JPH111794A - Plating method of surface of resin material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of the defect accompanied by burrs or the like between the in-mold coating(IMC) part in the surface and the sheet- molding compact(SMC) part in the back surface by applying the setting means setting the plating burr position generating in the boundary with the back surface not plated in the specified position of the back surface side. SOLUTION: In order to specify a spangle position and reduce the preparing man-hour before the plating treatment, only the flange part 2 equivalent to the end surface of the surface treated with IMC 3 and the back surface treated with SMC 4 without the IMC treatment is partially coated with the coating material 7 capable of coating, i.e., the end surface 2a is coated with a spray 11. In this case, the surface of IMC 3 is masked with a sheet of paper 8 before coating, and the masking jig 17 for preventing dust consisting of the steel or the like not dissolved with coating is arranged in the back surface. According to this constitution, the defect accompanied by the spangle is avoided and the coating area is reduced by setting the spangle in the specified position 18 apart from the end surface 2a of the back surface side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an FT.
IMC (In-mold-co) used for LID, bathtub etc.
The present invention relates to a method for plating a molded product of a sheet molding compound (hereinafter, referred to as SMC) having a surface subjected to ating).

[0002]

2. Description of the Related Art Conventionally, FT. In the SMC molding process, the plating method such as LID is performed on a molded product of SMC having a surface coated with IMC that can be plated in a metal mold and compression-molded.

[0003] For example, FIG. LID1
FIG. 3 is a plan view of the back half, and the outer peripheral flange portion 2 includes:
As shown in FIG. 9, a molded product of SMC4 having a thickness of about 3 to 6 mm with IMC3 having a thickness of about 100 μm applied to the surface is used. The plating technique of the IMC is disclosed in, for example, JP-A-6-286008, and the SMC molding method is disclosed in, for example, JP-A-2-258319, and will not be described in detail here. . The FT. In the LID, burrs 5 of SMC and IMC are generated at the end of the outer peripheral flange portion 2, and the burrs 5 are currently removed with a paper file.

[0004] This point will be described in more detail with reference to FIG. 10.
C3 is applied, but the material surface of SMC4 is exposed on the back surface of the molded product. Since plating does not adhere to the SMC 4, a flowering problem caused by sagging of the burr 5 occurs. Generally, fine anchor-shaped holes are formed on the surface of the IMC 3 by a chemical etching solution applied as a process before the plating process. After that, electroless copper or nickel is deposited by chemical plating in the form of biting, and the surface is made conductive,
Thereafter, electroplating is performed. At this time, the plating metal penetrates into the anchor-shaped holes, so that plating with good adhesion can be performed.

However, since SMC4 does not form fine anchor-shaped holes due to an etching solution for plating, electroless copper or nickel is deposited on the SMC4 by chemical plating.
Does not bite into Since the non-biting surface is not energized, electroplating does not adhere. When the molded product in which burrs 5 are generated on the SMC 3 is plated, the plating layer 6 is formed on the IMC 3 portion on the surface.
The plating layer stops at the terminal portion of the MC3, electricity flows intensively to the terminal portion, and the plating metal rises and adheres in a burr 5 shape. This is usually called "flower bloom".

[0006] As shown in FIG. L
If this flower blooms on the outer peripheral portion of the back surface of ID1, there is a risk of injury during handling, which is a safety problem. Therefore, as shown in FIG. 12, the entire back surface is coated with a paint 7 that can be plated to prevent flowering. At this time, in order to prevent the dust of the spray application from reaching the surface of the IMC 3, a means for masking the surface of the IMC 3 with a paper 8 and a tape 9 as shown in FIG.

However, FT. In the case of LID1, since it is necessary to mask all the outer peripheral flange portions 2 and all the flange portions of the holes of the air intake portion 10, there is a problem that many man-hours are required. As the masking means, a means is employed in which the entire back surface is degreased with isopropyl alcohol or the like, and then a paint capable of being plated with a thickness of 30 μm is applied. As such a paint that can be plated, for example, a blend of an ABS resin paint and a urethane paint is used.

When the above-described masking is not performed and the spray 11 is applied as shown in FIG. 11, it is necessary to wipe off dust that has passed to the IMC 3 surface with a thinner. I
This is because if plating is performed with dust remaining on the MC3 surface, the plating appearance will deteriorate. After setting at room temperature, the paint is baked. When masking is performed by blending the above ABS resin paint and urethane paint, as shown in FIG. 12, plating is performed under the same plating conditions as plastic ABS resin. FIG. 14 shows a finished product of the plating method according to the conventional method.

However, according to such a conventional method, as shown in FIG. 13, a large number of steps are required for spray-coating the paint 7 which can be plated on the entire back surface. More, in addition, considering the man-hour of surface masking to prevent dust in spray painting, and the man-hour of dust wiping work,
The number of such tasks is enormous. In particular, FT. LID
As shown in FIG. 8, ribs 12 run lengthwise and crosswise to improve the rigidity of the back surface of the base 1, so that a large number of degreasing steps are required before coating, which requires not only a great deal of labor but also a large amount of paint. There is also a problem that the amount used is large. By the way, without using the means of painting the backside, when plating without painting the backside with a paint that can be plated, burr-like flowering of the plated metal occurs on the end surface of the front surface and the back surface as described above, It is necessary to remove the flowers.

[0010]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art.
It is an object of the present invention to provide a plating method for plating an SMC molded product having MC on its front surface without causing "flower bloom" due to burrs or the like between the IMC portion on the front surface and the SMC on the rear surface. Another object of the present invention is to realize a rationalization of the plating method by greatly reducing the man-hour required in the past.

[0011]

According to a first aspect of the present invention, there is provided a method for plating a resin material surface, comprising the steps of: And a setting means for setting a plating burr position generated at a boundary with a back surface not to be plated to a specific position on the back surface side. The method of plating a resin material surface according to claim 2, wherein
As a setting means, after applying the IMC to the front surface, a paint that can be plated from the IMC surface to a specific position on the rear surface side is applied.

According to a third aspect of the present invention, there is provided the resin material surface plating method according to the first aspect, wherein
After applying the MC, a conductive tape is attached from the IMC surface to a specific position on the back surface side. According to a fourth aspect of the present invention, there is provided a method for plating a surface of a resin material according to the first aspect, wherein an end face between the resin material surface and the back surface of the resin material after plating is covered. According to a fifth aspect of the present invention, there is provided a method for plating a surface of a resin material according to any one of the first to fourth aspects, wherein a specific position of the method for plating a surface of the resin material is a reinforcing rib provided on a back surface of the resin material. And a base.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

(Summary of the Embodiment) The technology of the present invention is based on an IM method as a means for specifying a flowering position and reducing the number of preparation steps before plating.
A paint 7 that can be plated only on the flange portion 2 corresponding to the end surface of the front surface subjected to C3 treatment and the back surface of SMC4 not subjected to IMC treatment
, And the method of this partial coating includes partial coating with a spray 11 shown in FIG. 1 (Example 1), brush shown in FIG. 2, partial coating with a roller 13 (Example 2),
And a method of applying partial coating with a sponge 14 shown in FIGS. 3 to 5 (Example 3) and attaching a conductive adhesive tape 15 to the flange portion 2 shown in FIG. 6 (Example 4). It is.

In the above-mentioned coating means and sticking means, as an additional technique for avoiding the problem associated with the occurrence of flowering, after plating is completed, a rubber or plastic cover 16 is provided on the end face as shown in FIG. 2 (Example 5) or, as shown in FIG. 2, the distance between the rib 13 and the flange 13 adjacent to the flange 2 is set to 10 mm or less so that a finger does not enter the flowering portion (Example 6). Etc. are provided.

Next, specific embodiments of the present invention will be described. The implementation target is FT.
IMC3 processed SMC4 shown in FIG. 9 that constitutes LID
The flange portion 2 is an end surface between the front surface of the SMC4 and the back surface of the SMC4 without the IMC3 treatment.

(Embodiment 1) In Embodiment 1, the end face 2a is coated by the spray 11 as shown in FIG. In this case, it is necessary to mask the surface of the IMC 3 using the paper 8 such as newspaper before the painting as before. In addition, a masking jig 17 made of a material that does not dissolve by painting and made of, for example, steel for preventing dust is disposed on the back surface. In FIG. 1, the edge of the paper 8 is fixed to the surface of the IMC 3 using a masking tape 9. According to the first embodiment, by setting the flower bloom at the specific position 18 (see FIG. 1) distant from the end surface 2a on the back side, it is possible to avoid the trouble associated with the flower bloom. In addition, since the painting area is reduced, the number of painting steps and degreasing steps can be reduced, and the amount of paint used can be reduced.

(Embodiment 2) The embodiment 2 is based on a partial coating using a brush and a roller 13, and as shown in FIG. Roll your head. Because of the sponge, the flange portion 2 bites into the roller 12, and the flange vertical wall portion 2b is also coated with paint by the amount of the bite. in this case,
No masking of the IMC3 surface is required. However, when the paint applied to the flange portion 2 drips, it is necessary to wipe the dripping portion. According to the second embodiment, the flower bloom is located at the specific position 18 (see FIG. 2) on the back surface away from the end surface 2a.
(See FIG. 1), it is possible to avoid the trouble associated with the occurrence of flowering, and it is also possible to partially coat a specific position on the back surface of the resin material on which IMC has been applied to the front surface, thereby obtaining the first embodiment.
In addition to the effect described above, masking of the front and back surfaces is not required.

(Embodiment 3) Embodiment 3 is based on partial coating using a sponge 14, and as shown in FIGS.
A sponge 14 also having a U-shaped cross section, which is sufficiently filled with a paint that can be plated into a sponge fixing frame 19 having a U-shaped cross section, is installed. FT. Insert the flange 2 of the LID. Thereafter, a paint is applied to a portion where the sponge 14 and the flange portion 2 touch. In this case, the paint applied to the flange portion 2 does not drip on the surface. Therefore, a wiping operation is not required. According to the third embodiment as well, the flowering can be avoided at the specific position 18 (see FIG. 5) on the back surface away from the end surface, thereby avoiding the trouble associated with the flowering. Further, in addition to the effects of the first embodiment, since painting is not required, the operation can be greatly simplified.

(Embodiment 4) Embodiment 4 employs means for attaching a conductive adhesive tape 15 to the flange portion 2 as shown in FIG. 6 instead of partial coating. According to the fourth embodiment, the flowering can be set at the specific position 18 (see FIG. 6) on the back surface. Also, according to the fourth embodiment, the painting is unnecessary, so that the number of coating steps and the number of baking steps are reduced. Is unnecessary, the consumption of paint is reduced, and the masking work on the front and back surfaces is not required. Naturally, there is no occurrence of paint dripping.

(Embodiment 5) Embodiment 5 is an embodiment of an additional invention in which a flower blooms at a specific position 18 in Embodiments 1 to 4. As already described, Examples 1 to
Also in 4, the flower blooms occur at a specific position 18 on the back side away from the end face 2a. This position is not a prominent position, and it is a position that is hardly touched by a person, so that it may be left as it is, that is, it may be flowering, but this embodiment further covers the flowering part. Things. That is, as shown in FIG. 7, the outer surface of the plating layer 6 on the end face 2a is covered with a rubber or plastic cover 16 after plating is completed. According to the fifth embodiment, the flowering portion can be completely covered with the cover 16, and the flowering problem can be solved without performing operations such as removing burrs.

(Embodiment 6) Embodiment 6 is a means for substantially eliminating the problem of occurrence of flowering in Embodiments 1 to 4, as in Embodiment 5, as shown in FIG. The position of the rib 12 close to the part 2 is 1
0 mm or less.
This is set between the two bases, and by preventing the finger from entering the flower blooming portion, the trouble of flower bloom substantially does not occur. (Others) Examples 1 to 6 have been described above, but the present invention is not limited to these means.

[0022]

According to the present invention, the following effects can be obtained by the above configuration. 1. According to the first aspect of the present invention, by providing a means for setting the plating burr position to a specific position on the back surface of the resin material, it is possible to substantially avoid the problem associated with flowering. 2. According to the second aspect of the present invention, in addition to the effect of the first aspect, the plating possible paint is applied to a specific position on the back surface of the resin material on which the IMC is applied on the front surface.
By reducing the painting area and the number of painting and degreasing steps,
The amount of paint used can be reduced. Further, by using a brush roller or a sponge as the coating means, masking of the front surface and the back surface becomes unnecessary.

3. According to the third aspect of the present invention, by adopting a conductive tape attaching means as the burr position setting means, in addition to the effect achieved by the first aspect of the present invention, painting becomes unnecessary, so that Work can be greatly simplified. 4. According to the invention described in claim 4, by covering the end surface between the front surface and the back surface of the resin material after plating,
In addition to the effect of the first aspect of the present invention, since the burr is covered with the cover, the problem of the burr can be completely eliminated without removing the burr. 5. According to the fifth aspect of the present invention, in order to specify the plating burr position, by using the base of the reinforcing rib provided on the back surface of the resin material, in addition to the effects of the first to fourth aspects, Since the base of the rib is located at a position where human hands are less likely to touch, it is possible to substantially solve the problem of flower blooming without performing extra work such as removing burrs.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a method according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a method according to a second embodiment of the present invention.

FIG. 3 is an explanatory view of a first stage of the method according to the third embodiment of the present invention.

FIG. 4 is an explanatory view of a second step of the method according to the third embodiment of the present invention.

FIG. 5 is an explanatory view of a third step of the method according to the third embodiment of the present invention.

FIG. 6 is an explanatory diagram of a method according to a fourth embodiment of the present invention.

FIG. 7 is an explanatory view of a method according to a fifth embodiment of the present invention.

FIG. 8 shows an FT. FIG. 4 is a plan view of a half of the LID back surface.

FIG. 9 is a cross-sectional view taken along line AA of FIG. 8;

10 shows a method according to the prior art and is a sectional view corresponding to the section AA in FIG. 8;

FIG. 11 is an explanatory diagram of a method according to the related art.

FIG. 12 is a cross-sectional view of a coated product obtained by a conventional technique.

FIG. 13 is a flowchart of a conventional plating method.

FIG. 14 is a cross-sectional view of a flange portion of a finished plated product according to the prior art.

[Explanation of symbols]

 1 FT. LID 2 (outer circumference) flange portion 2a end surface 2b flange vertical wall portion 3 IMC (In-mold-coating) 4 SMC (sheet molding compound) 5 Burr (flower bloom) 6 Plating (layer) 7 Plating paint 8 Paper 9 ( Masking) tape 10 air intake hole 11 spray 12 rib 13 brush, roller 14 sponge 15 conductive adhesive tape 16 cover 17 masking jig 18 specific position (burr position) 19 sponge fixing frame

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shigeru Matsuki 2023 Endo, Fujisawa City, Kanagawa Prefecture 18 Isuzu Motors Corporation Shonan Development Center

Claims (5)

[Claims] 1. A method for plating a surface of a resin material having a plated IMC on its surface, wherein setting means is provided for setting a plating burr position generated at a boundary with a non-plated back surface at a specific position on the back surface side. A plating method for a resin material surface. 2. The method of plating a resin material surface according to claim 1, wherein as the setting means, after applying the IMC to the front surface, a paint that can be plated from the IMC surface to a specific position on the back surface is applied. 3. After performing IMC as setting means,
2. The method according to claim 1, wherein a conductive tape is applied from the IMC surface to a specific position on the back surface. 4. The method for plating a surface of a resin material according to claim 1, wherein an end surface between the front surface and the back surface of the resin material after plating is covered. 5. The method according to claim 1, wherein the specific position is a base of a reinforcing rib provided on a back surface of the resin material.