JP3473411B2 - Substrate carrier and chip bonding method using substrate carrier - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate carrier for holding a substrate having an electrode protruding from the lower surface thereof, and a chip bonding method using the substrate carrier.

[0002]

2. Description of the Related Art SAW (Sound Acoustic Wave) is a type of substrate on which a semiconductor chip is mounted.
e) There is a package such as a filter package having a thin gold electrode protruding from the lower surface. Since this SAW filter package is small and handled individually, it is difficult to handle during the manufacturing process, and operations such as transportation and chip bonding are performed while being held by a dedicated carrier. A conventional SAW filter package carrier and chip bonding using this carrier will be described below with reference to the drawings. FIG. 5A shows a conventional S
Plan view of carrier for AW filter package, FIG.
(B) is sectional drawing of the same carrier for SAW filter packages.

In FIGS. 5A and 5B, a SAW filter package 2 is attached to a carrier 1 which is a metal plate member.
The concave portion 1a corresponding to the external dimensions of the SAW package 2 is mounted in the concave portion 1a. SA
Recesses for mounting a chip are formed on the upper surface of the W package 2, and electrodes 2a for external connection are formed on four corners of the lower surface. In the step of mounting the chip on the SAW package 2, the SAW package 2 is transported while being mounted on the carrier 1 to mount the chip. At the time of mounting, the SAW package 2 is fixed to the carrier 1 by vacuum suction through a suction hole 3 provided on the bottom surface of the recess 1a.

[0004]

However, as shown in FIG.
As shown in (b), since the suction hole 3 has the electrode 2a, S
The AW package 2 did not come into close contact with the lower surface of the AW package 2, and a leak occurred during vacuum suction, making it difficult to stably hold the SAW package 2. And since a large amount of air was sucked against this leak, the heat at the time of thermocompression bonding was taken away by this air, and accurate thermocompression bonding temperature management according to the heating pattern required for good thermocompression bonding was achieved. It was difficult.

The electrode 2a on the lower surface of the SAW package 2
Since the heights of the chips vary, the levelness of the mounting surface is not guaranteed, and it is difficult to perform uniform pressing when the chip is pressed against the mounting surface and pressure-bonded by ultrasonic vibration. As described above, in mounting a chip using a conventional carrier for a SAW package, it is difficult to maintain good thermocompression bonding temperature and accuracy during pressing, and it is difficult to perform bonding with stable quality. There was a problem.

Therefore, an object of the present invention is to provide a substrate carrier capable of ensuring stable bonding quality and a chip bonding method using the substrate carrier.

[0007]

A carrier for a substrate according to claim 1 is a carrier for a substrate which holds a substrate having an electrode protruding from a lower surface thereof, wherein a hole is formed corresponding to the electrode. A lower plate; and an upper plate having a clamp means for elastically clamping the side surface of the substrate, wherein the electrode fits in the hole while the substrate is clamped by the upper plate, and the substrate The lower surface of the is abutted against the plane surrounded by the hole and is received underneath.

According to a second aspect of the present invention, there is provided a chip bonding method for bonding a chip to a substrate having an electrode protruding from a lower surface thereof, the lower plate having a hole corresponding to the electrode. And holding the substrate in a substrate carrier comprising an upper plate having a clamping means for elastically clamping the side surface of the substrate, fitting the electrodes into the holes, and the lower surface of the substrate having the holes. In a state of being abutted against a plane surrounded by, the chip is mounted on a substrate and ultrasonic vibration is applied while pressing the chip with a bonding head, and through the surface received a The substrate was heated.

According to the invention described in each claim, a carrier for a substrate is used, which comprises a lower plate having holes formed corresponding to electrodes and an upper plate provided with a clamping means for elastically clamping the side surface of the substrate. As a result, the levelness of the substrate can be secured, the heating efficiency can be improved, and stable bonding quality can be secured.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a carrier according to an embodiment of the present invention, FIGS. 2 (a) and 2 (b) are plan views of the carrier, FIGS. 3 (a), 3 (b) and 3 (c), and FIG. 4 are the same. It is process explanatory drawing of a bonding method.

First, a carrier for a SAW package will be described with reference to FIGS. In FIG. 1, the carrier 10 includes a lower plate 11 and an upper plate 12.
It is made by stacking plates and joining them by spot welding. The carrier 10 is for mounting and holding the SAW package 2 as shown in FIG. 1, and the lower plate 11 has a plurality of electrodes corresponding to the arrangement of the gold electrodes 2 a formed on the lower surface of the SAW package 2. A hole 11a is provided (see FIG. 2 (b)).

As shown in FIG. 2A, the upper plate 1
2 has a rectangular opening 12a. Opening 1
A bridge portion 13 is provided diagonally across 2a, and in a state where the SAW package 2 is held, a cutout portion 14a provided in a central overhang portion 14 of the bridge portion 13 is provided.
And the SAW package 2 is clamped by sandwiching the SAW package 2 between the two edges a and b of the opening 12a. Hereinafter, this clamping method will be described.

When a pin is inserted into the pin hole 15 of the bridge portion 13 and moved in the arrow c direction, the bridge portion 13 is elastically deformed and displaced in the arrow c direction. In this state, the SAW package is placed between the notch 14a and the edges a and b on the two sides, and then the pin is removed from the pin hole 15, so that the bridge portion 13 returns to the direction opposite to the arrow c direction. As a result, the SAW package 2 is elastically clamped and held by the upper plate 12. That is, the opening 12
The a, the bridge portion 13, and the cutout portion 14a serve as a clamping means for elastically clamping the SAW package 2.
When the SAW package 2 is clamped, the electrode 2
a is fitted in the hole 11a, and the lower surface of the SAW package 2 is abutted against and received by the plane surrounded by the hole 11a of the lower plate 11.

Next, referring to FIGS. 3 and 4, the carrier 10
A chip bonding method using is explained.
This bonding method uses the S held on the carrier 10.
The chip is ultrasonically thermocompression bonded to the AW package 2. First, as shown in FIG. 3A, with the pin 17 inserted in the pin hole 15 and slightly moved in the direction of the arrow, S
The AW package 2 is mounted on the carrier 10. As a result, the SAW package 2 is placed on the lower plate 11, the electrodes 2a are fitted in the holes 11, and the lower surface of the SAW package 2 is received by the upper surface of the lower plate 11.
Then, by removing the pin 17, the bridge portion 13
Returns in the direction of the arrow, whereby the SAW package 2 is clamped and held by the carrier 10.

Next, the carrier 10 holding the SAW package 2 is sent to the chip bonding process. Figure 3
As shown in (c), the carrier 10 is mounted on a stage 18 equipped with a heater 22, is held by a bonding head 19, and has a chip 21 having bumps 21 (FIG. 4).
0 is bonded onto the SAW package 2. In this bonding step, the chip 20 is pressed against the SAW package 2 by the bonding head 19 as shown in FIG. 4, and ultrasonic vibration is applied to the chip 20 by an ultrasonic vibrator (not shown).

At the same time, the heater 22 of the stage 18
The heat is transferred to the lower surface of the SAW package 2 via the lower receiving portion 11b of the lower plate 11 of the carrier 10 to heat the bonding portion between the bump 21 of the chip 20 and the SAW package 2. By continuing the application of this ultrasonic vibration and the heating for a predetermined time, the chip 20 becomes S
Bonded to the AW package 2.

At this time, since the SAW package 2 is under-supported by the lower receiving portion 11b of the lower plate 11, the SAW package 2 is accurately held horizontally regardless of variations in the height of the electrodes 2a, and therefore the bumps 21 are held in the SAW package 2. It is uniformly contacted with and pressed against, and good bonding quality is secured. Further, the heat from the stage 18 is efficiently transferred to the joint through the lower receiving portion 11b, and thus the heating efficiency is excellent. Therefore, the responsiveness at the time of temperature rise / cooling of the joint is excellent, so that the predetermined temperature is maintained. Maintain the heating pattern accurately,
Good joining quality can be obtained.

[0018]

According to the present invention, the substrate is held on the substrate carrier which is composed of the lower plate having the holes formed corresponding to the electrodes and the upper plate having the clamping means for elastically clamping the side surface of the substrate. As a result, the levelness of the substrate can be ensured during chip bonding, and the heating efficiency can be improved to maintain a predetermined heating pattern with high accuracy, thus ensuring stable bonding quality. be able to.

[Brief description of drawings]

FIG. 1 is a perspective view of a carrier according to an embodiment of the present invention.

FIG. 2A is a plan view of a carrier according to an embodiment of the present invention. FIG. 2B is a plan view of a carrier according to an embodiment of the present invention.

3A is a process explanatory diagram of a bonding method according to an embodiment of the present invention; FIG. 3B is a process explanatory diagram of a bonding method according to an embodiment of the present invention; and FIG. 3C is a bonding process according to an embodiment of the present invention. Illustration of process steps

FIG. 4 is a process explanatory diagram of a bonding method according to an embodiment of the present invention.

5A is a plan view of a conventional SAW filter package carrier, and FIG. 5B is a cross-sectional view of a conventional SAW filter package carrier.

[Explanation of symbols]

2 SAW package 2a electrode 10 careers 11 Lower plate 11a hole 12 Upper plate 13 Bridge section 19 Bonding head 20 chips

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/50 H01L 21/52 H01L 21/68

Claims (2)

(57) [Claims] 1. A substrate carrier for holding a substrate having an electrode protruding from a lower surface thereof, wherein a lower plate having a hole corresponding to the electrode and a side surface of the substrate are elastically clamped. Consisting of an upper plate with clamping means,
The electrode is fitted in the hole while the substrate is clamped to the upper plate, and the lower surface of the substrate is in contact with a flat surface surrounded by the hole to be supported. A carrier for substrates. 2. A chip bonding method for bonding a chip to a substrate having an electrode protruding from a lower surface thereof, wherein a lower plate having a hole corresponding to the electrode and a side surface of the substrate are elastic. The substrate is held by a substrate carrier including an upper plate having a clamp means for clamping the electrode, the electrode is fitted in the hole, and the lower surface of the substrate is in contact with a plane surrounded by the hole. In a state of being subbed, the chip is mounted on a substrate, ultrasonic vibration is applied while pressing the chip by a bonding head, and the substrate is heated via the subbed surface. Chip bonding method.