JP3485518B2 - Imaging device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus for electronically recording an optical image of a subject as an image information signal,
In particular, the present invention relates to an image pickup apparatus which has improved operability when it is connected to a peripheral device and the image information signal is exchanged between the apparatuses.

[0002]

2. Description of the Related Art As a conventional device of this type, there is a so-called electronic camera, which is described in "Journal of the Television Society," Vol.
No. 6, No. 3 (1992) pp. 300-307, the digital still camera described in Sasaki et al.'S image coding method for digital still cameras (hereinafter referred to as known example 1), and Fuji Photo Film. Catalog "FUJIX DIGITAL STILL"
An example is the DS-100 type camera described in CAMERA SYSTEM ”(September 1991) (hereinafter referred to as known example 2).

In the electronic cameras described in the publicly known examples 1 and 2, for example, as shown in FIG. 1 of the publicly known example 1, the image information signal obtained by the image pickup device is digitized (quantized) to form a semiconductor memory. It is recorded on the mounted card (hereinafter referred to as a memory card).

As described above, in the publicly known examples 1 and 2, the image information signal is handled as a digital signal, so that the connection with the peripheral equipment such as a personal computer which originally handles the digital signal (through an analog / digital converter or the like is not necessary). Instead of directly transmitting and receiving digital signals)
It has been shown that it is easy and that it has good connectivity with other systems, such as no deterioration in image quality due to the transmission path.

It should be noted that the publicly known example 1 does not describe a specific example of connection with a peripheral device, but it is understood that a memory card is used as an intermediary medium. In the known example 2,
An example of using such a memory card is disclosed. That is, the memory card is first attached to the electronic camera to record the image information signal, and then the memory card is detached from the electronic camera and attached to a peripheral device separate from the electronic camera to be recorded on the memory card. The image information signal is read by this peripheral device. Also in this case, as a method of transmitting the image information recorded in the memory by the electronic camera as a digital signal to a peripheral device (without passing through a digital / analog converter or an analog / digital converter), the above-mentioned memory card is used as an intermediary. No method other than the method as a medium is disclosed.

By the way, as a known device for electrically transmitting and receiving image information signals by connecting to a personal computer or the like, "F" issued by FUJIFILM Microdevice Co., Ltd.
SA2001 Outline Explanation Material "(June 24, 1991)
There is an FSA2001 type still image compression / expansion substrate described in (hereinafter, known example 3). The device described in the prior art 3 has a built-in semiconductor memory for storing digital image information signals, and the semiconductor memory is stored between the device and a personal computer connected via a connector, a cable or the like. Alternatively, the digital image information signal already stored is transmitted or received as a digital signal.

In the case of the known examples 1 and 2, it is a camera device,
In contrast to the case where the known example 3 has an image pickup means for generating an electrical image information signal from an optical image, such means is not provided, and the image information signal is created by a personal computer. The image information signal generated by the personal computer is transmitted to the device described in the known example 3 and temporarily stored in the first memory. Next, the image information signal read from the first memory is subjected to image data compression processing by the DCT (Discrete Cosine Transform) method and sent back to the personal computer. Such an operation is similar to the operation of the device block shown in FIG.

Here, since the writing or reading operation of the image information signal in the device described in the known example 3 is executed under the time management of the connected personal computer,
Due to the duplication of writing and reading of the information data in the first memory, etc., the content is switched to the data of another image while the data of one image is being read, and as a result, Inconveniences such as changes in image information can be avoided in advance.

Further, in the device described in the known example 3,
At the time of the compression processing of the image data and the output of the compressed image information signal, the data output from this apparatus to the personal computer is performed in synchronization with the clock output by the personal computer. Since a clock independent from the inside of the apparatus, that is, a clock asynchronous with the clock output from the personal computer, is used, a so-called FIFO (Fast In
/ Fast Out) type buffer memory.

The operation of this FIFO type memory will now be described with reference to FIG.

In FIG. 1, the FIFO type memory 21 has memory addresses 0, 1, 2, ..., N, n + 1 ,.
It has a data storage area at address m. When the memory 21 starts to operate, data is first written in the order of address 0, address 1, 2, ... The update of the write address is performed at each repetition timing of the clock inside the device. When the data is written to the address n, the data reading is started from the address 0 at this timing, and the data is read in the order of 1, 2, ... The update of the read address is performed at each repetition timing of the external clock supplied from the personal computer to the above device. After that, the read address is also updated so as to follow the sequentially updated write address. For both writing and reading, when the address reaches address m,
It is controlled to return to the address 0 again at the next clock timing.

When the FIFO type memory is operated as described above, the address offset amount in the initial state of writing and reading is Aos (= n), and writing and reading are performed when the write address becomes the final m address of the buffer memory. Letting A'os (= m−n) be the address offset amount with and the repetition cycle of the external read clock be T, the write clock timing relative to the read clock generation timing is Aos × T at maximum in the delay direction. , Maximum A'o in the direction of travel
Even if each of s × T is shifted, the data can be correctly read out in the order written in the memory. That is, the data transfer can be correctly executed by interposing the FIFO buffer memory between the systems operating with the asynchronous clocks.

However, when the FIFO type memory is used, the write clock (in the compressed data output operation mode of the device described in the known example 3, the clock inside the device)
And the read clock (in the same mode, the clock supplied from the personal computer to the device) cannot be set without any mutual relation. For example, regarding the difference in the repetition frequency between the clocks, the address offset amount regulated by the capacity of the buffer memory used becomes a limiting factor, and the start timing of the read operation is
It must be time-controlled with respect to the timing of the write operation.

The apparatus described in the known example 3 further inputs a compressed image information signal from a personal computer, restores the original uncompressed image information signal by an internal data decompression circuit, and restores the above-mentioned first semiconductor. It also has a function of storing it in the memory and then sending this restored image information signal back to the personal computer. Even in such an operation, the operation timing of this apparatus is executed under the control of the connected personal computer, so that the compressed image information signal supplied from the computer is written into the first semiconductor memory. Then, it is possible to avoid the situation where the writing of the restored image information signal to this memory overlaps in time.

In this operation, the FIFO memory operates by using the clock supplied from the personal computer as the write clock and the internal clock of the device as the read clock. The relationship is the same as the case of the output operation of the compressed image information signal described above.

In the device described in the known example 3,
A program of a personal computer to be connected and used is configured so that the FIFO type memory does not generate an operation mode in which writing by a clock inside the apparatus and writing by a clock from the personal computer temporally overlap.

[0017]

By the way, the known example 1,
An electronic circuit for an image pickup device such as an electronic camera shown in FIG.
By using the recent highly integrated LSI technology and high-density board mounting technology, it is possible to realize with an extremely small circuit block. For this reason, especially when trying to make a small camera using a single-focus optical lens or the like, in the method using the memory card shown in the above-mentioned known example, there is a space for storing the memory card, a memory card loading The connector mounting space or the space for the mechanism for removing the memory card is a major factor that hinders miniaturization.

Further, it is conceivable that the memory card is downsized as the device is downsized, but it is troublesome to remove a smaller memory card from the downsized device, and the device is mistakenly removed during removal. There is also a risk that the device may be destroyed by dropping it.

The inconvenience caused by the insertion / removal of the memory card as described above is that the image pickup device is provided with a connector for inputting / outputting an image information signal, and the signal can be directly transmitted / received to / from an external device through this connector. Can be solved with. However, the image pickup device is provided with a recording switch corresponding to the shutter button of the conventional film camera, and by the closing operation of the recording switch, an external device connected to the connector as desired by the operator is selected. There is a case where an operation of capturing an optical image in the apparatus at a timing that is not restricted by the operation status of the device and recording the electric image in the semiconductor memory as an electric signal is executed or desired to be executed. For example, when the external device is attached to the connector after the recording switch is closed and the recording operation inside the device is not completed yet, or when an image is recorded without missing a momentary shutter opportunity. is there. Therefore, when the image pickup apparatus is provided with the connector as described above, in order to prevent the change of the image content due to the overlap of the writing and reading of the information in the semiconductor memory, or the writing of the information by the operation of the recording switch. In order to avoid the inconvenience that the contents of the image and the writing of the information input from the external device compete with each other in the same semiconductor memory and the image contents are changed, all the device operations are centrally managed by the computer. New operation management different from that of the device described in the known example 3 is required.

Further, a personal computer can be considered as an external device for exchanging image information with the image pickup apparatus. In this case, an information transmission clock completely uncorrelated with a system operation clock inside the image pickup apparatus is sent from the personal computer. It is extremely effective from the viewpoints of versatility and operability if information can be exchanged by inputting into.

SUMMARY OF THE INVENTION An object of the present invention is to provide a small-sized image pickup device which prevents malfunctions and is excellent in versatility and operability in consideration of the above points.

[0022]

In order to achieve the above object, the present invention is an image pickup apparatus to which an external device can be connected.
The recording instructing means and the imaging device that generates the image signal from the optical image
Image means and image signal generated by the imaging means are stored
Connector for connecting the memory means and the external device
And controlling writing and reading of image signals in the memory means
And a control unit for controlling the external device.
Detects readiness for reading image signals from memory means
It has a state detection means and is connected through the connector.
When the external device receives a read command from the external device,
The image signal stored in the memory means is read out.
And the memo of the external device by the state detection means.
When the readiness state of reading the image signal from the
Even if the recording instruction means is operated,
Writing of the generated image signal into the memory means is performed.
The configuration is such that it is controlled not to exist. And this control means
Is connected to the external device via the connector,
The image signal is read from the memory means to the external device.
When not in use and the status detection means
The readiness for reading out the image signal from the device is not detected.
When the recording instruction means is operated, it is generated by the image pickup means.
The written image signal is written to the memory means.
To control it.

In addition to the above structure, a memory means is further provided.
Of the playback image on the monitor that displays the stored image signal.
It has a reproduction image update instruction means for instructing update, and
The state detection means is the memory device for the image signal from the external device.
Detecting the write ready status to the stage, the above control means
Image signals from external devices connected via
When it is written in the memory means and by the state detection means
Prepare to write the image signal of the external device to the memory means.
When the state is detected, the playback image update instruction means is operated.
Memory for updating the playback image on the monitor
Control so that the image signal is not read from the device
It is configured to do.

Further , the present invention is a camera capable of connecting an external device.
An imaging device for generating an image signal from an optical image
And a memory for storing the image signal generated by the imaging means
Means for displaying the image signal stored in the memory means.
Playback image update instruction to update the playback image on the Nita device
Means, a connector for connecting an external device, and a memory
Means for controlling writing and reading of image signals of the means
And the control means is a memo of the image signal from the external device.
A state detection unit that detects the state of preparation for writing to the unit
And then the image from the external device connected through the connector
Detecting when and when signals are being written to memory means
To the memory means of the image signal from the external device
Playback image update instruction when write ready status is detected
Even if the method is operated, the replay image on the monitor can be updated.
The image signal is not read from the memory means for
It is configured to control And this control means
Is connected to the external device via the connector,
If the image signal from the device is not written to the memory means
Image signal from an external device
When the write ready state to the memory means is not detected,
When the reproduced image update instruction means is operated,
The image signal is read and the playback image is updated on the monitor device.
The control is performed so that

With the above configuration, the image generated by the image pickup means
Write the image signal to the memory means and pass it through the connector
Can be read by an external device connected by
When the image signal of the memory means is being read at
Generated by the image pickup means when the device is ready to read
Since writing of image signals to the memory means is prohibited,
The contents of the image signal of the memory means read by the external device change
There is nothing to do.

Further , the image signal of the external device is stored in the above memory.
To the image means of this memory means.
It can also be read to update the playback image on the Nita device.
Write the image signal from the external device to the memory means.
Is being performed and is ready for writing
Sometimes, the memory for updating the playback image on the monitor device
Since the reading of the image signal of the means is prohibited, the memory means
The playback image that is read from and displayed on the monitor device is
The displayed contents do not change.

[0027]

[0028]

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of an image pickup apparatus according to the present invention, in which 1 is an image pickup element, 2 is a timing generation circuit, 3 is an oscillator, 4 is a power switch, 5 is a recording trigger switch, and 6 Is an AND gate, 7 is a timing generation circuit, 8 is an oscillator, 9 is an inverter, 10 and 11
Is a switch, 12 and 13 are semiconductor memories, 14 is a connector, 15 and 16 are switches, 17 is a camera signal processing circuit, 18 is a switch, 19 is an encoder, 20 is an output terminal, 21 is an image data compression processing circuit, and 22 is An image data expansion processing circuit, 23 is a state detector, and 24 is a switch.

In the figure, when the user closes the power switch 4, the timing generation circuit 2 composed of a microcomputer or a logic circuit detects this,
An unillustrated power supply circuit is operated to start supply of operating power supply to each unit, and the first reference frequency signal supplied from the oscillator 3 is appropriately subjected to processing such as frequency division to obtain the image sensor 1, the camera signal processing circuit 17 The operation clock pulses CK1, CK3, CK2 of the encoders 19 and the switch control signals SW1, SW2, SW3 are generated. These switch control signals SW1, SW2, SW3 cause the switches 10, 16, 18 to close in the direction shown. These switches 10, 16 and 18 can be easily configured by known multiplexer circuits based on logic circuit technology.

An analog image information signal AIS resulting from photoelectric conversion of an optical image is output from the image pickup device 1 in which an optical lens (not shown) is mounted on the light receiving surface. The camera signal processing circuit 17 is composed of circuits known in television cameras, such as a correlated double sampling circuit, an automatic gain adjustment circuit, a matrix circuit, and a gamma processing circuit, and an A / D (analog / analog / A digital) converter is provided and outputs a digitized baseband digital image information signal DIS. This digital image information signal DIS is supplied to an encoder 19 via a switch 18, a chroma signal modulated to a subcarrier is generated from the baseband digital image information signal DIS, and one of the baseband luminance signal and the clock pulse CK1 is generated. The synchronization signal supplied from the timing generation circuit 2 is timed as a unit, and these are combined and output from the output terminal 20 as a composite video signal or as an independent component signal.

The encoder 19 has a D / A (digital / analog) converter and outputs an analog image information signal to the output terminal 20. Here, by connecting a known television monitor device to the output terminal 20, a continuous (moving image) image captured by the image sensor 1 can be displayed as a television image there.

The above-described operation is similar to that of a known television camera device, and can be realized by using, for example, a television camera circuit of a commercially available Hitachi-made VM-H39 type VTR integrated camera.

Next, the operation of the electronic camera function of this embodiment will be described.

The baseband digital image information signal DIS output from the camera signal processing circuit 17 is supplied to the semiconductor memory 12 via the switch 16. Also,
At this time, in the semiconductor memory 12, the clock CL and the address signal Ad generated in synchronization with the camera signal processing clock CK3 and the like in the timing generation circuit 2 are respectively passed through the switch 10 to write clock WC and write address signal WA. Supplied as.

FIG. 3 is a timing chart showing the operation of the semiconductor memory 12, and FIG. 3A shows the operation timing of the television camera circuit composed of the image pickup device 1 and the camera signal processing circuit 17. 8A shows the storage timing of the semiconductor memory 12, and FIG. 9C shows the operation mode of the semiconductor memory 13. In addition, P1 and P of FIG.
2, P3, ... Represent sequential images (field image or frame image of television signal) in the image information signal DIS. The image written in the semiconductor memory 12 is also represented by the same symbol.

In FIGS. 1 and 3, when the power switch 4 is closed at time T1, the television camera circuit starts the above-mentioned operation and the image information signal DIS is generated. The semiconductor memories 12 and 13 generally have a memory capacity capable of recording data for one field image or one frame image.

Generally, when writing image data to the semiconductor memory 12, the previously written image data is rewritten into new data by a predetermined amount of data (eg, 8 bits) in time sequence. To be executed.
When recording a natural image with an electronic camera or the like, image 1
Since a data amount of at least a kilobit unit or more is required for one sheet, even after the writing of one image data is started, the image written before the writing of one image data is completed. The data will remain in the semiconductor memory. That is, for example, in FIG. 3B, in the time domain marked with P2, not only the data of the image P2 is stored in the semiconductor memory 12, but the data of the image P1 previously written and the data of the image P1 are written this time. The data of the image P2 to be written are mixed and stored.

Further, in FIG. 3, a portion represented by adding the term "hold" such as "P4 hold" is written with new image data after the writing of one image data is completed (ie, with writing of new image data). , The image data is not rewritten) and the image data is stored as it is.

After time T1, in the semiconductor memory 12, the images P1 to P4 generated by the camera signal processing circuit 17 are sequentially written, and the image data is updated each time. Then, when the recording trigger switch 5 is closed by the user (time T2), at this time, when the writing of the data of the image P4 being written is completed, the next data writing to the semiconductor memory 12 is prohibited, and this image is The semiconductor memory 12 is controlled so that the data of P4 is retained (freeze). This control is executed by the timing control circuit 2 stopping the generation of the clock CL at the timing of the vertical synchronizing signal of the image information signal AIS. Then, the timing control circuit 2 generates the operation control signal MC. This operation control signal MC is supplied to the state detection circuit 2 as described later.
The signal is supplied to the timing generation circuit 7 via the AND gate 6 which is controlled to open / close in accordance with the output signal SD of 3 to start the operation.

The timing generation circuit 7 appropriately processes the reference signal supplied from the oscillator 8 such as frequency division, and drives the clock CL1 for driving the semiconductor memory 12 and the address signal Ad1.
The operation clocks CK4 and CK5 of the image data compression processing circuit 21 and the image data expansion processing circuit 22, the driving clock CL2 of the semiconductor memory 13 which stores the compressed image data CID2, the address signal Ad2, and the read operation and the write operation are switched. It is a circuit that generates a read / write switching signal (R / -W2) for controlling, and can be configured by a known logic circuit. The read / write switching signal (R /
-W2) indicates "read" when "H" (high level) and "write" when "L" (low level)
Shall be instructed.

The timing generation circuit 7 has an operation control signal M
When C is received, the compression processing of the image data and the writing operation of the compressed image data CID to the semiconductor memory 13 are started.

That is, the clock CL1 and the address signal Ad1 output from the timing generation circuit 7 are
0, read clock RC, read address signal R
It is supplied to the semiconductor memory 12 as A. This allows
Data of the image P4 stored and held is sequentially read from the semiconductor memory 12, and compressed by the compression processing circuit 21 to obtain compressed image data CID. By using the FIFO type semiconductor memory as the semiconductor memory 12, as described in FIG. 2, the reading of the data of the image P4 can be started even in the middle of the writing period of the data of the image P4 of FIG. 3B. You can Further, the write clock WC and the read clock RC may be asynchronous.

The compressed image data CID output from the compression processing circuit 21 is the data input / output terminal I of the semiconductor memory 13.
/ O and the clock CL2 output from the timing generation circuit 7, the address signal Ad2, and the read / write switching signal (R / -W2) for instructing "write".
Is supplied to the semiconductor memory 13 via the switch 11 as the clock CL, the address signal Ad and the read / write switching signal (R / -W), and is shown with P4 as shown in FIG. 3C. The data of the image P4 compressed during the period is written in the semiconductor memory 13.

Here, the semiconductor memory 13 is a memory which is switched between a writing mode and a reading mode of image data by a read / write switching signal (R / -W),
When the read / write switching signal (R / -W) is "H", the write mode is set. At this time, the data input / output terminal I / O is for data input, and the clock CL and the address signal A
d is used as a write clock and a write address signal, respectively. When the read / write switching signal (R / -W) is "L", the read mode is set. At this time, the data input / output terminal I / O is for data output, and the clock CL and the address signal Ad are used as a read clock and a read address signal. A semiconductor memory circuit in which writing and reading are switched and used in this manner is also known.

By the way, in this embodiment, when the apparatus is miniaturized, an LSI miniaturized circuit is adopted for the data compression circuit 21 and the data decompression circuit 22, but in view of the processing capability of the circuit element, It takes a longer processing time to generate one compressed image data than to generate one image data by the above-described camera operation. Therefore, the semiconductor memory 12 is used as a buffer memory,
It enables image capture at high speed of camera operation. Further, at this time, the semiconductor memory 12 holds the data of the image P4 until the compression processing of the data of the image P4 and the writing to the semiconductor memory 13 are completed, so that the transformation of the image content is prevented. There is. In order to perform this operation, the timing generation circuit 2 causes the operation control signal M
During the period from the output of C to the supply of the operation end signal ME from the timing generation circuit 7, the closing information of the recording trigger switch 5 is not taken in.

In FIG. 3C, the timing generation circuit 7 stops the generation of the write clock CL2 at the time when the writing of the compressed data of the image P4 is completed, and thereafter the semiconductor memory 13 stores the image of this image P4. The data holding mode is set, and the operation end signal ME is sent to the timing generation circuit 2. The timing generation circuit 2 uses the operation end signal ME
In response to this, the generation of the operation control signal MC is stopped, the writing operation of the semiconductor memory 12 is started again, the data of the images P5, P6 and P7 are sequentially written in the semiconductor memory 12, and the next closing of the recording trigger switch 5 is performed. Prepare for operation.

As the semiconductor memory 13, it is conceivable to use one having a data storage capacity for a plurality of images. At this time, in the data writing operation period shown by P4, P7, etc. in FIG. 3C, only a partial area allocated to one image is newly stored in the storage area of the image data in the semiconductor memory 13. Rewritten with image data. In addition, in the period indicated by “hold” in FIG. 3C, not only the image data written immediately before this but also the image data written before this is held. Furthermore, when the semiconductor memory 13 is, for example, a battery-backed static random access memory or a so-called flash nonvolatile memory,
Before the time of writing the data of the image P4 in FIG. 3C, the image Px recorded at the time of shooting before the current shooting started by the closing of the power switch 4 at time T1.
Data is stored.

FIG. 3 also shows the memory operation when the recording trigger switch 5 is closed again (time T3) during the writing period of the data of the image P7 into the semiconductor memory 12. The operation in this case is also the same as the recording operation of the data of the image P4, and thus the description thereof will be omitted.

The operation of the electronic camera function (still image recording function) of this embodiment has been described above with reference to FIG. 3, but it is similar to the operation of the apparatus shown in the above-mentioned known examples 1 and 2.

When the semiconductor memory 13 is a flash type memory, rewriting of image data by so-called overwriting cannot be performed due to the element structure. Therefore, in FIG.
At the timing of the image P4 in (c), this image P4
Before the writing of the data, the operation of temporarily erasing the image data remaining in the memory area assigned as the data writing area of the image P4 is executed. This erasing operation is specifically an operation of writing data of a predetermined logic level in the semiconductor memory, and for example, a control (not shown) output from the timing generation circuit 7 to the output side of the data compression circuit 21 in FIG. Arrange a logic gate controlled to output a predetermined level of data by a signal,
This can be performed by writing the data of the predetermined level before writing the data of the image P4.

As a flash type memory device,
Data input / output terminal I / using several kinds of control signals
It is also known that the code signal supplied to O is taken into the memory element and the operation mode such as writing and erasing is switched. Further, at the time of erasing or writing, a so-called ready / busy signal generation function is provided to warn the user to generate data of a predetermined logic level and wait for the progress to the next operation until the operation inside the memory element is completed. What is possessed is also known. Even when such a memory element is used, a semiconductor memory is provided so that a plurality of switching signals of the switch 11 are provided as needed and a control code is appropriately switched to image data and supplied to the data input / output terminal I / O terminal. Can be constructed by a known technique in the technical field of digital circuits using. In addition, the switch 1 of FIG.
It is also possible to provide an interface circuit between 1 and 15 and the semiconductor memory 13 according to the function of the memory element used.

Thus, when recording the image information signal,
When the semiconductor memory 13 is a flash type memory, the erasing operation is configured to be executed in conjunction with each other, so that the user does not have to worry about the erasing operation peculiar to the flash type memory. It can be operated with the same feeling as a memory device that can be rewritten.

The feature of this embodiment is that the operation of the connector 14, the switches 11 and 15, the state detection circuit 23 for detecting the preparation state of the signal transfer operation with the external equipment, and the timing generation circuit 7 is started. AND to prevent
The gate 6 is provided so that the digital image information signal can be exchanged between the external device and the semiconductor memories 12 and 13.

This point will be described below with reference to FIGS. 4 and 5. However, FIG. 4 is a block diagram showing a specific example of the state detection circuit 23 in a state where an external device is connected to the connector 14 of FIG. 1, where 23a is T-FF (T-type flip-flop) and 23b is AND. 1 is a gate, 23c is an OR circuit, 25 is an external device, and 25a is a connector.
The same reference numerals are attached to the portions corresponding to.

FIG. 5 is a timing chart for explaining the signal transfer function with an external device, and the signals corresponding to those in FIG. 4 are designated by the same reference numerals. Note that FIG.
3 (a), (b), and (c) are shown in FIGS.
Same as (c).

First, at time T1 when the power switch 4 is turned on in FIGS. 1 and 5, as described above,
Since the already recorded image data is held in the semiconductor memory 13 and the operation of the timing generation circuit 7 is stopped, the operation end signal ME becomes “H” and indicates the operation end state. Record trigger switch 5 at time T2
When the writing of the data of the image P4 to the semiconductor memory 13 shown in FIG. 5C is started by the above-described series of operations, the operation end signal ME becomes the level "L", and the timing ends. It indicates that the generation circuit 7 is in operation.

4 and 5, the AND gate 23b of the state detection circuit 23 receives one input as
The operation end signal ME is supplied. The other input of the AND gate 23b is connected to the connector 14 by an external device 25.
When the connector 25a of No. 1 is fitted and an external device is connected, a signal (hereinafter referred to as a preparation status instruction signal) CSSa supplied from the external device 25 via the connectors 25a and 14 indicating the preparation status of the signal transfer operation. is there. The output of the AND gate 23b is T-F as a trigger clock.
It is supplied to the clock terminal T of F23a.

The reset terminal R of the T-FF 23a is supplied with an initial reset signal INS when the operating power is turned on by the power switch 4 (FIG. 1) via the OR gate 23c. The initial reset signal INS is used for resetting each logic circuit to a predetermined initial state after being generated for a predetermined short time after the power is turned on. Such a reset method is well known in the logic circuit technical field. A dedicated IC for generating a reset signal at the start of power supply is commercially available. Therefore, the state detection circuit 23
Although the reset signal generating IC may be provided as a component of the above, the output signal of the reset signal generating circuit provided in the timing generating circuit 2 may be used as the initial reset signal INS.

The Q output of the T-FF 23a is connected to the state detection signal S
Output as D. The state detection signal SD is reset from the indefinite state (the undetermined state of "H" or "L") to the "L" state at time T1 as shown in FIG. 5 by the initial reset signal INS. When the state detection signal SD is "L", the switches 11 and 15 in FIG. 1 are in the state shown in FIG. Further, the "L" state detection signal SD is inverted by the inverter 9 of FIG. 1 to become "H", and causes the AND gate 6 to pass the operation control signal MC. As a result, as described with reference to FIG. 3, the data of the image P4 is written in the semiconductor memory 13 in conjunction with the closing of the recording trigger switch 5 at the time T2.

Here, at time T4, the external device 25 instructs the state detection circuit 23 to indicate that the external device 25 is ready for signal transmission / reception.
It is assumed that Sa is supplied. At this time, when the operation end signal ME changes to “H” along with the end of the operation of the timing generation circuit 7 due to the completion of writing the data of the image P4 into the semiconductor memory 13, the T-FF 23a is triggered at this timing. The detection signal SD is inverted to "H".

When the state detection signal SD becomes "H", the state shown in FIG.
Switches 11 and 15 are switched in the opposite direction to that shown in FIG. The switch 11 that is a unidirectional digital signal switch can be easily configured by a multiplexer circuit, and the switch 15 that is a bidirectional switch can be easily configured by a so-called analog switch circuit, for example. Well known in the art.

The state detection signal SD is sent to the connectors 14 and 25a.
Is supplied to the external device 25 via the, and informs the external device 25 that the image pickup apparatus is in a signal transferable state by its level being “H”.

Therefore, when the external device 25 receives the state detection signal SD, the clock CL3, the address signal Ad3, and the read / write switching signal (R / -W3) for instructing the reading are passed through the switch 11 in FIG. Are supplied to the semiconductor memory 13. Thereby, the semiconductor memory 1
3 reads out, for example, one specific image or all image data from the recording area designated by the address signal Ad3, and externally outputs from the data input / output terminal I / O terminal via the switch 15 and the connector 14. Device 25 (Fig. 4)
Supply to. At this time, the operation of the semiconductor memory 13 is exclusively controlled by the external device 25.

In FIG. 4 and FIG. 5, the external device 25 is
When desired image data is read from the semiconductor memory 13,
The output of the clock CL3 is stopped and the preparation status instruction signal CS
Sa is returned to "L", and at the same time, the transfer operation end signal CSSb is supplied to the state detection circuit 23. The transfer operation end signal CSSb is transmitted to the T-FF via the OR gate 23c.
23a, which is reset to reset the state detection signal S
Return D to "L".

When the external device 25 is a personal computer, a signal transmission / reception clock CL3 (FIG. 1)
A signal of relatively low frequency is often used as
It is convenient that the frequency can be determined only by the constraint condition of the external device 25 alone. This is generally
When a low-cost external device 25 is used, its data processing capability is low, so that signal transmission / reception with a low-frequency clock is suitable, and if the external device has a high processing capability, a high-speed clock can be used for a short period of time. This is because it is desired to complete the transfer operation in time. Therefore, the external device 25
It is conceivable that the time required to send and receive signals to and from will differ depending on the type of external device used, even if the amount of signal data to be sent and received is the same.

In this embodiment, the state detection signal SD is also supplied for controlling the AND gate 6 inserted in the transmission path of the operation control signal MC for instructing the operation start of the timing generation circuit 7, and the state detection signal SD is supplied. Is at "H", the operation control signal MC is blocked by the AND gate 6 and at least the image data writing interlocking operation to the semiconductor memories 12 and 13 executed by closing the recording trigger switch 5 is performed. It is prohibited that the writing of new image data to the semiconductor memory 13 is prohibited, and the image data in the semiconductor memory 13 is modified and the image content is changed during the uncertain time required for exchanging a signal with the external device 25. To prevent.

FIG. 5 explains the operation of the embodiment having the above-mentioned configuration. However, for example, the state detection signal SD
When "H" is set to "H", the timing generation circuit 2 can be configured by a known technique in the logic circuit technical field so as to ignore the closed circuit of the recording trigger switch 5, and the above-described alteration of the image data in the semiconductor memory 13 can be prevented. However, in this case,
Naturally, all operations by the operation of the recording trigger switch 5 are prohibited.

In FIG. 5C, when the writing operation of the image P4 in the semiconductor memory 13 is completed and the operation end signal ME is inverted to "H", as shown in FIG. Writing of P5, P6, and P7 resumes (FIG. 5B). When the recording trigger switch 5 is closed at time T3, the image P7 is held in the semiconductor memory 12, but the state detection signal SD is "H", so the AND gate 6 outputs the operation control signal MC. It is blocked and is not supplied to the timing generation circuit 7, and the timing generation circuit 7 does not start operation. Therefore, in the semiconductor memory 13, writing of the data of the image P7 is prohibited, and the previous image data remains held.

As described above, not only the switching operation of the switches 11 and 15 but also the operation of the timing generation circuit 7 is prohibited, so that unnecessary operation of the circuit can be omitted and power consumption can be suppressed.

When the reading of the data of the image P4 to the external device 25 is completed and the status detection signal SD output from the status detection circuit 23 by the transfer operation end signal CSSb becomes "L", the switches 11 and 15 are turned on again. It switches to the direction shown in FIG. Further, the AND gate 6 is also in the passable state and the operation control signal MC is supplied to the timing generation circuit 7. As a result, the timing generation circuit 7 starts its operation, the operation end signal ME becomes "L", and the data of the compressed image P7 is written in the semiconductor memory 13 at the timing shown in FIG. 5 (c). When this writing is completed,
The operation end signal ME becomes "H" again, and the preparation status instruction signal CSSa becomes "H" again, which indicates that the external device 25 is ready to exchange signals. This allows
The state detection signal SD is inverted to "H", and the external device 25 is notified that the image pickup apparatus is ready to exchange signals again.

As described above, according to the operation of this embodiment, during the data read from the semiconductor memory 13 to the external device 25, the data write to the semiconductor memory 13 is prohibited or the data to the semiconductor memory 13 is written. Since data reading to the external device 25 is prohibited in the middle of writing, there is no possibility that the image data in the semiconductor memory 13 is rewritten during the data reading operation of the semiconductor memory 13 to the external device 25. Therefore, it is possible to prevent the data of a plurality of images from being mixedly output instead of the image data of one imaged image. Therefore, an image reproduced using this output data is captured as one image data. You can avoid changing to something different from.

When the operation control signal MC is set to be on standby for output, image data is transferred to the semiconductor memory 12 by closing the recording trigger switch 5 even while data is being read out to the external device 25. Capture,
In other words, shooting can be performed, and the image information captured here can be automatically transferred to the semiconductor memory 13 and recorded as soon as the data reading to the external device 25 is completed without requiring a new operation by the user. can do. Further, when the data writing to the semiconductor memory 13 is completed, the state detection signal SD is automatically inverted to "H" in conjunction with this,
Since this embodiment can be switched to a signal transferable state with the external device 25 and the connected external device 25 can be notified of this state, the image data recorded in the semiconductor memory 13 can be waited for. It is also possible to shorten the time period and read continuously by the external device 25.

Further, the preparation status instruction signal CSSa is shown in FIG.
The level change timing is not limited to that shown in FIG. 5, but, for example, it may be once inverted to “H” and then maintained at this level. At this time, FIG.
Operation completion signal M after the writing of new image information in
Every time E is inverted from "L" to "H", a signal can be automatically exchanged with the external device 25.

In addition, the preparation status indication signal CSSa is changed to that shown in FIG.
As shown in, when it is specified that the external device 25 returns to “L” from “H” each time the signal transfer is completed, it is not always necessary to supply the transfer operation end signal CSSb from the external device 25. Not, for example, the preparation status indication signal C
The state detection circuit 23 has a well-known logic circuit configuration such as a monostable multivibrator circuit which generates a pulse signal having a predetermined pulse width in synchronization with the edge timing of SSa from "H" to "L". It is also possible to provide a pulse signal corresponding to the transfer operation end signal CSSb by supplying it with the preparation status instruction signal CSSa.

Incidentally, in FIG. 5, the preparation state instruction signal C
When the image data holding timing by SSa, that is, the preparation state instruction signal CSSa is inverted to "H" within the "H" period of the operation end signal ME, the state detection circuit 23 immediately outputs the state detection signal SD of "H". Then, the image pickup apparatus of this embodiment is in a state of exchanging signals with the external device 25, but is particularly prepared immediately before the operation end signal ME is switched from “H” to “L” in conjunction with the closing of the recording trigger switch 5. When the situation indicating signal CSSa is inverted from "L" to "H", a noise signal having a minute pulse width is generated from the AND gate 23b in FIG. 4, which causes the T-FF 23a.
May be triggered and the state detection signal SD may be inverted to "H". Before time T1 or time T
When the preparation status instruction signal CSSa is inverted to “H” at a time near 1, the TF by the initial reset signal INS
Due to the conflict with the reset control of F23a, the T-FF23
The operation of a may be uncertain.

FIG. 6 is a circuit diagram showing another embodiment of the state detection circuit 23 in FIG. 1, which is also suitable for such a case. 23d is an inverter, 26 to 29 are resistors, 30 is a transistor, 31, Reference numeral 32 is a capacitor, and 33 is a power source, and the portions corresponding to FIGS.

FIG. 7 is a waveform diagram showing the signals of the respective parts in FIG. 6, and the signals corresponding to those in FIG. 6 are designated by the same reference numerals.

In FIG. 6, the state detection circuit 23 is provided with a fitting detection switch 24, and when the connector 25a of the external device (not shown) is fitted to the connector 14 (time T1), this fitting is performed. The detection switch 24 is pressed and closed, and the "H" voltage signal SV from the power supply 33 is supplied to the AND gate 23b. This "H" voltage signal SV takes the place of the preparation status instruction signal CSSa in the specific example shown in FIG. The resistor 28 is used for the fitting detection switch 2
This is for keeping one input of the AND gate 23b at the ground ("L") level when the 4 is opened.

As a result, as shown in FIG. 7A, when the power supply of the apparatus is turned on by closing the power switch 4 in FIG.
As described above, the preparation status indication signal CSSa is
This is the same as inverting from "L" to "H" at 1.

In this specific example, the AND gate 23 is also used.
The operation end signal ME is supplied to the other input of b through the resistor 26, but the capacitor 31 and the transistor 30 are connected between this input terminal of the AND gate 23b and the ground.
And are connected in parallel. Then, the initial reset signal I is applied to the base of the transistor 30 via the resistor 27.
NS is supplied.

Therefore, as shown in FIG. 7A, when the initial reset signal INS of "H" is generated when the power is turned on,
Since the transistor 30 becomes conductive during the signal period,
The input level ADI on the side to which the operation end signal ME of the AND gate 23b is supplied is kept at "L". Then, when the initial reset signal INS becomes “L” after a lapse of a predetermined time, the transistor 30 becomes non-conductive, and at this time,
When the operation end signal ME is "H", the input level ADI becomes "H" after a time delay determined by the time constant of the resistor 26 and the capacitor 31. During this time delay, T
Since the -FF 23a is reset by the initial reset signal INS, the T-FF 23a is surely triggered by the "1 level" output ADO of the AND gate 23b obtained when the input level ADI becomes "H". , The state detection signal SD can be generated.

Further, FIG. 7B shows the operation of "H" output from the operation of the timing generating circuit 2 at time T2 'in conjunction with the closing operation of the recording trigger switch 5 (FIG. 1) at time T2. This is for the operation in the case where the control signal MC and the timing at which the fitting detection switch 24 is closed and the power supply 33 supplies the voltage signal SV of "H" to the AND gate 23b.

When the timing generation circuit 7 (FIG. 1) starts operating by the operation control signal MC of "H" generated from the timing generation circuit 2 (FIG. 1) at time T2 ', the operation end signal ME is "H". Is inverted to "L", but generally due to the operation delay depending on the signal propagation speed of the circuit element or the phase relationship between the operation clock of the timing generation circuit 7 supplied from the oscillation 8 and the operation control signal MC, etc. There is a time difference from T2 ′ to the time when the operation end signal ME is inverted to “L”. When the voltage signal SV from the fitting detection switch 24 is inverted from "L" to "H" during this time difference period, the AND gate 23b generates the pulsed "H" output signal ADO for a short period. When the T-FF 23a is triggered by this output signal ADO, the state detection signal SD is inverted to "H", and as it is, the switches 11 and 15 (see FIG. ) Is connected to the access side of the external device, the image data taken at the timing of time T2 cannot be stored in the semiconductor memory 13 (FIG. 1).

Therefore, the specific example shown in FIG. 6 has the following configuration in order to avoid such a situation in which photographing is invalid.

That is, in addition to the transfer operation end signal CSSb and the initial reset signal INS, the operation end signal ME is level-inverted by the inverter 23d and supplied to the OR circuit 23c as in the specific example shown in FIG. Thus, when the operation end signal ME is inverted to “L”,
Make sure that the T-FF 23a is reset, and once "H"
The state detection signal SD inverted to "L" is returned to "L" again. As a result, the operation of the timing generation circuit 7 can effectively write the image information to the semiconductor memory 13.

At this time, the condition for generating the state detection signal SD having the "H" pulse waveform as shown in FIG. 7B is that the voltage signal SV from the fitting detection switch 24 is "H". Circuit operation delay time t from the time of inversion until the AND gate 6 (FIG. 1) is closed by the state detection signal SD
Time around T2 'defined by the sum of 1 and the delay time t2 from the time when the operation control signal MC is inverted to "H" to the time when the T-FF 23a is reset by the operation end signal ME of "L". The voltage signal SV from the fitting detection switch 24 is inverted to "H" in the area. At this time, the times t1 and t2 can be predicted in advance from the speed performance of the circuit element to be used, the circuit configuration adopted, or the like, and the "H" of the state detection signal SD shown in FIG. The period is shorter than the period (t1 + t2).

Therefore, the connector 14 for the state detection signal SD
By providing a circuit configuration for preventing the output of a signal having a predetermined pulse width or less in the output section, the pulse state detection signal SD of “H” shown in FIG. 7B is supplied to the external device. Can be prevented. In FIG.
An integrator circuit including a resistor 29 and a capacitor 32 is used as the blocking means. Of course, other configurations that realize similar functions are known in the logic circuit technical field. It should be noted that even if the pulsed state detection signal SD is directly supplied to the external device, the external device may be configured so as not to respond to the state detection signal SD having a minute pulse width preliminarily assumed. As described above, when the state detection circuit 23 side is configured to block the pulse-shaped state detection signal SD, the constraint conditions for the operation of the external device are less, and the operation program setting in the external device is troublesome. Can be reduced.

As still another specific example of the state detection circuit 23, in FIG. 6, a gate is provided on the resistance 28 side of the fitting detection switch 24, and the gate signal G shown in FIG.
It may be controlled by C to block the voltage signal. The gate signal GC becomes "H" at a time T2 when the recording trigger switch 5 is closed, that is, a predetermined time before the operation control signal MC, the operation end signal ME is inverted to "L", and a predetermined time elapses after that. This gate signal G is generated by the timing generation circuit 2 so as to return to "L" later.
In the “H” period of C, the voltage signal SV from the fitting detection switch 24 is blocked and is not supplied to the AND gate 23b, and the voltage from the fitting detection switch 24 is shown in the time region (t1 + t2) of FIG. 7B. The signal SV is prohibited from being inverted to "H". In this case, the "H" state of the output signal ADO of the AND gate 23b and the state detection signal SD shown after time T2 'in FIG. 7B does not occur. Therefore, it becomes unnecessary to supply the inverted signal of the operation end signal ME to the OR circuit 23c.

Although the state detection circuit 23 shown in FIGS. 4 and 6 and the AND gate 6 and the inverter 9 in FIG. 1 are configured by hardware logic circuits, for example, a microcomputer is used. The state is detected by the initial reset signal INS, the operation end signal ME, the voltage signal SV, the gate signal GC, and the transfer operation end signal CSSb in FIG. 6, and the operation control signal M is detected based on the result.
C or the state detection signal SD may be generated.

The above is the description of the image pickup operation and the image information output operation to the external device of the embodiment shown in FIG. 1. Next, the image reproduction operation of this embodiment is shown in the operation time chart of FIG. Will be explained.

In this operation, in FIG. 1, the power supply switch 4 is closed in the state of the broken line in the direction opposite to that shown in the drawing to switch to the reproduction mode, and in this case,
The recording trigger switch 5 is configured to have a function as a sequential selection switch for reproduced images. Such function switching can be easily realized by using a microcomputer or logic circuit technology.

In FIG. 1 and FIG. 8, when the user closes the power switch 4 to the reproduction mode side indicated by the broken line at time T1, the operating power is started to be turned on, and as shown in FIG. The operation is started. At this time, as an initial operation, as shown in FIG. 8B, the data of the first image P1 is read from the semiconductor memory 13 in the image data holding state, and as shown in FIG. Memory 1
Written to 2. The initial operation is executed as follows.

The timing generation circuit 2 includes a power switch 4
The reproduction operation is started by the closing of the circuit, and at this time, the microcomputer in the timing generation circuit 2 is programmed to perform the next initial operation. That is, the timing generation circuit 7 is operated by the operation control signal MC, the clock CL2, the address signal Ad2, and the read / write switching signal (R /-) of "L" for instructing the read operation.
W2) is generated. Further, the operation clock CK5 of the image data expansion circuit 22 for restoring the compressed image data to the uncompressed image data, the clock CL1 for the semiconductor memory 12, and the address signal Ad1 are generated. Further, the switch control signals SW1, SW2, SW3 cause the switches 10, 16, 18 to be closed in the opposite direction to that shown in the drawing. Since the timing generation circuit 7 starts the initial operation, the operation end signal ME maintains "L" at time T1.

Here, as shown in FIG. 8, it is assumed that the preparation status instructing signal CSSa shown in FIGS. 4 and 5 indicates that the external device is ready to access the semiconductor memory 13. Also due to the action of the AND gate 23b shown in FIG. 4 or FIG.
Does not reverse to "H". Therefore, switch 1
1 and 15 maintain the state shown in FIG. 1, image data is read from the data input / output terminal I / O of the semiconductor memory 13,
After being processed by the image data expansion circuit 22, the switch 16
Is supplied to the semiconductor memory 12 via. At this time, the clock CL1 and the address signal Ad1 from the timing generation circuit 7 are supplied to the semiconductor memory 12 as the write clock WC and the write address signal WA, respectively.

The above is the initial operation in the reproduction mode. Next, the operation of reading image data from the semiconductor memory 12 will be described.

In this case, the clock CL and the address signal Ad output from the timing generation circuit 2 are supplied to the semiconductor memory 12 as the read clock RC and the read address signal RA, respectively. This data reading is performed by scanning the data area of the field image or the frame image at the scanning speed of the television signal.

The image data read from the semiconductor memory 12 is supplied to the encoder circuit 19 via the switch 18, converted into an analog video signal and output from the output terminal 20.

Generally, in the semiconductor memory 12 in which the supply of the operating power is stopped together with the stop of the power supply and the power supply is not backed up, the false data with the undefined level is stored at the start of the power supply at time T1. become. Therefore, in FIG. 8, during the writing operation of the data of the image P1, the false data is sequentially rewritten by the data of the image P1.

Here, the image data expansion circuit 22 outputs 1
The restoration processing of the image data of one sheet is also limited by the operation speed because of the same processing capacity as the above-described image data compression processing operation. Therefore, in general, compared with the image data read time for one sheet of the semiconductor memory 12 by the clock CL from the timing generation circuit 2 and the address signal Ad,
The time required for the image data expansion circuit 22 to restore the image data for one image is longer. Therefore, at time T1, the data read of the semiconductor memory 12 is immediately started by the clock CL and the address signal Ad from the timing generation circuit 2, and the video signal is generated by the encoder 19 from the read image data, and the video signal is connected to the output terminal 20. On the display device such as the television monitor device, first, a false image, which is often a mosaic pattern, is reproduced by the above false data, and then the image expanded by the image data expansion circuit 22. The image based on the data of P1 is displayed such that the image gradually changes from the upper left corner of the displayed image.

Here, the recording area of the semiconductor memory 12 that has been rewritten with the restored data is known from the state of the address signal Ad1 from the timing generation circuit 7, and the image data from other areas is output from the semiconductor memory 12. At this timing, for example, by holding the input level of the encoder 19 at a predetermined value or the like, the output of the video signal signal due to the false data at the time of rewriting is blocked, and the part of the screen where the rewriting is not completed can be displayed in gray, for example. It is also possible to have a different configuration. In addition, when updating the playback image that is performed without stopping the power supply,
The image that was previously selected is displayed so that it gradually changes to the newly selected image.

As is clear from the above description, the image information output from the output terminal 20 has a period in which a plurality of images are mixed, but the television monitor device connected to the output terminal 20 has a specific Since it is not a device used to retrieve a single image, there is no problem even if mixed images are output transiently. On the contrary, it is better to be able to display on the monitor display how the images were updated. In many cases, it is suitable because the operating status can be grasped.

When the writing of the data of the image P1 to the semiconductor memory 12 is completed, the timing generation circuit 7 stops the generation of the clocks CL1 and CL2, and the semiconductor memory 12 enters the data holding mode of the image P1 and the semiconductor memory The read operation of 13 is stopped. Further, the timing generation circuit 7 outputs the operation end signal ME of "H". At this time, as shown in FIG. 8, the preparation status instruction signal CSSa
Is "H", which indicates a signal transmission / reception preparation state by the external device, the state detection circuit 23 generates the "H" state detection signal SD. As a result, the switches 11, 1
5 switches in the direction opposite to that shown in FIG. 1, and the semiconductor memory 13 can be accessed by an external device connected to the connector 14.

Here, the clock CL3, the address signal Ad3 and the read / write switching signal (R / -W3) of "L" for instructing the data writing are supplied from the external device, and the data of the image Pext is supplied from the external device. Switch 15
The data of one or a plurality of images can be written in the semiconductor memory 13 at the timing marked with Pext shown in FIG. Further, the image P1 shown in FIG.
8 is completed, the preparation status instruction signal CSSa is
In contrast to the case of, the semiconductor memory 12 and 13 are both in the data holding state when it remains at “L”, and in this state, the recording trigger switch 5 is closed at time T2 to instruct selection of the next image. Immediately thereafter, the timing generation circuit 2 outputs the operation control signal MC to execute the writing operation of the image P2 to the semiconductor memory 12.

In this embodiment, similarly to the above-mentioned image pickup operation, even during the reproduction operation, the output of the operation control signal MC can be suspended during the period when the state detection signal SD is "H". 8, when the state detection signal SD becomes “H” before the time T2, the transfer operation end signal CSS indicating the end of the signal transfer operation from the external device.
The semiconductor memory 12 is kept in the data holding state until b is supplied and the state detection signal SD returns to "L". When the state detection signal SD is inverted to "L", the image P is automatically displayed.
It is also possible to execute the writing to the second semiconductor memory 12. When the image P2 is rewritten in the semiconductor memory 13 at the timing of Pext in advance, the rewritten image is written in the semiconductor memory 12.

In addition, when the signal is not exchanged with the external device in the connected state of the external device, it goes without saying that the preparation status instruction signal CSSa may be kept at "L".
For example, when the voltage signal SV from the fitting detection switch 24 is used instead of the preparation state instruction signal CSSa as in the state detection circuit 23 shown in FIG. 6, the state detection signal SD of “H” is the connector 14 By sending back the sending / receiving operation end signal CSSb from the external device every time it is transmitted via the, the state detection signal SD immediately returns to “L” and the operation by closing the recording trigger switch 5 is started. As a result, the reproduction image can be selected by operating the recording trigger switch 5 without delay.

According to the image reproducing operation of this embodiment as described above, during the period in which the image data is read from the semiconductor memory 13 to write the reproduced image data in the semiconductor memory 12, the external device transfers data to the semiconductor memory 13. The data writing is prohibited, and while the data writing from the external device to the semiconductor memory 13 is being executed, the semiconductor memory 13 is
It is prohibited to read data from and write to the semiconductor memory 12. By such an operation, there is no risk that the image data read from the semiconductor memory 13 will be mixed with a plurality of image data. Therefore, the image data written in the semiconductor memory 12 and the image data read from the semiconductor memory 12 will be displayed on a television monitor or the like. The content of the displayed image will not be changed to something different from the one image stored in the semiconductor memory 13.

Further, the operation of updating the reproduced image due to the closed circuit of the recording trigger switch 5 or the like is made to stand by for the period of signal transmission / reception with the external device, and the recording trigger switch 5 is continuously connected mechanically or electrically. Timing is generated so as to detect the open / closed state of the recording trigger switch 5 at a predetermined timing such as a timing at which the state detection signal SD is inverted from "H" to "L" by using a means for closing the circuit. By programming the microcomputer of circuit 2, this embodiment can be operated to immediately and automatically reproduce the image written from the external device. The equivalent function is
Further, even if the signal transfer operation end signal CSSb is used instead of the closing signal of the recording trigger switch 5,
realizable. At this time, when the semiconductor memory 13 is for recording a plurality of images, the image input from the external device is one image by one writing operation, and the written image and the read image are matched. Therefore, a means for detecting the address signal supplied from the external device and loading the start address into the counter for generating the address signal Ad2 arranged in the timing generation circuit 7 is also used.

Incidentally, in FIG. 5 or FIG. 8, the state detection signal SD
Is "H", regardless of whether it is in the imaging mode as described with reference to FIGS. 4 and 5 or the reproduction mode as described in FIG. By reversing the level of R / -W3), data writing from the external device to the semiconductor memory 13 or data reading from the semiconductor memory 13 to the external device can be executed. The state detection circuit 23 outputs the state detection signal even during the combined operation of the operation mode of this embodiment and the write access or read access of the semiconductor memory 13 by the external device, which is not described in FIG. 5 and FIG. The control operation described in FIGS. 5 and 8 by the signal SD, that is, the data write access to the semiconductor memory 13 (in the imaging mode) or the data read access from the semiconductor memory 13 (in the reproduction mode) by the internal operation of this embodiment. Access to the semiconductor memory 13 by an external device is prohibited during execution of the
While the access to the semiconductor memory 13 is being executed, a plurality of image data are stored in the storage area assigned to the data of one image in the semiconductor memory 13 by the control operation of prohibiting the access to the semiconductor memory 13 by the internal operation of this embodiment. Can be prevented.

As described above, in the embodiment shown in FIG. 1, the semiconductor memory 13 is accessed by the operation started in conjunction with the closing of the recording trigger switch 5, that is, the image pickup operation or the reproduction operation. At times, access to the semiconductor memory 13 from an external device is completely prohibited.

By the way, the access to the semiconductor memory 13 by this internal operation is, as is clear from the above description of the embodiment, the memory area of the image data for one screen in the semiconductor memory 13 per closing of the recording trigger switch 5. Only executed by accessing. Therefore, when the semiconductor memory 13 stores a plurality of image data, even if the access prohibition control as described above is limited to the memory area of the data for one image, the desired effect is obtained. can get.

FIG. 9 is a block diagram showing a main part of another embodiment of an image pickup apparatus according to the present invention which can realize such control operation. 11A and 11B are switches, and 13A and 1B.
3B is a semiconductor memory, 15A and 15B are switches, 23
A, 23B, and 34 are state detection circuits, 35 is a selection signal generation circuit, 36 and 37 are AND gates, 38 to 42 are OR circuits, and 43 to 45 are inverters. I am wearing it.

In FIG. 9, the left half portion of FIG. 1, that is, the timing generation circuit 2, the semiconductor memory 12, the image pickup device 1, the camera signal processing circuit 17, and the encoder 19 are the same, and therefore omitted. ing. In addition, the switch 11, the semiconductor memory 13, the switch 15, and the state detection circuit 23 in FIG.
1B, semiconductor memories 13A and 13B, switches 15A,
15B and state detection circuits 23A and 23B are provided. Although not shown in FIG. 9, the timing generating circuit 7 is similar to that shown in FIG.
The address signal Ad1 is also generated.

The feature of this embodiment is that the semiconductor memory 13
Is arranged independently for each image to be stored so that the access control of the image data can be executed independently for each image data. In this embodiment,
The number of images to be stored is two, and for this reason, as described above, the semiconductor memory 13 and the switch 1 in FIG.
Two systems are provided for each of the systems 1, 15 and the state detection circuit 23.

Here, the semiconductor memories 13A and 13B each storing the data for one image are composed of one (or a plurality) of semiconductor memory ICs which are commercially available, respectively. Generally, a chip enable terminal CE is provided, and the chip enable signal supplied to this terminal is operated by a clock CL, an address signal Ad, and a read / write switching signal (R / -W) depending on the logic level of the chip enable signal. However, when it is "L", it has a function of not accepting the above-mentioned operation control at all and separating the input / output impedance of the data input / output terminal I / O from the external circuit as a high impedance. In this embodiment, the semiconductor memories 13A and 13B are selected by using such a function.

Therefore, in this embodiment, the operation control signal MC supplied to the timing generation circuit 7 via the AND gate 6 is also supplied to the selection signal generation circuit 35 composed of a counter, a shift register or the like. It The selection signal generating circuit 35 is used in the semiconductor memories 13A and 13B.
The selection signals S1 and S2 for selecting are generated.

Also in this embodiment, as in the above-described embodiment, since the semiconductor memories 13A and 13B are accessed in units of one image, the selection signal S1,
S2 does not become a logic level (here, the selection level is "H") that simultaneously selects the semiconductor memories 13A and 13B. From the external device, the semiconductor memory 1
Preparation status indication signal C which becomes "H" when 3A is selected
The SSa1 and the preparation status instruction signal CSSa2 which becomes “H” when the semiconductor memory 13B is selected are supplied via the connector 14.

Here, the timing generation circuit 7 receives the operation control signal MC supplied from the timing generation circuit 2 in conjunction with the closing of the recording trigger switch 5 shown in FIG. 1 and executes the access to the semiconductor memory 13. At this time, in the selection signal generation circuit 35, the recording trigger switch 5 is set to 1
Due to the closed circuit, the selection signal S1 becomes "H" and the selection signal S
2 becomes "L", the next closing of the recording trigger switch 5 causes the selection signal S1 to become "L" and the selection signal S2 becomes "H", and when the recording trigger switch 5 is further closed, the selection signal S1 and S2 return to the initial level, and thereafter, the level change of the selection signals S1 and S2 is
The above operation is repeated every time the recording trigger switch 5 is closed.

The selection signals S1 and S2 are supplied to the AND gates 36 and 37, respectively, and become "L" at the start of the operation of the timing generation circuit 7, and during that operation, AN
In order to maintain the levels of the D gates 36 and 37, the operation end signal ME is inverted in level by the inverter 43 and supplied to the AND gates 36 and 37. The output signals of the AND gates 36 and 37 pass through the OR circuits 38 and 39, respectively, and are output as semiconductor chip 1 as chip enable signals.
It is supplied to the chip enable terminals CE of 3A and 13B.
As a result, the semiconductor memories 13A and 13B are alternately selected each time the timing generation circuit 7 performs an operation due to the closing of the recording trigger switch 5.

The selection signals S1 and S2 are level-inverted by the inverters 44 and 45, respectively, and then the OR circuits 41 and
It is supplied to the state detection circuits 23A and 23B via 42. Further, the operation end signal ME is also transmitted to the OR circuit 41,
It is supplied to the state detection circuits 23A and 23B via 42. As a result, the output signal of the OR circuit 41 is "L" only during the period when the semiconductor memory 13A is being accessed by the timing generation circuit 7, and "H" during the other periods. Similarly, the output signal of the OR circuit 42 is also the semiconductor memory 13B.
Is "L" only during the period when the timing generating circuit 7 is being accessed, and "H" during the other periods. The output signals of the OR circuits 41 and 42 are the state detection circuits 23A and 23A.
In B, it replaces the operation end signal ME in the state detection circuit 23 in FIG.

The state detection circuit 23A is supplied with the preparation status instruction signal CSSa1 from the external device, and the state detection circuit 23B is supplied with the preparation status instruction signal CSSa2. These preparation status instruction signals CSSa1 and CSSa2 are shown in FIG. Preparation state instruction signal CSS supplied to the state detection circuit 23 of
It is the same as a. Further, the transfer operation end signal CSSb from the external device is supplied to both the state detection circuits 23A and 23B.

Here, the external device is the semiconductor memory 13A.
To access the preparation status instruction signal CSSa1
In addition, when the semiconductor memory 13B is accessed, the preparation state instruction signal CSSa2 is set to "H", but these are not set to "H" at the same time. Also, when the external device accesses either of the semiconductor memories 13A and 13B, the external device generates the pulsed transfer operation end signal CSSb as shown in FIG. 5 every time the access operation of the selected semiconductor memory ends. .

With the above configuration, the state detection circuit 23A performs the same operation as the state detection circuit 23 shown in FIG. 4, and when the semiconductor memory 13A is accessed by the timing generation circuit 7, the state of the preparation state instruction signal CSSa1. , The state detection signal SDa is held at "L",
When this access is not made, the state detection signal SDa can be switched to "H" by setting the preparation status instruction signal CSSa1 to "H".

When the state detection signal SDa is "H", the switches 11A and 15A are switched to change the semiconductor memory 13A.
Each of the terminals is connected to an external device, and is supplied to the chip enable terminal CE of the semiconductor memory 13A via the OR circuit 38 to make it operable. Furthermore, the semiconductor memory 1 is connected to an external device via the OR circuit 40.
Notify that 3 has become accessible. The semiconductor memory 13B is also operated by the state detection circuit 23B.
Similarly, access is switched.

The state detection signals SDa and SDb are
It is also supplied to the state detection circuit 34. In the embodiment shown in FIG. 1, the state detection signal SD output from the state detection circuit 23 is supplied to the AND gate 6 via the inverter 9, and the state detection circuit 23 is controlled to operate by the timing generation circuit 2. Although it was used for the control of waiting for the output of the signal MC, in the embodiment shown in FIG.
This operation is performed by using the state detection circuit 34.

That is, the state detection circuit 34 uses the selection signal S
The semiconductor memory to be selected by the selection signal generating circuit 35 in the next operation from the levels S1 and S2 is the semiconductor memory 13A.
Or the semiconductor memory 13B can be detected. Therefore, depending on the logic level of the state detection signal SDa or SDb, the semiconductor memory 13A, 13B by the external device can be detected.
Memory 13
When A or 13B is not accessed by an external device, the operation is immediately started, and when it is accessed, it waits, or the semiconductor memory 13A, 13B.
The one of B which is not accessed is selected to start the operation.

FIG. 10 is a block diagram showing a specific example of the state detection circuit 34 in FIG. 9. 34a and 34b are AND gates and 34c is a NOR circuit, and the portions corresponding to FIG. I am wearing it.

In the figure, when the selection signal S1 is "H", the selection signal generation circuit 35 sets the selection signal S2 to "H" and the selection signal S1 to "L" when the next operation control signal MC is input. Further, when the selection signal S2 is "H", the selection signal S1 is switched to "H" and the selection signal S2 is switched to "L" when the next next operation control signal MC is input.

Therefore, in the state detection circuit 34, the selection signal S2 and the state detection signal SDa are AND gate 34a.
And the selection signal S1 and the signal SDb are AND gate 34b.
When the semiconductor memory 13A or 13B that is being accessed by the external device and the semiconductor memory 13A or 13B that is scheduled to be accessed by the operation of the next timing generation circuit 7 match. , AND gate 34a, 34b outputs "H"
Signal is output. At this time, since the output signal of the NOR circuit 34c becomes "L", the passage of the operation control signal MC is blocked by the AND gate 6, and the state detection signal SDa or SDb becomes "L". It is in the standby operation state until the matching state is released.

In the embodiment shown in FIG. 9, two images are stored in each of the two systems of semiconductor memories 13A and 13B, but a total of two images are stored. 11, 15 and state detection circuit 2
3, it is possible to store two or more images by adding a circuit configuration including the OR circuit 38 and the like. At this time as well, only one state detection circuit 34 is required.
FIG. 11 shows a specific example of the state detection circuit 34 when the N-system semiconductor memory 13 is used. However, in the figure,
341, 342, 343, 344, ..., 34N are shown in FIG.
It is an AND gate corresponding to the AND gates 34a and 34b at 0, and the same reference numerals are given to the portions corresponding to FIG.

In FIG. 11, N semiconductor memories 13 are provided.
The selection signal generation circuit 35 in which the number of stages of the counter or shift register is set corresponding to
, S2, S3, S4, ..., SN are generated, and these are respectively AND gates 341, 342 of the state detection circuit 34.
, 343, 344, ..., 34N. Although not shown, N pieces of the state detection circuits 23A and 23A of FIG. 9 are provided, and the state detection signals SD1, SD2, SD3, SD4, ..., SDN from the respective AND gates 341 are respectively provided. , 342, 343, 344, ...
..., 34N. With such a configuration, the next operation of the timing generation circuit 7 causes the execution of the operation of the timing generation circuit 7 to wait when any of the semiconductor memory 13 systems scheduled to be accessed is accessed by an external device. be able to.

In FIGS. 10 and 11, the selection signal generating circuit 35 has an initial reset signal INS when the power is turned on.
Is supplied to reset the above-mentioned counter and the like, thereby setting the selection signal in the initial state (generally, the first selection signal S1 is "H").

Further, a digital adder circuit for adding 1 to the present count number and a function for loading the addition result into this counter are added to the counter of the selection signal generating circuit 35 in FIG. 10 or FIG. The AND gate 6 is configured by executing the above load at the timing when the output signal of the circuit 34c is "L" and the operation control signal MC is inverted from "L" to "H".
When the operation control signal MC is blocked, the selection signal generation circuit 35 automatically counts up and the NOR circuit 34c
The condition in which the output signal of "1" becomes "L" is released, and the operation control signal MC passing through the AND gate 6 by this release causes the selection signal generating circuit 35 to count up again, so that the semiconductor not accessed by the external device It becomes possible to select a memory system and execute writing.

As described above, even if the semiconductor memory 13 is divided into a plurality of independently accessible memory blocks, the same effect as that of the embodiment shown in FIG. 1 can be obtained. When any of the multiple memory blocks is being accessed by an external device,
It is also possible to select the memory block that has not been automatically accessed and execute the access to the semiconductor memory 13 by the imaging operation or the reproduction operation. Therefore,
In the case where the semiconductor memory 13 having a recording area for a plurality of images is adopted, the recording area excluding the recording area currently accessed by the external device is stored in the recording area even while the external device is accessing the semiconductor memory 13. It is also possible to capture and record multiple images.

In the embodiment shown in FIGS. 1 and 9, the recording trigger switch 5 for starting the operation is arranged in the apparatus, but the present invention is not limited to this, and, for example, an infrared ray is used. It is also possible to start the operation by a remote controller that uses, or to instruct the operation start from an external device connected to the connector 14.

Further, in the embodiment shown in FIGS. 1 and 9, instead of the semiconductor memory 13, memory means such as a magnetic disk may be adopted.
It is configurable to implement these memory access switching controls.

Furthermore, in the embodiments shown in FIGS. 1 and 9, the image data is compressed or expanded, but
Such a function is not essential in the present invention. Further, although the semiconductor memory 12 is used as a buffer memory, this semiconductor memory 12 is not indispensable especially in the embodiment having no image data compression / expansion function, and the captured image information is recorded in the semiconductor memory 13 in real time. It may be configured to do so.

Furthermore, as the semiconductor memories 13, 13A and 13B shown in FIGS.
When using flash type memory devices that generate busy signals, the ready / busy signals that they generate,
A signal obtained by ORing each of the state detection signals SD, SDa, SDb may be transmitted to the external device via the connector 14.

Furthermore, in FIG. 1, the switch 10
A switch corresponding to the switch 11 is further provided between the semiconductor memory 12 and the semiconductor memory 12, and by switching the data input terminal I and the data output terminal O of the semiconductor memory 12, respectively, the connection relationship shown in FIG. A switch that can be selectively connected depending on the connection relationship with the external device via the switch is provided, and this switch is used instead of the signal indicating the operation state of the timing generation circuit 2 as the operation end signal ME or as the operation end signal ME. By being configured to switch according to the output signal of the state detection circuit 23 additionally used,
Writing uncompressed image data from an external device into the semiconductor memory 12, compressing the image data with the image data compression processing circuit 21, and writing into the semiconductor memory 13;
The compressed image data from the external device is written in the semiconductor memory 13, and the image data expansion processing circuit 12
It can be realized that the image information restored in step 5 is temporarily stored in the semiconductor memory 12 and then the image information restored from the semiconductor memory 12 is read to an external device. Also,
At this time, the overlapping of the access of the semiconductor memory 12 started by the user operating the recording trigger switch 5 at an arbitrary timing and the access of the individual semiconductor memory 12 by the external device is automatically detected by the operation of the state detection circuit. This can be avoided, so that data of a plurality of images will not be mixed in one image data.

FIG. 12 is an external view of an embodiment of the image pickup apparatus according to the present invention and a diagram showing a usage example. Here, 46 is an image pickup apparatus according to the present invention, 47 is a light receiving lens for image pickup, 48 is a viewfinder similar to a conventional film camera, and 49 is a lens hood.

FIG. 12A shows the external appearance of the image pickup apparatus, which is provided with an image pickup light-receiving lens 47, a finder 48, and a lens hood 49, which are similar to those of a conventional film camera. Further, like the conventional film camera, a recording trigger switch 5 is provided on the left side of the upper surface in the drawing, and a connector 14 is attached to the right side surface of the drawing. Here, if the semiconductor memory 13 that is irremovably built in the device is used, the illustrated thickness D can be made extremely thin.

FIGS. 12B to 12E show an example in which the external device is a personal computer PC, and the image pickup device 46 is mounted on the personal computer PC. FIG. 12B shows the connector of the image pickup device 46. 14 is a personal computer PC
The figure shows the case of directly connecting to the internal socket.

FIG. 12C shows the connector 1 of the image pickup device 46.
4 shows an example in which 4 is connected to a personal computer PC via a socket 50 and a cable 51.

In FIG. 12D, the image pickup device 46 is attached to an adapter 52 having a built-in power supply circuit such as a known AC / DC converter for generating a DC voltage from an AC power supply, and the adapter 52 and the personal computer PC are connected. It is a thing. In this case, for example, while operating power is supplied from the operating power input terminal provided in the connector 14 to the image pickup device 46, an input / output signal of the connector 14 is supplied to an electric circuit installed inside the adapter 52, for example, an electric wiring or a signal buffer. It is connected to a personal computer PC via a circuit or the like. The adapter 52 may be a built-in known DC power source such as a dry battery, and in this case, the adapter 5
2 is exclusively configured to supply operating power, and the image pickup device 46
It can also be used together when used outdoors.

FIG. 12E shows an example in which the personal computer PC is connected to an adapter 53 having a mechanism similar to that of a well-known tabletop illuminator stand.
In this case, for example, by installing the image pickup device 46 inside the circle drawn by the fluorescent tubes of the round fluorescent lamps 54a and 54b, the subject illuminated by the fluorescent lamps 54a and 54b is imaged, and the image information thereof is obtained by a personal computer. It can be configured to transmit to a PC.

Here, the connector 14 shown in FIG.
In the operation of FIGS. 12B to 12E, the terminal position of FIG. 12 is defined with the device exterior surface on the side opposite to the direction of the incident light of the imaging light-receiving lens 47 as a reference. When the reference surface is attached to the adapter or the like, the incident light direction is not shielded and is opened, so that the image can be taken while being attached to the personal computer PC or the adapter.

[0148]

As described above, according to the present invention,
The image signal generated by the image pickup means is written in the memory means
Read it with an external device connected through the connector.
It is possible to issue a memory means by an external device.
When the image signal of is read and its read preparation
When in the state, the image signal generated by the image pickup means
Writing to the memory means is prohibited, so external devices
The contents of the image signal of the memory means for reading may change.
Absent.

Also, the image signal of the external device is stored in the memory means.
Memory for writing and updating the playback image on the monitor
It is possible to read out the image signal of the means, external device
When the image signal of
Image on the monitor when it is ready to write
Of the image signal from the memory means for updating
The monitor is stopped, so read it to update the playback image on the monitor.
The contents of the image signal of the memory means to be exposed do not change.
Yes.

[0150]

[Brief description of drawings]

FIG. 1 is a block diagram showing an embodiment of an image pickup apparatus according to the present invention.

FIG. 2 is a schematic diagram showing a FIFO type memory used in a conventional imaging device.

FIG. 3 is a timing diagram showing an operation of the semiconductor memory in FIG.

4 is a block diagram showing a specific example of a state detection circuit in FIG.

5 is a timing chart showing the signal transfer function with the external device of the embodiment shown in FIG. 1 and the operation of the state detection circuit shown in FIG.

FIG. 6 is a block diagram showing another specific example of the state detection circuit in FIG.

7 is a timing diagram showing an operation of the state detection circuit shown in FIG.

FIG. 8 is a timing chart showing an image reproducing operation of the embodiment shown in FIG.

FIG. 9 is a block diagram showing a main part of another embodiment of an imaging device according to the present invention.

10 is a block diagram showing a specific example of a state detection circuit in FIG.

11 is a block diagram showing another specific example of the state detection circuit in FIG.

FIG. 12 is a diagram showing an appearance of an embodiment of an image pickup apparatus according to the present invention and an example of use thereof.

[Explanation of symbols]

1 Image sensor 2 Timing generation circuit 4 power switch 5 Recording trigger switch 7 Timing generation circuit 10, 11, 11A, 11B switch 12, 13, 13A, 13B Semiconductor memory 14 connector 15,15A, 15B, 16 switch 17 Camera signal processing circuit 18 switch 19 encoder 20 output terminals 21 Image data compression processing circuit 22 Image data decompression processing circuit 23, 23A, 23B state detection circuit 24 Mating detection switch 25 External equipment 34 Status detection circuit 35 Selection signal generation circuit

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Manabu Wakabayashi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. Video Media Research Laboratory (56) Reference JP-A-2-159191 (JP, A) Kaihei 3-40577 (JP, A) JP 4-142182 (JP, A) JP 4-159884 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H04N 5 / 225,5 / 76-5/956

Claims (7)

(57) [Claims] 1. An imaging device capable of connecting an external device.
Te, a recording instruction unit, an imaging means for generating image signals from the optical image, a memory means for storing the image signal generated by the image pickup means
And a connector for connecting the external device, and controlling writing and reading of image signals in the memory means.
And control means, control means, the image signal from said memory means of the external device
A state detection means for detecting the read ready state of the signal,
The external device connected via the connector is the external device.
Stored in the memory means by a read command from the container
When the image signal is being read out and the status detecting hand
Of the image signal from the memory means of the external device
When the read ready state is detected, the recording instruction means
Even if operated, the image signal of the image signal generated by the imaging means is
An image pickup device characterized by controlling so that writing to the memory means is not performed . 2. The control means via the connector
With the external device connected, from the memory means
The image signal has not been read out to the external device.
When and when the state detection means causes the external device to
The readiness for reading the image signal from the memory means is detected.
If the recording instruction means is operated when there is no
Writing the image signal generated by the image means into said memory means
The control is performed so that only the
The imaging device according to 1. 3. The image signal stored in the memory means
A playback image that instructs to update the playback image on the monitor device to be displayed.
Image update instructing means, and the state detecting means is arranged to detect the image signal from the external device.
The control means detects the write preparation state to the memory means, and the control means is connected via the connector.
Image signals from external equipment are written to the memory means.
And the external device by the state detection means
The ready state for writing the image signal of the above into the memory means is detected.
When the reproduced image update instruction means is operated,
Also, the notes Me other updates of the reproduced image in the monitoring device
Control so that the image signal is not read from the recording means.
Imaging according to claim 1 or 2, characterized in that
apparatus. 4. An image pickup apparatus capable of connecting an external device.
And image pickup means for generating an image signal from the optical image , and memory means for storing the image signal generated by the image pickup means
And a monitor device for displaying the image signal stored in the memory means.
Image update instructing means for instructing to update the playback image
And a connector for connecting the external device, and controlling writing and reading of image signals in the memory means.
And a control means, said control means, said memory hand image signal from the external device
Has state detection means for detecting the state of preparation for writing to the stage
The image from the external device connected via the connector.
And when the image signal is being written to the memory means.
The memo of the image signal from the external device is detected by the state detecting means.
When the state of writing preparation to the recording medium is detected,
Even if the image update instruction means is operated,
Reading the image signal from the memory means for updating the raw image
Shooting characterized by controlling not to put out
Image device. 5. The control means via the connector
With the external device connected,
When and before the image signal is not written to the memory means
By the state detection means of the image signal from the external device
When the ready state for writing to the memory means is not detected
When the reproduction image update instruction means is operated,
The image signal is read from the memory means and
It is specially controlled to update the playback image of
The imaging device according to claim 3 or 4, which is a characteristic. 6. The image signal generated by the image pickup means is recorded.
Other memory means to be remembered and the image signal stored in the other memory means is compressed and compressed.
Compression means for generating an image signal , wherein the memory means stores the compressed image signal from the compression means.
The image signal read from the memory means by the external device is
The compressed image signal is a compressed image signal.
The image pickup apparatus according to claim 1. 7. The image signal generated by the image pickup means is recorded.
Other memory means to be remembered and the image signal stored in the other memory means is compressed and compressed.
A compression unit for generating an image signal, and an expansion unit for expanding the compressed image signal stored in the memory device.
And a long section, wherein the memory means stores the compressed image signals from said compression means
However , the reproduction image update instruction means is expanded by the expansion means.
A renewal image renewal instruction of the monitor device for displaying an image signal
The image signal written from the external device to the memory means is
The compressed image signal is a compressed image signal.
The image pickup apparatus according to claim 1.