JPH0971323A - Chip parts supplying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly and securely supply chip parts to a parts supplying unit of a delivery place to a mounter. SOLUTION: This chip parts supplying device is provided with a parts carrying air blow port 22, which is formed in a parts carrying passage 10 for carrying chip parts 6 to a part supplying unit for delivering the chip parts from a part storage unit 8 for storing the chip parts 6 to an equipment to be installed in a printed substrate, and furthermore, the device is provided with an agitating and aligning air blow ports 16, 17 for agitating and aligning chip parts, which are formed in moving parts 14, 9, 11 from the part storage unit 8 to the part carrying passage 10. Furthermore, air discharge ports 24, 25 for discharging the residual pressure, which is to be generated after blowing the air into the atmosphere, are formed near the agitating and aligning air blow ports.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel chip component supply device. More specifically, the present invention relates to a chip component supply device for delivering a chip component to a chip component mounter that mounts the chip component on a printed circuit board, and at a high speed, the chip component to a component supply unit that is a delivery place to the mounting machine, and Relating to reliable supply technology.

[0002]

2. Description of the Related Art A so-called bulk feeder is known as a chip component supply device for delivering a chip component to a chip component mounting machine for mounting the chip component on a printed circuit board.

A bulk case (not shown) is attached to the bulk feeder a, and the bulk case is made into a bulk.
That is, the bare chip parts b, b, which are not packaged,
... are stored, and by mounting the bulk case, a large number of chip components b, b, ... Stored in the bulk case enter the rear part component storage portion c.

A slightly wider space d called a chamber is formed following the front side of the parts storage section c through a narrow path, and a parts conveying path e extends forward from the front end of the chamber d, and the parts conveying path is formed. An unillustrated component supply portion is formed at the front end of e.

An air outlet f for conveying the component is opened in a portion of the component conveying path e slightly separated from the chamber d in a direction facing the front end direction of the component conveying path e. An air outlet g for agitation alignment is formed rearward, that is, facing toward the chamber d, slightly behind the air outlet f for transportation. Further, another air outlet h for stirrer alignment is opened toward the rear surface of the front end portion of the component storage portion c and slightly rearward.

When positive pressure air is supplied to the bulk feeder a, air is ejected from the air outlets f, g and h.

The chip component b is conveyed toward the front end of the component conveying path e by the air ejected from the component conveying air outlet f, and the air ejected from the stirrer aligning air outlet g is supplied to the chamber. The chip parts b, b, ... Inside d are agitated and aligned, and the air blown out from another air outlet h for agitation alignment is the chip components b, b ,. -It functions to stir and align, and to limit the number of chip parts b, b, ... that are transferred from the part storage part c to the chamber d.

[0008]

By the way, in the above-mentioned conventional chamber a, problems occur in the possibility of high-speed transportation of chip components and the reliability of the posture of the chip components supplied to the component supply unit.

That is, the inside of the chamber a is usually in a hermetically sealed state, and communicates with the outside air only through a slight gap between the bulk supply case and the parts supply section located at the front end of the parts conveyance path e. There is. If the chip components are not transported at a high speed, that is, if the interval at which the air is ejected is long, the air ejected from the air outlets g and h gradually flows between the agglomerated chip components and from the gap. Although it does not go out and become a residual pressure, if the chip component is conveyed at a high speed, that is, if the air ejection interval becomes short, the air ejected before the next air ejection is sufficiently discharged from the bulk feeder a. It does not come off, and it becomes a so-called residual pressure, which acts as residual pressure with a delayed response to the air ejected from the air outlet f for conveying the component, so that the chip component located in the component supply unit (not shown) This will disturb the posture and reduce the reliability of chip component supply.

Therefore, it is desired that the air blown out from the air outlet for agitation and alignment is not quickly discharged from the bulk feeder to become a harmful residual pressure.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a chip component supply device of the present invention transfers a chip component from a component storage part for storing the chip component to a mounting machine for mounting the chip component on a printed circuit board. In addition to the air outlets for component transportation formed in the component transportation path for transporting to the component supply unit for delivery, the chip components are agitated at the transition portion from the component storage unit to the component transportation path. A stirrer air outlet for stirrer alignment is provided for the purpose of aligning, and an air discharge port is formed near the stirrer air outlet for stirrer to release residual pressure generated after the air is blown into the atmosphere.

Therefore, in the chip component supply device of the present invention, the air blown out from the air outlet for agitation alignment is promptly discharged into the atmosphere from the air outlet.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The details of the chip component supply device of the present invention will be described below with reference to an embodiment shown in the drawings.

In the illustrated embodiment, the present invention is applied to what is called a bulk feeder.

A component supply case 1 for supplying a chip component to the chip component supply device according to the present invention is a thin box-shaped storage part 2 and one end of the storage part 2 is connected to a chip part supply device to be described later. The engaging portion 3 as a part is integrally formed.

The engaging portion 3 is formed with an opening 4 for communicating the inside and outside of the storage portion 2, and the opening 4 is opened and closed by a shutter 5 (see FIG. 1).

In the component supply case 1 as described above, the chip components 6, 6, ... In a bulk state, that is, in an unpackaged bare state are stored. Then, the component supply case 1 is set in the chip component supply device 7 in a state in which the rear end of the component supply case 1 is inclined downward, and when the shutter 5 is opened, the opening 4 is opened.

The rear part of the chip component supply device 7 is inclined downward as a whole, and the chip component supply device 1 set in the chip component supply device 7 to the chip components 6, 6 ,. It flows into the chip component supply device 7,
The component storage section 8 and the chamber 9 reach the component alignment chamber 11 located on the inlet side of the component transfer path 10.

The parts storage portion 8 is slightly flat in the left-right direction and has a relatively large volume, and is formed so as to be inclined so that the entire part thereof is displaced downward as it goes forward, and flows from the parts supply case 1. Chip parts 6, 6, ...
Is to be stored.

A support wall 12 is formed at the upper end of the front end wall of the component storage section 8 and is directed obliquely upward and rearward. The support plate 12 is made of an elongated sheet metal material and extends in a direction inclined obliquely rearward and downward. 13 are supported.

The rear end portion of the restraint plate 13 which protrudes obliquely downward and rearward from the support wall 12 is a free end, and the front end portion thereof is bent obliquely forward and downward at a substantially right angle so that the front end portion and the component storage part are stored. An appropriate gap is formed between the bottom surface of the portion 8 and the bottom, and the gap serves as the gate 14.

The gate 14 prevents the chip components 6, 6, ... Stored in the component storage portion 8 from flowing into the chamber 9 at a time.

The chamber 9 is located on the downstream side of the component storage section 8, and the bottom surface thereof is continuous with the bottom surface of the component storage section 8.

At the bottom surface of the outlet 15 of the component storage section 8, an air outlet 16 for stirring alignment is opened obliquely rearward, and at the component storage section outlet 15, the chip components 6, 6 ,.
..Agitated and aligned.

Further, the chamber 9 has chip parts 6, 6 located in a parts alignment chamber 11 located on the downstream side thereof.
It functions as a space for agitating and aligning.

The component alignment chamber 11 is located in front of the chamber 9 and has a bottom surface continuous with the component storage section 8 and the bottom surface of the chamber 9, and the cross-sectional shape of one chip component 6 has a margin. The size is such that two chip parts 6, 6 can pass through at the same time, and the two chip parts 6, 6 cannot pass through at the same time.
... so that the chip parts 6, 6, are sequentially supplied.
... functions as a space for arranging.

An air outlet 17 for aligning agitation is formed obliquely rearward at the bottom of the part alignment chamber 11 and an outlet for jetting agitation air from the air outlet 17 for aligning agitation. Thus, the chip components 6, 6, ... In the component alignment chamber 11 are blown off and agitated in the chamber 9. Then, when the supply of the stirring air is stopped, the chip parts 6, 6,
... drop and enter the parts alignment chamber 11 in an aligned state.

The chip parts 6, 6, ... Inflowed from the part supply case 1 into the part storage part 8 of the chip part supply device 7 flow through the part storage part 8, the chamber 9, and the part alignment chamber 11. , The chip parts 6, 6, ... Are located up to the lower part of the parts alignment chamber 11, the chamber 9 and the parts storage part 8 from the upstream side part of the parts conveyance path 10, and this state is the chip parts 6 , 6, ... Are put in a standby state for transfer to a component supply unit described later (see FIG. 3).

In this state, the load of many of the chip components 6, 6, ... Positioned in the component storage portion 8 is applied to the suppression plate 13, so that the chip components 6, 6 in the component storage portion 8 are placed. , Are not applied to the outlet 15 of the component storage section, and clogging of the chip components 6, 6 in the vicinity of the outlet 15 of the component storage section is less likely to occur.

When the pressing portion of the component mounter (not shown) presses the feed lever 18, the chip component 6,
6 are supplied to the component supply unit 19 located at the front end of the one-piece component transport path 10. That is, the feed lever 18
When is pressed, positive pressure air is supplied to the air supply port 20 from a positive pressure air supply device (not shown) almost at the same time, and the positive pressure air causes the chip components 6, 6, ...
And is supplied to the component supply unit 19.

An air supply path 23 extending inward from the air supply port 20 is formed, and the air supply path 21 is branched into two at the tip thereof, one of which is the above-mentioned part conveying path 1
0 is connected to an air outlet 17 for stirrer alignment that is open to the lower surface of the component aligning chamber 11, and the other is the lower surface of the component transport path 10 and is obliquely forward to the downstream side of the air outlet 17 for stirrer alignment. It is connected to an air outlet 22 for conveying the component, which is open facing.

Further, the air outlet 1 for aligning the agitation described above.
6 is branched before the air outlet 17 for agitating and aligning.

The air supply port 20 of the air supply passage 21
A check valve 23 is inserted at a position nearer to prevent backflow of the air supplied into the air supply passage 21 to the air supply port 20 side (see FIG. 1).

When positive pressure air is supplied from the air supply port 20, the positive pressure air is jetted through the air supply passage 21 from the air outlets 17 and 16 for agitating and aligning and the air outlet 22 for conveying parts. The chip component 6 located at the head among the chip components 6, 6, ... Arranged in the component alignment chamber 11 is pushed by the carrier air ejected from the component carrier air outlet 22. It is sent to the parts supply unit 19.

On the other hand, the air blown from the air outlets 17 and 16 for agitating and aligning the chip components 6 and 6 located in the component alignment chamber 11 and the component storage portion 8, particularly near the gate 14, respectively. ..Agitated and aligned.

One side surface of the component storage portion 8, particularly the suppressing plate 1
Air outlets 24, 25 are opened on the side surface of the front side of 3 and one side surface of the chamber 9, respectively, and these air outlets 24, 25 are connected to the air exhaust passage 26, respectively.
It communicates with the air discharge port 28 via 27. The air discharge paths 26 and 27 are joined together before the air discharge port 28.

Then, the air outlet 1 for stirrer alignment
The air jetted from 6 and 17 is the chip component 6,
After stirring 6, ..., Immediately, air outlet 2
4, 25, the air discharge paths 26, 27, and the air discharge port 28 are discharged into the atmosphere.

Therefore, the air outlet 1 for stirrer alignment
Air ejected from Nos. 6 and 17 does not disturb the posture of the chip component 6 located in the component supply unit 19 as a residual pressure of so-called response delay, and the chip component supply is speeded up, that is, It is possible to shorten the air ejection interval and increase the chip component supply amount per unit time.

A groove 29 narrower than the width of the component transport path 10 is formed on the lower surface of the component transport path 10.

[0040]

As is apparent from the above description, the chip component supply device of the present invention transfers the chip component from the component storage part for storing the chip component to the mounting machine for mounting the chip component on the printed board. In addition to the air outlets for component transportation formed in the component transport path for transporting to the component supply section, the chip components are formed in the transition section from the component storage section to the component transport path, and the chip components are agitated and aligned. An air outlet for stirrer alignment is provided for this purpose, and an air outlet is formed in the vicinity of the air outlet for stirrer alignment to allow residual pressure generated after the air is blown into the atmosphere.

Therefore, in the chip component supply device of the present invention, the air blown out from the air outlet for the stirring alignment is promptly discharged into the atmosphere from the air outlet. Therefore, the air ejected from the air outlet for stirring alignment does not become a residual pressure of so-called delayed response and does not disturb the posture of the chip component located in the component supply unit.
It is possible to speed up the supply of chip components, that is, shorten the air ejection interval to increase the amount of chip components supplied per unit time.

It should be noted that the shapes and structures of the respective parts shown in the above-mentioned embodiments are merely examples of the embodiment when carrying out the present invention, and the technical scope of the present invention is thereby provided. It should not be interpreted in a limited way.

[Brief description of drawings]

FIG. 1 shows an example of an embodiment of the chip component supply device of the present invention together with FIGS. 2 to 4, and is a schematic side view showing the inside as seen through.

FIG. 2 is a schematic perspective view.

FIG. 3 is an enlarged vertical sectional view.

4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is an enlarged perspective view showing a component supply case.

FIG. 6 is an enlarged cross-sectional view of a main part showing an example of a conventional chip component supply device.

[Explanation of symbols]

 6 chip parts 7 chip parts supply device 8 parts storage section 10 parts transfer path 16, 17 air outlet for stirrer alignment 19 parts supply section 22 air outlet for parts transfer 24, 25 air outlets 26, 27 air outlets (Communication path to atmosphere)

Claims (4)

[Claims] 1. A component transporting path formed on a component transporting path for transporting a chip component from a component storage part for storing the chip component to a mounter for mounting the chip component on a printed circuit board. In addition to the air blowout port, an air blowout port for stirring alignment for forming the agitating and aligning the chip components is provided at a transition portion from the component storing section to the component conveying path, and the air for the agitating alignment is provided. A chip component supply device characterized in that an air discharge port is formed in the vicinity of the air outlet to release residual pressure generated after the air is blown into the atmosphere. 2. The chip component supply device according to claim 1, wherein a plurality of air outlets for aligning the agitation are formed. 3. The chip component supply device according to claim 1, wherein a plurality of the air discharge ports are formed. 4. The chip component supply device according to claim 3, wherein the communication passages of the plurality of air discharge ports to the atmosphere merge on the way.