JP3490295B2 - High frequency signal processing device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency signal processing device, for example, an extension amplifier, a trunk line branch amplifier, a distribution amplifier, a trunk line amplifier, an optical repeater used in a common reception facility, and particularly for inputting / outputting a high frequency signal. Regarding the installation of the connector.

[0002]

2. Description of the Related Art A circuit unit 1 for various amplifiers as described above is housed in a housing 2 made of, for example, aluminum die-cast as shown in FIG. This circuit unit 1
For example, as shown in FIG. 6, it is configured on a printed circuit board 3, and conductive plate plates 4 and 6 are arranged with the printed circuit board 3 interposed therebetween. The printed board 3 and the plates 4 and 6 are coupled by a plurality of conductive spacers 8. The printed circuit board 3 is detachably attached to the housing 2 via a large number of earth springs 7.

For this circuit unit 1, VHF band,
Since it is necessary to input or output a high frequency signal in the UHF band, the SHF band or the like, the housing 2 is provided with a connector 10 for a coaxial cable. The center contact 10a of the connector 10 and the outer contact 10b need to be connected to predetermined positions on the printed circuit board 3, respectively. Therefore, the connection of the center contact 10a is soldered to the land for input or output of the printed circuit board 3 through the coated conductor 12. Further, the external contacts 10b are connected as follows. That is, the reference potential (ground potential) of the printed circuit board 3
The tips of the two metal spring members 14 soldered to the surfaces are brought into contact with the plate 6 and bent so as to face inward. The external contact 10b is arranged between these spring members 14, and the external contacts 10b are brought into point contact with both spring members 14.

[0004]

However, in this structure, the external contact 10b of the connector 10 is only in point contact with the spring member 14, and therefore is not well connected to the reference potential surface. Further, if the circuit unit 1 is attached to and detached from the housing 2 several times, the spring member 14 may gradually spread due to deterioration over time, and contact failure with the external contact 10b may occur.

Also, depending on the frequency used, the coated conductor 1
2 generated stray inductance, and due to this, the operating band of the circuit unit 1 could not be extended to a high frequency band.

Further, in the circuit unit 1, since the printed circuit board 3 and the plates 4 and 6 are connected and assembled only by the spacers 8, a good ground cannot be provided to the printed circuit board 3. In order to improve it, the printed circuit board 3 is attached to the housing 2 by using the earth spring 7. However, when the circuit unit 1 is attached to and detached from the housing 2 several times, the earth spring 7 may damage the housing 2 and the earth spring 7 has elasticity, so that the circuit unit 1 is attached to the housing 2. There was also the problem of difficulty.

An object of the present invention is to improve the electrical connection between the connector and the circuit board. Further, the present invention is
The purpose is to easily attach the circuit unit to the housing and not to damage the housing.

[0008]

In order to solve the above-mentioned problems, the invention according to claim 1 has a conductive chassis having a high-frequency signal processing section therein, and a metal cylindrical cylindrical flange section on the base section. A first connector for the high-frequency signal processing section, which has a center contact inside the external contact and has the flange section in surface contact with the chassis, and the chassis is detachably accommodated. A conductive housing, a second connector provided in the housing, and a connector provided in the housing and connecting the first and second connectors. . Further, in a state where the chassis is housed in the housing, the tip end portion of the external contact of the first connector contacts the rear wall of the housing, and surrounds the first connector together with a part of the chassis. A shield wall is provided from the chassis to the rear wall of the housing. The high-frequency signal processing unit is provided on a single substrate arranged in the chassis, and a plurality of reference potential portions of the substrate are fixed to the chassis by a conductive connector.

According to the first aspect of the present invention, the flange portion of the external contact of the first connector for the high frequency signal processing portion is in surface contact with the chassis. The contact area of the external contact of the first connector with the chassis is larger than that in the case of point contact. Further, the connection of the first connector to the second connector provided in the housing, for example, the connection of the center contacts is performed by a connector. Therefore, for example, even when inspecting the high frequency signal processing unit at the time of factory shipment,
It is not necessary to store the signals in the housing one by one and take out or input a signal from the second connector attached to the housing, and to input a high-frequency signal to the first connector, or the first connector. The high frequency signal can be taken out from. Further, the reference potential portion on the substrate is connected to the chassis, which is the reference potential, by a conductive connector. Moreover, the connection is made at a plurality of places. Therefore, a good ground can be provided to the substrate.

According to a second aspect of the present invention, in the high frequency signal processing device according to the first aspect, the center contact of the first connector is directly connected to the substrate.

According to the second aspect of the present invention, the center contact of the first connector is directly connected to the substrate, for example, the input or output portion of the high frequency signal on the substrate without using the covered conductor. . Therefore, no stray inductance is generated.

According to a third aspect of the present invention, a conductive chassis having a high-frequency signal processing unit therein, a first connector for the high-frequency signal processing unit attached to the chassis, and the chassis are detachable. A conductive housing housed therein; a second connector provided in the housing; and a connector provided in the housing for connecting the first and second connectors. ing. The chassis has a peripheral wall portion having two opposing openings, and a wall portion inside the peripheral wall portion, which is substantially parallel to the opening and is coupled to the peripheral wall portion, is housed in the housing. In the
One end of the peripheral wall portion is in contact with the rear wall of the housing. When the chassis is housed in the housing, the first
A shield wall is provided until the tip of the external contact of the connector contacts the rear wall of the housing and surrounds the first connector together with a part of the peripheral wall from the chassis to the rear wall of the housing. Has been. One substrate provided with the high-frequency signal processing unit in the peripheral wall portion in parallel with the wall portion is provided so as to substantially contact the peripheral wall portion, and reference potential portions at a plurality of dispersed locations on the substrate. Are coupled to the chassis by electrically conductive connectors.
The first connector has a center contact inside an external contact having a cylindrical shape made of metal and having a flange portion at a base portion, and the flange portion has a surface contact with a side of the chassis opposite to a side where the substrate is arranged. It is fixed in the state where it was made.

According to the third aspect of the present invention, since the peripheral portion of the substrate is disposed so as to be substantially in contact with the peripheral wall portion of the chassis, the peripheral wall portion is provided with the conductive connector, for example, the reference potential portion of the peripheral portion. Can be coupled, or the reference potential portion of the substrate can be coupled to the wall portion. Further, the flange portion of the first connector is in surface contact with the wall portion, and the portion in surface contact is on the opposite side of the substrate, so that the connection with the second connector can be easily performed. .

[0014]

[0015]

[0016]

[0017]

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The high-frequency signal processing device of this embodiment is an extension amplifier used in, for example, a joint reception facility. As shown in FIGS. 1 and 5, the extension amplifier 20 includes a housing 22 having conductivity, which is made of, for example, an aluminum die cast. Inside the housing 22, a chassis 24 is arranged, as schematically shown in FIG. In this chassis 24, a printed circuit board 26 on which the circuit of the extension amplifier is constructed is arranged.

The casing 22 has parallel end walls 22 facing each other.
a, 22b and side walls 22c, 22d which are perpendicular to the end walls 22a, 22b and are parallel to each other. These end walls 2
The rear wall 2 shown in FIG. 1 so as to close one opening in a space surrounded by 2a, 22b and side walls 22c, 22d.
2e is arranged. The other opening facing the rear wall 22e is covered with an aluminum die-cast lid 23 as shown in FIG. 5, and the housing 22 and the lid 23 are screwed with bolts 25a and 25b. Further, the housing thus assembled is used by suspending it on the messenger wire. A status monitor circuit and the like are provided in the lid 23, but since they are not directly related to the present invention, detailed description thereof will be omitted.

As shown in FIG. 1, the chassis 24 has a rectangular frame-shaped peripheral wall portion 2 having opposed rectangular openings.
4a. A rectangular wall portion 24b is arranged in a position biased to one opening in the peripheral wall portion 24a, with the periphery thereof being connected to the peripheral wall portion 24a. The chassis 24 is also made of a conductive material such as aluminum or stainless steel. The other opening of the chassis 24 is removably closed by a conductive lid member 24c. As shown in FIG. 5, various adjustment switches and operation knobs are provided on the surface of the lid member 24, but since they are not directly related to the present invention, detailed description thereof is omitted. To do.

A printed circuit board 26 is arranged between the lid member 24c and the wall portion 24b. This printed circuit board 26
Is also formed into a substantially rectangular shape, and the peripheral portion thereof is the peripheral wall portion 2.
It is in contact with 4a. Since the printed circuit board 26 is arranged in such a chassis 24, the printed circuit board 2
6 is shielded.

Various parts for forming an extension amplifier circuit are arranged on the surface (front surface) of the printed board 26 on the side of the lid member 24. Among these parts, a small one is the wall portion 24b of the printed board 26. It is electrically and mechanically fixed to the pattern by being soldered to the pattern formed on the side surface (back surface).

Further, among the parts, relatively large parts 28,
30 and the like are fixed to the substrate 26 by a connector, for example, a screw 32. The part to be screwed is a part (for example, a case of parts) which may be connected to a reference potential, for example, a ground potential. Moreover, the screw 32 is made of a conductive metal, and the tip end thereof is screwed to the wall portion 24b beyond the printed circuit board 26, as shown in FIG. Therefore, these relatively large parts 2
Cases 8 and 30 are electrically connected to the reference potential.

In addition, although not shown, many screws similar to the screw 32 are used to connect the printed circuit board 26 to the wall portion 24b. The insertion position of these screws in the printed circuit board 26 is a portion where the back surface corresponding to this is the reference potential. The holes formed on the printed circuit board for inserting these screws are through holes that electrically connect the land formed on the front surface side to the reference potential portion on the back surface side, and the head of the screw is attached to the land on the front surface side. Surface contact is desirable. As a result, the reference potential portion of the printed board 26 is electrically connected to the wall portion 24b.

The position shown by x in FIG. 4 shows the screw insertion position for mounting the above-mentioned components, mounting the substrate 26, and the like. There are a large number of insertion positions of these screws, and they are distributed at various positions on the printed circuit board 26. Therefore,
The reference potential portion of the printed board 26 is favorably electrically connected to the wall portion 24b.

A plurality of lands 33 are also provided in the peripheral portion of the front surface of the printed board 26, and these lands 33 are electrically connected to the reference potential portion on the back surface through through holes. These lands 33 are electrically connected to the peripheral wall portion 24a by a conductive coupling body such as soldering. Therefore, the reference potential portion of the printed circuit board 26 is electrically connected not only to the wall portion 24b but also to the peripheral wall portion 24a through the lands 33. Therefore, the reference potential portion of the printed circuit board 26 can be more reliably connected to the chassis 2
4 can be connected to various positions at various positions, and can be surely grounded.

A first connector, for example, coaxial cable connectors 34, 36 is provided on the surface of the wall portion 24b of the chassis 24 opposite to the printed circuit board 26. The coaxial cable connector 34 is for inputting a high frequency signal to the input section of the extension amplifier, and the coaxial cable connector 36 is for outputting a high frequency signal from the output section of the extension amplifier. Printed circuit board 2
6 are arranged on the wall portion 24b so as to correspond to the input portion and the output portion which are located at 6 positions. A coaxial cable connector other than these two coaxial cable connectors may be attached.

The coaxial cable connectors 34, 36 have reference potential portions, for example, external contacts 34a, 36a made of a metal cylinder. Dielectrics 34b and 36b are arranged in these external contacts 34a and 36a,
The center contact 34 is placed in these dielectrics 34b and 36b.
c, 36c.

The outer contacts 34a and 36a are provided with flange portions 34d and 36d at their bases, as shown in an enlarged view in FIG.
Which are in surface contact with the wall 24b and are joined to the wall 24b by screws 38. Therefore, the external contacts 34a and 36a have a large contact area with the wall portion 24b, which is the reference potential portion, and can be grounded favorably. The chassis 24 may be attached to and removed from the housing 22 many times. However, the coaxial cable connector 3
Since 4 and 36 are fixed to the wall portion 24b of the chassis 24, the contact area does not change even if they are attached and detached many times.

Further, as shown in FIG. 1, since the periphery of the tips of the external contacts 34a, 36a is in contact with the rear wall 22e of the conductive case 22, the external contacts 34a, 36a are more favorably processed. Can be connected to the reference potential part. The outer contacts 34a and 36a are surrounded by the shield walls 40 and 40 together with the peripheral wall portion 24a. The tips of these shield walls 40 are in contact with the rear wall 22e of the housing 22. Therefore, the external contact 34
a and 36a are the peripheral wall 24a, the shield wall 40, and the housing 22.
The rear wall 22 surrounds the entire circumference and is shielded because it is made of a conductive metal.

The center contacts 34c and 36c are
Extends to the input and output of the printed circuit board 26,
Soldered directly to these. Therefore, it is not necessary to use a covered wire to connect the center contacts 34c and 36c to the input part and the output part, respectively, and to extend the operating band of this extended amplifier to a high frequency without generating stray inductance. You can

A second connector, for example coaxial cable connectors 42, 44, is attached. Like the coaxial cable connectors 34 and 36, the coaxial cable connectors 42 and 44 also have external contacts 42a and 44.
a, dielectric (not shown), center contacts 42c, 44
have c.

These coaxial cable connectors 42, 44
Is attached to the end walls 22a and 22b of the housing 22 in the vicinity of the positions where the coaxial cable connectors 34 and 36 are arranged so as to be substantially perpendicular to the coaxial cable connectors 34 and 36.

The external contacts 42a and 44a are connected to the housing 2
It is fixed to the two end walls 22a and 22b. Further, the center contacts 42c and 44c are connected to each other, for example, an L-shaped pin 4 such as an L-shaped pin 4 arranged inside the housing 22, as shown in an enlarged view in FIG.
6 and 46 are connected to the center contacts 34c and 36c of the coaxial cable connectors 34 and 36 , respectively. Since the coaxial cable connectors 34 and 42 are arranged close to each other and the coaxial cable connectors 36 and 44 are arranged close to each other, these center contacts 34c are arranged.
And 42c, and the center contacts 36c and 44c are connected by a relatively short L-shaped pin 46.

The circuit of this extension amplifier is printed circuit board 26.
When the printed circuit board 26 is formed on the chassis 24 and attached to the chassis 24, a high frequency signal is input to the extension amplifier and the output high frequency signal is measured to inspect the electrical characteristics of the extension amplifier. Here, since the coaxial cable connectors 34 and 36 are attached to the chassis 24, the signal source is connected to the coaxial cable connector 34 via the coaxial cable, and the coaxial cable connector 36 is connected to the measuring device via the coaxial cable. The inspection can be performed by connecting. Therefore, it is not necessary to mount the chassis 24 inside the housing 22 and connect the signal source and the measuring device using the coaxial cable connectors 42 and 44 mounted on the housing 22, thus improving the inspection work efficiency. .

The housing 22 is provided with coaxial cable connectors 42 and 44 and is connected to the coaxial cable connectors 34 and 36 via the L-shaped pin 46. Similarly, the coaxial cables can be connected to the coaxial cable connectors 42 and 44 of the housing 22 to input and output a high frequency signal, and the coaxial cable connectors 34 and 36 in the housing 22 can be connected. There is no need to do this, and the work of connecting coaxial cables is easy.

In the above embodiment, the present invention is applied to the extension amplifier used in the common reception facility, but other devices used in the common reception facility, such as a distribution amplifier, a trunk branch amplifier, a trunk amplifier, and an optical repeater. The present invention can also be applied to the above. Further, the printed circuit board is not limited to the equipment for the joint reception facility, and the printed circuit board is provided in the chassis provided in the housing, and the VHF band, the UHF band or the S band is provided on the printed circuit board.
The present invention can be implemented in various types as long as an electronic circuit that processes a high frequency signal such as the HF band is configured.

[0038]

As described above, according to the invention described in claim 1, since the flange portion of the external contact of the first connector for the high frequency signal processing portion is in surface contact with the chassis,
The contact area of the flange portion with the chassis is large, contact failure of the external contact of the first connector does not occur due to deterioration over time, and the characteristics of the high-frequency signal processing unit are stabilized. Further, since the connection of the first connector to the second connector provided on the housing is performed by connection, even in the factory shipment inspection of the high-frequency signal processing unit, each housing is housed in one housing, There is no need to take out or input a signal from the second connector attached to the housing,
Input a high frequency signal to the first connector, or
The high-frequency signal can be taken out from the connector, and the work efficiency such as inspection is improved. Further, on the substrate, the portion serving as the reference potential is coupled to the chassis, which is the reference potential, by the conductive connector, and the coupling is performed at a plurality of places, so that a good ground is provided to the substrate. can do.

According to the second aspect of the present invention, the portion on the substrate to be the reference potential is formed by the conductive connector.
Since it is coupled to the chassis, which is the reference potential, and the coupling is performed at a plurality of places, it is possible to provide a good ground to the substrate.

[0040]

According to the third aspect of the present invention, since the peripheral portion of the substrate is arranged so as to be substantially in contact with the peripheral wall portion of the chassis, the peripheral reference potential portion is provided by the conductive connector on the peripheral wall portion. It is possible to connect them, or it is possible to connect the reference potential part of the substrate to the wall part. Moreover, the flange portion of the first connector is in surface contact with the wall portion, and the portion in surface contact is on the side opposite to the substrate, so that the connection with the second connector can be easily performed.

[0042]

[Brief description of drawings]

FIG. 1 is a partially omitted plan view of an extension amplifier embodying the present invention.

FIG. 2 is a diagram showing a connection state of a coaxial cable connector of the extension amplifier of FIG.

FIG. 3 is a diagram showing a state where a coaxial cable connector of the extension amplifier of FIG. 1 is attached to a chassis.

FIG. 4 is a schematic view of the extension amplifier of FIG. 1 with a cover removed, with the cover omitted.

5 is a diagram showing a state in which the lid of the extension amplifier of FIG. 1 is removed.

FIG. 6 is a diagram showing a connection state of a coaxial cable connector to a printed circuit board in a conventional extension amplifier.

7 is a diagram showing a state in which a cover of a housing of the extension amplifier of FIG. 5 is removed.

[Explanation of symbols]

22 case 24 chassis 26 printed circuit board 32 screw (connector) 33 land (connector) 34 36 connector for coaxial cable (first connector) 34a 36a external contact (reference potential part) 34c 36c center contact 42 44 for coaxial cable Connector (second connector) 46 L-shaped pin (connector)

Front page continuation (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01R 9/05 H04N 5/00 H05K 7/10

Claims (3)

(57) [Claims] 1. A conductive chassis having a high-frequency signal processing unit therein, and a center contact inside a metal cylindrical outer contact having a flange portion at a base, wherein the flange portion faces the chassis. A first connector for the high-frequency signal processing unit arranged in contact with each other, a conductive housing in which the chassis is detachably accommodated, and a second connector provided in the housing A connector provided in the housing for connecting the first and second connectors, and the distal end portion of the external contact of the first connector in a state where the chassis is housed in the housing. Is provided in contact with the rear wall of the housing and surrounds the first connector together with a part of the chassis, and a shield wall is provided from the chassis to the rear wall of the housing. The processing unit is a high-frequency signal processing device, wherein the processing unit is provided on one substrate arranged in the chassis, and reference potential portions at a plurality of positions on the substrate are fixed to the chassis by conductive connectors. 2. The high frequency signal processing device according to claim 1, wherein the center contact of the first connector is directly connected to the substrate. 3. A conductive chassis having a high-frequency signal processing unit inside, a first connector for the high-frequency signal processing unit attached to the chassis, and a conductive housing in which the chassis is detachably accommodated. And a second connector provided in the housing, and a connector provided in the housing for connecting the first and second connectors, wherein the chassis is opposed to each other. A peripheral wall portion having two openings, and a wall portion that is connected to the peripheral wall portion substantially in parallel with the opening inside the peripheral wall portion, and is housed in the housing. One end of the peripheral wall portion is in contact with the rear wall of the housing, and the tip of the external contact of the first connector is in contact with the rear wall of the housing when the chassis is housed in the housing. Enclose the first connector with part of A shield wall is provided so as to surround the chassis until it contacts the rear wall of the housing, and one substrate provided with the high-frequency signal processing unit in the peripheral wall portion in parallel with the wall portion is the peripheral wall. The reference potential portions at a plurality of dispersed locations on the substrate are coupled to the chassis by a conductive connector, and the first connector has a cylindrical shape made of metal and is flanged to the base portion. A high-frequency signal processing device, which has a center contact inside an external contact having a portion, and is fixed in a state where the flange portion is in surface contact with the side of the chassis opposite to the side where the substrate is arranged.