JP3488273B2 - Metal strip electrolysis equipment - Google Patents
Metal strip electrolysis equipmentInfo
- Publication number
- JP3488273B2 JP3488273B2 JP29747393A JP29747393A JP3488273B2 JP 3488273 B2 JP3488273 B2 JP 3488273B2 JP 29747393 A JP29747393 A JP 29747393A JP 29747393 A JP29747393 A JP 29747393A JP 3488273 B2 JP3488273 B2 JP 3488273B2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic solution
- plate
- metal strip
- electrolytic
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属帯板電解処理装置
に係り、特に、金属帯板の裏面に汚れムラやキズを発生
させることなく、当該金属帯板の表面を連続的に電解処
理する金属帯板電解処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal strip plate electrolytic treatment apparatus, and more particularly, to a continuous electrolytic treatment of the surface of a metal strip plate without causing uneven stains or scratches on the back surface of the metal strip plate. The present invention relates to a metal strip electrolytic treatment device.
【０００２】[0002]
【従来の技術】従来から、金属帯板の上部表面を連続的
に電解処理（片面処理）する方法として、種々の電解処
理方法が紹介されている。そして、その中の一般的な方
法として、電解槽内を連続的に通過する金属帯板表面
に、電解液吐出管から吐出される電解液を供給し、当該
電解液を電極により電気分解することで、前記金属帯板
の上部表面を電解処理する方法が挙げられる。2. Description of the Related Art Heretofore, various electrolytic treatment methods have been introduced as a method of continuously electrolytically treating the upper surface of a metal strip (single-sided treatment). Then, as a general method among them, the electrolytic solution discharged from the electrolytic solution discharge pipe is supplied to the surface of the metal strip plate that continuously passes through the electrolytic cell, and the electrolytic solution is electrolyzed by the electrodes. Then, a method of electrolytically treating the upper surface of the metal strip may be used.
【０００３】しかしながら、この電解処理方法は、前記
金属帯板の裏面の一部に、前記電解液が巻き込まれて裏
廻りし、この部分まで電解処理される結果、金属帯板の
裏面に汚れやムラが生じ、商品価値を著しく低下させる
という問題があった。また、前記電解液の裏廻りによ
り、不必要な部分まで電解処理されるため、効率的な電
解処理を行うことができないという問題があった。そし
て、効率的な電解処理を行うためには、電源装置を大型
化する必要があり、設備費用がかかる、広い設置スぺー
スが必要になる等、種々の問題を引き起こしていた。However, in this electrolytic treatment method, a part of the back surface of the metal strip plate is entrained by the electrolytic solution and goes around, and as a result of this part being subjected to electrolytic treatment, the back surface of the metal strip plate becomes dirty. There was a problem that unevenness was caused and the product value was significantly reduced. In addition, there is a problem in that efficient electrolytic treatment cannot be performed because an unnecessary portion is electrolytically treated by the backing of the electrolytic solution. In addition, in order to carry out efficient electrolytic treatment, it is necessary to upsize the power supply device, resulting in various equipment costs, a large installation space, and the like.
【０００４】そこで、近年では、前記金属帯板を支持・
誘導するガイド板と金属帯板との間に、樹脂板、ゴム
板、ガラス板等からなる干渉板を設置し、当該金属帯板
と干渉板とが形成する隙間を狭くすることで、前記金属
帯板の裏面に裏廻りする電解液の量を極力減少させ、当
該金属帯板の裏面が電解処理されることを抑制する従来
例が紹介されている。Therefore, in recent years, the metal strips have been supported and
An interference plate made of a resin plate, a rubber plate, a glass plate, or the like is installed between the guiding plate and the metal strip plate, and the gap formed by the metal strip plate and the interference plate is narrowed, whereby the metal A conventional example has been introduced in which the amount of the electrolytic solution that circulates on the back surface of the strip is reduced as much as possible to suppress the back surface of the metal strip from being electrolytically treated.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記干
渉板を用いた従来例は、裏廻りする電解液の量を少なく
しようとすればするほど、当該干渉板と金属帯板とが形
成する隙間を狭くする必要がある。ここで、前記金属帯
板は、前記電解槽内を連続的に通過（移動）するため、
前記干渉板と金属帯板との間に電解液が供給されない
と、金属帯板の裏面が干渉板に接触して擦れ、当該金属
帯板の裏面にキズが発生し、商品価値を著しく低下させ
るという問題が発生してしまう。従って、前記電解液の
裏廻りに起因して発生する金属帯板の裏面の汚れムラ
と、前記金属帯板と干渉板との接触に起因して発生する
当該金属帯板の裏面のキズ両方を無くすることができ
ず、どちらにしても金属帯板の商品価値を向上すること
が困難であった、このため、実際には、電解液の裏廻り
をある程度無視し、前記金属帯板と干渉板との間に、当
該金属帯板の裏面にキズが発生しない程度の隙間を開け
た状態で電解処理を行っているのが現状である。However, in the conventional example using the interference plate, the gap formed by the interference plate and the metal strip plate is reduced as the amount of the electrolytic solution on the back side is reduced. Need to be narrow. Here, since the metal strip passes (moves) continuously in the electrolytic cell,
If the electrolytic solution is not supplied between the interference plate and the metal strip plate, the back surface of the metal strip plate contacts and rubs against the interference plate, causing scratches on the back surface of the metal strip plate, which significantly reduces the commercial value. That problem will occur. Therefore, both the uneven stain on the back surface of the metal strip caused by the backing of the electrolyte solution and both the scratches on the back surface of the metal strip caused by the contact between the metal strip and the interference plate. It could not be eliminated, and it was difficult to improve the commercial value of the metal strip in either case.In practice, therefore, the backing of the electrolyte was ignored to some extent, and the metal strip interfered with the metal strip. At present, the electrolytic treatment is performed with a gap between the plate and the metal strip that does not cause scratches on the back surface of the metal strip.
【０００６】本発明は、このような問題を解決すること
を課題とするものであり、金属帯板の裏面に電解液が裏
廻りすることを防止すると共に、金属帯板の裏面にキズ
を発生させることなく、当該金属帯板の表面を連続的に
電解処理することが可能な金属帯板電解処理装置を提供
することを目的とする。An object of the present invention is to solve such a problem and to prevent the back surface of the metal strip plate from being backed up by the electrolytic solution and to cause scratches on the back surface of the metal strip plate. An object of the present invention is to provide a metal strip electrolytic treatment apparatus capable of continuously electrolytically treating the surface of the metal strip without performing the treatment.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するた
め、本発明は、電解槽と、当該電解槽を通過する金属帯
板表面に塩酸などの電解液を供給する電解液吐出管と、
前記電解液を電気分解する電極と、を備え、前記金属帯
板を連続的に電解処理する金属帯板電解処理装置におい
て、前記電解液吐出管から電解液を分流する分岐管と、
当該分岐管から供給される電解液を収容する集液タンク
と、当該集液タンクに収容された電解液を上部表面に均
一に誘導して電解液層を形成する電解液誘導板と、当該
電解液誘導板と隙間をおいた上方に設置され、当該電解
液誘導板上の電解液を上部表面に均一に誘導して前記金
属帯板の裏面から外側へ向けて流れのある電解液膜を介
在させる電解液膜形成板と、を設置したことを特徴とす
る金属帯板電解処理装置を提供するものである。A solution for the order to achieve this object, the present invention provides an electrolytic cell, the electrolyte solution discharge pipe for supplying the electrolytic solution such as hydrochloric acid to the metal strip surface passing through the electrolytic cell,
An electrode for electrolyzing the electrolytic solution, and a metal strip electrolysis treatment apparatus for continuously electrolytically treating the metal strip, a branch pipe for branching the electrolytic solution from the electrolytic solution discharge pipe,
A liquid collecting tank that stores an electrolytic solution supplied from the branch pipe, an electrolytic solution guide plate that uniformly guides the electrolytic solution stored in the liquid collecting tank to an upper surface to form an electrolytic solution layer, and the electrolytic solution. Installed above the liquid guide plate with a gap, the electrolyte solution on the electrolyte guide plate is uniformly guided to the upper surface, and an electrolyte film with a flow from the back surface of the metal strip to the outside is interposed. An electrolytic solution film forming plate is provided, and a metal strip plate electrolytic treatment device is provided.
【０００８】そして、前記電解液誘導板に、前記集液タ
ンクに収容された電解液を当該電解液誘導板の上部表面
に供給する穴を複数開口し、当該電解液誘導板の上部表
面に、前記穴から供給された電解液を均一に誘導する溝
を設け、前記電解液膜形成板に、前記電解液誘導板上の
電解液を当該電解液膜形成板の上部表面に均一に誘導す
る穴を複数開口したことを特徴とする金属帯板電解処理
装置を提供するものである。A plurality of holes are formed in the electrolytic solution guide plate for supplying the electrolytic solution contained in the liquid collecting tank to the upper surface of the electrolytic solution guide plate. A groove that uniformly guides the electrolytic solution supplied from the hole is provided, and the electrolytic solution film forming plate uniformly guides the electrolytic solution on the electrolytic solution guiding plate to the upper surface of the electrolytic solution film forming plate. The present invention provides a metal strip plate electrolytic treatment apparatus having a plurality of openings.
【０００９】また、前記電解液膜形成板に、前記電解液
誘導板より多数の穴を開口したことを特徴とする金属帯
板電解処理装置を提供するものである。さらに、前記集
液タンクを複数設置し、当該集液タンクに電解液を提供
する各々の分岐管に、電解液の供給量を制御する供給量
制御手段を設置したことを特徴とする金属帯板電解処理
装置を提供するものである。Further, the present invention provides a metal strip plate electrolytic treatment apparatus characterized in that the electrolytic solution film forming plate has a larger number of holes than the electrolytic solution guiding plate. Further, a plurality of the liquid collecting tanks are installed, and a supply amount control means for controlling a supply amount of the electrolytic solution is installed in each branch pipe for supplying the electrolytic solution to the liquid collecting tank. An electrolytic treatment apparatus is provided.
【００１０】[0010]
【作用】本発明に係る金属帯板電解処理装置は、前記分
岐管から集液タンクに収容された電解液を上部表面に均
一に誘導して当該電解液からなる電解液層を形成する電
解液誘導板と、当該電解液誘導板と隙間をおいた上方に
設置され、当該電解液誘導板上の電解液を上部表面に均
一に誘導して前記金属帯板の裏面から外側へ向けて流れ
のある電解液膜を介在させる電解液膜形成板と、を設置
したため、前記電解槽内を連続して通過する金属帯板に
電解処理を行う際に、当該金属帯板の裏面に電気分解さ
れた電解液が巻き込まれることがない。In the metal strip electrolytic treatment apparatus according to the present invention, the electrolytic solution that uniformly guides the electrolytic solution contained in the collecting tank from the branch pipe to the upper surface to form the electrolytic solution layer made of the electrolytic solution. Installed above the guide plate and the electrolytic solution guide plate with a gap between them, the electrolytic solution on the electrolytic solution guide plate is uniformly guided to the upper surface and flows outward from the back surface of the metal strip.
Since an electrolytic solution film forming plate having an electrolytic solution film interposed therein is installed, when performing electrolytic treatment on a metal strip plate that continuously passes through the inside of the electrolytic cell, electrolysis is performed on the back surface of the metal strip plate. Electrolyte does not get caught.
【００１１】即ち、前記金属帯板と電解液膜成形板との
間に介在する電解液膜を形成する電解液は、常に、前記
電解液誘導板上から供給され、当該電解液膜を強制的に
形成しながら、新しく供給される電解液に押されて、金
属帯板の裏面から外側へ向けて流れていく。ここで、前
記電解液膜は、前記電解液誘導板と電解液膜形成板との
間に形成される隙間を埋めた状態で形成される。従っ
て、前記金属帯板の上部表面側で電気分解された電解液
は、前記電解液膜形成板と金属帯板との間に介在してい
る電解液膜に阻止されて、当該金属帯板の裏側に廻り込
むことがない。このため、前記金属帯板の裏面が電気分
解されることがなく、当該金属帯板の裏面に電解処理に
起因した汚れムラが発生することがない。That is, the electrolytic solution forming the electrolytic solution film interposed between the metal strip plate and the electrolytic solution film forming plate is always supplied from above the electrolytic solution guide plate to force the electrolytic solution film. While being formed, it is pushed by the newly supplied electrolytic solution and flows outward from the back surface of the metal strip. Here, the electrolytic solution film is formed in a state where a gap formed between the electrolytic solution guide plate and the electrolytic solution film forming plate is filled. Therefore, the electrolytic solution electrolyzed on the upper surface side of the metal strip is blocked by the electrolytic solution film interposed between the electrolytic solution film forming plate and the metal strip plate, There is no turning around on the back side. Therefore, the back surface of the metal strip is not electrolyzed, and the back surface of the metal strip does not have uneven stain due to the electrolytic treatment.
【００１２】また、前記電解液膜形成板と金属帯板との
間には、強制的に電解液膜が介在しているため、当該金
属帯板が電解槽内を連続的に通過しても、前記電解液膜
形成板と金属帯板とが接触して擦れることがない。従っ
て、前記金属帯板の裏面にキズが発生することがない。
さらに、前記集液タンクへの電解液の供給は、既存の電
解液吐出管から分岐した分岐管により行うことができる
ため、設計、施行が簡単であり、設備コストを削減する
ことができる。Further, since the electrolytic solution film is forcibly interposed between the electrolytic solution film forming plate and the metal strip plate, even if the metallic strip plate continuously passes through the electrolytic cell. The electrolytic solution film forming plate and the metal strip plate do not come into contact with each other and rub against each other. Therefore, no scratch is generated on the back surface of the metal strip.
Furthermore, since the supply of the electrolytic solution to the liquid collecting tank can be performed by the branch pipe branched from the existing electrolytic solution discharge pipe, the design and the implementation are simple, and the facility cost can be reduced.
【００１３】そして、前記電解液誘導板に、前記集液タ
ンクに収容された電解液を当該電解液誘導板の上部表面
に供給する穴を複数開口すると共に、前記穴から供給さ
れた電解液を均一に誘導する溝を設けたことで、前記作
用に加え、前記電解液誘導板上に、より簡単に均一で良
好な電解液層を形成することができる。また、前記電解
液膜形成板に、前記電解液誘導板上の電解液を当該電解
液膜形成板の上部表面に均一に誘導する穴を複数開口し
たことで、前記作用に加え、より簡単に均一で良好な電
解液膜を形成することができる。The electrolyte guide plate is provided with a plurality of holes for supplying the electrolyte solution contained in the collecting tank to the upper surface of the electrolyte guide plate, and the electrolyte solution supplied from the holes is provided. By providing the groove that guides uniformly, in addition to the above-described action, it is possible to more easily form a uniform and favorable electrolytic solution layer on the electrolytic solution guide plate. Further, in the electrolytic solution film forming plate, by providing a plurality of holes for uniformly guiding the electrolytic solution on the electrolytic solution guiding plate to the upper surface of the electrolytic solution film forming plate, in addition to the above action, more easily. It is possible to form a uniform and good electrolyte membrane.
【００１４】そしてまた、前記電解液膜形成板に、前記
電解液誘導板より多数の穴を開口したことで、前記作用
に加え、さらに均一で良好な電解液膜を形成することが
できる。さらに、前記集液タンクを複数設置し、当該集
液タンクに電解液を供給する各々の分岐管に、電解液の
供給量を制御する供給量制御手段を設置したことで、前
記作用に加え、さらに均一で良好な電解液膜を形成する
ことができる。Further, by forming a larger number of holes in the electrolytic solution film forming plate than in the electrolytic solution guiding plate, it is possible to form a more uniform and favorable electrolytic solution film in addition to the above-mentioned function. Further, by installing a plurality of the collection tank, each branch pipe for supplying the electrolytic solution to the collection tank, by providing a supply amount control means for controlling the supply amount of the electrolytic solution, in addition to the above action, Further, a uniform and good electrolytic solution film can be formed.
【００１５】[0015]
【実施例】次に、本発明に係る一実施例について、図面
を参照して説明する。図１は、本発明の実施例に係る金
属帯板電解処理装置の全体を示す構成図、図２は、図１
に示す金属帯板電解処理装置のＡ−Ａ断面図、図３は、
図１に示す金属帯板電解処理装置の集液タンク付近の拡
大断面図、図４は、図１に示す金属帯板電解処理装置の
電解液膜形成板の部分平面図、図５は、図１に示す金属
帯板電解処理装置の電解液誘導板の部分平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment according to the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing the entire metal strip plate electrolytic treatment apparatus according to an embodiment of the present invention, and FIG.
3 is a sectional view of the metal strip plate electrolytic treatment apparatus shown in FIG.
1 is an enlarged cross-sectional view of the vicinity of a liquid collecting tank of the metal strip plate electrolytic treatment apparatus shown in FIG. 1, FIG. 4 is a partial plan view of an electrolyte solution film forming plate of the metal strip plate electrolytic treatment apparatus shown in FIG. 1, and FIG. FIG. 2 is a partial plan view of an electrolytic solution guide plate of the metal strip plate electrolytic treatment apparatus shown in FIG. 1.
【００１６】図１ないし図５に示す金属帯板電解処理装
置１は、金属帯板２が連続的に通過可能な電解槽３を備
えている。前記電解槽３には、当該電解槽３内を通過す
る金属帯板２の上部表面に電解液を吐出する電解液吐出
管１０が設置されている。この電解液吐出管１０は、汲
上手段１１を介して電解液回収槽１２に接続されてお
り、この電解液回収槽１２内に収容されている電解液を
前記汲上手段１１により汲み上げて、金属帯板２の上部
表面に電解液を吐出するように設計されている。また、
前記電解槽３の底部には、前記金属帯板２に電解液を吐
出した際に、当該金属帯板２から電解槽３の底部に流れ
落ちた電解液を前記電解液回収槽１２に回収するための
電解液回収管１３が接続されている。即ち、前記電解液
回収槽１２は、電解液を金属帯板２の上部表面に供給す
ると共に、当該供給した電解液の一部を回収する、いわ
ゆる循環機能を有している。The metal strip plate electrolytic treatment apparatus 1 shown in FIGS. 1 to 5 includes an electrolytic cell 3 through which a metal strip plate 2 can continuously pass. The electrolytic bath 3 is provided with an electrolytic solution discharge pipe 10 for discharging an electrolytic solution onto the upper surface of the metal strip 2 passing through the electrolytic bath 3. The electrolytic solution discharge pipe 10 is connected to an electrolytic solution recovery tank 12 via a pumping means 11, and the electrolytic solution contained in the electrolytic solution recovery tank 12 is pumped up by the pumping means 11 to form a metal strip. It is designed to discharge the electrolyte onto the upper surface of the plate 2. Also,
At the bottom of the electrolytic bath 3, when the electrolytic solution is discharged to the metal strip 2, the electrolytic solution that has flowed down from the metal strip 2 to the bottom of the electrolytic bath 3 is collected in the electrolytic solution collecting tank 12. The electrolytic solution recovery pipe 13 is connected. That is, the electrolytic solution recovery tank 12 has a so-called circulation function of supplying the electrolytic solution to the upper surface of the metal strip 2 and recovering a part of the supplied electrolytic solution.
【００１７】前記電解槽３内であって、前記金属帯板２
の下方には、後に説明する分岐管９から供給される電解
液を収容する集液タンク４が金属帯板２の通過方向に複
数設置されている。前記各集液タンク４の上部には、特
に、図３及び図５に示す電解液誘導板６が密接した状態
で載架されている。Inside the electrolytic cell 3, the metal strip 2
A plurality of liquid collection tanks 4 for storing an electrolytic solution supplied from a branch pipe 9 which will be described later are installed in the lower part of FIG. Above each of the liquid collection tanks 4, in particular, the electrolyte guide plates 6 shown in FIGS. 3 and 5 are mounted in close contact with each other.
【００１８】前記電解液誘導板６には、前記集液タンク
４に収容されている電解液をその上部表面に供給する複
数の穴１７が開口されている。また、電解液誘導板６の
上部表面には、当該上部表面に供給された電解液を均一
に誘導する縦溝１６及び横溝１５が複数設けられてい
る。そして、前記電解液が縦溝１６及び横溝１５を流れ
ることで、電解液誘導板６の上部表面に均一な電解液層
を形成することができるようになっている。尚、本実施
例では、前記縦溝１６及び横溝１５の総面積が、前記電
解液誘導板６の面積の半分程度となるように、縦溝１６
及び横溝１５の長さや幅を設定した。The electrolytic solution guide plate 6 is provided with a plurality of holes 17 for supplying the electrolytic solution contained in the liquid collecting tank 4 to the upper surface thereof. Further, on the upper surface of the electrolytic solution guide plate 6, a plurality of vertical grooves 16 and lateral grooves 15 are provided for uniformly guiding the electrolytic solution supplied to the upper surface. Then, by flowing the electrolytic solution through the vertical groove 16 and the horizontal groove 15, it is possible to form a uniform electrolytic solution layer on the upper surface of the electrolytic solution guide plate 6. In the present embodiment, the vertical groove 16 and the horizontal groove 15 are arranged such that the total area of the vertical groove 16 and the horizontal groove 15 is about half the area of the electrolytic solution guide plate 6.
Also, the length and width of the lateral groove 15 were set.
【００１９】前記電解液誘導板６と隙間をおいた上方に
は、特に図３及び図４に示す電解液膜形成板５が設置さ
れている。この電解液膜形成板５には、前記電解液誘導
板６上の電解液をその表面に供給すると共に、電解液膜
形成板５の上部表面に当該電解液を均一に誘導して電解
液膜を形成する複数の穴１８が開口されている。ここ
で、電解液膜形成板５上に、均一で良好な電解液膜が形
成できるように、前記穴１８を開口する位置が、前記電
解液誘導板６に開口した穴１７と同一直線上にならない
ようにした。尚、本実施例では、前記電解液膜形成板５
に、前記電解液誘導板６より多数の穴１８を開口した。Above the electrolytic solution guide plate 6 with a gap, an electrolytic solution film forming plate 5 shown in FIGS. 3 and 4 is installed. The electrolytic solution film forming plate 5 is supplied with the electrolytic solution on the electrolytic solution guiding plate 6 on its surface, and the electrolytic solution is uniformly guided to the upper surface of the electrolytic solution film forming plate 5 to form the electrolytic solution film. A plurality of holes 18 that form the holes are opened. Here, in order to form a uniform and good electrolyte solution film on the electrolyte solution film forming plate 5, the position where the hole 18 is opened is on the same straight line as the hole 17 which is opened in the electrolyte solution guiding plate 6. I tried not to become. In this embodiment, the electrolytic solution film forming plate 5 is used.
In addition, a large number of holes 18 were formed in the electrolyte guide plate 6.
【００２０】前記電解液吐出管１０には、当該電解液吐
出管１０から電解液を分流し、分流した電解液を集液タ
ンク４に供給する分岐管９が各集液タンク４に一本づつ
設置されている。前記各分岐管９には、集液タンク４へ
の電解液の供給量を制御する供給量制御手段８が設置さ
れている。なお、符号７は、金属帯板２の上部表面に吐
出された電解液を電気分解する電極であり、符号１４
は、電解槽３を通過する金属帯板２を誘導する金属帯板
誘導ロールである。Each of the electrolyte solution discharge pipes 10 has a branch pipe 9 for dividing the electrolyte solution from the electrolyte solution discharge pipe 10 and supplying the divided electrolyte solution to the liquid collection tanks 4. is set up. A supply amount control means 8 for controlling the supply amount of the electrolytic solution to the liquid collection tank 4 is installed in each of the branch pipes 9. Reference numeral 7 is an electrode for electrolyzing the electrolytic solution discharged onto the upper surface of the metal strip plate 2, and reference numeral 14 is given.
Is a metal strip guide roll that guides the metal strip 2 passing through the electrolytic cell 3.
【００２１】次に、本実施例に係る金属帯板電解処理装
置１の具体的動作について図面を参照して説明する。先
ず、電解槽３内に金属帯板２が侵入すると、汲上手段１
１が作動し、電解液回収槽１２内に予め収容されている
電解液を汲み上げ、電解液吐出管１０を介して当該電解
液を金属帯板２の上部表面に吐出する。この吐出された
電解液は、前記電極７により電気分解され、金属帯板２
の電解処理が開始される。Next, a specific operation of the metal strip electrolytic treatment apparatus 1 according to this embodiment will be described with reference to the drawings. First, when the metal strip 2 enters the electrolytic bath 3, the pumping means 1
1 operates to pump up the electrolyte solution previously stored in the electrolyte recovery tank 12 and discharge the electrolyte solution to the upper surface of the metal strip 2 through the electrolyte solution discharge pipe 10. The discharged electrolytic solution is electrolyzed by the electrode 7 and the metal strip 2
The electrolytic treatment of is started.
【００２２】一方、前記電解液吐出管１０から分岐した
分岐管９にも電解液が供給され、この電解液は、予め電
解液が充填されている集液タンク４内に収容される。こ
の分岐管９からの電解液の供給により、集液タンク４内
の電解液は、電解液誘導板６の穴１７を経て、縦溝１６
及び横溝１５に均一に誘導され、電解液誘導板６上に電
解液層を形成する。この電解液層は、集液タンク４内に
供給される電解液によりその膜厚が増加していき、前記
電解液誘導板６と電解液膜形成板５との間に形成されて
いる隙間を充填する。さらに、前記電解液層は、集液タ
ンク４から供給される電解液によりその膜厚を増加させ
ると共に、上方に押しやられる。このため、前記電解液
層を形成している電解液は、前記電解液膜形成板５の穴
１８を通って上部表面に均一に誘導され、当該電解液膜
形成板５の上部表面に電解液膜を強制的に形成する。On the other hand, the electrolytic solution is also supplied to the branch pipe 9 branched from the electrolytic solution discharge pipe 10, and the electrolytic solution is stored in the liquid collecting tank 4 which is filled with the electrolytic solution in advance. By the supply of the electrolytic solution from the branch pipe 9, the electrolytic solution in the collecting tank 4 passes through the hole 17 of the electrolytic solution guide plate 6 and the vertical groove 16
Further, the electrolyte layer is formed on the electrolyte guide plate 6 by being uniformly guided by the lateral grooves 15. The thickness of this electrolytic solution layer is increased by the electrolytic solution supplied into the liquid collecting tank 4, and the gap formed between the electrolytic solution guide plate 6 and the electrolytic solution film forming plate 5 is reduced. Fill. Further, the thickness of the electrolytic solution layer is increased by the electrolytic solution supplied from the collecting tank 4 and is pushed upward. Therefore, the electrolytic solution forming the electrolytic solution layer is uniformly guided to the upper surface through the holes 18 of the electrolytic solution film forming plate 5, and the electrolytic solution is formed on the upper surface of the electrolytic solution film forming plate 5. Force film formation.
【００２３】この時、前記電解液膜形成板５上に供給さ
れる電解液の量が多過ぎたり、穴１８から供給される電
解液の勢いが強すぎると、前記電解液膜の膜厚が増加し
（金属帯板２と電解液膜形成板５との距離が大きくな
り）、前記電極７により電気分解された電解液が、金属
帯板２の裏面に裏廻りすることを防止することができな
くなってしまう。また、前記電解液膜形成板５上に供給
される電解液の量が少なすぎたり、穴１８から供給され
る電解液の勢いが弱すぎると、前記電解液膜の膜厚が低
下し（金属帯板２と電解液膜形成板５との距離が小さく
なり）、金属帯板２と電解液膜形成板５とが接触して擦
れ易くなり、金属帯板２の裏面にキズが付いてしまう。
従って、前記各々の分岐管９に設置されている供給量制
御手段８により、集液タンク４に供給する電解液の量を
調整することが重要となる。At this time, if the amount of the electrolytic solution supplied to the electrolytic solution film forming plate 5 is too large, or if the momentum of the electrolytic solution supplied from the hole 18 is too strong, the thickness of the electrolytic solution film will be reduced. It is possible to prevent the electrolytic solution, which is increased (the distance between the metal strip plate 2 and the electrolytic solution film forming plate 5 is increased) and electrolyzed by the electrode 7, from spreading to the back surface of the metallic strip plate 2. I can not do it. Further, if the amount of the electrolytic solution supplied onto the electrolytic solution film forming plate 5 is too small, or if the momentum of the electrolytic solution supplied from the holes 18 is too weak, the thickness of the electrolytic solution film decreases (metal (The distance between the strip 2 and the electrolyte film forming plate 5 becomes small), the metal strip 2 and the electrolyte film forming plate 5 come into contact with each other and are easily rubbed, and the back surface of the metal strip 2 is scratched. .
Therefore, it is important to adjust the amount of the electrolytic solution supplied to the liquid collection tank 4 by the supply amount control means 8 installed in each of the branch pipes 9.
【００２４】前記動作により、前記金属帯板２は，前記
電解液膜上をすべるように通過（移動）しながら、連続
的な電解処理が行われる。従って、前記電解処理時に、
金属帯板２が電解液膜形成板５と接触して擦れることが
ないため、金属帯板２の裏面にキズがつくことがない。
また、前記電解液膜は、前記電解処理時に、電解液誘導
板６上から供給される電解液により、常に強制的に形成
され、且つ、新しく供給される電解液に押されて、金属
帯板２の裏面から外側へ向けて流れていく。このため、
前記金属帯板２の上部表面側で電気分解された電解液
は、前記電解液膜形成板５と金属帯板２との間に介在し
ている電解液膜に阻止されて、当該金属帯板２の裏側に
廻り込むことがない。このため、前記金属帯板２の裏面
が電気分解されることがなく、当該金属帯板２の裏面に
電解処理に起因した汚れムラが発生することがない。By the above operation, the metal strip 2 is continuously electrolyzed while passing (moving) on the electrolytic solution film so as to slide. Therefore, during the electrolytic treatment,
Since the metal strip 2 does not come into contact with the electrolyte film forming plate 5 and rub against it, the back surface of the metal strip 2 is not scratched.
Further, the electrolytic solution film is always forcibly formed by the electrolytic solution supplied from above the electrolytic solution guide plate 6 during the electrolytic treatment, and is pushed by the newly supplied electrolytic solution, so that the metal strip plate is formed. It flows from the back of 2 toward the outside. For this reason,
The electrolytic solution electrolyzed on the upper surface side of the metal strip plate 2 is blocked by the electrolytic solution film interposed between the electrolytic solution film forming plate 5 and the metal strip plate 2, and the metal strip plate. It does not go around to the back side of 2. Therefore, the back surface of the metal strip plate 2 is not electrolyzed, and the back surface of the metal strip plate 2 is free from uneven stain due to the electrolytic treatment.
【００２５】また、前記電解処理時に、前記金属帯板２
上から電解槽３の底部に落下した電解液は、電解液回収
管１３を介して電解液回収槽１２に回収され、再び、電
解液吐出管１０及び分岐管９に供給される。なお、本発
明に係る金属帯板電解処理装置を使用して電解処理を施
す金属帯板２としては、アルミニウム、アルミニウム合
金、ステンレスなど、種々の金属からなる帯板を使用す
ることができる。Further, during the electrolytic treatment, the metal strip 2
The electrolytic solution that has dropped from the top to the bottom of the electrolytic bath 3 is recovered in the electrolytic solution recovery tank 12 via the electrolytic solution recovery pipe 13 and is again supplied to the electrolytic solution discharge pipe 10 and the branch pipe 9. As the metal strip 2 to be electrolyzed using the metal strip electrolytic treatment apparatus according to the present invention, strips made of various metals such as aluminum, aluminum alloy, and stainless can be used.
【００２６】また、本発明に係る金属帯板電解処理装置
で使用する電解液としては、塩酸など、所望の液を使用
してよい。そして、本実施例では、集液タンク４上に電
解液誘導板６を密接した状態で載架した構造としたが、
これに限らず、集液タンク４に収容された電解液を汲上
手段により汲み上げて、前記電解液誘導板６の穴１７に
電解液を供給するなど、他の方法により電解液を供給し
てもよい。As the electrolytic solution used in the metal strip electrolytic treatment apparatus according to the present invention, a desired solution such as hydrochloric acid may be used. Further, in the present embodiment, the electrolytic solution guide plate 6 is mounted on the liquid collection tank 4 in a closely contacted state,
Not limited to this, the electrolytic solution stored in the liquid collecting tank 4 may be pumped up by the pumping means, and the electrolytic solution may be supplied to the hole 17 of the electrolytic solution guide plate 6 by another method. Good.
【００２７】また、本実施例では、前記電解液誘導板６
の上部表面に、縦溝１６及び横溝１５を設け、当該電解
液誘導板６の上部表面に、均一で良好な電解液層を形成
したが、これに限らず、当該上部表面に均一で良好な電
解液層を形成することが可能であれば、他の方法により
電解液層を形成してもよい。Further, in this embodiment, the electrolyte guide plate 6 is used.
The vertical groove 16 and the horizontal groove 15 are provided on the upper surface of the above, and a uniform and good electrolytic solution layer is formed on the upper surface of the electrolytic solution guide plate 6. However, the present invention is not limited to this, and a uniform and good electrolytic solution layer is formed on the upper surface. The electrolytic solution layer may be formed by another method as long as the electrolytic solution layer can be formed.
【００２８】そしてまた、本実施例では、電解液膜形成
板５に、電解液誘導板の穴１７より多数の穴１８を開口
し、この穴１８から供給される電解液を均一に誘導し
て、当該電解液膜形成板５上に電解液膜を形成したが、
これに限らず、電解液膜形成板５上に、均一で良好な電
解液膜を形成することが可能であれば、他の方法により
形成してもよい。さらに、本実施例では、集液タンク４
を複数設置したが、これに限らず、集液タンク４は、所
望により一個所に設置してもよく、また、その設置数
は、任意に決定してよい。Further, in this embodiment, a larger number of holes 18 are formed in the electrolytic solution film forming plate 5 than the holes 17 of the electrolytic solution guiding plate, and the electrolytic solution supplied from the holes 18 is uniformly guided. , An electrolytic solution film was formed on the electrolytic solution film forming plate 5,
The method is not limited to this, and any other method may be used as long as a uniform and favorable electrolytic solution film can be formed on the electrolytic solution film forming plate 5. Furthermore, in this embodiment, the liquid collection tank 4
However, the present invention is not limited to this, and the liquid collection tank 4 may be installed at one location if desired, and the number of installations may be determined arbitrarily.
【００２９】[0029]
【発明の効果】以上説明したように、本発明に係る金属
帯板電解処理装置は、電解槽と、当該電解槽を通過する
金属帯板表面に塩酸などの電解液を供給する電解液吐出
管と、前記電解液を電気分解する電極と、を備え、前記
金属帯板を連続的に電解処理する金属帯板電解処理装置
において、前記電解液吐出管から電解液を分流する分岐
管と、当該分岐管から供給される電解液を収容する集液
タンクと、当該集液タンクに収容された電解液を上部表
面に均一に誘導して電解液層を形成する電解液誘導板
と、当該電解液誘導板と隙間をおいた上方に設置され、
当該電解液誘導板上の電解液を上部表面に均一に誘導し
て前記金属帯板の裏面から外側へ向けて流れのある電解
液膜を介在させる電解液膜形成板と、を設置したため、
前記電解槽内を連続して通過する金属帯板に電解処理を
行う際に、当該金属帯板の裏面に強制的に電解液膜を形
成することができる。従って、電気分解された電解液
は、前記電解液膜に阻止され、前記金属帯板の裏側に廻
り込むことを防止することができる。また、前記電解液
膜の存在により、前記電解液形成板と金属帯板とが接触
して擦れることがない。このため、前記金属帯板の裏面
に汚れムラやキズが発生することを防止することができ
る。As described above, the apparatus for electrolytically treating a metal strip according to the present invention passes through an electrolytic cell and the electrolytic cell.
Discharge of electrolyte solution that supplies electrolyte solution such as hydrochloric acid to the surface of metal strip
A tube and an electrode for electrolyzing the electrolytic solution, and
Metal strip electrolytic treatment device for continuous electrolytic treatment of metal strip
In, a branch for dividing the electrolytic solution from the electrolytic solution discharge pipe
Liquid containing a pipe and an electrolytic solution supplied from the branch pipe
A tank, is installed the liquid collection stowed electrolyte tank and an electrolyte guide plate to form a uniform induced to electrolytic liquid layer on the top surface, an upwardly placed the electrolyte guide plate with a gap,
An electrolytic solution film forming plate for uniformly guiding the electrolytic solution on the electrolytic solution guide plate to the upper surface and interposing an electrolytic solution film having a flow from the back surface of the metal strip to the outside, is provided.
When electrolytically treating a metal strip that continuously passes through the electrolytic bath, an electrolytic solution film can be forcibly formed on the back surface of the metal strip. Therefore, the electrolyzed electrolytic solution is prevented by the electrolytic solution film and can be prevented from flowing around to the back side of the metal strip. Further, due to the presence of the electrolytic solution film, the electrolytic solution forming plate and the metal strip plate do not come into contact with each other and rub against each other. Therefore, it is possible to prevent uneven stains and scratches from being generated on the back surface of the metal strip.
【００３０】さらに、前記集液タンクへの電解液の供給
は、既存の電解液吐出管から分岐した分岐管により行う
ことができるため、設計、施行が簡単であり、設備コス
トを削減することができる。この結果、製造コストを増
加することなく、電解処理後の金属帯板の製品価値を向
上することができる。Furthermore, since the supply of the electrolytic solution to the liquid collecting tank can be performed by a branch pipe branched from the existing electrolytic solution discharge pipe, the design and the implementation are simple and the facility cost can be reduced. it can. As a result, the product value of the metal strip after electrolytic treatment can be improved without increasing the manufacturing cost.
【００３１】そして、前記電解液誘導板に、前記集液タ
ンクに収容された電解液を当該電解液誘導板の上部表面
に供給する穴を複数開口すると共に、前記穴から供給さ
れた電解液を均一に誘導する溝を設けたことで、前記効
果に加え、前記電解液誘導板上に、より簡単に均一で良
好な電解液層を形成することができる。また、前記電解
液膜形成板に、前記電解液誘導板上の電解液を当該電解
液膜形成板の上部表面に均一に誘導する穴を複数開口し
たことで、前記効果に加え、より簡単に均一で良好な電
解液膜を形成することができる。A plurality of holes for supplying the electrolytic solution contained in the collecting tank to the upper surface of the electrolytic solution guide plate are formed in the electrolytic solution guide plate, and the electrolytic solution supplied from the holes is provided. In addition to the above-mentioned effects, the provision of the uniform guiding groove makes it possible to more easily form a uniform and good electrolytic solution layer on the electrolytic solution guiding plate. Further, in the electrolytic solution film forming plate, by providing a plurality of holes for uniformly guiding the electrolytic solution on the electrolytic solution guiding plate to the upper surface of the electrolytic solution film forming plate, in addition to the effect, more easily. It is possible to form a uniform and good electrolyte membrane.
【００３２】そしてまた、前記電解液膜形成板に、前記
電解液誘導板より多数の穴を開口したことで、前記効果
に加え、さらに均一で良好な電解液膜を形成することが
できる。さらに、前記集液タンクを複数設置し、当該集
液タンクに電解液を供給する各々の分岐管に、電解液の
供給量を制御する供給量制御手段を設置したことで、前
記効果に加え、さらに均一で良好な電解液膜を形成する
ことができる。Further, by forming a larger number of holes in the electrolytic solution film forming plate than in the electrolytic solution guiding plate, a more uniform and good electrolytic solution film can be formed in addition to the above effects. Further, by installing a plurality of the collection tank, each branch pipe for supplying the electrolytic solution to the collection tank, by providing a supply amount control means for controlling the supply amount of the electrolytic solution, in addition to the effect, Further, a uniform and good electrolytic solution film can be formed.
【図１】本発明の実施例に係る金属帯板電解処理装置の
全体を示す構成図である。FIG. 1 is a configuration diagram showing an entire metal strip electrolytic treatment apparatus according to an embodiment of the present invention.
【図２】図１に示す金属帯板電解処理装置のＡ−Ａ断面
図である。FIG. 2 is a cross-sectional view taken along the line AA of the metal strip plate electrolytic treatment apparatus shown in FIG.
【図３】図１に示す金属帯板電解処理装置の集液タンク
付近の拡大断面図である。FIG. 3 is an enlarged cross-sectional view of the vicinity of a liquid collection tank of the metal strip plate electrolytic treatment apparatus shown in FIG.
【図４】図１に示す金属帯板電解処理装置の電解液膜形
成板の部分平面図である。FIG. 4 is a partial plan view of an electrolytic solution film forming plate of the metal strip plate electrolytic processing apparatus shown in FIG.
【図５】図１に示す金属帯板電解処理装置の電解液誘導
板の部分平面図である。5 is a partial plan view of an electrolytic solution guide plate of the metal strip plate electrolytic treatment apparatus shown in FIG.
１ 金属帯板電解処理装置 ２ 金属帯板 ３ 電解槽 ４ 集液タンク ５ 電解液膜形成板 ６ 電解液誘導板 ７ 電極 ８ 供給量制御手段 ９ 分岐管 １０ 電解液吐出管 １１ 汲上手段 １２ 電解液回収槽 １３ 電解液回収管 １４ 金属帯板誘導ロール １５ 横溝 １６ 縦溝 １７ 穴 １８ 穴 1 Metal strip electrolysis equipment 2 metal strips 3 electrolysis tank 4 Collection tank 5 Electrolyte film forming plate 6 Electrolyte induction plate 7 electrodes 8 Supply amount control means 9 Branch pipe 10 Electrolyte discharge pipe 11 Pumping means 12 Electrolyte recovery tank 13 Electrolyte recovery pipe 14 Metal strip induction roll 15 lateral groove 16 vertical groove 17 holes 18 holes
───────────────────────────────────────────────────── フロントページの続き (72)発明者 川口 健 群馬県館林市本町３−１−７−206 (72)発明者 熊住 務 群馬県館林市本町３−１−７−706 (56)参考文献 特開 昭53−12738（ＪＰ，Ａ) 特開 平５−32082（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C25F 7/00 C25D 5/00 - 7/12 C25D 11/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ken Kawaguchi 3-1-7-206 Honmachi, Tatebayashi City Gunma Prefecture (72) Inventor Tsutomu Kumazumi 3-1-7-706 Honmachi Town, Tatebayashi City Gunma Prefecture (56) Reference References JP 53-12738 (JP, A) JP 5-32082 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C25F 7/00 C25D 5/00-7 / 12 C25D 11/00
Claims (4)
板表面に塩酸などの電解液を供給する電解液吐出管と、
前記電解液を電気分解する電極と、を備え、前記金属帯
板を連続的に電解処理する金属帯板電解処理装置におい
て、 前記電解液吐出管から電解液を分流する分岐管と、当該
分岐管から供給される電解液を収容する集液タンクと、
当該集液タンクに収容された電解液を上部表面に均一に
誘導して電解液層を形成する電解液誘導板と、当該電解
液誘導板と隙間をおいた上方に設置され、当該電解液誘
導板上の電解液を上部表面に均一に誘導して前記金属帯
板の裏面から外側へ向けて流れのある電解液膜を介在さ
せる電解液膜形成板と、を設置したことを特徴とする金
属帯板電解処理装置。1. An electrolytic cell, and an electrolytic solution discharge pipe for supplying an electrolytic solution such as hydrochloric acid to the surface of a metal strip passing through the electrolytic cell,
An electrode for electrolyzing the electrolytic solution, and a metal strip plate electrolytic treatment apparatus for continuously electrolytically treating the metal strip, wherein a branch pipe for dividing the electrolytic solution from the electrolytic solution discharge pipe, and the branch pipe. A collection tank for containing the electrolytic solution supplied from
An electrolytic solution guide plate that uniformly guides the electrolytic solution contained in the liquid collection tank to the upper surface to form an electrolytic solution layer, and is installed above the electrolytic solution guide plate with a gap between the electrolytic solution guide plate and the electrolytic solution guide plate. An electrolytic solution film forming plate that uniformly guides the electrolytic solution on the plate to the upper surface and interposes an electrolytic solution film having a flow from the back surface of the metal strip to the outside. Strip plate electrolytic treatment device.
収容された電解液を当該電解液誘導板の上部表面に供給
する穴を複数開口し、当該電解液誘導板の上部表面に、
前記穴から供給された電解液を均一に誘導する溝を設
け、前記電解液膜形成板に、前記電解液誘導板上の電解
液を当該電解液成膜板の上部表面に均一に誘導する穴を
複数開口したことを特徴とする請求項１記載の金属帯板
電解処理装置。2. The electrolytic solution guide plate is provided with a plurality of holes for supplying the electrolytic solution contained in the liquid collecting tank to the upper surface of the electrolytic solution guide plate, and the upper surface of the electrolytic solution guide plate is provided with:
A groove that uniformly guides the electrolytic solution supplied from the hole is provided, and the electrolytic solution film forming plate uniformly guides the electrolytic solution on the electrolytic solution guiding plate to the upper surface of the electrolytic solution film forming plate. The metal strip plate electrolytic treatment apparatus according to claim 1, wherein a plurality of openings are provided.
板より多数の穴を開口したことを特徴とする請求項２記
載の金属帯板電解処理装置。3. The electrolytic processing apparatus for a metal strip plate according to claim 2, wherein the electrolytic solution film forming plate has a larger number of holes than the electrolytic solution guiding plate.
タンクに電解液を供給する各々の分岐管に、電解液の供
給量を制御する供給量制御手段を設置したことを特徴と
する請求項１ないし請求項３のいづれか一項に記載の金
属帯板電解処理装置。4. A plurality of the collection tanks are installed, and a supply amount control means for controlling the supply amount of the electrolytic solution is installed in each branch pipe for supplying the electrolytic solution to the collection tank. The metal strip plate electrolytic treatment apparatus according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29747393A JP3488273B2 (en) | 1993-11-02 | 1993-11-02 | Metal strip electrolysis equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29747393A JP3488273B2 (en) | 1993-11-02 | 1993-11-02 | Metal strip electrolysis equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07126900A JPH07126900A (en) | 1995-05-16 |
| JP3488273B2 true JP3488273B2 (en) | 2004-01-19 |
Family
ID=17846957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29747393A Expired - Fee Related JP3488273B2 (en) | 1993-11-02 | 1993-11-02 | Metal strip electrolysis equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3488273B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313668B (en) * | 2014-09-30 | 2017-03-15 | 苏州芯航元电子科技有限公司 | Electronics producing line electrochemical processing cell |
-
1993
- 1993-11-02 JP JP29747393A patent/JP3488273B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07126900A (en) | 1995-05-16 |
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