over supply means of the cover is provided, the parts conveying path and an outer Establish a residual pressure release path that communicates with the bottom surface of the cover.
As it goes forward, it displaces upward and slips out of the top surface of the cover.
It is formed as follows.

[0014]

Therefore, according to the bulk cassette of the present invention, a plurality of chip parts are formed in the part transfer path even if positive pressure air remains in the part transfer path even if the chip parts are located in the part transfer path. Positive pressure air can be released from the residual pressure release passage, and the residual pressure does not press the chip component unnecessarily. Therefore, the chip component located in the component supply section pops out or rides on the peripheral edge of the chip component. It is possible to eliminate such a supply error and surely supply the chip component to the supply position. In addition, the residual pressure release path
Because it is formed to incline to the slope,
The positive pressure air that is emitted can be efficiently discharged to the outside.
come.

[0015]

The details of the bulk cassette of the present invention will be described below with reference to the illustrated embodiments.

In the figure, 1 is a bulk cassette, 2 is its frame, and the required members are attached to the frame 2. Since the bulk cassette 1 is the same as the known one except for the configuration of the component supply unit, only the components other than the component supply unit will be briefly described.

Reference numeral 3 is a clamp lever, and 4 is a clamp claw operated by the clamp lever 3, and a connecting portion (not shown) provided at the front end of the lower surface of the frame 2 is connected to the front end of the moving base 5 of the component mounting machine. Then, the clamp claw 4 is locked to the front edge of the rear end of the moving base 5, and the bulk cassette 1 is attached to the moving base 5 (see FIG. 2).

Reference numeral 6 denotes a frame guide, and the guide 6
And the bulk case 7 is attached. The bulk case 7 has a flat box shape, and an opening 8 is formed at its front end, and the opening 8 is opened and closed by a shutter 9 (see FIGS. 1 and 3).

Reference numeral 10 denotes a knob provided at the base end portion of the shutter 9, which is located in a facing hole 11 formed on the upper surface. The chip parts 12, 12, ... In bulk state are housed and supplied in such a bulk case 7.
When the bulk case 7 is attached to the bulk cassette 1, the shutter 9 is opened and the opening 8 is opened (see FIG. 3).

As described above, when the bulk case 7 is attached to the bulk cassette 1, the chip parts 12, 12, ...
Is supplied to the inlet portion 14 of the chute 13 which is a component supply path (see FIG. 4).

The chute 13 is formed on the frame 2, the side surface is covered by a side cover 15 attached to the frame 2, and the top surface of the rear half of the almost horizontal portion near the front end is the tip cover 16. Further, the upper surface of the front half is covered with the transparent cover 17, and is formed in a tunnel shape except for the front end portion. The front end of the chute 13 is connected to the component supply unit 18 with its upper surface opened.

The transparent cover 17 is for visually observing the state of the front side portion of the component supply section 18 in the chute 13.

The chip component 12 is, for example, a 1608C type ceramic capacitor, and its shape is 0.
It is a rectangular parallelepiped of 8 * 0.8 * 1.6 (mm ³ ), both ends in the longitudinal direction are electrodes 12 a, 12 a, and the cross-sectional shape of the chute 13 to which the chip component 12 is conveyed is 0.
It is a 96 × 0.96 (mm ² ) square (see FIGS. 5 and 6).

When the pressing portion of the component mounting machine (not shown) presses the feed lever 19, the chip component 12
Is supplied to the single-part supply unit 18. That is, when the feed lever 19 is pressed, positive pressure air is supplied from a positive pressure air supply device (not shown) connected to the air supply port 20, and the positive pressure air causes the chip component 12 to pass through the chute 13 and component supply. It is supplied to the section 18.

Reference numeral 21 denotes an air supply passage extending inward from the air supply port 20.
Is branched at its tip into two parts, one of which is connected to a component stirring nozzle 22 opened on the lower surface of the inlet portion 14 of the chute 13 and the other is directed to the component supply portion 18 side on the lower surface of the middle portion of the chute 13. Is connected to a nozzle 23 for a component chute that is opened. Reference numeral 24 is a check valve inserted at a position near the air supply port 20 of the air supply passage 21 to prevent backflow of the air supplied into the air supply passage 21 to the air supply port 20 side. belongs to.

[0026] 25, 25, 25 are formed in the distal end cover 16, communicates between the chute 13 and the outside, a residual pressure release passage for releasing the residual pressure in the chute 13 to the outside, the distal end cover 16 The three residual pressure release passages 25, 25, 25 are formed to be parallel to each other so as to be displaced upward as they go forward from the lower surface of the and to escape to the upper surface thereof.

The residual pressure release passages 25, 25, 25 are formed so as to be inclined forward and upward because the direction of the positive pressure air ejected from the component chute nozzle 23 is forward. This is for discharging to the outside, and the inclination angle is arbitrary.

Further, the residual pressure release passage 25 has a square cross-sectional shape and is formed in a shape slightly smaller than the smallest cross-sectional shape of the chip component 12, so that the chip component 12 cannot pass through the residual pressure release passage 25. It is said that
The chip component 12 conveyed in the chute 13 is prevented from accidentally entering the residual pressure release passage 25 (see FIG. 9). The cross-sectional shape is substantially uniform over the entire length of the residual pressure release passage 25.

When positive pressure air is supplied from the air supply port 20, however, the air is sprayed from the component stirring nozzle 22 and the component chute nozzle 23 through the air supply passage 21 and is positioned at the inlet portion 14. The chip components 12, 12, ... Are being agitated, and one of them 12 is dropped into the chute 13 and is further jetted from the component chute nozzle 23 (shown by an arrow in FIG. 7). .) To the component supply unit 18 (see FIGS. 7 and 8).

The components are agitated by the nozzle 22 for stirring,
Chip components 12, 12, ... Inside the chute inlet portion 14
The agitated air has a large space formed by the chute inlet portion 14 and the interior of the bulk case 7 communicating with each other, and is discharged into the space. Therefore, a high positive pressure does not remain inside the air. Absent.

The air jetted from the component chute nozzle 23 and carrying the chip component 12 to the component supply unit 18 is discharged from the residual pressure release passages 25, 25, 25 (indicated by an arrow in FIG. 8), The pressure in the chute 13 does not increase. Therefore, even if a plurality of chip components 12 are located in the chute 13, the last chip component 12 is not pressed by the residual pressure, and the leading chip component 12 located in the component supply unit 18 is the component supply unit. 18
Never jump out of.

Although the three residual pressure release passages 25, 25, 25 are formed in parallel with each other in the above embodiment, the bulk cassette of the present invention is not limited to this, and the inclination angle of each residual pressure release passage 25 is different. They may be formed differently, and the number formed is not limited to three, but is arbitrary.

FIG. 10 shows a modification 26 of the residual pressure release passage.

The residual pressure release passage 26 has a circular cross section,
Its size is a diameter slightly smaller than the diagonal of the smallest cross-sectional shape (square) of the chip component 12.

As a result, the chip component 12 does not pass through the residual pressure release passage 26, so that the chip component 12 does not accidentally enter the residual pressure release passage 25.

Then, the residual pressure release passage 26 having a circular sectional shape and the residual pressure release passage 25 having a rectangular sectional shape in the first embodiment were compared with each other in terms of the maximum sectional area through which the chip component 12 cannot pass. In this case, since the circular residual pressure release path 26 is larger, the residual pressure in the chute 13 can be more efficiently discharged to the outside (see FIGS. 9 and 10).

FIG. 12 shows another modification 27 of the residual pressure release passage.

The residual pressure release passage 27 is formed such that its cross-sectional shape is such that the chip component 12 cannot pass through at the inlet and becomes larger toward the outlet side.

For this reason, the cross sectional area of the residual pressure release passage 27 increases as the residual pressure is released.
The pressure is released well, and the residual pressure in the chute 13 can be discharged to the outside more efficiently.

FIG. 13 shows a comparative example 28 of the residual pressure release passage.

Residual pressure release of the present invention described so far
Unlike the paths 25, 26 and 27, the residual pressure release path 28 as a comparative example of the present application has an inclined angle (angle between the chute 13 in front of the inlet of the residual pressure release path 28 and the residual pressure release path 28). It was formed.

According to the residual pressure release passage 28, it is possible to prevent the chip components 12 conveyed in the chute 13 from entering the residual pressure release passage 28.

Further, since the chip component 12 is less likely to enter the residual pressure release passage 28, the cross sectional shape of the residual pressure release passage 28 may be sized so that the chip component 12 can pass therethrough. The pressure can be discharged efficiently.

The residual pressure release passage 2 can also be obtained by disposing a mesh 29 having a mesh smaller than the minimum cross-sectional area of the chip part 12 at the inlet of the residual pressure release passage 25, 26 or 27 of the present invention.
5 , 26 or 27 can be made larger in sectional shape than the chip component 12 (see FIG. 11). Not limited to the net 29, a rod-shaped member or the like may be arranged, and the point is that the chip component 12 does not enter the residual pressure release passage 25, 26, or 27.

[0045]

[0046]

As is apparent from the above description, in the bulk cassette of the present invention, the chip components supplied from the bulk case are supplied to the component mounting machine through the component transfer path by the air supplied from the air supply means. In the bulk cassette of chip parts to be sent to the supply part, the part transfer path part
The product supply unit side is covered with a cover, and the inside of the component transfer path and the outside are provided at a part between the part of the cover where the air for transfer from the air supply unit is supplied and the part supply unit. To form a residual pressure release passage, and connect the residual pressure release passage to the lower surface of the cover.
From the top to the front, displace upward and pull it out on the top surface of the cover.
It is characterized in that it is formed so as to be sharpened .

Therefore, according to the bulk cassette of the present invention,
Even if multiple chip components are located in the component transport path and positive pressure air remains in the component transport path, positive pressure air can be discharged from the residual pressure release path formed in the middle of the component transport path. Therefore, the residual pressure does not press the chip component unnecessarily, and therefore, it is possible to eliminate a supply error such as the chip component positioned in the component supply portion popping out or riding on the peripheral portion thereof. Can be reliably supplied to the supply position. In addition, the residual pressure release path
Because it is formed to incline to the slope,
The positive pressure air that is emitted can be efficiently discharged to the outside.
come.

It should be noted that the shapes and structures of the respective parts shown in the above-mentioned embodiments are merely examples of the embodiment when carrying out the present invention, and the technical scope of the present invention is limited by these. It should not be construed in a conventional way.

[Brief description of drawings]

FIG. 1 shows an example of implementation of the bulk cassette of the present invention together with FIGS. 2 to 9, and is a schematic perspective view.

FIG. 2 is a schematic side view showing a state of being attached to a component mounting machine.

FIG. 3 is a perspective view showing a bulk case.

FIG. 4 is a cross-sectional view showing an enlarged main part.

FIG. 5 is an enlarged perspective view of a chip part.

FIG. 6 is an enlarged cross-sectional view of a main part of the inside of the chute as viewed from the transport direction.

FIG. 7 is a cross-sectional view of essential parts showing a state where a chip component is being conveyed.

FIG. 8 is a cross-sectional view of essential parts showing a state in which residual pressure is discharged from within the chute.

FIG. 9 is an enlarged cross-sectional view showing the sizes of a chip component and a residual pressure release path in comparison with each other.

FIG. 10 is an enlarged sectional view showing a modified example of the residual pressure release passage.

FIG. 11 is a view of a state in which a net is provided at the inlet of the residual pressure release passage as viewed from the inside of the chute.

FIG. 12 is an enlarged cross-sectional view showing another modified example of the residual pressure release passage.

FIG. 13 is an enlarged sectional view showing a comparative example of a residual pressure release passage.

FIG. 14 is a schematic view of the component mounting machine together with FIG. 15, and is a perspective view.

FIG. 15 is a side view.

FIG. 16 is a perspective view showing a conventional bulk cassette.

FIG. 17 is a perspective view showing a bulk case.

FIG. 18 is a sectional view of a conventional bulk cassette.

FIG. 19 is a cross-sectional view showing a problem of the conventional bulk cassette.

[Description of Reference Signs] 1 bulk cassette 7 bulk case 12 chip component 13 chute (component transport path) 16 tip cover (cover) 18 component supply section 23 component chute nozzle (portion to which air is supplied) 25 residual pressure release path 26 Residual pressure release path 27 Residual pressure release path

Claims (5)

(57) [Claims] 1. A bulk cassette of chip parts for sending chip parts supplied from a bulk case by air supplied from an air supply means to a parts supply section to a parts mounting machine through a parts transfer path , wherein Cover the component supply side with a cover.
In addition, a part between the part of the cover to which the air for transportation from the air supply means is supplied and the part supply part.
In minutes, follow the above components conveying path and the outside to form a residual pressure release passage communicating with, going forward the residual pressure release passage from the lower surface of the cover
The bulk cassette is characterized in that it is formed so that it is displaced upwards and is pulled out to the upper surface of the cover . 2. The bulk cassette according to claim 1, wherein at least an inlet side cross-sectional shape of the residual pressure release passage is formed in a shape through which a chip component cannot pass. 3. The bulk cassette according to claim 1, wherein a plurality of residual pressure release passages are formed. 4. The bulk cassette according to claim 1, wherein the residual pressure release passage has a circular cross-sectional shape. 5. The residual pressure release passage has a small inlet side and an outlet side
The bulk cassette according to claim 1, 2, 3, or 4, wherein the bulk cassette is formed large .