JP3482819B2 - Plating method for resin material surface - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to a truck FT.
IMC (In-mold-co) used for LID, bathtub, etc.
The present invention relates to a method for plating a molded product of a sheet molding compound (hereinafter referred to as SMC) having an ating) applied on its surface.

[0002]

2. Description of the Related Art Conventionally, FT. The plating method such as LID is performed on a compression molded SMC molded product whose surface is coated with IMC that can be plated in a mold in the SMC molding process.

For example, FIG. 8 shows an FT. LID1
It is a plan view of the back half and the outer peripheral flange portion 2 has
As shown in FIG. 9, a molded product of SMC4 having a thickness of about 3 to 6 mm, on the surface of which IMC3 having a thickness of about 100 μm is applied, is used. The plating IMC processing technology is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-286008, and the SMC molding method is disclosed in, for example, Japanese Patent Application Laid-Open No. 2-258319, and therefore will not be described in detail here. . The FT. In the LID, burrs 5 of SMC and IMC are generated at the ends of the outer peripheral flange portion 2, but the burrs 5 are currently removed with a paper file.

This point will be described in more detail with reference to FIG. 10. The surface of the above-mentioned molded product can be plated with IM.
Although C3 is applied, the material surface of SMC4 is exposed on the back surface of the molded product. Since plating does not adhere to the SMC 4, a blooming problem due to the sag of the burr 5 occurs. Generally, fine anchor-shaped holes are formed on the surface of the IMC 3 by a chemical etching liquid applied as a pretreatment of the plating treatment. After that, electroless copper or nickel is deposited by chemical plating so that the surface becomes conductive,
After that, electroplating is performed. At this time, the plated metal bites into the anchor-shaped hole, which enables plating with good adhesion.

However, since SMC4 does not form fine anchor-shaped holes due to the etching solution used for plating, electroless copper or nickel can be removed by chemical plating from SMC4.
Can't bite into Since this non-biting surface is not energized, electroplating does not adhere. When the molded product in which the burr 5 is generated on the SMC 3 is plated, the plating layer 6 is formed on the IMC 3 portion of the surface.
The plating layer stops at the end portion of the MC3, electricity is intensively flowed to the end portion, and the plating metal rises and adheres to the burr 5. This is usually called "Hanasaki".

As shown in FIG. 10, the plated FT. L
If this flower blooms on the outer periphery of the back surface of ID1, there is a risk of injury during handling, which is a safety concern. Therefore, as shown in FIG. 12, a paint 7 that can be plated is applied to the entire back surface to prevent flowering. At this time, in order to prevent dust applied by spray coating from reaching the surface of the IMC 3, as shown in FIG. 11, a means for masking the surface of the IMC 3 with paper 8 and tape 9 is adopted.

However, FT. In the case of LID1, it is necessary to mask all the outer peripheral flange portion 2 and all the flange portions of the holes of the air intake portion 10, so that there is a problem that a large number of man-hours are required. As the masking means, a means for degreasing the entire back surface with isopropyl alcohol or the like and then applying a paint capable of plating to a thickness of 30 μm is adopted. As such a paint that can be plated, for example, a blend of an ABS resin paint and a urethane paint is used.

When the spray 11 is applied as shown in FIG. 11 without performing the above masking, it is necessary to wipe the dust around the IMC 3 surface with a thinner. I
This is because if plating is performed with dust left on the MC3 surface, the plating appearance will deteriorate. Then, after setting at room temperature, the paint is baked. When masking is performed with a blend of the ABS resin-based paint and the urethane-based paint, the plating process is performed under the same plating process conditions as the plastic ABS resin, as shown in FIG. The finished plated product by the conventional method thus completed is as shown in FIG.

However, according to such a conventional method, as shown in FIG. 13, the number of man-hours for spray-coating the platable paint 7 on the entire back surface is large, and if the subsequent baking process is included, the man-hours are further increased. In addition to this, considering the number of man-hours for surface masking to prevent dust in spray painting and the man-hours for wiping off dust,
The number of tasks will be enormous. In particular, FT. LID
As shown in FIG. 8, the rear surface of No. 1 has ribs 12 running in the vertical and horizontal directions to improve the rigidity, which requires a lot of degreasing work before coating, which requires a lot of time and labor. There is also the problem of large usage. By the way, without adopting the means of backside coating, if the backside is plated without coating with a paint that can be plated, burr-like flower blooms of the plated metal occur on the end faces of the front and back sides as described above, Flower bloom removal work is required.

[0010]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art.
An object of the present invention is to provide a plating method for plating an SMC molded product having MC applied on the surface thereof, in which "flower bloom" due to burrs or the like does not occur between the IMC portion on the front surface and the SMC on the back surface. Then, by reducing the number of man-hours required conventionally, the rationalization of the plating method is realized.

[0011]

As a means for achieving the above object, according to an aspect of the plating method of the resin material surface according to the present invention, meet method plateable IMC is plated resin material surface that has been subjected to the surface Te, and wherein the benzalkonium set the Mekkibari position occurring at the boundary between the back side which is not plated at a specific position of the back side.

According to the method of plating the surface of the resin material according to the present invention, after the IMC is applied , the flux is removed from the surface subjected to the IMC.
Reinforcing ribs provided on the back surface of the resin material via the flange
The feature is that it is possible to plate up to. Furthermore
The reinforcing ribs on the back of the resin material are flanges.
The distance from the part is 10 mm or less.

[0013]

DETAILED DESCRIPTION OF THE INVENTION

(Outline of Examples) The basis of the technique of the present invention is to identify the flowering position and reduce the number of preparation steps before the plating process by using IM.
A paint 7 that can be plated only on the flange portion 2 that contacts the end faces of the C3 treated front surface and the IMC non-treated SMC4 rear surface.
Partial coating by means of the spray 11 shown in FIG. 1 (Example 1), the brush shown in FIG. 2 and the roller 13 (Example 2),
And partial coating with the sponge 14 shown in FIGS. 3 to 5 (Example 3), and sticking the conductive adhesive tape 15 to the flange portion 2 shown in FIG. 6 (Example 4). Is.

In addition, as an additional technique for avoiding the problems associated with the blooming of flowers in the above-mentioned coating means and pasting means, after the completion of plating, a cover 16 made of rubber or plastic is attached to the end face as shown in FIG. Attaching (Example 5), or as shown in FIG. 2, the distance between the rib 13 adjacent to the flange portion 2 is set to 10 mm or less so that fingers do not enter the flowering portion (Example 6). Etc. are provided.

(Common Items of Embodiments) Next, concrete embodiments of the present invention will be described. The target is FT.
IMC3 processed SMC4 shown in FIG. 9 which constitutes LID
The flange portion 2 which is the end face of the front surface of the SMC4 and the back surface of the SMC4 without the IMC3 treatment, and this point will be described as common to all the examples.

(Embodiment 1) Embodiment 1 is based on partial coating using the spray 11. As shown in FIG. 1, the end surface 2a is coated with the spray 11. In this case, prior to painting, it is necessary to mask the surface of the IMC 3 with a paper 8 such as newspaper in the same manner as in the past. In addition, a masking jig 17 for preventing dust, which is made of a material that does not melt by coating, such as steel, is arranged on the back surface. In FIG. 1, the edge of the paper 8 is fixed to the surface of the IMC 3 by using the masking tape 9. According to the first embodiment, by setting the flower bloom at the specific position 18 (see FIG. 1) distant from the end surface 2a on the back surface side, it is possible to avoid the trouble associated with the flower bloom. Moreover, since the coating area is reduced, the number of coating steps and degreasing steps can be reduced, and the amount of paint used can be reduced.

(Example 2) Example 2 is based on partial coating using a brush and roller 13. As shown in FIG. 2, sponge roller 13 is used.
After soaking the paint in the area, roll the head of the flange 2. Bite into the flange portion 2 rollers 1 3 for the sponge, the flange vertical wall portion 2b just as much as he bites also be coated with paint. In this case, masking of the IMC3 surface is unnecessary. However, when the paint applied to the flange portion 2 drips, it is necessary to wipe off the dripping portion. According to the second embodiment, by setting the flower bloom at the specific position 18 (see FIG. 2) on the back surface side distant from the end face 2a, it is possible to avoid the trouble associated with the flower bloom, and also the IMC.
In addition to the effect of the first embodiment, the masking of the front surface and the back surface is unnecessary by partially coating the resin material on the front surface of the back surface to a specific position.

(Example 3) Example 3 is a partial coating using a sponge 14, and as shown in FIGS.
The sponge fixing frame 19 having a U-shaped cross section is provided with a sponge 14 having a U-shaped cross section, which is sufficiently filled with a paint that can be plated. FT. Insert the flange portion 2 of the LID. Then, the paint is applied to the portion where the sponge 14 and the flange portion 2 are in contact with each other. In this case, the paint applied to the flange portion 2 does not drip on the surface. Therefore, the wiping work becomes unnecessary. Then, also in the third embodiment, by setting the flower bloom at the specific position 18 (see FIG. 5) on the back surface side away from the end face, it is possible to avoid the trouble associated with the flower bloom. Further, in addition to the effect of the first embodiment, painting is not necessary, so that the work can be greatly simplified.

(Embodiment 4) In Embodiment 4, instead of partial coating, a means for attaching a conductive adhesive tape 15 to the flange portion 2 as shown in FIG. 6 is adopted. According to the fourth embodiment as well, the flower bloom can be set at the specific position 18 (see FIG. 6) on the back surface. Also, according to the fourth embodiment, the painting is not necessary, and therefore the coating man-hours and the baking man-hours are required. Is unnecessary, the consumption of paint is small, and masking work on the front and back surfaces is unnecessary. As a matter of course, no dripping of paint occurs.

(Embodiment 5) Embodiment 5 is an embodiment of an additional invention in which a flower blooms at a specific position 18 in Embodiments 1 to 4. As already mentioned, Examples 1 to 1
Also in No. 4, flower bloom occurs at the specific position 18 on the back surface side away from the end surface 2a. This position is not a conspicuous position and is a position that is less likely to be touched by the human hand, so that it may be left as it is, that is, as it is in bloom, but the present example further covers the blooming part. It is a thing. That is, as shown in FIG. 7, the outer surface of the plating layer 6 on the end face 2a is covered with a cover 16 made of rubber or plastic after the completion of plating. According to the fifth embodiment, the flowering part can be completely covered by the cover 16, and the flowering problem can be solved without performing work such as removing burrs.

(Embodiment 6) Like Embodiment 5, Embodiment 6 is a means for substantially eliminating the problem of flower blooming in Embodiments 1 to 4, and as shown in FIG. The position of the rib 12 close to the portion 2 is changed from the flange portion 2 to 1
0 mm or less, and the flowering part is the flange 2 and the rib 1
It is set between the two bases, and by preventing the fingers from entering the flowering part, the flowering defect will not substantially occur. (Others) Although Examples 1 to 6 have been described above, the present invention is not limited to these means.

[0022]

The present invention has the following effects due to the above configuration. 1. According to the present invention, by providing the means for setting the plating burr position to the specific position on the back surface of the resin material, it is possible to substantially avoid the troubles associated with flower bloom. 2. According to the present invention, when identifying the plating burr position,
Between the flange and the reinforcing rib on the back of the resin material.
By doing so, the base of the rib is less likely to be touched by humans
Since it is a position, special work such as deletion against Bali
You can effectively solve the flowering problem without doing any work.
You can 4. Furthermore, the distance between the flange and the rib is 10 mm or less.
By doing so, the finger does not get into the flowering part.

[0023]

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a method according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a method according to a second embodiment of the present invention.

FIG. 3 is an explanatory diagram of a first stage of the method according to the third embodiment of the present invention.

FIG. 4 is an explanatory diagram of a second stage of the method according to the third embodiment of the present invention.

FIG. 5 is an explanatory diagram of a third stage of the method of Example 3 according to the present invention.

FIG. 6 is an explanatory diagram of a method of Example 4 according to the present invention.

FIG. 7 is an explanatory diagram of a method of Example 5 according to the present invention.

FIG. 8 is an FT. The top view of the LID back half.

9 is a cross-sectional view taken along the line AA of FIG.

10 is a corresponding cross-sectional view of the AA cross-section of FIG. 8 showing the prior art method.

FIG. 11 is an explanatory diagram of a method according to the related art.

FIG. 12 is a cross-sectional view of a coated product obtained by a conventional technique.

FIG. 13 is a flowchart of a conventional plating method.

FIG. 14 is a cross-sectional view of a flange portion of a plated finished product according to a conventional technique.

[Explanation of symbols]

1 (of the truck) FT. LID 2 (outer periphery) flange 2a end face 2b Flange vertical wall 3 IMC (In-mold-coating) 4 SMC (Sheet molding compound) 5 Bali (flower bloom) 6 plating (layer) 7 Platable paint 8 paper 9 (Masking) tape 10 Air intake hole 11 spray 12 ribs 13 brushes and rollers 14 Sponge 15 Conductive adhesive tape 16 covers 17 Masking jig 18 Specific position (becomes a burr position) 19 Sponge fixed frame

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fumio Odaka, 1823, 2023 Endo, Fujisawa, Kanagawa Prefecture Isuzu Motors Limited, Shonan Development Center (72) Inventor, Shigeru Matsuki 18, 1823, Endo, Fujisawa, Kanagawa Prefecture Isuzu Automobile Co., Ltd. Shonan Development Center (56) References JP-A-6-322580 (JP, A) JP-A-5-177654 (JP, A) Actual development Sho-60-20566 (JP, U) (58) Field (Int.Cl. ⁷ , DB name) C25D 5/56

Claims (2)

(57) [Claims] 1. A surface is provided with a plateable IMC and an edge is formed.
Proximity to the flange that extends from the surface to the back and the end face flange
And resin material table with reinforcing ribs provided on the back side
In the method of plating the surface, IMC on the surface of the resin material
After applying, including the flange portion from the surface IMC
By making it possible to plate between the flange and rib
Of the resin material that is not plated.
Setting the crimp position between the flange portion and the rib
A method for plating a surface of a resin material, which is characterized in that 2. The distance between the flange portion and the rib is
The method for plating a surface of a resin material according to claim 1, wherein the plating method is 10 mm or less .