JP3489400B2 - Electronic component plasma cleaning apparatus and plasma cleaning method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component plasma cleaning apparatus and a leaning method for cleaning the surface of an electronic component with plasma.

[0002]

2. Description of the Related Art A plasma cleaning method is known as a method for cleaning the surface of a substrate (for example, JP-A-6-21032). In this method, plasma is generated in a reduced pressure atmosphere, and electrons and ions generated as a result are made to collide with the surface of an electronic component to perform surface treatment. In this method, the effect of plasma cleaning depends on the time (hereinafter, referred to as “processing time”) in which plasma is continuously generated by applying a high frequency voltage to the electrodes and plasma cleaning processing is performed. Therefore, in order to perform an appropriate plasma cleaning, it is necessary to appropriately manage the processing time. Therefore, in the plasma cleaning apparatus, the processing time is set as the plasma cleaning processing condition together with the high frequency power output applied to the electrode. Is set.

[0003]

By the way, in an area where the power supply situation is bad, such as a developing country, a power supply abnormality such as a power failure may occur. When a plasma cleaning device is used in such an area and a power supply abnormality occurs during the plasma cleaning process, the power of the entire device is cut off. However, in the conventional plasma cleaning apparatus, when a power failure occurs, not only the plasma cleaning process itself is interrupted but also the function of the control unit is stopped, so that the process history of the electronic component in which the process is interrupted,
That is, it is not possible to save as a record how long the processing time has elapsed before the plasma cleaning process is interrupted.

Therefore, the electronic parts whose processing has been interrupted are
Since it is unclear how much processing time should be added to continue plasma cleaning after the power is restored, it is unavoidable to dispose of it in order to avoid shipping defective products due to excessive processing or insufficient processing as products. Was there.
And in some areas, power failure may occur frequently,
There has been a problem that the number of electronic components to be discarded reaches a considerable number and the product yield is reduced.

Therefore, an object of the present invention is to provide a plasma cleaning apparatus and a leaning method for electronic parts, which can reduce the number of electronic parts to be discarded and improve the product yield.

[0006]

According to a first aspect of the present invention, there is provided a plasma cleaning device for electronic parts, wherein the plasma cleaning means performs plasma cleaning on the electronic parts in the vacuum chamber, and a transfer means for transferring the electronic parts into the vacuum chamber. A storage unit that stores a processing history of electronic components during the plasma cleaning process;
A control unit that controls the carrying unit and the storage unit, a main power supply that supplies power to the plasma cleaning device, a power supply abnormality detection unit that detects an abnormality in the power supplied from the main power supply, the control unit and the Equipped with a backup power supply that supplies power to the storage unit, recovers from a power failure and restarts
If there is a problem with the power supply,
Additional processing for substrates for which the Zuma cleaning processing has been interrupted
Find the time and push this additional processing time to the substrate.
Perform a plasma cleaning process .

According to a second aspect of the present invention, there is provided a plasma cleaning method for an electronic component, wherein the electronic component is carried into a vacuum chamber,
A plasma cleaning method of generating plasma to plasma-clean electronic components, wherein a processing history of electronic components during plasma cleaning processing is stored in a storage unit to detect an abnormality in a main power supply that supplies power to the plasma cleaning device. If detected by the power supply abnormality detection means, power is supplied from the backup power supply to the storage unit and the control unit, and the processing history is transmitted from the storage unit to the control unit to recover from the power supply abnormality and restart. If
From the above processing history, due to power supply abnormality
Obtain additional processing time for substrates for which the processing has been interrupted.
Therefore, the plasma clock is applied to the substrate for this additional processing time.
A leaning process was performed .

[0008]

According to the present invention having the above-described structure, the processing history of the electronic component being processed is stored in the storage unit, and if the abnormality of the main power source is detected by the power source abnormality detecting means, the backup power source is provided. When power is supplied from the storage unit to the control unit from the storage unit, the processing history of the electronic components being processed is transmitted from the storage unit to the control unit, and the system restarts after recovery from the power failure
In case of the
Calculate the additional processing time for the substrate where the heating process was interrupted.
Therefore, the plasma clock is applied to the substrate for this additional processing time.
By performing the leaning process, it is possible to continue the plasma cleaning of the electronic parts whose processing has been interrupted based on the processing history after the abnormality of the main power supply is recovered, and it is possible to utilize the electronic parts that were previously discarded. The product yield can be improved.

An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a plasma cleaning apparatus for electronic parts according to an embodiment of the present invention, FIG. 2 is a partial sectional view of a plasma cleaning apparatus for electronic parts, and FIG. 3 is a control system for a plasma cleaning apparatus for electronic parts. FIG. 4 is a block diagram showing the configuration, and FIGS. 4 and 5 are partial cross-sectional views of a plasma cleaning apparatus for the electronic component.

First, the overall structure of a plasma cleaning apparatus for electronic parts will be described with reference to FIGS. In FIG. 1, reference numeral 10 is a base member, and a transport path 14 for a substrate 1 which is an electronic component is provided on the upper surface of the base member 10. The transport path 14 is a concave portion continuously formed in the longitudinal direction corresponding to the width of the substrate 1. The substrate 1 is placed in this concave portion and the substrate 1 is pushed in the longitudinal direction so that the substrate 1
Is to be transported.

A vacuum chamber 11 is provided on the transfer path 14. The vacuum chamber 11 includes a base member 10, an electrode 12 (see FIG. 2) attached to the base member 10, and a lid member 13. 2 on the outer surface of the lid member 13.
Two plate-shaped brackets 15 are fixed to each other, and the ends of the brackets 15 are joined to the block 16. The block 16 is connected to the opening / closing means 17 of the lid member 13. By driving the opening / closing means 17, the lid member 13 moves up and down, and the vacuum chamber 11 opens and closes.

The vacuum chamber 11 is connected to an air supply / exhaust section 26 and a plasma gas supply section 27 via a pipe 25 connected to a lid member (see FIG. 2). Air supply / exhaust section 26
Performs vacuum suction of the vacuum chamber 11 and introduction of air into the vacuum chamber 11. Plasma gas supply unit 27
Supplies a plasma generating gas into the vacuum chamber 11. The electrode 12 is electrically connected to the high frequency power source 19 (see FIG. 2). The high frequency power supply 19 applies a high frequency voltage to the electrode 12. Vacuum chamber 11, air supply / exhaust unit 2
6, the plasma gas supply unit 27 and the high frequency power supply 19 constitute plasma cleaning means.

In FIG. 1, a guide rail 40 is provided on the side surface of the base member 10. Two sliders 41 and 42 are slidably fitted to the guide rail 40. Bracket 4 for sliders 41 and 42
3, 44 are fixed to each other. Bracket 43,
A first cylinder 45 and a second cylinder 47 are attached to 44, respectively. The rod 46 of the first cylinder 45 and the rod 48 of the second cylinder 47 have the first
The transport arm 49 and the second transport arm 50 of FIG.

The front end of the first transfer arm 49 and the front end of the second transfer arm 50 extend onto the transfer path 14 and are bent downward to form the first transfer claw 49a and the second transfer claw 49a. It is a transport claw 50a. The first transfer claw 49a and the second transfer claw 50a are located on the transfer path 14 and move up and down by the rod 46 of the first cylinder 45 and the rod 48 of the second cylinder 47 protruding and retracting. .

A first motor 57 and a second motor 58 are arranged on the side surface of the base member 10. Pulleys 55 and 56 are attached to the rotating shafts of the first motor 57 and the second motor 58, respectively. Base member 1
Driven pulleys 53 and 54 are provided on the side surface of 0 corresponding to the pulleys 55 and 56. Belts 59 and 60 are respectively attached to the pulley 55 and the driven pulley 53 and the pulley 56 and the driven pulley 54. The belts 59 and 60 are connected to the brackets 43 and 44 by the connecting members 51 and 52.

Therefore, the first motor 57 and the second motor 58 are driven in the forward and reverse directions to move the belts 59 and 60 in the horizontal direction, and the first cylinder 45 and the first cylinder 45 mounted to the brackets 43 and 44, respectively. The second cylinder 47 moves forward and backward in the horizontal direction. By combining the forward / reverse movement in the horizontal direction and the vertical movement of the first cylinder 45 and the second cylinder 47, the first transfer claw 49a and the second transfer claw 50a move the substrate 1 on the transfer path 14. Transport by pushing. That is, the first transport claw 49a and the second transport claw 50
a is a substrate transfer means, the first transfer claw 49a carries the substrate 1 into the vacuum chamber 11 from the upstream side (the left side in FIG. 1), and the second transfer claw 50a uses the vacuum chamber 1
The substrate 1 is unloaded from inside 1 to the downstream side (right side in FIG. 1).

The loader section 20 of the substrate 1 is arranged on the upstream side of the base member 10. The loader unit 20 has a Z table 22 equipped with a Z-axis motor 23, and a magazine 21 is mounted on the Z table 22. A large number of substrates 1 are stored in a magazine 21 in a horizontal posture. A pusher 24 pushes the substrate 1 in the magazine 21 onto the transport path 14.

An unloader section 30 of the substrate 1 is arranged on the downstream side of the base member 10. The unloader unit 30 has a Z table 32 having a Z-axis motor 33, and a magazine 31 is mounted on the Z table 32. The plasma-cleaned substrate 1 is inserted into the magazine 31 by the second transfer claw 50a and collected.

Next, the configuration of the control system of the plasma cleaning apparatus for electronic parts will be described with reference to FIG. In FIG. 3, the main power supply 61 is supplied with power from a general commercial power source or the like. The main power source 61 includes a control unit 70, a storage unit 71, a clock 7
2. Power is supplied to the control unit section 64 including the interface 73 and the like, the plasma cleaning means 74, the substrate transport means 75, and other parts of the plasma cleaning apparatus for electronic components. A power supply abnormality detection device 62 such as a voltmeter is attached to the circuit wiring from the main power supply 61 to the power supply load side, and detects a power supply abnormality such as a power failure or a large fluctuation in voltage and sends a detection signal to the control unit 70. Reference numeral 63 denotes a storage battery as a backup power source, which is always charged by the power from the main power source 61. When the main power source 61 is abnormal, power can be supplied to the control unit section 64 of the plasma cleaning apparatus for electronic parts by a circuit different from the main power source 61.

For each cycle of the plasma cleaning process, the control unit 70 reads the processing start time and the time when the power supply abnormality occurs from the clock 72, which is a timer, and stores it as a processing history of the substrate being processed in the storage unit 71. To memorize. The storage unit 71 stores the processing history of the substrate being processed and the plasma cleaning processing conditions such as the set processing time and high frequency power output.

When the plasma cleaning process is interrupted due to a power supply abnormality, the control unit 70 reads the processing history of the substrate for which the plasma cleaning process is interrupted from the storage unit 71. When the plasma cleaning device for electronic components is restarted and the plasma cleaning process is restarted after the power failure is recovered, the control unit 70 controls the plasma cleaning unit 74 and the substrate transfer unit via the interface 73 based on the read process history. Give necessary instructions to 75.

This plasma cleaning apparatus for electronic parts is constructed as described above, and its operation will be described below with reference to the drawings. FIG. 2 shows a state in which the substrate 1 placed on the electrode 12 is being plasma cleaned. The inside of the vacuum chamber 11 is first evacuated by the air supply / exhaust unit 26, and then the plasma generating gas is introduced into the vacuum chamber 11 by the plasma gas supply unit 27.

Thereafter, the power supply device 19 is driven to apply a high frequency voltage to the electrode 12, plasma is generated in the vacuum chamber 11, and ions and electrons generated as a result collide with the surface of the substrate 1b. Plasma cleaning of the surface of the substrate 1 is performed (see the downward arrow in FIG. 2).

At this time, the power supply may be cut off due to an abnormality in the power supply, and the plasma cleaning may be interrupted. In this case, the power supply abnormality detecting means 62 first detects the power supply abnormality and transmits the detection result to the control unit 70, and at the same time, the storage battery 63, which is a backup power supply, supplies power to the control unit unit 64. Therefore, even if a power supply abnormality occurs, the control unit 64 does not stop functioning.

After the power supply is restored, the plasma cleaning device for electronic parts is restarted through necessary steps. At the time of restarting, first, the processing history of the substrate for which the plasma cleaning processing has been interrupted due to a power supply abnormality is read from the storage unit 71. That is, the time t1 when the plasma cleaning processing of the substrate 1 is started and the time t when the power supply abnormality detecting means 62 detects the power supply abnormality.
2 and are read.

From these two times t1 and t2, the processing time T already performed before the processing is interrupted is calculated. By calculating the difference between this processing time T and the preset processing time T0 set according to the type of the substrate 1, an appropriate additional processing time (T0-T) that should be performed by additionally performing plasma cleaning after the processing is restarted. Is required. That is, after restarting the plasma cleaning apparatus for electronic components, the additional processing time (T0-
By performing the plasma cleaning process only for T),
In total, plasma cleaning for the set processing time T0 will be performed. Therefore, even if the plasma cleaning process is temporarily interrupted due to an abnormal power supply, the quality of the substrate 1 does not deteriorate due to excessive cleaning or insufficient cleaning.

When the plasma cleaning is completed, the atmosphere is introduced into the vacuum chamber 11 by the air supply / exhaust unit 26, and the lid member 13 is raised to open the vacuum chamber 11 (see FIG. 4). Next, as shown in FIG. 5, the first motor 57 and the second motor 58 are driven to move the first transport claw 49a and the second transport claw 50a to the downstream side (right side in FIG. 5). By moving (see arrows e and f), a new substrate 1 on standby is carried into the vacuum chamber 11, and the plasma-cleaned substrate 1 is transferred to the vacuum chamber 1.
1 and carry it out into the magazine 31 (see FIG. 1),
The plasma cleaning cycle ends.

[0028]

According to the present invention, the processing history of the electronic component under processing is stored in the storage unit, and when an abnormality occurs in the main power supply, the backup power supply supplies power to the storage unit and the control unit. In addition to supply, the processing history of the substrate being processed is transmitted from the storage unit to the control unit, recovering from the power failure and restarting.
If it does, the process history may cause a
When additional processing is applied to a substrate for which the cleaning processing has been interrupted
And the substrate is added for this additional processing time.
Since the cleaning process is performed , it is possible to continue the process of the electronic component in which the plasma cleaning process has been temporarily interrupted after the power supply abnormality is recovered, based on the process history. For this reason, even if a power failure occurs, plasma cleaning is performed for each electronic component in the proper processing time, quality defects due to over-processing and under-processing do not occur, and substrates that were previously discarded have been interrupted. Can be used to improve product yield.

[Brief description of drawings]

FIG. 1 is a perspective view of a plasma cleaning apparatus for electronic parts according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a plasma cleaning apparatus for electronic parts according to an embodiment of the present invention.

FIG. 3 is a block diagram showing a configuration of a control system of a plasma cleaning apparatus for electronic parts according to an embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a plasma cleaning apparatus for electronic parts according to an embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a plasma cleaning apparatus for electronic parts according to an embodiment of the present invention.

[Explanation of symbols]

1 substrate 10 Base member 11 vacuum chamber 13 Lid member 14 Transport path 20 Loader section 26 Air supply / exhaust section 27 Plasma gas supply unit 30 Unloader section 49a First transport claw 50a Second transport claw 61 Main power supply 62 Power supply abnormality detection means 63 storage battery 71 storage 72 clock 74 Plasma cleaning means 75 substrate transfer means

Claims (4)

(57) [Claims] 1. A plasma cleaning means for plasma-cleaning a work in a vacuum chamber, a carrying means for carrying an electronic component into the vacuum chamber, and a storage section for storing a processing history of the electronic component during the plasma cleaning process.
A control unit that controls the plasma cleaning unit, the transfer unit, and the storage unit; a main power supply that supplies power to the plasma cleaning apparatus; and a power supply abnormality detection unit that detects an abnormality in the power supplied from the main power supply, When the system is equipped with a backup power supply for supplying power to the control unit and the storage unit and recovers from a power failure and restarts,
Plasma cleaning process due to abnormal power supply
The additional processing time for the board where the
For this additional processing time only plasma cleaning
A plasma cleaning apparatus for electronic parts, which is characterized by carrying out a process. 2. The plasma cleaning apparatus for electronic parts according to claim 1, wherein the processing history includes a processing start time and a power supply abnormality time. 3. A plasma cleaning method for an electronic component, wherein the electronic component is carried into a vacuum chamber and plasma is generated to perform plasma cleaning on the electronic component, wherein a processing history of the electronic component during plasma cleaning processing is stored in a storage unit. If an abnormality of the main power supply for supplying power to the plasma cleaning device is detected by the power supply abnormality detection means, the backup power supply supplies power to the storage unit and the control unit, and the processing history is stored in the storage unit. From the control unit to the control unit to recover from the power failure and restart.
In case of the
Additional processing time for substrates whose cleaning process was interrupted
For this additional processing time on the substrate
A plasma cleaning method for electronic parts, characterized by performing a cleaning process. 4. The method of plasma cleaning an electronic component according to claim 3, wherein the processing history includes a processing start time and a power supply abnormality time.